CHT-PLA9486A-TDFP16-T 数据手册
CHT-ELARA
DATASHEET
80V High Temperature Quad Diode
Version: 1.6
14-Dec-23
(Last Modification Date)
General description
Features
The CHT-ELARA is a high temperature
•
Specified from -55 to +225°C (Tj)
80V/500mA quad diode in a hermetically
•
Reverse voltage: VR = 80V (max)
sealed TDFP16 ceramic package. It is de-
•
Forward current: IF = 450 mA (max
signed to achieve high performance in an
extremely wide temperature range: typical
@ 225°C (Tj) and VF = 1.5V)
•
Forward voltage:
operation temperature goes from -55°C to
225°C while keeping leakage currents low.
VF = 0.6V (typ. @ IF = 1mA)
•
Junction capacitance:
This quad diode can be used in a variety of
Cj=15pF (typ. @ VR = 25V)
applications, including rectification, clamp-
•
Dielectric isolation: min 80V
ing and general purpose.
•
Monolithic design
o
Excellent matching between
on-die diodes
A1
o
C1
A2
C2
Superior thermal tracking
•
Low thermal resistance
•
Package: Hermetically sealed
TDFP16 ceramic package
C3
A3
C4
A4
•
Validated at 225°C for 1000 hours
(and still on-going)
CHT-ELARA
Applications
• Full bridge rectification
• Power supplies
• General purpose diode
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CHT-ELARA
Datasheet
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Package Configuration1,2
A1
A1 1
16 C1
A1 2
15 C1
A2 3
14 C2
A2 4
13 C2
C3 5
12 A3
C3 6
11 A3
C4 7
10 A4
C4 8
9
A4
A1
Pin #
Pin name
Pin description
A1
Anode diode 13 (should be
connected to the most negative voltage of the application (even if diode “A1-K1” is
not used)
2
A1
Anode diode 13 should be
connected to the most negative voltage of the application (even if diode “A1-K1” is
not used)
3
A2
Anode diode 2
4
A2
Anode diode 2
5
C3
Cathode diode 3
6
C3
Cathode diode 3
7
C4
Cathode diode 4
8
C4
Cathode diode 4
9
A4
Anode diode 4
10
A4
Anode diode 4
11
A3
Anode diode 3
12
A3
Anode diode 3
13
C2
Cathode diode 2
14
C2
Cathode diode 2
15
C1
Cathode diode 1
16
C1
Cathode diode 1
1
1
Pins with the same name are internally connected
Package heat sink (exposed pad) is internally connected to terminal A1
3 See Mode of operations section
2
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CHT-ELARA
Datasheet
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Absolute Maximum Ratings
Reverse voltage VR
Forward surge current IFSM
Power dissipation Tc=25°C
Junction temperature Tj
Operating Conditions
80V
1A
3W
250°C
Reverse voltage VR
Continuous forward current IF
Forward voltage VF
Power dissipation Tc=25°C
Junction temperature
0V to 80V
0mA to 900mA
0V to 2V
3W
-55°C to +225°C
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CHT-ELARA
Datasheet
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Electrical characteristics (per diode)
Unless otherwise stated, Tj = 25°C. Bold figures point out values valid over the whole temperature range (T j = -55°C
to +225°C).
Parameter
Forward voltage
Symbol
VF
Condition
IF=1mA, Tj=25°C
VF=1.5V; Tj=25°C
Forward current
IF
Reverse leakage current
IR
Breakdown reverse voltage
Junction capacitance
Reverse recovery time4
V(BR)
Cj
trr
Peak reverse recovery current
Irrp
VR=25V; f = 1 MHz
VR = 80V
IF = 900 mA
Ta = 25°C
Symbol
ΘJC
ΘJA
Condition
TDFP16 package
TDFP16 package
Min
VF=1.5V; Tj=225°C
VR=80V, Tj=25°C
VR=80V, Tj=225°C
Typ
0.65
450
Max
450
2
2.5
Unit
V
mA
15
57
mA
nA
uA
V
pF
ns
750
mA
80
Thermal Characteristics
Parameter
Junction to case thermal resistance5
Junction to air thermal resistance6
Min
Typ
11
70
Max
Unit
°C/W
°C/W
4
trr measured between point where current crosses zero and current reaches 10% of peak
reverse recovery current
5 Power equally distributed through the 4 diodes
6 Power equally distributed through the 4 diodes; see Safe operating area, power dissipation,
and PCB layout considerations section
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CHT-ELARA
Datasheet
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Typical Performance Characteristics (applicable to each diode)
1.00E+00
1.00E+00
9.00E-01
8.00E-01
1.00E-01
Forward Current If (A)
Forward Current If (A)
7.00E-01
6.00E-01
5.00E-01
4.00E-01
1.00E-02
1.00E-03
3.00E-01
2.00E-01
1.00E-04
225°C
225°C
175°C
175°C
125°C
1.00E-01
125°C
25°C
0.00E+00
0.00E+00
25°C
-55°C
5.00E-01
1.00E+00
1.50E+00
2.00E+00
1.00E-05
0.00E+00
2.50E+00
-55°C
5.00E-01
1.00E+00
DC Forward Voltage Vf (V)
2.00E+00
2.50E+00
DC Forward Voltage Vf (V)
Figure 1: Forward current vs. forward voltage and
temperature (linear scale).
Figure 2: Forward current vs. forward voltage and
temperature (log10 scale).
2.50E-06
0.8
0.7
2.00E-06
0.6
DC Reverse Current Ir (A)
DC Forward Voltage Vf (V)
1.50E+00
0.5
0.4
0.3
0.2
0.1
1.50E-06
1.00E-06
5.00E-07
0
-100
-50
0
50
100
150
200
250
0.00E+00
-80
Temperature (°C)
-70
-60
-50
-40
-30
-20
-10
0
DC Reverse Voltage Vr (V)
Figure 3: Forward voltage (at forward current
IF=1mA) vs. temperature.
Figure 4: Reverse leakage current vs. reverse voltage (Tj = 225°C)
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CHT-ELARA
Datasheet
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Mode of operations
CHT-ELARA can be used in a variety of
different applications:
Stand-Alone diodes
Clamping function
Each diode can be used independently of
each other. However, A1 pin should be
connected to the most negative voltage of
the application (even if diode “A1-K1” is
not used).
“SIGNAL” is clamped between positive
“PS+” and negative “PS-“ power supplies.
A1 pin must be connected to the negative
power supply (even if diode “A1-K1” is not
used).
PS-
A1
C1
A2
A1
C1
A2
C2
C3
A3
C4
A4
C2
C3
A3
PS+
C4
SIGNAL
CHT-ELARA
A4
Rectification function
CHT-ELARA
Full-bridge rectifier
In this configuration, A1 pin should be
connected to the rectified negative voltage.
CHT-ELARA can also be used in applications where a positive and a negative
power supplies are generated through a
transformer.
A1
C1
PS-
A1
C1
A2
C2
REF
~
A2
C2
C3
A3
C4
C3
A3
C4
A4
+
CHT-ELARA
A4
CHT-ELARA
PS+
~
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CHT-ELARA
Datasheet
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Safe operating area, power dissipation, and PCB layout considerations
The maximum power dissipation is determined by the maximum junction temperature rating, the ambient temperature, and
junction-to-ambient thermal resistance:
PDMAX =(TJMAX−TA)/RθJA
Where TJMAX=225°C and RθJA=RθJC+RθCA
with RθJC=11°C/W and RθCA (to be determined) is function of the size of the copper
mounting pad and thermal coupling to the
TDFP16.
The graph below indicates the junction-toair thermal resistance of the TDFP package mounted on PCB versus the surface
of the copper thermal pads on the PCB.
The designer should refer to this graph
when designing his PCB layout, taking into
account his own operating configuration:
expected power dissipation and the maximum expected ambient operating temperature.
100
Junction-to-Ambient thermal
resistance(°C/W)
The tiny TDFP package used for CHTELARA requires adequate PCB layout in
order to achieve efficient thermal dissipation, the minimization of the junction operating temperature, and maximizing the
power dissipation taking advantage of the
temperature behavior capability of CHTELARA.
The junction-to-air overall thermal resistance of CHT-ELARA in TDFP package
relies, to a large extend, on the implementation of the copper mounting pads that act
as a heatsink for the integrated circuit. The
design must take into consideration the
size of the copper pad and its placement
on either of the board surfaces, or both.
80
60
Ta = 25°C
Still Air
Polyimide board
40
20
0
0
1
2
3
4
5
6
Top& Bottom copper mounting pad area (cm2)
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CHT-ELARA
Datasheet
14-Dec-23
(Last Modification Date)
Package Dimensions
3.20
1.2
0.18
0.15
0.89
2.80
3.90
2.80
Min 6.00 / Max 6.50
0.635
0.5-0.75
5.00
5.50
0.18
7.50 Max
TDFP16 physical dimensions (mm +/- 10%)
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CHT-ELARA
Datasheet
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Ordering Information
Product Name
CHT-ELARA
Ordering Reference
CHT-PLA9486A-TDFP16-T
Package
TDFP16
Marking
CHT-PLA9486A
Contact & Ordering
CISSOID S.A.
Headquarters and
contact EMEA:
CISSOID S.A. – Rue Francqui, 11 – 1435 Mont Saint Guibert - Belgium
T : +32 10 48 92 10 - F: +32 10 88 98 75
Email: sales@cissoid.com
Sales
Representatives:
Visit our website: http://www.cissoid.com
Disclaimer
Neither CISSOID, nor any of its directors, employees or affiliates make any representations or extend any warranties
of any kind, either express or implied, including but not limited to warranties of merchantability, fitness for a particular
purpose, and the absence of latent or other defects, whether or not discoverable. In no event shall CISSOID, its directors, employees and affiliates be liable for direct, indirect, special, incidental or consequential damages of any kind
arising out of the use of its circuits and their documentation, even if they have been advised of the possibility of such
a damage. The circuits are provided “as is”. CISSOID has no obligation to provide maintenance, support, updates, or
modifications.
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CHT-PLA9486A-TDFP16-T 价格&库存
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