CYSB0604TL-045

承 認 書 SPECIFICATION FOR APPROVAL CUSTOMER: CUSTOMER P/N PART NO: DESCRIPTION: PRODUCTS NO: PRODUCTS REV: DATE: 鹿鸣 SMD POWER INDUCTORS CYSB0604TL-045 1 2018-7-20 PURCHASER CONFIRMED REMARK PROVIDER ENGINEER DEPT. APPROVAL BY CHECK BY DRAWN BY chenlinli 誠陽實業有限公司 TAIWAN CHENG YANG COMPONENT CORP TAIPEI OFFICE 2F-1, NO. 176, Chine-Yi Road., Zhonghe TAIWAN(R.O.C) 新北市中和區建一路176號2樓之一 District, New Taipei City, POSTAL CODE: 23500 TEL NO.:+886-2- 8228-0930 FAX NO.:+886-2-8228-0929 Email:h21803@ms29.hinet.net 寶誠電子有限公司 CHINA FACTORY ZHUHAI BAO CHENG ELECTRONICSCO.,LTD Guan Tang Industrial Park, Tang Jia Wan Town, Zhuhai City, Guangdong Province, CHINA 中國廣東省珠海市塘家灣鎮官塘工業區 POSTAL CODE: 519085 TEL NO:86-756-3383187 FAX NO:86-756-3380704 E-mail: baocheng@baocheng.biz 昆山誠陽電子有限公司 CHINA FACTORY KUNSHAN CHENG YANG ELECTRONICSCO.,LTDP Qiang-An Road., High-Tech. Industrial Park, Kunshan City, Jiangsu Province, 江蘇省昆山市高科技工業園區強安路38號 China POSTAL CODE: 215300 TEL NO:86-512-57823500 FAX NO:86-512-57823503 E-mail: kscy@taiwan-chengyang.com.tw REVISION NOTES NO. Date Description of Revision 1 2018-7-20 首次送樣 ROHS Compliant TEST DATA DIMENSION&ELECTRIC CHARACTER CUSTOMER: CUSTOMER : 鹿鸣 PART NO.: SMD INDUCTOR SERIES NO: CYSB0604TL-045 UNIT：mm EXTERNAL DIMENSIONS 2R2 RECOMMEND LAND PATTERN DIMENSIONS A 5.85±0.3 B 6.25±0.3 C 3.6MAX D 4.0±0.3 E 1.27REF F 0.5REF a 1.6 b 0.80 c 1.27REF d 6.00 CYSB0604TL-045 NOTE: Operating temperature：‘-25℃~+105℃ storage ： 温度：0℃~+40℃ 湿度：RH10%~70% APPROVED BY: Vincent CHECKED BY: Yasir DRAWN BY: chenlinli ROHS Compliant TEST DATA DIMENSION&ELECTRIC CHARACTER CUSTOMER: CUSTOMER : 鹿鸣 PART NO.: SMD INDUCTOR SERIES NO: CYSB0604TL-045 APPROVED BY CHECKED BY PREPARED BY Vincent Yasir #REF! ■GENERAL CHARACTERISTICS page.1 Operation Temperature -40℃ to +125℃ (Includes temperature when the coil is heated) External Appearance On visual inspection, the coil has no external defects. More than 90% of terminal electrode should be covered with solder. l After fluxing, component shall be dipped in a melted. Solder Ability Test dipped in a melted. Solder:bath at 235℃±5℃ for 5 ± 0.5senonds 1.Components should have not evidence of electrical and mechanical damage. 2.Inductance: within±10% of initial value. 3.Impedance: within±10% of initial value. Heat endurance of Soldering ●Preheat:150±5℃ 60seconds. ●Solder temperature: 250±5℃. ●Flux: rosin. ●Dip time:10±0.5seconds. After soldering of X,Y withstanding at below conditions .The terminal should not Peel off. (Refer to figure at below) Terminal Strength Insulating Resistance Dielectric Strength VibrationTest 5N:60sec. Over 100MΩ at 100V D.C. between coil and core. No dielectric breakdown at 30V D.C. for 1 minute between coil and core. Inductance deviation within +10% after vibration for 1 hour. In each of three orientations at sweep vibration(10-~55-~10HZ)with 1.5mmP-P amplitudes Inductance deviation within +10% after being dropped once with 981m/s2 (100G) Drop test shock Attitude upon a rubber block method shock testing machine, in three different orientations  Application Notice/Handling 1. Storage Conditions To maintain the solder ability of terminal electrodes: (1) Temperature and humidity conditions: less than 40℃ and 70% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Handling (1) Do not touch the electrodes(soldering terminals)with fingers as this may lead to deterioration of solderability. (2) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (3) Bulk handling should ensure that abrasion and mechanical shock are minimized. ■GENERAL CHARACTERISTICS TEST Required Characteristics page.2 Test Method/Condition 1. No case deformation or change in appearance 2. △L/L≦10% High Temperature StorageTest 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method108A Temperature:125℃±2℃ Time:96±2 hours. Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦10% Low Temperature Storage Test 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: IEC 68-2-1A 6.1 6.2 Humidity Test Temperature:-40℃±2℃ Time:96±2 hours. Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method103B Thermal Shock Test 1. Dry oven at a temperature of 40℃±2℃ for 96hours 2. Measurements At the end of this period 3. Exposure: Temperature: 40℃±2℃. Humidity:93±2hoyrs. 4. Tested while the chamber. 5. Tested not less than 1 hour. Nor more than 2 hours at room temperature. 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method107G First–40℃ for 30 Minutes, last 125℃ for 30 Minutes as 1 cycle. Go through 20 cycles. ■Application Notice/Handling (1) Temperature and humidity conditions : less than 40℃ and 70% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. (4) Do not touch the electrodes (soldering terminals) with fingers as this may lead to deterioration of solder ability (5) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (6) Bulk handling should ensure that abrasion and mechanical shock are minimized. ■THE CONDITION OF REFLOW(RECOMMENDATION) TYPICAL WAVE SOLDER PROFILE FOR LEADED AND LEAD -FREE THROUGH-HOLE PACKAGES IPC/JEDEC J-STD-020C, Figure 5-1 page.3 TYPICAL IR REFLOW PROFILE FOR LEADED AND LEAD -FREE SURFACE MOUNT PACKAGES