CMBA054949

Model : CMBA054949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base (thickness) : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad : Antioxidant Treatment Plastic (UL94-V0) T725 or others Performance 15x15 7.2 0.24 6.6 0.22 6.0 0.20 5.4 0.18 4.8 0.16 4.2 0.14 3.6 0.12 3.0 0.10 2.4 0.08 1.8 0.06 1.2 0.04 0.6 0.02 0.0 0 100 200 300 400 500 600 700 Air Velocity (LFM) 800 900 Pressure drop (in-H2O) Rsa (oC/W) Heat Source (LxW) 0.00 100 0 No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : http://www.malico.com.tw H=12 H=21 H=33