AOD603A
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N- and P-Channel 60-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
60
P-Channel
- 60
ID (A)a Qg (Typ.)
RDS(on) (Ω)
0.030 at VGS = 10 V
35
0.033 at VGS = 4.5 V
30
0.050 at VGS = - 10 V
- 19
0.060 at VGS = - 4.5 V
- 15
6 nC
8 nC
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
APPLICATIONS
• CCFL Inverter
TO-252
D-PAK
D1/D2
Top View
Drain Connected to
Tab
G1
G2
S1
S2
N -channel
P-channel
S1 G1 D1/D2 S2 G2
ABSOLUTE MAXIMUM RATINGS (TA = 25°C UNLESS OTHERWISE NOTED)
Parameter
Symbol Nch Limit Pch Limit
VDS
Drain-Source Voltage
60
-60
VGS
Gate-Source Voltage
±20
±20
TC=25°C
ID
35
-20
Continuous Drain Current a
b
I
140
-80
Pulsed Drain Current
DM
a
TC=25°C
IS
35
-20
Continuous Source Current (Diode Conduction)
a
T
=25°C
P
50
50
Power Dissipation
C
D
TJ, Tstg
TJ, Tstg -55 to 175
Operating Junction and Storage Temperature Range
Units
V
A
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Case
c
Symbol Maximum
RθJA
50
RθJC
3
Units
°C/W
Notes
a.
Package Limited
b.
Pulse width limited by maximum junction temperature
c.
Surface Mounted on 1” x 1” FR4 Board.
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Parameter
Gate-Source Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current a
Drain-Source On-Resistance
a
Forward Transconductance a
Diode Forward Voltage a
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
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Symbol Test Conditions
Static
VDS = VGS, ID = 250 uA
VGS(th)
VDS = VGS, ID = -250 uA
IGSS
VDS = 0 V, VGS = ±20 V
VDS = 60 V, VGS = 0 V
IDSS
VDS = -48 V, VGS = 0 V
VDS = 5 V, VGS = 10 V
ID(on)
VDS = -5 V, VGS = -10 V
VGS = 10 V, ID = 20 A
VGS = 4.5 V, ID = 16 A
rDS(on)
VGS = -10 V, ID = -10 A
VGS = -4.5 V, ID = -8 A
VDS = 15 V, ID = 20 A
gfs
VDS = -15 V, ID = -10 A
IS = 17 A, VGS = 0 V
VSD
IS = -10 A, VGS = 0 V
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Dynamic b
N - Channel
VDS = 30 V, VGS = 4.5 V,
ID = 20 A
N - Channel
VDS = 30 V, RL = 1.5 Ω,
ID = 20 A,
VGEN = 10 V, RGEN = 6 Ω
N - Channel
VDS = 15 V, VGS = 0 V, f = 1 Mhz
P - Channel
VDS = -30 V, VGS = 4.5 V,
ID = -10 A
P - Channel
VDS = -30 V, RL = 3 Ω,
ID = -10 A,
VGEN = -10 V, RGEN = 6 Ω
P - Channel
VDS = -15 V, VGS = 0 V, f = 1 Mhz
Min
Typ
1
-1
45
-25
Max
Unit
3
-3
±100
1
-1
V
V
nA
uA
A
A
30
33
50
60
15
11
0.89
-0.98
9
3
4
5
5
27
8
1500
84
79
10
5
4
5
4
30
11
1180
84
60
mΩ
mΩ
S
S
V
V
nC
ns
pF
nC
ns
pF
2
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N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
5
VGS = 10 thru 4 V
16
I D - Drain Current (A)
I D - Drain Current (A)
18
14
12
10
8
6
4
4
3
2
TC = 125 °C
1
25 °C
3V
2
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 55 °C
0
0.0
2.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
3.0
3.5
1500
0.060
1200
C - Capacitance (pF)
R DS(on) - On-Resistance (mΩ)
0.055
0.050
0.045
0.040
VGS = 4.5 V
0.035
VGS = 10 V
0.030
Ciss
900
600
300
Coss
0.025
0
2
4
6
8
10
12
14
16
18
0
20
10
20
30
40
50
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
60
2.0
VDS = 30 V
ID = 4.3 A
1.8
8
RDS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
Crss
0
0.020
6
4
VGS = 10 V
ID = 4.3 A
1.6
1.4
1.2
1.0
2
0.8
0
0
3
6
9
12
15
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
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150
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N-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
R DS(on) - Drain-to-Source On-Resistance (mΩ)
20
TJ = 150 °C
I S - Source Current (A)
10
TJ = 25 °C
1
0.0
0.2
0.4
0.6
1.0
0.8
1.2
0.12
0.11
0.10
0.09
0.08
0.07
ID = 4.3 A
0.06
0.05
0.04
0
1.4
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
3.0
25
2.8
2.4
Power (W)
VGS(th) (V)
20
ID = 250 µA
2.6
2.2
2.0
15
10
1.8
5
1.6
1.4
- 50
- 25
0
25
50
75
100
125
150
0
0.01
0.1
1
10
100
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
1000
100
Limited by RDS(on)*
10
I D - Drain Current (A)
100 µs
1 ms
1
10 ms
0.1
TA = 25 °C
Single Pulse
0.01
100 ms
1s
10 s
DC
0.001
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum V GS at which R DS(on) is specified
Safe Operating Area
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N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
4.0
6
3.5
5
Power Dissipation (W)
ID - Drain Current (A)
3.0
4
3
2
2.5
2.0
1.5
1.0
1
0.5
0.0
0
25
50
75
100
125
0
150
25
50
75
100
125
150
TC - Case Temperature (°C)
TC - Case Temperature (°C)
Power Derating
Current Derating*
IC - Peak Avalanche Current (A)
100
10
TA =
1
0.000001
L . ID
BV - VDD
0.00001
0.0001
0.001
TA - Time In Avalanche (s)
Single Pulse Avalanche Capability
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 90 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
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P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
25
25
VGS = 10 thru 5 V
20
I D - Drain Current (A)
I D - Drain Current (A)
20
15
4V
10
15
10
TC = 125 °C
5
5
3V
25 °C
- 55 °C
0
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
50
60
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
1500
0.11
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0.10
0.09
0.08
0.07
VGS = 4.5 V
VGS = 10 V
0.06
1200
Ciss
900
600
0.05
300
Coss
0.04
0.00
Crss
0
0
5
10
15
20
25
0
10
20
ID - Drain Current (A)
40
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
2.2
10
VDS = 30 V
ID = 3.1 A
2.0
8
R DS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
30
6
4
VGS = 10 V
ID = 3.1 A
1.8
1.6
1.4
1.2
1.0
2
0.8
0
0
3
6
9
Qg - Total Gate Charge (nC)
Gate Charge
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12
15
0.6
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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P-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
0.40
20
0.35
10
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
TJ = 150 °C
TJ = 25 °C
1
0.0
0.30
0.25
ID = 3.1 A
0.20
0.15
0.10
0.05
0.00
0.2
0.4
0.6
0.8
1.0
0
1.2
2
6
8
10
On-Resistance vs. Gate-to-Source Voltage
0.6
50
0.4
40
ID = 250 µA
Power (W)
V GS(th) Variance (V)
Source-Drain Diode Forward Voltage
0.2
0.0
- 0.2
- 0.4
- 50
4
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
30
20
10
- 25
0
25
50
75
100
125
150
0
10-3
10-2
10-1
1
10
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power
100
600
100
IDM Limited
Limited
by R DS(on)*
I D - Drain Current (A)
10
P(t) = 0.0001
1
P(t) = 0.001
ID(on)
Limited
0.1
P(t) = 0.01
P(t) = 0.1
TA = 25 °C
Single Pulse
0.01
0.1
BVDSS Limited
P(t) = 1
P(t) = 10
DC
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum V GS at which R DS(on) is specified
Safe Operating Area, Junction-to-Case
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P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
4.0
3.5
ID - Drain Current (A)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
25
50
75
100
125
150
TC - Case Temperature (°C)
Current Derating*
4.5
100
IC - Peak Avalanche Current (A)
4.0
Power Dissipation (W)
3.5
3.0
2.5
2.0
1.5
1.0
10
TA =
L . ID
BV - VDD
0.5
0.0
0
25
50
75
100
125
TC - Case Temperature (°C)
Power Derating, Junction-to-Foot
150
1
0.000001
0.00001
0.0001
0.001
TA - Time In Avalanche (s)
Single Pulse Avalanche Capability
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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AOD603A
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P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 85 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
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data are subject to change without notice.
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