EBLS321609-3R3K

COMPONENT SPECIFICATION 版次：第3版 N A M E MULTILAYER CHIP INDUCTORS EBLS-201212 COMPOSITE SPECIFICATION SPEC# 1 8 EBLS2012-101K 1. SCOPE This specification applies to the EBLS-2012 series Multilayer Chip Inductors 2. STANDARD ATMOSPHERIC CONDITIONS Unless otherwise specified the standard range of atmospheric conditions for making measurements and tests is as follows: Ambient temperature : 20±15℃ Relative humidity : 30~70% If there may be any doubt on the results, measurements shall be made within the following limits : Ambient temperature : 25±5℃ Relative humidity : 30~70% 3. RATINGS PART NO EBLS2012-101K INDUCTANCE Q AT 1 MHz 60mV 100μH±10% Min 25 4. DIMENSION SELF-RESONANT FREQUENCY(MHz) Min 7 DATE REVISION CHECKED BY APPROVED BY JSHING 表格編號：034承認書 A HSU (Ω) Max (mA)Max 3.1 2 OPERATING TEMP. RANGE : -40℃ ~ +85℃ STORAGE TEMP. RANGE : -10℃ ~ +40℃ TYPE L W T A(m/m) EBLS-2012 2.0±0.2 HISTORY PLANNED BY DC RESISTANCE RATED CURRENT Chi Chi Huang 1.25±0.2 1.25±0.2 0.2~0.8 SIGN. SIGN. 2 COMPONENT SPECIFICATION 版次：第3版 N A M E MULTILAYER CHIP INDUCTORS COMPOSITE SPECIFICATION EBLS-201212 SPEC# EBLS2012-101K 2 INDUCTANCE VS DC SUPERPOSITION CHARACTERISTICS IMPEDANCE VS FREQUENCY CHARACTERISTICS Q VS FREQUENCY CHARACTERISTICS 表格編號：034承認書 A 8 3 COMPONENT SPECIFICATION 版次：第3版 3 MULTILAYER CHIP INDUCTORS COMPOSITE SPECIFICATION EBLS-201212 SPEC# EBLS2012-101K 8 6) Reflow soldering conditions ˙ Pre－heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max.Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Unenough pre－heating may cause cracks on the ferrite, resulting in the deterioration of product quality. ˙ Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode, When soldering is repeated, allowable time is the accumulated time. Temperature(℃) N A M E Temperature Profile 270 260 250 240 230 0 10 20 30 40 50 60 70 A B C D E Slope of temp. rise ※ 1 to 5 Heat time 50 to 150 ※ sec 120 to 180 ※ ℃ ※ ℃/sec 1 to 5 Heat temperature Slope of temp. rise ※ ℃/sec Time over 230℃ Peak temperature 90~120 ※ sec 255~260 ※ ※ time Peak hold 10 max. ※ ℃ sec ※No. of mounting 3 ※ times (Melting area of solder) 6-1 Reworking with soldering iron Preheating 150℃, lminute Tip temperature 280℃ max Soldering time 3seconds max. Soldering iron output 30w max. End of soldering iron ∮3mm max. ˙Reworking should be limited to only one time. Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. Upper Limit 6-2 Solder Volume Recommendable Solder shall be used not to be exceed the upper limits as shown below. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 表格編號：034承認書 A 4 COMPONENT SPECIFICATION 版次：第3版 N A M E MULTILAYER CHIP INDUCTORS EBLS-201212 4 COMPOSITE SPECIFICATION SPEC# 8 EBLS2012-101K 7 EQUIPMENT 7-1 IMPEDANCE Impedance shall be measured with HP－4286A impedance analyzer or equivalent system 7-2 DC RESISTANCE DC resistance shall be measured using HP 4338 digital mili－ohm meter with 4 terminal method. 8.MECHANICAL CHARACTERISTICS ITEM Specification TEST CONDITIONS TERMINAL Without deformation cases Solder chip on PCB and applied 10N STRENGTH impedance shall be satisfied ±20% (1.02Kgf) for 10 sec DC resistance shall be satisfied. Substrate Without deformation cases, After soldering a chip to a test substrate, bending test inductance shall be satisfied ± 20% bend the substrate by 3mm hold for 10s DC resistance shall be satisfied. and then return. Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering. Bending unit : mm 0.8 45 40 45 100 RESISTANCE No visible damage Solder Temp. : 265±3℃ TO SOLDER Electrical characteristics and mechanicalImmersion time : 6±1 sec HEAT characteristics shall be satisfied. Preheating : 100℃ to 150℃, 1 minute. SOLDER－ ABILITY Consult standard MIL-STD-202 METHOD 210 95% min. coverage of all metabolised area Consult standard J-STD-002 表格編號：034承認書 A Measurement to be made after keeping at room temp for 24±2 hrs. Solder : Sn-3Ag-0.5Cu Solder temp. : 240±5℃ Immersion time : 3±1 sec Solder : Sn-3Ag-0.5Cu 5 COMPONENT SPECIFICATION 版次：第3版 N A M E MULTILAYER CHIP INDUCTORS EBLS-201212 COMPOSITE SPECIFICATION SPEC# 5 EBLS2012-101K 9. RELIABILITY AND TEST CONDITIONS 9-1 HIGH TEMPERATURE RESISTANCE a. Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Temperature +85℃±2℃ 2.Applied current：Rated current 3.Testing time：1008±12hrs (maximum value) 4.Measurement：After placing at room ambient temperature for 24 hours minimum 9-2 HUMIDITY RESISTANCE a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Humidity：90 to 95﹪RH 2.Temperature：60±2℃ 3.Applied current：Rated current (maximum value) 4.Testing tine：1008±12hours 5.Measurement：After placing at room ambient temperature for 24 hours minimum 9-3 TEMPERATURE CYCLE a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Temperature -40℃,+85℃ kept stabilized for 30 minutes each 2.Cycle：100 cycles 3.Measurement：After placing for 24hours minimum at room ambient temperature 4. step1. -40℃ temp±3℃ 30±3 minutes step2. Room temperature 2to5 minutes step3. +85℃ temp±2℃ 30±3 minutes step4. room temperature 2to5 minutes 9-4 LOW TEMPERATURE STORAGE LIFE TEST a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Temperature -40℃±2℃ 2.Testing time：1008±12hours 3.Measurement：After placing for 24 hours minimum at room ambient temperature 9-5 THERMAL SHOCK a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Temperature -40℃,+85℃ kept stabilized for 30 minutes each 2.Cycle：100 cycles 3.Measurement：After placing for24 hours minimum at room ambient temperature 9-6 VIBRATION TEST a.Performance specification 1.Appearance：no mechanical damage 2.Inductance shall be with ±20﹪of the initial value b.Test condition 1.Waveform:Sine wave 2.Frequency:10~55~10 Hz 3.Sweep time:1min 4.Amplitude:1.5mm(peak-peak) 5.Direction:X,Y,Z(3 axes) 6.Duration:2 hrs./axis,total 6 hrs. 表格編號：034承認書 A COMPONENT SPECIFICATION 版次：第3版 N A M E MULTILAYER CHIP INDUCTORS EBLS-201212 6 COMPOSITE SPECIFICATION EBLS2012-101K SPEC# 8 10. EMBOSSED CARRIER TAPE PACKAGING 10-1 DIMENSIONS Unreeling direction A0 1.5 ±0.1 B0 2.35 ±0.1 W F 8.0 3.5 ±0.1 ±0.05 E 1.75 ±0.1 P1 4.0 ±0.1 P2 2.00 ±0.05 10-2 LEADER AND TRAILER TAPE P0 D0 D1 K T T2 4.0 1.55 1.00 1.67 0.22 1.67 ±0.1 ±0.05 ±0.1 ±0.15 ±0.05 ±0.25 10-3 DIRECTION THE DIRECTION SHALL BE SEEN FROM THE TOP OF COVER TAPE Unreeling direction 10-4 REELS PACKING QTY. 3,000 PCS REEL 表格編號：034承認書 A COMPONENT SPECIFICATION 版次：第3版 N A M E MULTILAYER CHIP INDUCTORS EBLS-201212 COMPOSITE SPECIFICATION SPEC# 10-5 PEELING STRENGTH OF COVER TAPE Cover tape 7 EBLS2012-101K (10g~100g) 165°~180° Test condition 1) peel angle：165°~180° vs carrier tape 2) peel speed：300mm/min 11.PACKAGING 1) Tape & Reel packaging in composite specification 6/8 2) Reel and a bag of desiccant shall be packed in Nylon or plastic bag 3) Maximum of 5 bags shall be packaged in a inner box 4) Maximum of 6 inner box shall be packaged in a outer box 12.Reel Label Producing the goods label needs to indicate (1 ) Pb Free (2) RoHS Compliant 表格編號：034承認書 A COMPONENT SPECIFICATION 版次：第3版 N A M E MULTILAYER CHIP INDUCTORS EBLS-201212 13. STORAGE COMPOSITE SPECIFICATION SPEC# 8 EBLS2012-101K 13-1The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Packages must be stored at 40℃ or less and 70﹪RH or less. 13-2 The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). 13-3 Packaging material may be deformed if packages are stored where they are exposed to heat or direct sun－ light. 13-4 Minimum packages, such as polyvinyl heat－seal packages shall not be opened until just before they are used. If opened, use the reels as soon as possible. 13-5 Solderability specified in composite specification 4/8 shall be for 6 months from the date of delivery on condition that they are stored at the environment specified clause 13-1 & 13-2. For those parts which passed more than 6 months shall be checked solderability before it is used. 14. Quality System ■ ISO/TS16949 ■ IECQ QC 080000 表格編號：034承認書 A 8