CL-Y-35X35

Model : CMBA023535 Series For 35x35 Chip set BGA Heat Sink CMBA023535 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 35x35mm Height : 12,15,18,21,23,28,33 mm Base (thickness) : 2.6mm 3.Finish: Black Anodize 4.Chip set package thickness and clip color 3.3+/-0.25mm - Yellow clip 1.7+/-0.25mm - Blue clip 0.8+/-0.25mm - Orange clip 5.Accessory : Clip : Plastic (UL94-V0) Thermal pad : T710 or others Performance 15x15 3.5 0.35 3.0 0.30 2.5 0.25 2.0 0.20 1.5 0.15 1.0 0.10 0.5 0.05 Pressure drop (in-H2O) Thermal resistance Rca (oC/ W) Heat Source (LxW) H=25 H=20 H=12 H=25 0.0 0.00 0 100 200 300 400 500 600 700 800 Air Velocity (LFM) No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : http://www.malico.com.tw