CMLM1608C4R7MIT

CMLM1608C4R7MIT Multilayer Power Inductors Name COMPOSITE SPECIFICATION CMLM1608C4R7MIT 1 SPEC# CMLM1608C4R7MIT 8 1. Scope This specification applies to the CMLM1608C4R7MIT series Multilayer Power Inductors 2. Standard and Atmospheric Conditions Unless otherwise specified the standard range of atmospheric conditions for making measurements and tests is as follows: Ambient temperature : 20±15℃ Relative humidity : 30~70% If there may be any doubt on the results, measurements shall be made within the following limits : Ambient temperature : 25±5℃ Relative humidity : 30~70% 3. Ratings SELF-RESONANT INDUCTANCE PART NO 4.7uH±20% CMLM1608C4R7MIT RATED CURRENT FREQUENCY(MHz) Min AT1 MHz 250mV ※ DC RESISTANCE (Ω) (mA)Max 0.65±20% 500 ※The maximum rated current : the DC current value having temperature increased 40 ℃ after thru DC current 2 hours at ambient temperature. Regarding to the inductance variability of rated current, please refer to page 2: Inductance Vs. DC superposition characteristics. 4. Dimensions unit: mm (inch) OPERATING TEMP. RANGE : -55℃ ~ +125℃ STORAGE TEMP. RANGE : -10℃ ~ +40℃ TYPE L W T A(m/m) CMLM1608 PLANNED BY CHECKED BY APPROVED BY LUN TINA Chi Chi Huang 1.6±0.15 0.8±0.15 0.8±0.15 0.2~0.6 (0.063±0.006) (0.031±0.006) (0.031±0.006) (0.008~0.024) CMLM1608C4R7MIT Multilayer Power Inductors Name CMLM1608C4R7MIT Reference curve COMPOSITE SPECIFICATION SPEC# CMLM1608C4R7MIT 2 8 CMLM1608C4R7MIT Multilayer Power Inductors Name CMLM1608C4R7MIT 3 COMPOSITE SPECIFICATION 8 SPEC# CMLM1608C4R7MIT 6. Reflow soldering conditions Temperature(℃) ˙ Pre－heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre－heating may cause cracks on the ferrite, resulting in the deterioration of product quality. ˙ Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode, when soldering is repeated, allowable time is the accumulated time. 270 260 250 240 230 0 10 20 30 40 50 60 70 Temperature Profile A B C D E Slope of temp. rise Heat time Heat temperature Slope of temp. rise Time over 230℃ ※ 1 to 5 ※ ℃/sec 50 to 150 ※ sec 120 to 180 ※ ℃ 1 to 5 ※ ℃/sec 90~120 ※ sec Peak temperature 255~260 ※ ℃ Peak hold time 10 max. ※ sec ※ times No. of mounting 3 (Melting area of solder) 6-1 Reworking with soldering iron 150℃, 1 minute Preheating 280℃ max. Tip temperature Soldering time 3 seconds max. Soldering iron output 30w max. φ 3mm max. End of soldering iron ˙Reworking should be limited to only one time. Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. Upper Limit 6-2 Solder Volume Recommendable Solder shall be used not to be exceed the upper limits as shown below. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. CMLM1608C4R7MIT Multilayer Power Inductors Name CMLM1608C4R7MIT COMPOSITE SPECIFICATION SPEC# 4 8 CMLM1608C4R7MIT 7. Equipment 7-1 Inductance Inductance shall be measured with HP－4286A Inductance analyzer or equivalent system 7-2 DC RESISTANCE DC resistance shall be measured using HP 4338 digital mili－ohm meter with 4 terminal method. 8. Mechanical Characteristics ITEM Terminal Strength Specification Without deformation cases inductance shall be satisfied ± 20% Test Conditions Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec DC resistance shall be satisfied. Substrate Without deformation cases, Bending Test inductance shall be satisfied ± 20% DC resistance shall be satisfied. After soldering a chip to a test substrate, bend the substrate by 3mm hold for 10s and then return. Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering. Bending unit : mm 0.8 45 40 45 100 Resistance No visible damage Solder Temp. : 265±3℃ to Solder Heat Electrical characteristics and mechanical Immersion time : 6±1 sec characteristics shall be satisfied. Preheating : 100℃ to 150℃, 1 minute. Consult standard MIL-STD-202 METHOD 210 Solderability 95% min. coverage of all metabolised area Consult standard J-STD-002 Measurement to be made after keeping at room temp for 24±2 hrs. Solder : Sn-3Ag-0.5Cu Solder temp. : 240±5℃ Immersion time : 3±1 sec Solder : Sn-3Ag-0.5Cu CMLM1608C4R7MIT Name Multilayer Power Inductors CMLM1608C4R7MIT COMPOSITE SPECIFICATION SPEC# CMLM1608C4R7MIT 9. RELIABILITY AND TEST CONDITIONS 9-1 HIGH TEMPERATURE RESISTANCE a. Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Temperature: 125℃ ±2℃ 2.Testing time：1000±12hrs 3.Measurement：After placing at room ambient temperature for 24 hours minimum 9-2 Biased Humidity RESISTANCE a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Humidity: 85 ± 5%RH 2. Temperature: 85℃ ±2℃ 3.Testing time: 1000 ± 12 hours 4.Measurement：After placing at room ambient temperature for 24 hours minimum 9-3 TEMPERATURE CYCLE a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1. Low Temperature: - 55℃ ±5℃ kept stabilized for 30 minutes each 2. High Temperature: 125℃ ±5℃kept stabilized for 30 minutes each 2.Cycle：1000 cycles 3.Measurement：After placing for 24hours minimum at room ambient temperature 4. step1. -55℃ temp±3℃ 30±3 minutes step2. Room temperature 2to5 minutes step3. +125℃ temp±3℃ 30±3 minutes step4. room temperature 2to5 minutes 9-4 VIBRATION TEST a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Frequency and Amplitude:10-2000-10Hz 2.Direction:X,Y,Z. 3.Test duration:4 hours for each direction,12hours in total. 9-5 Mechanical Shock TEST a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.peak acceleration ：100 g's 2.Duration of pulse：6 ms 3.Waveform ：Half-sine 4.Velocity change ：12.3 ft/sec 5. Direction：X，Y，Z（3axes/3 times） 9-6 Operational Life a. Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Temperature: 125℃ ±2℃ 2.Testing time：1000±12hrs 3.Measurement：After placing at room ambient temperature for 24 hours minimum 9-7 Electrostatic discharge test a. Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.ESD voltage: 15k volts 2.Mode 1:150 pF/330 Ohm 3.Mode 2:150 pF/2000 Ohm 9.1 REMARK The reliability test customers if there are special requirements in accordance with customer needs 5 8 CMLM1608C4R7MIT Multilayer Power Inductors Name CMLM1608C4R7MIT PAPER CARRIER TYPE PACKING COMPOSITE SPECIFICATION SPEC# CMLM1608C4R7MIT 6 8 CMLM1608C4R7MIT Multilayer Power Inductors COMPOSITE SPECIFICATION Name CMLM1608C4R7MIT SPEC# CMLM1608C4R7MIT 10-5 PEELING STRENGTH OF COVER TAPE Cover tape 7 8 (10g~100g) 165°~180° Test condition 1. peel angle：165°~180° vs carrier tape 2. peel speed：300mm/min 11. Packaging 1. Tape & Reel packaging in composite specification 6/8 2) Reel and a bag of desiccant shall be packed in Nylon or plastic bag 3) Maximum of 5 reels shall be packaged in a inner box 4) Maximum of 6 inner box shall be packaged in a outer box 12. Reel Label Producing the goods label needs to indicate (1 ) Pb Free (2) RoHS Compliant CMLM1608C4R7MIT Multilayer Power Inductors COMPOSITE SPECIFICATION CMLM1608C4R7MIT SPEC# CMLM1608C4R7MIT NAME 13. Storage 13-1The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Packages must be stored at 40℃ or less and 70﹪RH or less. 13-2 The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). 13-3 Packaging material may be deformed if packages are stored where they are exposed to heat or direct sun－ light. 13-4 Minimum packages, such as polyvinyl heat－seal packages shall not be opened until just before they are used. If opened, use the reels as soon as possible. 13-5 Solderability specified in composite specification 4/8 shall be for 6 months from the date of delivery on condition that they are stored at the environment specified clause 13-1 & 13-2. For those parts which passed more than 6 months shall be checked solderability before it is used. 14. Quality System ■ ■ ISO/TS16949 IECQ QC 080000 8 8