OLED DISPLAY MODULE
Product Specification
CUSTOMER
Standard
PRODUCT
NUMBER
DD-12864WE-4A
Date
CUSTOMER
APPROVAL
INTERNAL APPROVALS
Product Mgr
Doc. Control
Electr. Eng
Bazile
Peter
Anthony
Perkins
Rekha
Mani
Date: 20/10/09
Date: 20/10/09
Date: 20/10/09
Copyright ©2009 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
TABLE OF CONTENTS
1
MAIN FEATURES .......................................................................................................... 4
2
MECHANICAL SPECIFICATION............................................................................... 5
2.1
2.2
3
ELECTRICAL SPECIFICATION................................................................................. 7
3.1
3.2
3.3
3.4
3.5
4
CONFORMITY ....................................................................................................... 22
DELIVERY ASSURANCE ..................................................................................... 22
DEALING WITH CUSTOMER COMPLAINTS .................................................... 26
RELIABILITY SPECIFICATION .............................................................................. 27
8.1
8.2
8.3
9
LABELLING & MARKING.................................................................................... 22
QUALITY ASSURANCE SPECIFICATION ............................................................. 22
7.1
7.2
7.3
8
COMMANDS .......................................................................................................... 19
POWER UP/DOWN SEQUENCE........................................................................... 19
RESET CIRCUIT..................................................................................................... 19
ACTUAL APPLICATION EXAMPLE ................................................................... 20
PACKAGING AND LABELLING SPECIFICATION.............................................. 21
6.1
7
OPTICAL CHARACTERISTICS............................................................................ 18
FUNCTIONAL SPECIFICATION .............................................................................. 19
5.1
5.2
5.3
5.4
6
ABSOLUTE MAXIMUM RATINGS ....................................................................... 7
ELECTRICAL CHARACTERISTICS ...................................................................... 8
INTERFACE PIN ASSIGNMENT ............................................................................ 9
BLOCK DIAGRAM ................................................................................................ 11
AC CHARACTERISTICS ....................................................................................... 13
OPTICAL SPECIFICATION....................................................................................... 18
4.1
5
MECHANICAL CHARACTERISTICS .................................................................... 5
MECHANICAL DRAWING ..................................................................................... 6
RELIABILITY TESTS ............................................................................................ 27
LIFE TIME............................................................................................................... 27
FAILURE CHECK STANDARD ..................................................................................... 27
PRECAUTIONS............................................................................................................. 28
9.1
9.2
9.3
9.4
9.5
HANDLING................................................................................................................. 28
STORAGE ............................................................................................................... 29
DESIGNING ............................................................................................................ 29
DISPOSING ................................................................................................................. 29
OTHER ....................................................................................................................... 30
Product No.
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REV. A
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REVISION RECORD
Rev.
Date
A
20 October 09
Product No.
Page
Chapt.
Comment
ECR no.
First Issue
DD-12864WE-4A
REV. A
Page
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Copyright ©2009 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
1 MAIN FEATURES
ITEM
CONTENTS
Display Format
128 x 64 Dots
Overall Dimensions(W*H*T)
26.70×19.26× 1.45 mm
Active Area(W*H)
21.744 × 10.864 mm
Viewing Area(W*H)
23.744 x 12.864 mm
Display Mode
Passive Matrix (0.96”)
Display Colour
White Colour
Driving Method
1 / 64 duty
Driver IC
SSD1306
Operating temperature
-30Ԩ ~ +70Ԩ
Storage temperature
-40Ԩ ~ +80Ԩ
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2 MECHANICAL SPECIFICATION
2.1 MECHANICAL CHARACTERISTICS
ITEM
CHARACTERISTIC
UNIT
128 x 64
Dots
26.70×19.26× 1.45
mm
Viewing Area
23.744 x 12.864
mm
Active Area
21.744 × 10.864
mm
Dot Size
0.154 × 0.154
mm
Dot Pitch
0.17 × 0.17
mm
1.54
g
Display Format
Overall Dimensions
Weight
IC Controller/Driver
Product No.
SSD1306
DD-12864WE-4A
REV. A
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2.2 MECHANICAL DRAWING
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3 ELECTRICAL SPECIFICATION
3.1 ABSOLUTE MAXIMUM RATINGS
VSS = 0 V, Ta = 25 °C
Item
Symbol
Min
Max
Unit
Note
Supply Voltage for Operation
VDD
-0.3
4
V
Note 1, 2
Supply Voltage for Display
VCC
0
11
V
Operating Temperature
Top
-30
70
°C
Storage Temperature
Tstg
-40
80
°C
Static Electricity
Be sure that you are grounded when handling displays.
Note 1: All the above voltages are on the basis of “VSS=0V”.
Note 2: When this module is used beyond above absolute maximum ratings, permanent
damage to the module may occur. Also for normal operations it’s desirable to use
this module under the conditions according to Section 3.2 “Electrical Characteristics”
and section 4 “optical characteristic. If this module is used beyond these conditions
the module may malfunction and the reliability could deteriorate.
Copyright ©2009 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
3.2 ELECTRICAL CHARACTERISTICS
3.2.1 DC Characteristics
Characteristics
Symbol
Supply Voltage for Logic
VDD
Supply Voltage for
Display
VCC
Supply Voltage for
DC/DC
Min
Typ
Max
Unit
1.65
2.8
3.3
V
Note 3
8.5
9
9.5
V
VBAT
Internal DC/DC
3.5
-
4.2
V
Supply Voltage for
Display (Generated by
Internal DC/DC)
VCC
Note 4
7
7.35
7.5
V
High Level Input
VIH
-
0.8xVDD
-
VDD
V
Low Level Input
VIL
-
0
-
0.2xVDD
V
High Level Output
VOH
0.9xVDD
-
VDD
V
Low Level Output
VOL
0
-
0.1xVDD
V
Operating Current for
VDD
IDD
-
-
180
300
µA
Operating Current for
VCC
Note 1
-
6
7.5
mA
ICC
Note 2
-
10.8
13.5
mA
Note 5
-
11.6
14.5
mA
Note 2
-
20.9
26.1
mA
Operating Current for
VBAT(VCC Generated by
Internal DC/DC)
Conditions
Iout=100μA,3.3
MHz
Iout=100μA,3.3
MHz
IBAT
Sleep Mode Current for
1
5
IDD, SLEEP
µA
VCI
Sleep Mode Current for
1
5
ICC, SLEEP
µA
VCC
Note 1 VDD= 2.8V, VCC = 9V, 50% Display area turned on.
Note 2 VDD = 2.8V, VCC = 9V, 100% Display area turned on
Note 3 Brightness (Lbr) and Supply Voltage for Display (VCC) is subject to the change of the
panel characteristics and the customer’s request.
Note 4 VDD= 2.8V, VCC = 7.35V, 50% Display area turned on.
Note 5 VDD = 2.8V, VCC = 7.35V, 100% Display area turned on
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3.3 INTERFACE PIN ASSIGNMENT
No.
Symbol
I/O
1
N.C. (GND)
-
2
C2P
I
3
C2N
I
4
C1P
I
5
C1N
I
Function
Reserved Pin (Supporting Pin)
The supporting pins can reduce the influences from stresses on
the function pins. These pins must be connected to external
ground.
Positive Terminal of the Flying Inverting Capacitor
Negative Terminal of the Flying Boost Capacitor
The charge-pump capacitors are required between the terminals.
They must be floated when the converter is not used.
6
VBAT
P
Power Supply for DC/DC Converter Circuit
This is the power supply pin for the internal buffer of the
DC/DC voltage converter. It must be connected to external
source when the converter is used. It should be connected to
VDD when the converter is not used.
7
N.C.
-
Reserved Pin
The NC pins between function pins are reserved for compatible
and flexible design.
8
VSS
P
Ground of Logic Circuit
This is a ground pin. It acts as a reference for the logic pins. It
must be connected to external ground.
9
VDD
P
Power Supply for Logic
This is a voltage supply pin. It must be connected to
external source
10
BS0
11
BS1
I
12
BS2
Communicating Protocol Select
These pins are MCU interface selection input. See the
following table:
BS0
BS1
I2C
0
1
3-wire SPI
1
0
4-wire SPI
0
0
68XX-parallel
0
0
80XX-parallel
0
1
13
CS#
I
Chip Select
This pin is the chip select input. The chip is enabled for MCU
communication only when CS# is pulled low.
14
RES#
I
Power Reset for Controller and Driver
This pin is reset signal input.. When the pin is low, initialization
of the chip is executed.
Product No.
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REV. A
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BS2
0
0
0
1
1
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No.
Symbol
I/O
15
D/C#
I
16
R/W#
I
17
E/RD#
I
18~25
D7~D0
I/O
26
IREF
I
27
VCOMH
O
28
VCC
P
29
VLSS
30
N.C. (GND)
Product No.
-
DD-12864WE-4A
Function
Data/Command Control
This pin is Data/Command control pin. When the pin is pulled
high, the input at D7~D0 is treated as display data.
When the pin is pulled low, the input at D7~D0 will be
transferred to the command register. For detail
relationship to MCU interface signals, please refer to the
Timing Characteristics Diagrams.
When the pin is pulled high and serial interface mode is selected,
the data at SDIN is treated as data. When it is pulled low, the data
at SDIN will be transferred to the command register. In I2C
mode, this pin acts as SA0 for slave address selection.
Read/Write Select or Write
This pin is MCU interface input. When interfacing to a
68XX-series microprocessor, this pin will be used as
Read/Write (R/W#) selection input. Pull this pin to
“High” for read mode and pull it to “Low” for write mode.
When 80XX interface mode is selected, this pin will be the Write
(WR#) input. Data write operation is initiated when this pin is
pulled low and the CS# is pulled low.
Read/Write Enable or Read
This pin is MCU interface input. When interfacing to a
68XX-series microprocessor, this pin will be used as the
Enable (E) signal. Read/write operation is initiated when this pin
is pulled high and the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives
the Read (RD#) signal. Data read operation is initiated when this
pin is pulled low and CS# is pulled low.
Host Data Input/output Bus
These pins are 8-bit bi-directional data bus to be connected to the
microprocessor’s data bus. When serial mode is selected, D1 will
be the serial data input SDIN and D0 will be the serial clock
input SCLK. When I2C mode is selected, D2 & D1 should be
tired together and serve as SDAout & SDAin in application and
D0 is the serial clock input SCL.
Current Reference for Brightness Adjustment
This pin is segment current reference pin. A resistor should be
connected between this pin and VSS. Set the current lower than
12.5μA.
Voltage Output High Level for COM Signal
This pin is the input pin for the voltage output high level for
COM signals. A capacitor should be connected between this pin
and VSS.
Power Supply for OEL Panel
This is the most positive voltage supply pin of the chip. A
stabilization capacitor should be connected between this pin and
VSS when the converter is used. It must be connected to external
source when the converter is not used.
Ground of Analogue Circuit
This is an analogue ground pin. It should be connected to VSS
externally.
Reserved Pin (Supporting Pin)
The supporting pins can reduce the influences from stresses on
the function pins. These pins must be connected to external
ground.
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3.4 BLOCK DIAGRAM
3.4.1 VCC SUPPLIED EXTERNAL
MCU Interface Selection:
Pins connected to MCU interface:
BS0, BS1 and BS2
CS#, RES#, D/C#, R/W#, E/RD#, and
D0~D7
C1, C3:
C2, C4, C5:
0.1μF
4.7μF
R1:
560kΩ, R1 = (Voltage at IREF – VSS) / IREF
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3.4.1 VCC SUPPLIED using internal DC/DC
MCU Interface Selection:
Pins connected to MCU interface:
C1, C2, C5, C6:
C3, C4:
R1:
Product No.
BS0, BS1 and BS2
CS#, RES#, D/C#, R/W#, E/RD#, and
D0~D7
1μF
4.7μF
390kΩ, R1 = (Voltage at IREF – VSS) / IREF
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3.5 AC CHARACTERISTICS
3.5.1 68XX-Series MPU Parallel Interface Timing Characteristics
Characteristics
Symbol
Min
Max
Unit
Clock Cycle Time
tcycle
300
-
ns
Address Setup Time
tAS
0
-
ns
Address Hold Time
tAH
0
-
ns
Write Data Setup Time
tDSW
40
-
ns
Write Data Hold Time
tDHW
7
-
ns
Read Data Hold Time
tDHR
20
-
ns
Output Disable Time
tOH
-
70
ns
Access Time
tACC
-
140
ns
Chip Select Low Pulse Width (Read)
Chip Select Low Pulse Width (Write)
PWCSL
120
60
-
ns
Chip Select High Pulse Width (Read)
Chip Select High Pulse Width (Write)
PWCSH
60
60
-
ns
Rise Time
tR
-
40
ns
Fall Time
tF
-
40
ns
(VDD - VSS = 1.65V, VCI = 2.8V, Ta = 25°C)
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3.5.2 8080-Series MPU Parallel Interface Timing Characteristics
Characteristics
Symbol
Min
Max
Unit
Clock Cycle Time
tcycle
300
-
ns
Address Setup Time
tAS
10
-
ns
Address Hold Time
tAH
0
-
ns
Write Data Setup Time
tDSW
40
-
ns
Write Data Hold Time
tDHW
7
-
ns
Read Data Hold Time
tDHR
20
-
ns
Output Disable Time
tOH
-
70
ns
Access Time
tACC
-
140
ns
Read Low Time
tPWLR
120
-
ns
Write Low Time
tPWLW
60
-
ns
Read High Time
tPWHR
60
-
ns
Write High Time
tPWHW
60
-
ns
Chip Select Setup Time
tCS
0
-
ns
Chip Select Hold Time to Read Signal
tCSH
0
-
ns
Chip Select Hold Time
tCSF
20
-
ns
Rise Time
tR
-
40
ns
Fall Time
tF
-
40
ns
(VDD - VSS 1.65V to 2.8V, Ta = 25°C)
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3.5.3 Serial Interface Timing Characteristics (4-wire SPI)
Characteristics
Symbol
Min
Max
Unit
Clock Cycle Time
tcycle
100
-
ns
Address Setup Time
tAS
15
-
ns
Address Hold Time
tAH
15
-
ns
Chip Select Setup Time
tCSS
20
-
ns
Chip Select Hold Time
tCSH
10
-
ns
Write Data Setup Time
tDSW
15
-
ns
Write Data Hold Time
tDHW
15
-
ns
Clock Low Time
tCLKL
20
-
ns
Clock High Time
tCLKH
20
Rise Time
tR
-
15
ns
Fall Time
tF
-
15
ns
ns
(VDD – VSS = 1.65V to 3.3V, Ta = 25°C)
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3.5.4 Serial Interface Timing Characteristics (3-wire SPI)
Characteristics
Symbol
Min
Max
Unit
Clock Cycle Time
tcycle
100
-
ns
Chip Select Setup Time
tCSS
20
-
ns
Chip Select Hold Time
tCSH
10
-
ns
Write Data Setup Time
tDSW
15
-
ns
Write Data Hold Time
tDHW
15
-
ns
Clock Low Time
tCLKL
20
-
ns
Clock High Time
tCLKH
20
Rise Time
tR
-
40
ns
Fall Time
tF
-
40
ns
ns
(VDD – VSS = 1.65V to 3.3, Ta = 25°C)
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3.5.1 I2C Timing Characteristics
Characteristics
Clock Cycle Time
Start Condition Hold Time
Data Hold Time (for “SDAOUT” Pin)
Data Hold Time (for “SDAIN” Pin)
Data Setup Time
Symbol
Min
Max
Unit
tcycle
2.5
-
us
tHSTART
0.6
-
us
-
us
tHD
0
300
tSD
100
-
us
Start Condition Setup Time
(Only relevant for a repeated Start
condition)
tSSTART
0.6
-
us
Stop Condition Setup Time
tSSTOP
0.6
-
us
Rise Time for Data and Clock Pin
tR
-
300
ns
Fall Time for Data and Clock Pin
tF
-
300
ns
tIDLE
1.3
Idle Time before a New Transmission
can Start
(VDD – VSS = 1.65V to 3.3, Ta = 25°C)
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4 OPTICAL SPECIFICATION
4.1 OPTICAL CHARACTERISTICS
Characteristics
Brightness (Vcc
Supplied
Externally)
Brightness (Vcc
Generated
internally)
Symbol
Condition
Min
Typ
Max
Unit
Lbr
With Polarizer
Note 1
80
100
-
cd/m2
Lbr
With Polarizer
Note 2
50
60
-
cd/m2
0.28
0.32
0.36
(X)
C.I.E.(White)
Dark Room
Contrast
Without Polarizer
-
(Y)
0.29
0.33
0.37
CR
-
>2000:1
-
-
>160
-
-
degree
Viewing Angle
Optical measurement taken at VDD = 2.8V, VCC = 9V & 7.35V
Software configuration follows Section 5.4 Initialization.
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5 FUNCTIONAL SPECIFICATION
5.1 COMMANDS
Please refer to the Technical Manual for the SSD1306
5.2 POWER UP/DOWN SEQUENCE
To protect panel and extend the panel lifetime, the driver IC power up/down routine should
include a delay period between high voltage and low voltage power sources during turn
on/off. It gives the panel enough time to complete the action of charge and discharge
before/after the operation.
5.2.1 POWER UP SEQUENCE
VDD ON VCC ON Display On
1. Power up VDD
2. Send Display off command
3. Initialization
4. Clear Screen
5. Power up VCC
6. Delay 100ms
(When VCC is stable)
7. Send Display on command
VCC
VCI/VDDIO
VSS/Ground
5.2.2 POWER DOWN SEQUENCE
1. Send Display off command
2. Power down VCC
3. Delay 100ms
(When VCC is reach 0 and panel is
completely discharges)
4. Power down VDDIO
Display off VCC off VDD off
VCC
VDDIO
VSS/Ground
5.3 RESET CIRCUIT
When RES# input is low, the chip is initialized with the following status:
1. Display is OFF
2. 128×64 Display Mode
3. Normal segment and display data column and row address mapping (SEG0 mapped
to column address 00h and COM0 mapped to row address 00h)
4. Shift register data clear in serial interface
5. Display start line is set at display RAM address 0
6. Column address counter is set at 0
7. Normal scan direction of the COM outputs
8. Contrast control register is set at 7Fh
9. Normal display mode (Equivalent to A4h command)
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5.4 ACTUAL APPLICATION EXAMPLE
Command usage and explanation of an actual example
Written Value for Parameters
(1) VCC Supplied Externally
(2) VCC Generated by Internal DC/DC Circuit
If the noise is accidentally occurred at the displaying window during the operation, please
reset the display in order to recover the display function.
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6 PACKAGING AND LABELLING SPECIFICATION
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6.1 LABELLING & MARKING
DENSITRON
DD-12864WE-4A
TW YY MM
7 QUALITY ASSURANCE SPECIFICATION
7.1 CONFORMITY
The performance, function and reliability of the shipped products conform to the Product
Specification.
7.2 DELIVERY ASSURANCE
7.2.1 DELIVERY INSPECTION STANDARDS
IPC-AA610, class 2 electronic assembly’s standard
7.2.2 Zone definition
A Active
B Outside Active
7.2.3 Visual inspection
Test and measurement to be conducted under following conditions
Temperature:
Humidity:
Fluorescent lamp:
Distance between the Panel & Eyes of the Inspector:
Distance between the Panel & the lamp:
Product No.
DD-12864WE-4A
REV. A
23±5℃
55±15%RH
30 W
≧30cm
≧50cm
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7.2.4 Standard of appearance inspection
Units: mm
Class
Item
Criteria
Minor
Critical
Packing &
Label
Major
Dimension
Outside & inside package Presence of product no., lot no., quantity
Product must not be mixed with others and quantity must not be different from
that indicated on the label
Product dimensions must be according to specification and drawing
Major
Electrical
Product electrical characteristics must be according to specification
Critical
OLED
Display
Black spot,
white spot,
dust
Minor
Missing lines, short circuits or wrong patterns on OLED display are not
allowed
Round type: as per following drawing
∅ = (X+Y)/2
Acceptable quantity
Size
Zone A
Zone B
Any number
∅