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BCRH1212Y-180M

BCRH1212Y-180M

  • 厂商:

    BC(台湾诚阳)

  • 封装:

    SMD

  • 描述:

    功率电感 SMD

  • 数据手册
  • 价格&库存
BCRH1212Y-180M 数据手册
ROHS Compliant 承 認 書 SPECIFICATION FOR APPROVAL CUSTOMER: CUSTOMER P/N PART NO: DESCRIPTION: PRODUCTS NO: PRODUCTS REV: DATE: SMD INDUCTOR BCRH1212Y-180M 1 2018-6-11 PURCHASER CONFIRMED REMARK PROVIDER ENGINEER DEPT. APPROVAL BY CHECK BY DRAWN BY chenlinli 誠陽實業有限公司 TAIWAN CHENG YANG COMPONENT CORP TAIPEI OFFICE 2F-1, NO. 176, Chine-Yi Road., Zhonghe District, New Taipei City, TAIWAN(R.O.C) 新北市中和區建一路176號2樓之一 POSTAL CODE: 23500 TEL NO.:+886-2- 8228-0930 FAX NO.:+886-2-8228-0929 E-mail:h21803@ms29.hinet.net 寶誠電子有限公司 ZHUHAI BAO CHENG ELECTRONICSCO.,LTD Guan Tang Industrial Park, Tang Jia Wan Town, Zhuhai City, Guangdong Province, CHINA CHINA FACTORY 中國廣東省珠海市塘家灣鎮官塘工業區 POSTAL CODE: 519085 TEL NO:86-756-3383187 FAX NO:86-756-3380704 E-mail: baocheng@baocheng.biz 昆山誠陽電子有限公司 CHINA FACTORY KUNSHAN CHENG YANG ELECTRONICSCO.,LTDP Qiang-An Road., High-Tech. Industrial Park, Kunshan City, Jiangsu Province, China 江蘇省昆山市高科技工業園區強安路38號 POSTAL CODE: 215300 TEL NO:86-512-57823500 FAX NO:86-512-57823503 E-mail: kscy@taiwan-chengyang.com.tw TEST DATA ROHS Compliant DIMENSION & ELECTRIC CHARACTER CUSTOMER: DESCRIPTION: 1.MECHANIC PART NO: SERIES NO: SMD INDUCTOR BCRH1212Y-180M UNIT : mm 180 2.RECOMMEND LAND PATTERN DIMENSIONS A B 12.5MAX 12.5MAX C 12.0MAX D E F G H 5.0±0.2 7.9±0.2 3.SPECIFICATIONS Part Number L(0A) Inductance 18uH±20% @1KHZ 0.25V Typical 18.0 16.0 BCRH1212Y-180M Heat Rating Current Saturation Current DC Amps.Idc(A) DC Amps.Idc(A) Max Typical Typical 19.0 6.5 7 Rdc(mΩ) (1). All test data is referenced to 25℃ ambient. (2). Operating Tenperature Rangr-30℃ to +100℃. (3). DC current(6.5A)that will cause an approximate△T of 40℃. (4). DC current(7.0A)that will cause Lo to drop approximately 25%. (5). The part temperature(ambient+temp rise)should not exceed 100℃ under worst case operating conditions.Circuit design,component placement,PWB trace size and thickness,airflow and other cooling provisions all affect part temperature part temperature should betheverified in the end appliation. APPROVED BY: Vincent CHECKED BY: Taojun DRAWN BY: Daixin PACKAGE STANDARD PART NO. ROHS Compliant BCRH1212Y SERIES 4. MARKING AND DATE CODE 4-1 Marking The inductor is marked with a 3-digit code Example: 18μH→ 180 5.PACKING DIRECTION: (mm) NO A B C QUANTITY 200PCS 200PCS 1000PCS 1 ROHS Complint SPECIFICATION FOR APPROVAL APPROVED BY: Vincent CHECKED BY: Taojun DRAWN BY: Daixin ROHS Compliant ELECTRONICS CHARACTER TEST CHART CUSTOMER: PART NAME: SMD INDUCTOR TEMPERATURE RISE CURRENT CUSTOMER P/N: TEST DATE:2018-6-11 BC PN: BCRH1212Y-180M SAMPLE CO: DC:6.5A TEST INSTRUMENTS CD1068+CD1320METER 1.CURVES OF TEMPERATURE AND INDUCTAME VARIED WITH TP CARRENT TEST INSTRUMENTS TEST TERM: 1KHZ 0.25V TEST INSTRUMENTS: WK3260B+WK3265B METER 2.INDUCTCMCE VS CURRENT ●DTL=-4% ■DTL=-9% ▲DTL=-50% CURRENT (A) TEST TERM: 0.25V TEST INSTRUMENTS: WK3260B METER 3.INDUCTCMCE VS FREQUENCUY FREQUENCY(Hz) 1.TEST CONDITION TEMPERATURE: 25℃ HUMIDITY: ≦ 65% RH APPROVED BY CHECKED BY PREPARED BY chenlinli TEST INSTRUMENTS ■GENERAL CHARACTERISTICS page.1 Operation Temperature -40℃ to +125℃ (Includes temperature when the coil is heated) External Appearance On visual inspection, the coil has no external defects. More than 90% of terminal electrode should be covered with solder. l After fluxing, component shall be dipped in a melted. Solder Ability Test dipped in a melted. Solder:bath at 235℃±5℃ for 5 ± 0.5senonds 1.Components should have not evidence of electrical and mechanical damage. 2.Inductance: within±10% of initial value. 3.Impedance: within±10% of initial value. Heat endurance of Soldering ●Preheat:150±5℃ 60seconds. ●Solder temperature: 250±5℃. ●Flux: rosin. ●Dip time:10±0.5seconds. After soldering of X,Y withstanding at below conditions .The terminal should not Peel off. (Refer to figure at below) Terminal Strength 5N:60sec. Insulating Resistance Over 100MΩ at 100V D.C. between coil and core. Dielectric Strength No dielectric breakdown at 30V D.C. for 1 minute between coil and core. VibrationTest Inductance deviation within +10% after vibration for 1 hour. In each of three orientations at sweep vibration(10-~55-~10HZ)with 1.5mmP-P amplitudes Inductance deviation within +10% after being dropped once with 981m/s2 (100G) Drop test shock Attitude upon a rubber block method shock testing machine, in three different orientations  Application Notice/Handling 1. 1. Storage Storage Conditions Conditions To maintain the solder ability of terminal electrodes: (1) Temperature and humidity conditions: less than 40℃ and 70% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Handling (1) Do not touch the electrodes(soldering terminals)with fingers as this may lead to deterioration of solderability. (2) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (3) Bulk handling should ensure that abrasion and mechanical shock are minimized. ■GENERAL CHARACTERISTICS TEST High Temperature StorageTest Required Characteristics Test Method/Condition 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method108A Low Temperature Storage Test page.2 Temperature:125℃±2℃ Time:96±2 hours. Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: IEC 68-2-1A 6.1 6.2 Humidity Test Temperature:-40℃±2℃ Time:96±2 hours. Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method103B Thermal Shock Test 1. Dry oven at a temperature of 40℃±2℃ for 96hours 2. Measurements At the end of this period 3. Exposure: Temperature: 40℃±2℃. Humidity:93±2hoyrs. 4. Tested while the chamber. 5. Tested not less than 1 hour. Nor more than 2 hours at room temperature. 1. No case deformation or change in appearance 2. △L/L≦10% 3. △Q/Q≦30% 4. △DCR/DCR≦10% Reference documents: MIL-STD-202G Method107G First–40℃ for 30 Minutes, last 125℃ for 30 Minutes as 1 cycle. Go through 20 cycles. ■Application Notice/Handling (1) Temperature and humidity conditions : less than 40℃ and 70% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. (4) Do not touch the electrodes (soldering terminals) with fingers as this may lead to deterioration of solder ability (5) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (6) Bulk handling should ensure that abrasion and mechanical shock are minimized. ■THE CONDITION OF REFLOW(RECOMMENDATION) page.3 TYPICAL WAVE SOLDER PROFILE FOR LEADED AND TYPICAL IR REFLOW PROFILE FOR LEADED AND LEAD -FREE THROUGH-HOLE PACKAGES LEAD -FREE SURFACE MOUNT PACKAGES IPC/JEDEC J-STD-020C, Figure 5-1
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