HSEC8-180-01-S-DV-A-WT-K

HSEC8–125–01–L–DV–A F-217 HSEC8–149–01–L–DV–A (0.80 mm) .0315" HSEC8-DV SERIES VERTICAL EDGE RATE CARD SOCKET ® SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HSEC8-DV Insulator Material: Black Liquid Crystal Polymer Contact: BeCu Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: 2.8 A per pin (2 adjacent pins powered) Operating Temp: -55 °C to +125 °C RoHS Compliant: Yes 10 YEAR MFG WITH 30 µ" GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES HIGH-SPEED CHANNEL PERFORMANCE Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (10-60) RECOGNITIONS HSEC8-DV Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com HSEC8 For complete scope of recognitions see www.samtec.com/quality 1 32 Custom designs compensate for misalignment. Contact Samtec. G b p s POSITIONS PER ROW PLATING OPTION CARD THICKNESS –01 FILE NO: 090871_0_000 09, 10, 13, 20, 25, 30, 37, 40, 49, 50, 60, 70, 80, 100 (13, 25, 49 only available with –L or –L2 option; 09 only available with –L2 option; 37 only available with –L option) 01 –03 CABLE CONNECTOR HSEC8–109–L2 HSEC8–113–L2 HSEC8–125–L2 HSEC8–149–L2 Notes: While optimized for 50 W applications, this connector with alternative signal/ground patterns may also perform well in certain 75 W applications. Contact Samtec for further information. Some lengths, styles and options are non-standard, non-returnable. –S = 30 µ" (0.76 µm) Gold on contact, Matte Tin on tail POSITIONS PER ROW 09*† 13*† 25*† 37† 40 49*† 50 60 70† 80† (1.32) 100† B .052 (No. of Positions + 6) x (0.80) .0315 + (0.60) .024 A = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail = (2.36 mm) .093" thick card A DV –L = (1.60 mm) .062" thick card No. of Positions x (0.80) .0315 + (7.80) .307 02 ECDP–04 ECDP–08 ECDP–16 ECDP–32 MISALIGNMENT MITIGATION Cable Mates: ECDP PROCESSING FILE NO. E111594 Mates with (1.60 mm) .062" or (2.36 mm) .093" cards Card Mates: (1.60 mm) .062" card, (2.36 mm) .093" card, HSC8 A B (4.50) .177 (11.80) .465 (6.10) .240 (15.00) .591 (6.10) .240 (24.60) .969 (18.10) .713 (34.20) 1.346 (18.90) .744 (36.60) 1.441 (22.90) .902 (43.80) 1.724 (22.90) .902 (44.60) 1.756 (26.90) 1.059 (52.60) 2.071 (26.90) 1.059 (60.60) 2.386 (26.90) 1.059 (68.60) 2.701 (26.90) 1.059 (84.60) 3.331 Positions where no dimensions are given do not have keying feature. * Mates with ECDP Series. † Available with –01 Card Only. 09, 13, 25, 37, 100 No. of Positions x (0.80) .0315 + (4.60) .181 02 01 (7.98) .314 (7.80) .307 (7.00)(5.60) .276 .220 (0.80) .0315 (1.75) .070 (1.12) .044 DIA No. of Positions x (0.80) .0315 + (2.20) .087 10, 20 & 30 WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. OTHER OPTION –K = (7.01 mm) .276" DIA Polyimide Film Pick & Place Pad (with –01 card) = (6.25 mm) .246" DIA Polyimide Film Pick & Place Pad (with –03 card) –BL = Board Locks (40, 50, 60, 80 only) (Other sizes available. Contact Samtec.) (Weld tab standard) –L = Latching Option (13, 25, 37, 49 only) (Weld tab standard) –L2 = ECDP Latching (09, 13, 25, 49 only) (For use with ECDP) (Weld tab standard) –WT = Weld tab –TR = Tape & Reel (09 - 70 only)