BZ401M

BZ401M Order Code: BZ401M-01 Version: A2 2017-08-24 Gas Discharge Tube Features Exterior Small Size Design EIA 1210 3.2×2.5×2.5mm Current Handling Capability 1,000A @ 8/20μ s Low Capacitance and Insertion Loss Fast Response and Long Service Life Reliable to Protect Electrostatic Surge Moisture sensitivity level: Level 1 SMD Application Information rmation Package (Top View) Ethernet ` 1 Agency Approvals 2 Schematic Symbol Icon Description Compliance with 2011/65/EU 2 1 Compliance withIEC61249-2-21:2003 Mean lead free Compliance with UL497B, Certificated E232249 Electrical Parameter DC Breakdown Voltage 1)2) Impulse Spark-over Voltage 100V/s 360-580 V Typical values：470 V At 1kV/μs for 99 % of measured values At 1kV/μs Typical values of distribution  950  900 V V Impulse Discharge Voltage 3) 10/700μs 6,000 V Impulse Discharge Current 3) 8/20μs 1,000 A Arc Voltage At 1A ~10 V Insulation Resistance DC=100V ≥1 GΩ C(1MHz) VDC=0.5V ≤0.5 pF Weight ~0.094 g Operating And Storage Temperature -40-90 ℃ Marking Without 1) At delivery AQL0.65level II ISO 2859 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 1 /3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BZ401M Order Code: BZ 401 M (1) (2) (3) BZ401M-01 Version: A2 2017-08-24 Gas Discharge Tube Part Numbering System Product Characteristics Characteristics Lead Material Copper Body Material Ceramics Terminal Finish 100% Matte-Tin Plated (1) Bencent Gas Discharge Tube (2) Series: DC Breakdown Voltage, e.g.：401=40×101=400V (3) Tolerance of DC Breakdown Voltage, M=+-20%, N=+-30%, the Specific tolerance is decided by the table of “Electrical Parameter” Environmental Reliability Characteristics Testing items Technical standards Temperature: 90℃ Time: 2H Temperature: -40℃ Time: 2H Frequency: 10-500Hz Amplitude: 0.15mm Time: 45min Temperature: 260±5℃ Time of dip soldering: 10s, 1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability Test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions A C REF mm inch A 3.2±0.3 0.126±0.013 B 0.3±0.2 0.013±0.008 C 2.5±0.2 0.098±0.008 D 2.5±0.2 0.098±0.008 REF mm inch A 4.5 0.177 B 2.0 0.079 C 2.8 0.110 D B Recommended Soldering Pad A B C 2 /3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BZ401M Order Code: BZ401M-01 Version: A2 2017-08-24 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time (min to max) 60 – 180 secs Average ramp up rate (Liquids) Tamp (TL) to peal TS(max) to TL - Ramp-up Rate 3°C/second max (Liquids) - Temperature (TL) Peak Temperature (TP) 217°C 60 – 150 seconds TL TS(max) Ramp-down Preheat TS(min) tS 260+0/-5 °C Time within 5°C of actual peak ~10 seconds Temperature (tp) Critical Zone TL to TP Ramp-up TL 3°C/second max - Temperature (TL) Reflow tP TP Temperature Pre Pb-Free assembly 25 Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Time time to peak temper ature Package Reel Information 3 /3 REF mm inch A 2.8±0.1 0.110±0.004 B 3.5±0.1 0.138±0.004 d Φ 1.5±0.1 Φ 0.059±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 P 8.0±0.1 0.315±0.004 E 1.75±0.1 0.069±0.004 F 5.5±0.1 0.217±0.004 W 12.0±0.2 0.472±0.008 D Φ 330.0 Φ 13.0 D1 Φ 50Min Φ 1.97Min D2 Φ 13±0.15 0.512±0.006 W1 16.8±2.0 0.661±0.079 Outline Reel (PCS) Per Carton (PCS) Reel Diameter(mm) TAPING 2,500 40,000 330 www.bencent.com.cn Carton Size(mm) L W H 360 360 380 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications