BCT642AEGG-TR

BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 4-Data Lane Switch GENERAL DESCRIPTION The BCT642A is a two-data-lane, MIPI, D-PHY, C-PHY switch. This single-pole, double-throw (SPDT) switch is optimized for switching between two high-speed or low-power MIPI sources. The BCT642A is designed for the MIPI specification and allows connection to a CSI or DSI module. FEATURES           APPLICATIONS Cellular Phones, Smart Phones Displays Switch Type: SPDT(6x) Signal Types: MIPI, D-PHY,C-PHY VCC:1.65 to 4.5V RON: 6.0Ω Typical HS MIPI 7.0Ω Typical LP MIPI ΔRON: 0.6Ω Typical RON_FLAT: 0.3Ω Typical ICC: 26uA Typical Differential Bandwidth:2.5GHz Typical CON:5.0pF QFN3.4x2.5-24L Package ORDERING INFORMATION Order Number Package Type Temperature Range BCT642AEGG-TR QFN3.4x2.5-24L -40°C to +85°C Marking QTY/Reel 642A XXXXX 3000 Mark Note: 1. "642A" in Marking is Product code 2. "XXXXX" in Marking will be appeared as the batch code. REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 1 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch DB2N CLKAP CLKAN DA1P DA1N DA2P PIN CONFIGURATION 18 17 16 15 14 13 20 11 SEL DB1N 21 10 VCC CLKBP 22 9 GND CLKBN 23 8 /OE NC 24 7 NC 2 3 4 5 6 D2N 1 D2P DB1P D1N DA2N D1P 12 CLKN 19 CLKP DB2P Figure1. Pin Configuration(Top Through View) PIN DESCRIPTION PIN NAME FUNCTION 1, 2 CLKP, CLKN Clock Path (Common) 3, 4 D1P, D1N Data Path 1 (Common) 5, 6 D2P, D2N Data Path2 (Common) 7, 24 NC No Connect (Float) 8 /OE Output Enable (Active Low) 9 GND Ground 10 VCC Power 11 SEL Select (0=A,1=B) 12, 13 DA2N, DA2P Data Path (A2) 14, 15 DA1N, DA1P Data Path (A1) 16, 17 CLKAN, CLKAP Clock Path (A) 18, 19 DB2N, DB2P Data Path (2B) 20, 21 DB1P, DB1N Data Path (1B) 22, 23 CLKBP, CLKBN Clock Path (B) REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 2 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch FUNCTIONAL DIAGRAM BCT642A CLKAP(17) CLKAN(16) DA1P(15) (1)CLKP DA1N(14) DA2P(13) (2)CLKN DA2N(12) (3)D1P (4)D1N (5)D2P (6)D2N CLKBP(22) CLKBN(23) DB1P(20) DB1N(21) DB2P(19) DB2N(18) (8)/OE SWITCH CONTROL (11)SEL (10)VCC (9)GND Figure2. Functional Diagram TRUTH TABLE SEL /OE Function Don’t care HIGH Disconnect LOW LOW D1, D2, CLK=DA1, DA2, CLKA HIGH LOW D1, D2, CLK=DB1, DB2, CLKB REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 3 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch TYPICAL OPERATING CIRCUIT Camera1 D Camera2 C D D C BCT642A D LCD1 LCD2 D C D D BCT642A C D MAP Processor Figure 3. C C MAP Processor Application Block Diagram REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 4 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch ABSOLUTE MAXIMUM RATINGS CAUTION Supply Voltage (VCC)…............................-0.5V to +5.25V This integrated circuit can be damaged by ESD if you don’t (1) DC Input Voltage (SEL, /OE) .................-0.5V to +5.25V pay attention to ESD protection. Broadchip recommends DC Switch I/O Voltage...............................-0.5V to 5.25V that all integrated circuits be handled with appropriate DC Input Diode Current.........................................-50mA precautions. Failure to observe proper handling and DC Output Current ……….....................................50mA installation procedures can cause damage. ESD damage Storage Temperature Range..................-65℃ to +150℃ can range from subtle performance degradation to Junction Temperature.............................................150℃ complete device failure. Precision integrated circuits may Operating Temperature Range.................-40℃ to +85℃ be more susceptible to damage because very small Lead Temperature (Soldering, 10 sec)....................260℃ parametric changes could cause the device not to meet its ESD Susceptibility published specifications. All Pins......................................................................2KV Broadchip reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. Please contact Broadchip sales office to get the latest datasheet. RECOMMENDED OPERATING CONDTIONS The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Symbol Parameter Min. Max. Unit VCC Supply Voltage 1.65 4.5 V VCTRL Control Input Voltage(SEL, /OE)(2) 0 VCC V Switch I/O Voltage (CLKn, HS Mode 0.1 0.3 VSW V CLKAn, CLKBn, Dn, DAn, DBn) LP Mode 0 1.2 ℃ TA Operating Temperature -40 +85 Notes： 1. The input and output negative ratings maybe exceed if the input and output diode current ratings are observed. 2. The control input must be held HIGH or LOW; it must not float. REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 5 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch DC ELECTRICAL CHARACTERISTICS ( All typical values are TA = 25℃, unless otherwise specified.) PARAMETER SYM Control Input Leakage(SEL, /OE) IIN Input Voltage High Input Voltage Low VCC (V) MIN VSW=0 to 1.3V 1.65 to 4.5 -1 VIH VIN=0 to VCC 1.65 to 4.5 1.0 VIL VIN=0 to VCC 1.65 to 4.5 INO(OFF) INC(OFF) CLKn, Dn=0.3V; VCC-0.3V; CLKAn, DAn, or CLKBn; DBn=VCC-0.3V, 0.3V, or Floating; /OE=0V 1.65 to 4.5 IA(ON) CLKn, Dn=0.3V; Vcc-0.3V; CLKAn, DAn, or CLKBn; DBn=VCC-0.3V, 0.3V, or Floating; /OE=0V Power-Off Leakage Current IOFF CLKn, Dn or CLKAn, DAn, or CLKBn; DBn; VIN=0V to 4.5V; VCC=0V Off-State Leakage IOZ 0≤CLKn, Dn, CLKAn, DAn, CLKBn, DBn≤ 3.6V; /OE=High Off leakage Current of Port CLKAn, DAn, CLKBn, DBn On leakage Current of Common Ports(CLKAn, Dn) CONDITIONS TYP MAX UNITS 1 uA V 0.4 V -1 1 uA 1.65 to 4.5 -1 1 uA 0 -1 1 uA 4.5 -1 1 uA ION=-10mA, /OE=0V, RON_MIPI SEL=VCC or 0V, CLKA, B, DBn or DAn=0.1, 0.2, _HS 0.3 1.8--4.5 6.0 Ω ION=-10mA, /OE=0V, Switch On Resistance for LP RON_MIPI SEL=VCC or 0V, CLKA, B, MIPI Applications(3) _LP DBn or DAn=0, 0.6, 1.2V 1.8-4.5 7.0 Ω ION=-10mA, /OE=0V, SEL=VCC or 0V, CLKA, B, DBn or DAn=0.1, 0.2, 0.3 1.8-4.5 0.6 Ω Switch On Resistance for HS MIPI Applications(3) On Resistance Matching Between HS MIPI Channels(4) Δ RON_MIPI _HS REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 6 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch DC ELECTRICAL CHARACTERISTICS ( All typical values are TA = 25℃, unless otherwise specified.) PARAMETER CONDITIONS VCC (V) ION=-10mA, /OE=0V, SEL=VCC or 0V, CLKA, B, DBn or DAn=0.0, 0.6, 1.2V 1.8-4.5 0.6 Ω On Resistance Flatness for RON_FLA HS MIPI Signals(4) T_MIPI_HS ION=-10mA, /OE=0V, SEL=VCC or 0V, CLKA, B, DBn or DAn=0.1, 0.2, 0.3 1.8-4.5 0.3 Ω On Resistance Flatness for RON_FLA LP MIPI Signals(4) T_MIPI_LP ION=-10mA, /OE=0V, SEL=VCC or 0V, CLKA, B, DBn or DAn=0.0, 0.6, 1.2V 1.8-4.5 1.5 Ω Quiescent Hi-Z Supply Current ICCZ V/OE= VCC ,VIN=0 or VCC, IOUT=0 4.5 Quiescent Supply Current ICC V/OE= 0 ,VIN=0 or VCC, IOUT=0 2.8 26 Increase in ICC Current Per Control Voltage and VCC ICCT 4.5 4.0 2.5 0.1 On Resistance Matching Between LP MIPI Channels(4) SYM Δ RON_MIPI _LP VSEL, /OE=1.65V MIN TYP MAX UNITS 0.5 uA uA uA Notes: 3. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower of the voltage on the two (A or B ports). 4. Guaranteed by characterization AC ELECTRICAL CHARACTERISTICS ( All values are for VCC=3.3V at TA=25℃ unless otherwise specified.) PARAMETER SYM CONDITIONS VCC (V) MIN TYP MAX UNITS Initalization Time VCC to Output(5) tINIT RL=50Ω, CL=5pF, VSW=1.2V 2.5 to 4.5 100 1.8 150 Enable Turn-On Time, /OE to Output tEN RL=50Ω, CL=5pF, VSW=1.2V 2.5 to 4.5 120 200 1.8 250 500 Disable Turn-off Time, /OE to Output tDIS RL=50Ω, CL=5pF, VSW=1.2V 2.5 to 4.5 25 50 1.8 50 90 Turn-On Time SEL to Output tON RL=50Ω, CL=5pF, VSW=1.2V 2.5 to 4.5 50 100 1.8 75 125 REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 7 us ns ns ns BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch AC ELECTRICAL CHARACTERISTICS ( All values are for VCC=3.3V at TA=25℃ unless otherwise specified.) PARAMETER SYM CONDITIONS Turn-Off Time SEL to Output tOFF RL=50Ω, CL=5pF, VSW=1.2V Break-Before-Make Time tBBM CL=5pF, RL=50Ω, VSW=1.2V OIRR f=750MHz, RL=50Ω, /OE=VCC ,VSW =-1dBm (200mVPP) Xtalk f=750MHz, RL=50Ω, /OE=VCC ,VSW =-1dBm (200mVPP) (5) Off Isolation for MIPI Crosstalk for MIPI (5) Differential -3db Bandwidth(5) BW CL=0pF, RL=50Ω VCC (V) MIN TYP MAX UNITS 2.5 to 4.5 50 200 1.8 200 325 10 ns 50 ns 1.65 to 4.5 -32 dB 1.65 to 4.5 -35 dB 2.5 GHz 3.0 2.0 Note: 5. Guaranteed by characterization. HIGH-SPEED-RELATED AC ELECTRICAL CHARACTERISTICS PARAMETER Channel-to-Channel Single-Ended Skew(6) Skew of Opposite Transitions of the Same Output(6) SYM CONDITIONS VCC (V) MIN TYP MAX UNITS tSK(O) TDR-Based Method (VSW =0.2VPP, CL=CON) 3.3 6 20 ps tSK(P) TDR-Based Method (VSW =0.2VPP, CL=CON) 3.3 6 20 ps Notes: 6. Guaranteed by characterization. CAPACITANCE PARAMETER Control Pin Input Capacitance(7) SYM CIN CONDITIONS VCC=0V, f=1MHz VCC (V) MIN TYP 0 2.1 Output On Capacitance(7) CON VCC=3.3V, /OE=0V, f=1MHz 3.3 5.0 Output Off Capacitance(7) COFF VCC and /OE=3.3V, f=1MHz 3.3 2.0 MAX UNITS pF Note: 7. Guaranteed by characterization. REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 8 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch TEST DIAGRAMS Figure 4. On Resistance Figure 6. AC Test Circuit Board Figure 8. Propagation Delay(tRtF-500ps) Figure 5. Off Leakage Figure 7. Turn-On/Turn-Off waveform Figure 9. Channel to Channel Skew REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 9 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch TEST DIAGRAMS (CONTINUED) Figure 10. Channel Off Capacitance Figure 11. Channel On Capacitance Figure 12. Break-Before-Make Interval Timing REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 10 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch PACKAGE OUTLINE DIMENSIONS QFN3.4x2.5-24L REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 11 BCT642A 2:1 MIPI D-PHY,C-PHY(2.5Gbps) 2-Data Lane Switch RECOMMEDNED PCB LAYOUT PATTERN (UNIT:mm) 0.4 0.7 0.2 0.4 3.8 0.6 0.2 2.9 REV1.0 www.broadchip.com Copyright © BROADCHIP TECHNOLOGY CO., LTD 12