CRH252010S-2R2MT

Specification Sheet for SMD Power Inductor Specification Sheet for Approved Customer Name: Customer Part No.: Ceaiya Part No: CRH252010S 系列 Spec No: L2510 【For Customer Approval Only】 If you Approval, Please Stamp 【RoHS Compliant Parts】 Approved By Checked By 李庆辉 查 Prepared By 凯 劳水花 Shenzhen Ceaiya Electronics Co., Ltd. 地址 1: 深圳市龙华新区硅谷动力工业园（清湖园）A16 栋 2 楼 地址 2：广东省东莞清溪镇青滨东路 105 号力合紫荆智能制造中心 10 栋 Http//www.ceaiya.com Tel: 0769-89135516 Fax: 0769-89135519 1 Specification Sheet for SMD Power Inductor 【Version of Changed Record】 Rev. Effective Date Changed Contents Change Reasons Approved By 01 2018-12-18 New release / Li qing hui 2 Specification Sheet for SMD Power Inductor 1. Scope This specification applies to the CRH252010S Series of wire wound SMD power inductor. 2. Product Description and Identification (Part Number) 1) Description: CRH252010S series of Wire wound SMD power inductor. 2) Product Identification (Part Number) CRH 252010 S - 2R2 M T ① ② ③ ④ ⑤ ⑥ ① Type CRH ③ ② External Dimensions(L×W×H) 【mm】 Ferrite Inductor 252010 2.5×2.0×1.0 Feature type S ⑤ Standard Product ④ Inductance Tolerance N ±30% M ±20% ⑥ Nominal Inductance Example Example 1R0 1.0uH 100 10uH 101 100uH Packing T Tape Carrier Package 3. Electrical Characteristics Please refer to Item 5. 1） Operating temperature range (individual chip without packing): -40℃ ~ +125℃ （Including Self-heating）. 2） Storage temperature range (packaging conditions): -10℃ ~ +40℃ and RH 70% (Max.). 4. Shape and Dimensions (Unit:mm) Dimensions and recommended PCB pattern for reflow soldering, please see Fig4-1 and Table4-1 Fig4-1. Table 4-1. A B C D E F G H I 2.5± 0.2 2.0 ± 0.2 1.05Max 1.5±0.2 0.8±0.2 0.8±0.2 2.0Ref 0.8 Ref 0.85 Ref 3 Specification Sheet for SMD Power Inductor 5. Electrical Characteristics Part Number DC Resistance Inductance Saturation Current Heat Rating Current 1MHz/1V Max. Typ. Max. Typ. Max. Typ. Units uH Ω Ω A A A A Symbol L CRH252010S-R22MT 0.22±20% 0.034 0.026 3.60 4.40 2.75 3.00 CRH252010S-R24MT 0.24±20% 0.034 0.026 3.60 4.40 2.75 3.00 CRH252010S-R33MT 0.33±20% 0.043 0.033 3.60 4.30 2.45 2.70 CRH252010S-R47MT 0.47±20% 0.044 0.033 2.80 3.20 2.40 2.60 CRH252010S-R68MT 0.68±20% 0.062 0.051 2.75 3.10 2.10 2.35 CRH252010S-1R0MT 1.0±20% 0.080 0.066 2.05 2.50 1.85 2.05 CRH252010S-1R5MT 1.5±20% 0.108 0.085 1.70 2.05 1.55 1.70 CRH252010S-2R2MT 2.2±20% 0.150 0.130 1.50 1.75 1.35 1.50 CRH252010S-3R3MT 3.3±20% 0.228 0.170 1.10 1.35 1.05 1.20 CRH252010S-4R7MT 4.7±20% 0.330 0.280 1.00 1.15 0.90 1.00 CRH252010S-5R6MT 5.6±20% 0.480 0.370 0.90 1.05 0.80 0.90 CRH252010S-6R8MT 6.8±20% 0.480 0.400 0.80 0.95 0.72 0.80 CRH252010S-8R2MT 8.2±20% 0.572 0.463 0.73 0.85 0.69 0.78 CRH252010S-100MT 10±20% 0.600 0.500 0.65 0.75 0.67 0.74 CRH252010S-120MT 12±20% 0.850 0.700 0.58 0.62 0.58 0.62 CRH252010S-150MT 15±20% 1.05 0.820 0.50 0.60 0.45 0.50 DCR Isat Irms Note:※1: Rated current: Isat(max.)or Irms(max.),whichever is smaller; ※2: Saturation Current: Max. Value, DC current at which the inductance drops less than 30% from its value without current; Typ. Value, DC current at which the inductance drops 30% from its value without current; ※3: Irms: DC current that causes the temperature rise (△T) from 20℃ ambient. For Max. Value, △T＜40℃; for Typ. Value, △T is approximate 40℃. The part temperature (ambient + temp. rise) should not exceed 125℃ under worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. Structure The structure of CRH252010S product. NO. Components Material ① Core Ni-Zn Ferrite ② Wire Polyurethane system enameled copper wire ③ Magnetic Glue Epoxy resin and magnetic powder ④ Electrodes AgNiSn or FeNiCu + Sn Alloy △f: Clearance between terminal and the surface of plate must be 0.1mm max when coil is placed on a flat plate. 4 Specification Sheet for SMD Power Inductor 7. Reliability Test Items 7.1 Terminal Strength Requirements Test Methods and Remarks No removal or split of the termination or other defects shall occur. 1) Solder the inductor to the testing jig (glass epoxy board shown in Fing.7.1-1) using eutectic solder. Then apply a force in the direction of the arrow. 2) 10N force. 3) Keep time: 5±2s X Y 7.2 High Temperature Fig.7.1-1 1. No visible mechanical damage. 2. Inductance change: Within ±10% 1) Storage Temperature :125+/-5℃ 2) Duration : 96 ±4 Hours 3) Recovery : then measured at room ambient temperature after placing 24 hours. 7.3 1. No visible mechanical damage 1) Temperature and time: -40±5℃ Low 2. Inductance change: Within ±10% 2) Duration: 96 4 hours 3) TRecovery : then measured at room ambient temperature after placing 24 hours. 1. No visible mechanical damage. 2. Inductance change: Within ±10% 1) Frequency range:10HZ~55HZ~10HZ Temperature 7.4 Vibration test ± 2) Amplitude:1.5mm p-p 3) Direction:X,Y,Z 4) Time:1 minute/cycle,2hours per axis 7.5 High Temperature Storage Tested 1. No visible mechanical damage. 2. Inductance change: Within ±10% 7.6 Resistance to Soldering Heat 1. No visible mechanical damage. 2. Inductance change: Within ±10% 1) Storage Temperature :60+/-2℃ 2) Relative Humidity :90-95% 3) Duration : 96 ±4 Hours 4) Recovery : then measured at room ambient temperature after placing 24 hours. 1) Re-flowing Profile: Please refer to Fig.7.6-1 2) Test board thickness: 1.0mm 3) Test board material: glass epoxy resin 4) The chip shall be stabilized at normal condition for 1~2 hours before measuring Fig.7.6-1 7.7 1. No visible mechanical damage. 1) Temperature and time: -40±3℃ for 30±3 min→105℃ Thermal Shock 2. Inductance change: Within ±10% for 30±3min, please refer to Fig.7.7-1. 2) Transforming interval: Max, 3 minute 105℃ 3) Tested cycle: 100 cycles 4) The chip shall be stabilized at normal condition for 1~2 hours before measuring Max 3 minute Fig.7.7-1 5 Specification Sheet for SMD Power Inductor 8.Packaging and Marking: 8-1.Carrier Tape Dimensions: E P P2 W F P0 ITEM W A0 B0 K0 P F E D0 P0 P2 T DIM 8.00 2.35 2.65 1.2 4.00 3.5 1.75 1.50 4.00 2.00 0.25 TOLE ±0.3 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 +0.1 ±0.1 ±0.1 ±0.05 8-2.Taping Dimensions: 8-3.Reel Dimensions: Carrier Tape Reel B A C N G Type A 8mm 178 B 20.7±0.8 8-4. Packaging Quantity: 2KPCS/ Reel 20KPCS/ Inner Box C 13±0.4 G N T 9 60 10.8 80KPCS/ Outer Box 9. Visual Inspection Standard of Product 6 Specification Sheet for SMD Power Inductor 7