BCMS565018I1815A

深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX 版本编码 Version number： A5 产品规格书 PRODUCT SPECIFICATION 客户名称 CUSTOMER 宏业产品系列 BCMS 系列叠层片式超大电流磁珠 PRODUCT SERIES BCMS SERIES MULTILAYER CHIP POWER BEAD 宏业规格型号 PRODUCT TYPE 客户型号规格 CUSTOMER’S PRODUCT TYPE 研发 品质 业务 批准 深圳市宏业兴电子有限公司 SHENZHEN HONGYEX ELECTRONICS CO,.LTD. 传真 Fax number：0755-83295141 邮箱 Email：hy@hongyex.com 公司地址：广东省深圳市福田区深南中路佳和大厦 A 座 23 层 Company address: 23/F,Block A,Jiahe building,Shenzhen City,Guangdong Province,China 工厂地址：惠州市罗阳镇鸿达工业区五号宏业兴工业园 Factory address:Hongyexing Industrial Park, No.5, Hongda Industrial Zone,Luoyang Town,Huizhou 备注 REMARK: 客户回签 CUSTOMER APPROVAL City,Guangdong Province,China 第 1 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX 版本编码 Version number： A5 变更履历 Change list 序号 NO. 1 2 3 4 5 修改日期 DATE 2019.11.8 2019.11.29 2020.03.01 2020.05.28 2020.07.28 修改内容 CHANGE CONTENT 初版 First edition 更新联系方式 Update contact 更新物料 Update material 更新规格 Update specification 更新参数单位 Update parameter units 第 2 页 共 12 页 版本号 Version NO. A1 A2 A3 A4 A5 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX 版本编码 Version number： A5 1 用途 APPLICATIONS 广泛应用于通信、影音设备、计算机、遥控等领域。 Widely use in Communications, Video and audio equipment, Computer, Remote control, etc. 2 特点 FEATURES 高可靠的一体化结构； Monolithic structure for high reliability; 尺寸小； Compact size inductor possible; 磁屏蔽结构，不受干扰； No cross coupling due to magnetic shield; 适用于各类表面贴装工艺； Perfect shape for mounting with no directionality; 具有优异的可焊性和耐焊性。 Excellent solderability and high heat resistance for reflow soldering or wave soldering. 3 产品编码 PRODUCT IDENTIFICATION A 121 BCMS 100505 ① ② ③ ④ ① Type：Chip Ferrite Bead ② External Dimensions (L×W) (mm)：1.0×0.5 ③ Material Code: A, B, K ④ Nominal Inductance：121，120Ω 4 外形及尺寸 SHAPE AND DIMENSIONS Unit: mm[inch] Type BCMS100505 [0402] BCMS160808 [0603] BCMS201209 [0805] BCMS201212 [0805] BCMS321609 [1206] BCMS321611 [1206] BCMS322513 [1210] BCMS451616 [1806] BCMS453215 [1812] L 1.0±0.15 [.039±.006] 1.6±0.15 [.063±.006] 2.0(+0.3,-0.1) [.079(+.012,-.004)] 2.0(+0.3,-0.1) [.079(+.012,-.004)] 3.2±0.2 [.126±.008] 3.2±0.2 [.126±.008] 3.2±0.2 [.126±.008] 4.5±0.2 [.177±.008] 4.5±0.2 [.177±.008] 第 3 页 共 12 页 W 0.5±0.15 [.020±.006] 0.8±0.15 [.031±.006] 1.25±0.2 [.049±.008] 1.25±0.2 [.049±.008] 1.6±0.2 [.063±.008] 1.6±0.2 [.063±.008] 2.5±0.2 [.098±.008] 1.6±0.2 [.063±.008] 3.2±0.2 [.126±.008] T 0.5±0.15 [.020±.006] 0.8±0.15 [.031±.006] 0.9±0.2 [.035±.008] 1.25±0.2 [.049±.008] 0.9±0.2 [.035±.008] 1.1±0.2 [.043±.008] 1.3±0.3 [.051±.012] 1.6±0.3 [.063±.003] 1.5±0.3 [.059±.012] a 0.25±0.1 [.010±.004] 0.3±0.2 [.012±.008] 0.5±0.3 [.020±.012] 0.5±0.3 [.020±.012 0.5±0.3 [.020±.012] 0.5±0.3 [.020±.012 0.8±0.2 [.032±.008] 0.8±0.2 [.032±.008] 0.8±0.2 [.032±.008] 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX 版本编码 Version number： A5 5 特性参数 SPECIFICATIONS 详见附录 A。Please refer to Appendix A. 工作温度范围 Operating temperatrue range: -40 储存温度范围 Storage temperature range: -10 ℃~ +85℃ ℃~ + 70% RH. 40℃, 6 特性参考曲线 Characteristic Curve 详见附录 B。Please refer to Appendix B. 7 测试及可靠性 TESTING AND RELIABILITY 7.1 测试环境条件 Test Conditions 一般按照以下环境条件测试（有特殊要求的除外），： Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. 温度 Ambient Temperature: 20±15 ℃ b. 湿度 Relative Humidity: 65±20% c. 大气压 Air Pressure: 86 kPa to 106 kPa 如果对测试结果有疑义，可以按照以下条件复测： If any doubt on the results, measurements/tests should be made within the following limits: a. 温度 Ambient Temperature: 20±2 ℃ b. 湿度 Relative Humidity: 65±5% c. 大气压 Air Pressure: 86kPa to 106 kPa 7.2 测试及可靠性 Testing and reliability 测试与可靠性 Testing and reliability 直流电阻 RDC 阻抗值 Impedance (|Z|) 额定电流 Rated Current（Ir） 可焊性 SOLDER－ABILITY 耐焊性 RESISTANCE TO SOLDER HEAT 测试方法与要求 Test Methods and Remarks a. 标准值参考第 5 章节附录 A。Refer to Item 5 Appendix A. b. 测试仪器：高精度电阻表 HP4338B 或等效仪器。Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent. a. 标准值参考第 5 章节附录 A。Refer to Item 5 Appendix A. b. 测试仪器：高精度射频阻抗分析仪 Anglient E4991A+HP16192A 或等效仪器。 Test equipment: High Accuracy RF Impedance /Material Analyzer -Anglient E4991A+ HP16192A or equivalent. c. 测试信号 Test signal: -40dBm or 100mV. d. 测试频率参考第 5 章节。Test frequency refers to Item 5. a. 标准值参考第 5 章节。Refer to Item 5. b. 测试仪器：HP6632B 直流电源，数字点温计或等效仪器。 Test equipment: HP6632B system DC power supply, digital surface thermometer or equivalent. c. 额定电流＜1A，温升 ΔT≤20℃；额定电流≥1A，温升 ΔT≤40℃。Rated Current ＜1A，ΔT≤20℃； Rated Current ≥1A，ΔT≤40℃ . 至少 95%的焊接面完全被焊锡连续覆盖。95% min. coverage of all metabolised area. 焊锡温度 Solder temp. : 240±5 ℃ 浸入时间 Immersion time : 3±1 sec 焊锡 Solder : Sn-3Ag-0.5Cu 无可见损伤。电特性和机械特性满足产品规范或检验标准要求。No visible damage. Electrical characteristics and mechanical characteristics shall be satisfied. 焊锡温度 Solder Temp. : 265±3 ℃ 浸入时间 Immersion time : 6±1 sec 第 4 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX Be n d in g 预热 Preheating : 100 ℃ to 150℃, 1 minute. 在室温下放置 24±2 小时后测试检查。Measurement to be made after keeping at room temp for 24±2 hrs. 焊锡 Solder : Sn-3Ag-0.5Cu 试验后无破损现象，电感量应在±20%以 un it : m m 内，直流电阻应符合标准/规范要求。 Without deformation cases, Inductance 0 .8 shall be satisfied ± 20%, DC resistance 45 45 shall be satisfied. 将产品焊接在试验板上，如图所示在试验 板中间位置施加压力，使得试验板中心点 向下弯曲 2mm， 保持 10 秒。After soldering a chip to a test substrate,bend the substrate 100 by 2mm hold for 10s and then return. Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering. a.试验要求 Performance specification 1）外观 Appearance：无可见机械损伤 no mechanical damage 2）电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value b.试验条件 Test condition 1）波形 Waveform:正弦波 Sine wave 2）频率 Frequency:10~55~10 Hz 3）持续时间 Sweep time:1min 4）Amplitude:1.5mm(peak-peak) 5.Direction:X,Y,Z(3 axes) 6.Duration:2 hrs./axis,total 6 hrs. a.试验要求 Performance specification 1）外观 Appearance：无可见机械损伤 no mechanical damage 2）电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value b.试验条件 Test condition 1）温度 Temperature ：-40 各保持 30 分钟。-40 ℃,+85℃ ℃ 2）周期 Cycle：5 次。5 cycles. 3）检查 Measurement：试验后至少在室温条件下放置 24 小时以上。After placing at room ambient temperature for 24 hours minimum. a.试验要求 Performance specification 1）外观 Appearance：无可见机械损伤 no mechanical damage 2）电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value b.试验条件 Test condition 1）湿度 Humidity：90 to 95﹪RH 2）温度 Temperature：60±2 ℃ 3）加载电流 Applied current：额定直流电流 Rated current 4）试验时间 Testing tine：1000（+48,0）hours 5）检查 Measurement：试验后至少在室温条件下放置 24 小时以上。After placing at room ambient temperature for 24 hours minimum. a. 试验要求 Performance specification 1) 外观 Appearance：无可见机械损伤 no mechanical damage 2) 电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value b. 试验条件 Test condition 1) 温度 Temperature： +85 ℃±2℃ 2) 加载电流 Applied current：额定直流电流 Rated current 3) 试验时间 Testing time：1000（+48,0）hours 4) 检查 Measurement：试验后至少在室温条件下放置 24 小时以上。After placing at room ambient temperature for 24 hours minimum. a.试验要求 Performance specification 1）外观 Appearance：无可见机械损伤 no mechanical damage. 2）电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value. 40 弯曲 Bend 版本编码 Version number： A5 振动 Vibration 温度冲击 Temperature shock 湿热负载 HUMIDITY RESISTANCE 高温负载 HIGH TEMPERATURE RESISTANCE 低温储存 LOW TEMPERATURE 第 5 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX STORAGE LIFE 端头强度 TERMINAL STRENGTH 跌落 Drop 盐雾 Salt mist 版本编码 Version number： A5 b.试验条件 Test condition 1.温度 Temperature：-40 ℃±2℃ 2.试验时间 Testing time：1000（+48,0）hours 3.检查 Measurement：试验后至少在室温条件下放置 24 小时以上。After placing for 24 hours minimum at room ambient temperature. 无破损现象。Without deformation cases. 电感量变化应在±20%以内。Inductance shall be satisfied ± 20%. 直流电阻应满足标准要求。DC resistance shall be satisfied. 焊接在 PCB 上的产品应持续成熟 10N 推力共 10 秒，0603[0201]产品推力为 2N。Solder chip on PCB and applied 10N(1.02Kgf) for 10 sec.0603[0201] chip applied 2N. 试验后产品应无失效现象。Products shall be no failure after test. 产品跌落在混凝土地面或钢板上。It shall be dropped on concrete or steel board. 试验方法：自由落下。Method : free fall. 高度 Height : 100cm. 产品跌落方向：3 个方向。Attitude from which the product is dropped : 3 direction. 总次数：每个方向 3 次（共 9 次）。The number of times : 3 times for each direction (Total 9 times). a.试验要求 Performance specification 1）外观 Appearance：无可见机械损伤 no mechanical damage. 2）电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value. b.试验条件 Test condition 1）盐溶液溶度 Concentration of salt solution：（5±0.1）%. 2）PH：6.5-7.2 3）时间 Time：48±2h 8 包装及储存 Packaging, Storage 8.1 包装 Packaging （1）载带尺寸 Tape Dimensions(Unit: mm) Paper Tape 型号 Type A B P Tmax 0603[0201] 0.4±0.1 0.7±0.1 2.0±0.05 0.55 1005[0402] 0.65±0.1 1.25±0.1 2.0±0.05 0.8 1608[0603] 1.0±0.2 1.8±0.2 4.0±0.1 1.1 2012[0805] 1.5±0.2 2.3±0.2 4.0±0.1 1.1 3216[1206] 1.9±0.2 3.5±0.2 4.0±0.1 1.1 EMbossed Tape 型号 Type A B P Pmax Tmax 2012[0805] 1.55±0.2 2.25±0.2 4.0±0.1 1.45 0.3 3216[1206] 1.88±0.2 3.5±0.2 4.0±0.1 1.27 0.3 3225[1210] 2.9±0.2 3.5±0.2 4.0±0.1 1.65 0.28 4516[1806] 1.93±0.2 4.95±0.2 4.0±0.1 2.03 0.35 4532[1812] 3.66±0.2 4.95±0.2 4.0±0.1 1.95 0.33 第 6 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX （2）载带 Tape 版本编码 Version number： A5 （3）卷盘 REEL 型号 Type T(mm) 载带 Tape 数量 Quantity 0603[0201] 0.3±0.05 Paper Tape 10K 1005[0402] 0.5±0.15 Paper Tape 10K 1608[0603] 0.8±0.15 Paper Tape 4K 2012[0805] 0.9±0.2 Paper Tape 4K 1.25±0.2 Embossed Tape 3K 0.9±0.2 Paper Tape 4K 1.1±0.2 Embossed Tape 3K 3225[1210] 1.3±0.3 Embossed Tape 2K 4516[1806] 1.6±0.3 Embossed Tape 2K 4532[1812] 1.5±0.3 Embossed Tape 1K 3216[1206] （4）剥离力 PEELING OFF FORCE 剥离速度 Speed of peeling off 剥离力 Peeling off force 300mm/s 0.1N to 1N(10g to 100g). （5）包装 Packaging a. 卷盘和干燥剂一同放入尼龙或塑料袋中。Reel and a bag of desiccant shall be packed in Nylon or plastic bag. b. 每个内盒中最多装 2 个上述袋子。Maximum of 2 bags shall be packaged in a inner box. c. 每个外箱中最多装 8 个内盒。Maximum of 8 inner box shall be packaged in a outer box. 第 7 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX 版本编码 Version number： A5 8.2 储存 Storage 8.2.1 不得暴露在高温高湿环境下储存，否则导致产品外电极和焊接性恶化变差。建议包装好的产品储存 在低于 40 ℃ 、小于 70% RH 条件下。The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Packages must be stored at 40 ℃ or less ﹪RH or less. and 70 8.2.2 不得暴露在灰尘或腐蚀性气体（如氯化氢，亚硫酸气体或硫化氢等）环境下储存，否则会导致产品 外电极和焊接性恶化变差。The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). 8.2.3 如果暴露在阳光直射或加热环境下储存，会导致包装材料变形。Packaging material may be deformed if packages are stored where they are exposed to heat or direct sunlight. 8.2.4 采用聚乙烯热封载带形式的最小包装，在使用之前不要拆开。如果拆开了，应尽快使用卷盘保护起 来。Minimum packages, such as polyvinyl heat-seal packages shall not be opened until just before they are used.If opened, use the reels as soon as possible. 8.2.5 在符合 8.2.1 和 8.2.2 要求的环境下储存，从产品发货日期开始 6 个月内，产品的焊接性能够满足 7.2 规定的要求。Solderability specified in composite specification 7.2 shall be for 6 months from the date of delivery on condition that they are stored at the environment specified clause 8.2.1 & 8.2.2. 在产品使用之前，如果储存期超过 6 个月，则需要复检焊接性。For those parts which passed more than 6 months shall be checked solderability before it is used. 9 安装使用及注意事项 9.1 回流焊条件 Reflow soldering conditions 焊接之前产品应预热到 150 ℃ 。焊接后应冷却到 100 ℃ 。Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 ℃ max.Also soldering should be in such a way that the temperature difference is limited to 100 ℃ max. 如果预热不充分，会导致产品质量恶化。Unenough pre－heating may cause cracks on the ferrite, resulting in the deterioration of product quality. 产品应当按照下述曲线焊接。Products should be soldered within the following allowable range indicated by the slanted line. 作业前，应对焊锡炉进行校准确认，保证能够符合焊接工艺条件。The excessive soldering conditions may cause the corrosion of the electrode, When soldering is repeated, allowable time is the accumulated time. 第 8 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX 版本编码 Version number： A5 9.2 返工 Reworking with soldering iron 预热 Preheating 150℃, l minute 最高温度 Tip temperature 280℃ max 焊接时间 Soldering time 3seconds max. 电烙铁输出功率 Soldering iron output 30w max. 电烙铁焊头尺寸 End of soldering iron ∮3mm max. *返工仅限一次。Reworking should be limited to only one time. 注意 Note：为了避免焊接高温冲击导致产品本体开裂，电烙铁焊头焊锡时应避免直接与产品接触。Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 9.3 焊料量 Solder Volume 焊料使用时，不得超过如下所示的上限要求。Solder shall be used not to be exceed the upper limits as shown below. 随着焊料的增加，产品承受的机械应力也随之增加。过量的焊料所产生的机械应力，会导致产品出现 机械或电气特性失效。Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 第 9 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX 版本编码 Version number： A5 附录 A 电气特性表 Appendix A Electrical Characteristics BCMS1608 Series Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS160808A260 6A 26 100 0.007 6000 0.8±0.15 [.031±.006] Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS201209H070 6A 7 100 0.008 6000 BCMS201209H110 6A 11 100 0.008 6000 BCMS201209A170 6A 17 100 0.008 6000 BCMS201209A300 6A 30 100 0.008 6000 BCMS201209A390 6A 39 100 0.008 6000 BCMS201209A600 6A 60 100 0.02 6000 BCMS201209A800 6A 80 100 0.02 6000 BCMS201209A121 6A 120 100 0.025 6000 Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS321611A310 6A 31 100 6 6000 BCMS321611A520 6A 52 100 8 6000 BCMS321611A800 4A 80 100 20 4000 BCMS321611A121 5A 120 100 25 5000 BCMS2012 Series 0.9±0.2 [.035±.008] BCMS3216 Series 1.1±0.2 [.043±.008] BCMS3225 Series Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS322513A520 6A 52 100 8 6000 BCMS322513A600 6A 60 100 8 6000 1.3±0.3 [.051±.012] 第 10 页 共 12 页 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX BCMS4516 Series 版本编码 Version number： A5 Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS451616A600 6A 60 100 8 6000 1.6±0.3 [.063±.012] Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS403022I560 10A 56 100 4 10000 BCMS4030 Series 2.28±0.2 [0.09±0.008] BCMS4532Series Part Number Impedance Unit Ω±25% Symbol BCMS453223I101 8A Test Max.DC resistance Max.rated Current Thichness MHz mΩ mA Mm[inch] |Z| Freq. DCR Ir T 100 100 7 8000 frequency 2.3±0.25 [0.091±0.01] BCMS5650Series Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS565015I171 4A 170 100 30 4000 BCMS565018I101 6A 100 100 6 6000 BCMS565018I151 5A 150 100 15 5000 1.8±0.25 BCMS565018I181 5A 180 100 20 5000 [0.071±0.01] BCMS565018I251 4A 250 100 15 4000 BCMS565032I271 4A 270 100 35 4000 3.2±0.25 BCMS565032I401 4.5A 400 100 30 4500 [0.126±0.01] BCHS565036I801 8A 800 100 10 8000 第 11 页 共 12 页 1.52±0.25 [0.06±0.01] 3.61±0.25 [0.142±0.01] 深圳市宏业兴电子有限公司 Shenzhen HongyeX Electronics Co.,Ltd. 文件编号 Document number： HYSP-BM000XX BCMS8530Series 版本编码 Version number： A5 Part Number Impedance Test frequency Max.DC resistance Max.rated Current Thichness Unit Ω±25% MHz mΩ mA Mm[inch] Symbol |Z| Freq. DCR Ir T BCMS853022I101 10A 100 100 4 10000 第 12 页 共 12 页 2.28±0.2 [0.09±0.008]