2R090TD-8

Gas Discharge Tube Diodes 2R075~2R800(T,S)B/D-8 Series GDTs (Gas Discharge Tubes) are placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment VZLWFKLQJRSHUDWLRQV7KHVHGHYLFHVGRQRWLQÀXHQFHWKHVLJQDO in normal operation. However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment. unit:(mm) 0.8±0.05 -*: 6±0.3 66±4 6±0.3 GDTs offer a high level of surge protection, a broad voltage range, low capacitance, and many form factors including new surface mount devices, which makes them suitable for applications such as MDF (Main Distribution Frame) modules, high data-rate telecom applications (e.g. ADSL, VDSL), and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PTC devices, TSS thyristor surge protection devices, and MOV (Metal Oxide Varistor) devices, they can help equipment manufacturers meet Dimension 4±0.5 4±0.5 8±0.3 8±0.3 (T)Series -*: (S)Series Features ‡5R+6FRPSOLDQWDQG/HDGIUHH ‡*+]ZRUNLQJIUHTXHQF\ ‡([FHOOHQWVWDELOLW\RQPXOWLSOHSXOVHGXW\F\FOH ‡([FHOOHQWUHVSRQVHWRIDVWULVLQJWUDQVLHQWV ‡8OWUD/RZ,QVHUWLRQ/RVV ‡.$.$VXUJHFDSDELOLW\WHVWHGZLWKȝ6SXOVH DVGH¿QHGE\,(& ‡8OWUDVPDOOGHYLFHVRIIHUHGLQDYDULHW\RI mounting lead forms ‡1RQ5DGLRDFWLYH ‡/RZFDSDFLWDQFHS) ‡9ROWDJH5DQJHV9WR9 ‡8/UHFRJQL]HG ‡&RQIRUPVWR,787.,(& Applications ‡&RPPXQLFDWLRQHTXLSPHQW ‡&$79HTXLSPHQW ‡7HVWHTXLSPHQW ‡'DWDOLQHV ‡3RZHUVXSSOLHV ‡7HOHFRP6/,&SURWHFWLRQ ‡%URDGEDQGHTXLSPHQW ‡$'6/HTXLSPHQWLQFOXGLQJ$'6/ ‡;'6/HTXLSPHQW ‡6DWHOOLWHDQG&$79HTXLSPHQW ‡*HQHUDOWHOHFRPHTXLSPHQW All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. GDT 01 (OHFWULDFO&KDUDFWHULVWLFV DC Sparkover voltage Maimum Impulse sparkover voltage Impuise life YV NYXV XV$ Type number V V 576% ±20%  576% 90±20%  576% ±20%  576% 230±20%  576% 300±20% 900 576% ±20% 1000 576% ±20% 1000 576% ±20% 1200 576% ±20% 1200 576% ±20% 1300 576' ±20%  576' ±20%  576' 90±20%  576' ±20%  576' 230±20%  576' 300±20%  576' ±20% 1000 576' ±20% 1000 576' ±20% 1200 576' ±20% 1200 576' ±20% 1300 576' ±20%  Times Minimum Insulation resistance Test Voltage Maximum Capacitance Maximum surge Discharge Current Altermationg Dischare Curiren 0+] #XVWLPHV +]6 pF .$ A .$ 10A .$ 20A GŸ DC(V) '&9 >1 '&9 >1 DC 100V >1 '&9 >1 WLPHV '&9 >1 S) '&9 >1 DC 100V >1 '&9 >1 1RWHV ,QVXODWLRQUHVLVWDQFHPHDVXUHDW '&9IRUWKH55DQG5 DC 200V for other. 7HUPVLQDFFRUGDQFHZLWK,787.DQG*%7 $WGHOLYHU\$4/OHYHO',1,62 GDT 02 All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. Pb – Free assembly tP TP Critical Zone TL to T P Ramp-up Pre Heat s(min) ) -Temperature Max (T s(max) -Time (Min to Max) (t s 150°C ) 200°C ) Tem p er at u r e -Temperature Min (T 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max -Temperature (T L) (Liquidus) 217°C -Temperature (t L) 60 – 150 seconds +0/-5 tL Ramp-down Preheat TS(min) tS 25 Peak Temperature (T P) 260 Time within 5°C of actual peak Temperature (t p ) 10 – 30 seconds Ramp-down Rate TL TS(max) time to peak temperature (t 25ºC to peak) Time °C 6°C/second max ) P Time 25°C to peak Temperature (T 8 minutes Max. Do not exceed 260°C Soldering Parameters - Wave Soldering (Thru-Hole Devices) Recommended Process Parameters: 280 Wave Parameter 260 240 Lead-Free Recommendation Preheat: 220 (Depends on Flux Activation Temperature) (Typical Industry Recommendation) 200 180 160 140 Temperature Minimum: 100° C Temperature Maximum: Preheat Time: 150° C 60-180 seconds 120 100 Solder Pot Temperature: 280° C Maximum Solder Dwell Time: 2-5 seconds 80 60 40 240 230 220 210 200 190 180 170 160 150 140 130 120 110 90 100 80 70 60 50 40 20 0 0 30 20 10 Temperature (°C) - Measured on bottom side of board 300 Time (Seconds) Cooling Time Preheat Time Dwell Time Soldering Parameters - Hand Soldering Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. All data is subject to change,Please check our data sheets at ZZZOHLGLWHFKFRP for updates. GDT 03 Packaging Dimensions For 'T' Type Axial Lead Items