BCIHP2213-220M

(SMD Power Inductors) Powder Molding Type BCIHP2213-Series ● Photograph picture BCIHP2213-Series ● Dimensions Recommend PC Board Pattern ITEM BCIHP2213-Series A(mm) 22.0±0.5 B(mm) C(mm) 22.5±0.5 13 MAX D(mm) 18.5±0.3 E(mm) 5.0±0.5 F(mm) 29 G(mm) 22 H(mm) 5.8 ● Part Numbering BCIHP A 2213 B - 100 C M D A:Series(系列代號) B:Dimension(尺寸) C:Inductance(電感值) D:Inductance Tolerance(電感值公差) ● Features 1. 100% lead (Pb)-free. 2. Lowest DCR. 3. Frequency range up to 3.0MHz. 4. Ultra low buzz noise, due to composite construction. ● Applications 1. 2. 3. 4. DC/DC converter for CPU in PC Battery powered devices LCD displays, HDDs, DVCs, DSCs, PDA etc. Thin type on-board power supply module. A+B+C+D 2213 R15=0.15uH M=±20% N=±30% ● 特點 1. 符合 RoHs. 2. 低電阻. 3. 頻率可達到 3.0 MHz. 4. 設計緊湊/超低噪音 ● 應用 1. 用於電腦處理器的 DC/DC 轉換設備. 2. 電源,電池設備. 3. 適用於液晶屏顯示,HDD, DVC, DSC, PDA 等. 4. 薄型車載電源模組. 3 APR 2019 TAPE BCIH11763HC-Series P: 1 / 7 (SMD Power Inductors) Powder Molding Type BCIHP2213-Series ● Specification ITEM INDUCTANCE uH @100KHZ,1.0V,0A(1) DCR mΩ 25℃ TYP HEAT RATING DCR mΩ CURRENT DC AMPS 25℃ MAX (5) TYPICAL(Irms) 0.47 1.0 2.2 3.3 4.7 6.8 10.0 0.56 0.86 1.22 1.50 1.77 2.84 3.80 0.67 0.89 1.25 1.80 1.84 3.09 4.14 80.0 69.0 58.0 49.0 47.0 36.0 28.0 BCIHP2213-150M 15.0 5.62 6.11 23.5 BCIHP2213-220M 22.0 10.60 10.80 17.5 BCIHP2213-330M 33.0 15.10 15.40 15.5 BCIHP2213-470M 47.0 17.30 17.70 13.5 BCIHP2213-R47M BCIHP2213-1R0M BCIHP2213-2R2M BCIHP2213-3R3M BCIHP2213-4R7M BCIHP2213-6R8M BCIHP2213-100M BCIHP2213-750M 75.0 29.76 32.35 12.0 BCIHP2213-820M 82.0 31.46 34.20 10.2 BCIHP2213-101M 100.0 36.25 39.40 9.1 BCIHP2213HC-151M 150.0 68.00 90.00 6.0 BCIHP2213HC-221M 220.0 98.00 130.00 4.5 BCIHP2213HC-401M 400.0 208.00 270.00 4.0 SATU RATION CURRENT DC AMPS (6) TYPICAL(Isat) 100.0≦20% 71.0≦20% 48.0≦20% 41.0≦20% 37.0≦20% 36.0≦20% 28.0≦20% 24.0≦20% 16.0≦20% 10.5≦20% 10.5≦20% 12.0≦20% 9.0≦20% 7.0≦30% 8.0≦30% 6.0≦30% 6.0≦30% Note: (1) Tolerance of Inductance:,M=±20%. (2) (3) (4) (5) (6) (7) (1) (2) (3) (4) (5) (6) (7) All test data is referenced to 25℃ ambient. Inductance is measured at 100KHz/1.0V. 25℃ ambient. Operating Temperature Range -40℃ to +125℃. DC current (Irms) (A) that will cause an approximate △T of 40℃. DC current (Isat) (A) that will cause Lo to drop approximately 20%. The part Temperature (ambient + temp rise) should not exceed 125℃ under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature Part temperature should be verified in the end application. 電感的公差：M=±20%. 所有的測試資料應該是在 25℃的環境溫度下測試. 感值測試頻率100KHz/1.0V. 操作溫度範圍－40℃到+125℃. 加 DC(Irms)電流值(A)會導致△T 40℃左右的變化. 加 DC(Isat)電流值(A)會導致初始值下降20%左右. 產品的溫度不能超過 125℃，即使在最壞的操作情況下，基板設計，元件放置，PWB 尺寸和厚度， 氣流和一些冷卻設備都會影響產品溫度，產品溫度要在最終應用時才被驗證. 3 APR 2019 TAPE BCIH11763HC-Series P: 2 / 7 (SMD Power Inductors) Powder Molding Type BCIHP2213-Series ● Material List NO 1 2 ITEM Core Wire External Electode 3 Electroplating 4 Paint 4 1 3 2 Materials Magnetic Metal Powder or equivalen Polyester Wire or equivalen Copper Ni/Sn Epoxy resin ● Packaging Information (1) Reel Dimension & Tape Dimension / Packaging Quantity DIMENSIONS (m/m) ITEN Q’TY (PCS) BCIHP2213-Series 100 W A0 B0 K0 P F T D0 P0 P2 E 44±0.3 22.5±0.1 23±0.1 13.6±0.1 32±0.1 20.2±0.15 0.5±0.05 1.5+0.1-0 4.0±0.1 2.0±0.1 1.75±0.1 (2) Tearing Off Force The force tearing off cover 10 to 130 grams (0.1N to 1.3N) in the arrow direction under the following conditions. ● Storage conditions/Note things (1) Storage temperature and humidity conditions : 1. Product packing with Carrier tape: +5℃~+40℃ and less than 60% RH. 2. Product alone: -20℃~+60℃ and less than 60% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. (4) Do not touch the electrodes (soldering terminals) with fingers as this may lead to deterioration of solder ability. (5) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (6) Bulk handling should ensure that abrasion and mechanical shock are minimized. 3 APR 2019 TAPE BCIH11763HC-Series P: 3 / 7 (SMD Power Inductors) Powder Molding Type BCIHP2213-Series ● Package for standard ITEM Packing method & Dimensions ITEM BCIHP2213-Series A 100 Pcs B 100 Pcs C Pcs 3 APR 2019 TAPE BCIH11763HC-Series P: 4 / 7 (SMD Power Inductors) Powder Molding Type BCIHP2213-Series ● General Characteristics Operation Temperature External Appearance -40℃ to +125℃ (Includes temperature when the coil is heated) On visual inspection, the coil has no external defects. ● Electrical Performance Test Inductance DCR Refer to standard electrical characteristics list. Saturation Current(Isat) Heat Rated Current(Irms) BCIHP2213-Series △L≦20% typical. BCIHP2213HC-Series △L≦30% typical. Approximately △T≦40℃. ● Reliability Test Solder Ability Test 1. More than 90% of terminal electrode should be covered with solder.  After fluxing, component shall be dipped in a melted.  Solder: bath at 245℃±5℃ for 5±0.5 seconds. 1. Components should have not evidence of electrical and mechanical damage. 2. Inductance: within±10% of initial value. Heat resistance of  Preheat:150±5℃ 60seconds. Reflow Soldering Test  Solder temperature: 255+5℃/-0℃.  Flux: rosin.  Dip time:10±0.5seconds. 1. No apparent damage Adhesion strength Test  Product is mounted on PCB. Thereafter R340 pressure fixture is used to apply pressure to product from backside of the board at a rate of approx. 1mm/sec. until bending width becomes 1mm and keep it for 5sec. 1. No separation or indication of electrode.  A static load using a R5.0 pressing tool shall be applied to the Welding strength Test body of the specimen in the direction of the arrow and shall be hold for 3±1 sec. Insulating Resistance Over 100MΩ at 100V D.C. between coil and core. Dielectric Strength Vibration Test Drop Test No dielectric breakdown at 30V D.C. for 1 minute between coil and core. 1. No separation or Inductance deviation within +10% after vibration for 1 hour. In each of three orientations at Sweep vibration indication of (10~55~10HZ) with 1.5mmP-P amplitudes. electrode. △L/L≦15% 2. Inductance deviation within +10% after being dropped once with 981m/s2 (100G) shock Attitude upon a rubber block method shock testing machine, in three different orientations. 3 APR 2019 TAPE BCIH11763HC-Series P: 5 / 7 (SMD Power Inductors) Powder Molding Type BCIHP2213-Series ● Reliability Test Required Characteristics Item High Temperature Storage Test Low Temperature Storage Test High Temperature Humidity Test Thermal Shock Test Storage Test Test Method/Condition 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15%  Temperature:125℃±3℃ Time:96±2 hours.  Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15%  Temperature:-40℃±3℃ Time:96±2 hours.  Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15%     Temperature:85℃±3℃. Humidity:85±5%RH Test Time:96±2 hours Tested not less than 1 hour. Nor more than 2 hours at room temperature. 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15%  First–40℃ for 30 Minutes, last 125℃ for 30 Minutes as 1 cycle. Go through 20 cycles. 3 APR 2019 TAPE BCIH11763HC-Series P: 6 / 7 (SMD Power Inductors) Powder Molding Type BCIHP2213-Series ● Soldering re-flow IPC/JEDEC J-STD-020C, Figure 5- 3 APR 2019 TAPE BCIH11763HC-Series P: 7 / 7