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EVK-CONNECT-021

EVK-CONNECT-021

  • 厂商:

    DENSITRON

  • 封装:

    Module

  • 描述:

  • 数据手册
  • 价格&库存
EVK-CONNECT-021 数据手册
OLED DISPLAY MODULE Product Specification CUSTOMER Standard PRODUCT NUMBER CLDD-256644A-Series CUSTOMER APPROVAL Date INTERNAL APPROVALS Product Mgr Doc. Control Electr. Eng Richard Applin Richard Applin Alan Wang Date: 10/07/13 Date: 10/07/13 Date: 10/07/13 Approval for Specification only Approval for Specification and Sample Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data FORM No. DT-029 TABLE OF CONTENTS 1 MAIN FEATURES ..................................................................................................... 5 2 MECHANICAL SPECIFICATION .......................................................................... 6 2.1 2.2 3 MECHANICAL CHARACTERISTICS ............................................................... 6 MECHANICAL DRAWING ................................................................................ 7 ELECTRICAL SPECIFICATION ............................................................................ 8 3.1 3.2 3.3 3.4 3.5 4 ABSOLUTE MAXIMUM RATINGS .................................................................. 8 ELECTRICAL CHARACTERISTICS ................................................................. 9 INTERFACE PIN ASSIGNMENT ..................................................................... 10 BLOCK DIAGRAM ........................................................................................... 12 TIMING CHARACTERISTICS ......................................................................... 13 OPTICAL SPECIFICATION .................................................................................. 17 4.1 4.2 5 OPTICAL CHARACTERISTICS ....................................................................... 17 BRIGHTNESS LOSS OF COVER LENS........................................................... 18 FUNCTIONAL SPECIFICATION ......................................................................... 19 5.1 5.2 5.3 5.4 6 COMMANDS ..................................................................................................... 19 POWER DOWN AND UP SEQUENCE............................................................. 19 RESET CIRCUIT ................................................................................................ 19 ACTUAL APPLICATION EXAMPLE .............................................................. 20 PACKAGING AND LABELLING SPECIFICATION ......................................... 21 6.1 7 LABELLING & MARKING............................................................................... 21 QUALITY ASSURANCE SPECIFICATION ........................................................ 22 7.1 7.2 7.3 8 CONFORMITY .................................................................................................. 22 DELIVERY ASSURANCE ................................................................................ 22 DEALING WITH CUSTOMER COMPLAINTS ............................................... 28 RELIABILITY SPECIFICATION ......................................................................... 29 8.1 8.2 8.3 RELIABILITY TESTS ....................................................................................... 29 LIFE TIME .......................................................................................................... 29 FAILURE CHECK STANDARD ....................................................................... 29 9 PART NUMBER DESCRIPTION FOR AVAILABLE OPTIONS ..................... 30 10 HANDLING PRECAUTIONS ................................................................................. 30 10.1 10.2 10.3 10.4 10.5 11 HANDLING PRECAUTIONS ........................................................................... 30 STORAGE PRECAUTIONS .............................................................................. 32 DESIGNING PRECAUTIONS ........................................................................... 32 OTHER PRECAUTIONS ................................................................................... 32 PRECAUTIONS WHEN DISPOSING OF THE OEL DISPLAY MODULES .. 33 SUPPORTED ACCESSORIES ............................................................................... 33 11.1 DUO KIT ............................................................................................................. 33 Product No. CLDD-256644A-Series REV. A Page 2 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 11.2 11.3 11.4 11.5 TRANSITION BOARD CARD .......................................................................... 34 CONNECTOR BOARD CARD .......................................................................... 34 CONNECTOR .................................................................................................... 34 OPTICAL BONDING SERVICE ....................................................................... 34 Product No. CLDD-256644A-Series REV. A Page 3 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data REVISION RECORD Rev. Date Page Chapt. A 10/07/13 -- -- Product No. Comment ECR no. Initial Release CLDD-256644A-Series REV. A Page 4 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 1 MAIN FEATURES ITEM CONTENTS Display Format 256 x 64 Dots Colour (Blue, Green, White, Yellow) Monochrome Overall Dimensions 101.30 (W)  34.00 (H)  4.00 (D) mm Viewing Area 78.78 (W) x 21.18 (H) mm Screen Size 3.12” Mode Passive Matrix Duty ratio 1/64 Driver IC SSD1322 Operating temperature -30°C ~ +85°C Storage temperature -40°C ~ +90°C Product No. CLDD-256644A-Series REV. A Page 5 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 2 MECHANICAL SPECIFICATION 2.1 MECHANICAL CHARACTERISTICS ITEM CHARACTERISTIC UNIT 256 x 64 Dots 101.30 (W)  34.00 (H)  4.00 (D) mm 78.78 (W) x 21.18 (H) mm mm 76.78 (W) x 19.18 (H) mm Dot Size 0.28 (W) 0.28 (H) mm Dot Pitch 0.30 (W) x 0.30 (H) mm 9.95 g Display Format Overall Dimensions Viewing Area Active Area Weight IC Controller/Driver Product No. SSD1322 CLDD-256644A-Series REV. A Page 6 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 2.2 MECHANICAL DRAWING Product No. CLDD-256644A-Series REV. A Page 7 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3 ELECTRICAL SPECIFICATION 3.1 ABSOLUTE MAXIMUM RATINGS Item Symbol Min Max Unit Note VCI -0.3 4 V 1, 2 Supply Voltage for Operation Supply Voltage for Logic Supply Voltage for I/O pins Supply Voltage for Display Operating Current for VCC VDD -0.5 2.75 V 1, 2 VDDIO -0.5 VCI V 1, 2 VCC -0.5 16 V 1, 2 ICC - 55 mA 1,2 Operating Temperature Top -30 +85 °C Storage Temperature Tst -40 +90 °C Static Electricity Be sure that you are grounded when handling displays. Note 1: All the above voltages are on the basis of “VSS = 0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3.2 “Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. Product No. CLDD-256644A-Series REV. A Page 8 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3.2 ELECTRICAL CHARACTERISTICS Item Symbol Min Typ Max Unit VCI 2.4 2.8 3.5 V VDD 2.4 2.5 2.6 V VDDIO 1.65 1.8 VCI V VCC 11.5 12 12.5 V High Level Input VIH 0.8xVDDIO -- VDDIO V Low Level Input VIL 0 -- 0.2xVDDIO V High Level Output VOH 0.9xVDDIO -- VDDIO V Low Level Output VOL 0 -- 0.1xVDDIO V Note 4 - 1.8 2.25 mA Note 5 - 1.8 2.25 mA Note 4 - 26.3 32.9 mA Note 5 - 41.1 51.4 mA ICI,SLEEP - 1 5 µA ICC,SLEEP - 1 5 µA Supply Voltage for Operation Supply Voltage for Logic Supply Voltage for I/O Pins Supply Voltage for Display Operating Current for VCI ICI Operating Current for VCC ICC Sleep Mode Current for VCI Sleep Mode Current for VCC Condition IOUT=100µA, 3.3MHz IOUT=100µA, 3.3MHz Note 3: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of panel characteristics and the customers request. Note 4: VCI = 2.8V, VCC = 12V, 50% Display Area Turn on. Note 5: VCI = 2.8V, VCC = 12V, 100% Display Area Turn on. Product No. CLDD-256644A-Series REV. A Page 9 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3.3 INTERFACE PIN ASSIGNMENT No. Symbol I/O 1 N.C. (GND) -- 2 VSS P 3 VCC P Function Reserved Pin (Supporting Pin). The supporting pins can reduce the influences from stresses on the function pins. This pin must be connected to external ground. Ground of Logic Circuit This is a ground pin. It also acts as a reference for the logic pins. It must be connected to external ground Power Supply for OEL Panel This is the most positive supply pin of the chip. They must be connected to external source. Voltage Output High Level for COM Signal 4 VCOMH P 5 VLSS P This pin is the input pin for the voltage output high level for COM signals. A tantalum capacitor should be connected between this pin and VSS. Ground of Analog Circuit This is analog ground pin. IT should be connected to VSS externally Host Data Input/Output Bus 6~13 D7~D0 I/O These pins are 8-bit bi-directional data bus to be connected to the microprocessors data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. Unused pins must be connected to VSS except for D2 in serial mode. Read/Write Enable or Read 14 E/RD# I This pin is MCU interface input. When interfacing to a 68XXsseries microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low. When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is low and CS# is pulled low. When serial mode is selected, this pin must be connected to VSS. Read/Write Select or Write 15 R/W# I This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it “Low” for write mode. When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low. When serial mode is selected, this pin must be connected to VSS. Communicating Protocol Select 16 17 Product No. BS0 BS1 I These pins are MCU interface selection input. See the following table: BS0 BS1 3-wire SPI 1 0 4-wire SPI 0 0 CLDD-256644A-Series REV. A Page 10 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 8-bit 68XX Parallel 8-bit 80XX Parallel 1 0 1 1 Data/Command Control 18 D/C# I 19 CS# I 20 RES# I 21 FR O This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detailed relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams Chip Select This pin is the chip select input. When the pin is enabled for MCU communication only when CS# is pulled low.. Power Reset for Controller and Driver This pin is reset signal input. When the pin is low, initialization of the chip is executed. Cascade Application Connection Pin This pin is No Connection pins. Nothing should be connected to this pin. It should be left open individually. Current Reference for Brightness Adjustment 22 IREF I 23 N.C. - This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current lower than 10µA Reserved Pin The N.C. pin between function pins are reserved for compatible and flexible design. Power Supply for I/O Pin 24 VDDIO P This pin is a power supply pin of I/O buffer. It should be connected to VDD or external source. All I/O signals should have VIH reference to VDDIO. When I/O signal pins (BS0~BS1, D0~D7, control signals…) pull high, they should be connected to VDDIO. Power Supply for Core Logic Circuit 25 VDD P 26 VCI P This is a voltage supply pin. It can be supplied externally (within the range of 2.4~2.6V) or regulated internally from VCI. A capacitor should be connected between this pin & VSS under all circumstances. Power Supply for Operation This is a voltage supply pin. It must be connected to external source & always be equal or higher than VDD & VDDIO. Voltage Output Low Level for SEG Signal 27 VSL P 28 VLSS P 29 VCC I This is segment voltage reference pin. When external VSL is not used, this pin should be left open. When external VSL is used, this pin should connect with resistor and diode to ground. Ground of Analog Circuit This is the analog ground pin. It should be connected to VSS externally Power Supply for OEL Panel Product No. This is the most positive supply pin of the chip. They should be connected to external source. CLDD-256644A-Series REV. A Page 11 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data Reserved Pin (Supporting Pin). 30 N.C. (GND) - The supporting pins can reduce the influences from stresses on the function pins. This pin must be connected to external ground. 3.4 BLOCK DIAGRAM MCU Interface Selection: BS0 and BS1 Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, CS#, and RES# C1, C3, C5: 0.1μF C2, C4: 4.7μF C6: 10μF C7: 1μF C8: 4.7uF / 25V Tantalum Capacitor R1: 680kΩ, R1 = 680kΩ, R1= (Voltage at IREF – VSS) / IREF R2: 50Ω, 1/4W D1: ≤1.4V, 0.5W Product No. CLDD-256644A-Series REV. A Page 12 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3.5 TIMING CHARACTERISTICS 3.5.1 68XX-Series MPU Parallel Interface Timing Characteristics: Symbol Description Min Max Unit tcycle 300 10 - ns tAS Clock Cycle Time Address Setup Time - ns tAH Address Hold Time 0 - ns tDSW Write Data Setup Time 40 - ns tDHW Write Data Hold Time 7 - ns tDHR Read Data Hold Time 20 - ns tOH Output Disable Time - 70 ns tACC Access Time - 140 ns PWCSL Chip Select Low Pulse Width (Read) Chip Select Low Pulse Width (Write) 120 60 - ns PWCSH Chip Select High Pulse Width (Read) Chip Select High Pulse Width (Write) 60 60 - ns tR Rise Time - 15 ns tF Fall Time - 15 ns (VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C) Product No. CLDD-256644A-Series REV. A Page 13 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3.5.2 80XX-Series MPU Parallel Interface Timing Characteristics: Symbol Description Min Max Unit 300 10 - ns tAS Clock Cycle Time Address Setup Time - ns tAH Address Hold Time 0 - ns tDSW Write Data Setup Time 40 - ns tDHW Write Data Hold Time 7 - ns tDHR Read Data Hold Time 20 - ns tOH - 70 140 ns tACC Output Disable Time Access Time tPWLR Read Low Time 150 - ns tPWLW Write Low Time 60 - ns tPWHR Read High Time Write High Time 60 60 - ns - ns Chip Select Setup Time 0 - ns Chip Select Hold Time to Read Signal Chip Select Hold Time 0 - ns 20 - ns - 15 ns tcycle tPWHW tCS tCSH tCSF tR tF Product No. Rise Time ns Fall Time 15 ns (VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C) CLDD-256644A-Series REV. A Page 14 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3.5.3 Serial Interface Timing Characteristics: (4-wire SPI) Symbol Description Min Max Unit 100 15 - ns tAS Clock Cycle Time Address Setup Time - ns tAH Address Hold Time 15 - ns tCSS 20 10 - ns tCSH Chip Select Setup Time Chip Select Hold Time - ns tDSW Write Data Setup Time 15 - ns tDHW Write Data Hold Time 15 - ns tCLKL Clock Low Time 20 - ns tCLKH Clock High Time 20 - ns - 15 ns tcycle tR tF Product No. Rise Time Fall Time 15 ns (VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C) CLDD-256644A-Series REV. A Page 15 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3.5.4 Serial Interface Timing Characteristics: (3-wire SPI) Symbol Description Min Max Unit 100 15 - ns tAS Clock Cycle Time Address Setup Time - ns tAH Address Hold Time 15 - ns tCSS 20 10 - ns tCSH Chip Select Setup Time Chip Select Hold Time - ns tDSW Write Data Setup Time 15 - ns tDHW Write Data Hold Time 15 - ns tCLKL Clock Low Time 20 - ns tCLKH Clock High Time 20 - ns - 15 ns tcycle tR tF Product No. Rise Time Fall Time 15 ns (VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C) CLDD-256644A-Series REV. A Page 16 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 4 OPTICAL SPECIFICATION 4.1 OPTICAL CHARACTERISTICS Colour Characteristics Symbol Conditions Min Typ. Brightness Lbr With Polarizer (Note 3) 60 80 - C.I.E. (Blue) (x) (y) Without Polarizer 0.12 0.22 0.16 0.26 0.20 0.30 Brightness Lbr With Polarizer (Note 3) 100 120 - C.I.E. (Green) (x) (y) Without Polarizer 0.27 0.58 0.31 0.62 0.35 0.66 Brightness Lbr With Polarizer (Note 3) 60 80 - C.I.E. (White) (x) (y) Without Polarizer 0.28 0.29 0.32 0.33 0.36 0.37 Brightness Lbr With Polarizer (Note 3) 60 80 - C.I.E. (Yellow) (x) (y) Without Polarizer 0.44 0.46 0.48 0.50 0.52 0.54 - Dark Room Contrast CR - - >2000:1 - - View Angle - - >160 - - Blue Green White Yellow Max Unit cd/m2 cd/m2 cd/m2 cd/m2 degree Note 3: Optical measurement taken at VCI = 2.8V, VCC = 12V Product No. CLDD-256644A-Series REV. A Page 17 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 4.2 BRIGHTNESS LOSS OF COVER LENS Depending on the different materials of cover lens, the brightness loss is given by the following table. Cover Lens Material Brightness Loss (%) Dark Neutral 1mm Acrylic 25% Neutral 1mm Acrylic 50% Clear 1mm Acrylic with single colour black silkscreen printed border No Loss Colour Blue Green White Yellow Blue Green White Yellow Blue Green White Yellow Brightness Min Typ. 45 60 75 90 45 60 45 60 30 40 50 60 30 40 30 40 60 80 100 120 60 80 60 80 Unit cd/m2 (Test Conditions: Without Polarizer, VCI = 2.8V, VCC = 12V) Product No. CLDD-256644A-Series REV. A Page 18 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 5 FUNCTIONAL SPECIFICATION 5.1 COMMANDS Refer to the Technical Manual for the SSD1322 5.2 POWER DOWN AND UP SEQUENCE To protect the panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. Such that panel has enough time to charge and discharge before/after operation. 5.2.1 Power up Sequence: 1. Power up VCI & VDDIO 2. Send Display off command 3. Initialization 4. Clear Screen 5. Power up VCC 6. Delay 100ms (when VCC is stable) 7. Send Display on command 5.2.2 Power down Sequence: 1. Send Display off command 2. Power down VCC 3. Delay 100ms (when VCC is reach 0 and panel is completely discharges) 4. Power down VCI & VDDIO 5.3 RESET CIRCUIT When RES# input is low, the chip initialized with the following status: 1. Display is OFF 2. 480x128 Display Mode 3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h) 4. Display start line is set at display RAM address 0 5. Column address counter is set at 0 6. Normal scan direction of the COM outputs 7. Contrast control registers is set at 7Fh Product No. CLDD-256644A-Series REV. A Page 19 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 5.4 ACTUAL APPLICATION EXAMPLE Command usage and explanation of an actual example If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function. Product No. CLDD-256644A-Series REV. A Page 20 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 6 PACKAGING AND LABELLING SPECIFICATION 6.1 LABELLING & MARKING DENSITRON CLDD-256644A-Series TW YY MM Product No. CLDD-256644A-Series REV. A Page 21 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 7 QUALITY ASSURANCE SPECIFICATION 7.1 CONFORMITY The performance, function and reliability of the shipped products conform to the Product Specification. 7.2 DELIVERY ASSURANCE 7.2.1 Delivery inspection standards  IPC-AA610 rev. C, class 2 electronic assemblies standard 7.2.2 Zone definition A Viewing area B Outside viewing area 7.2.3 Visual inspection Test and measurement to be conducted under following conditions: Temperature: Humidity: Fluorescent lamp: 23±5℃ 55±15%RH 30 W Distance between the Panel & Eyes of the Inspector: ≧30cm Distance between the Panel & the lamp: ≧50cm Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic eye 45° Product No. CLDD-256644A-Series 45° REV. A Page 22 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 7.2.1 Standard of appearance inspection Product No. CLDD-256644A-Series REV. A Page 23 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data Product No. CLDD-256644A-Series REV. A Page 24 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data Product No. CLDD-256644A-Series REV. A Page 25 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data Product No. CLDD-256644A-Series REV. A Page 26 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data Product No. CLDD-256644A-Series REV. A Page 27 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 7.3 DEALING WITH CUSTOMER COMPLAINTS 7.3.1 Non-conforming analysis Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser. 7.3.2 Handling of non-conforming displays If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard. Product No. CLDD-256644A-Series REV. A Page 28 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 8 RELIABILITY SPECIFICATION 8.1 RELIABILITY TESTS Test Item Test Condition Evaluation and assessment High Temperature Operation 85°C, 500 hrs Low Temperature Operation -30°C, 500 hrs High Temperature Storage 90°C, 500 hrs Low Temperature Storage -40°C, 500 hrs High Temperature & High Humidity Storage 60°C, 90% RH, 500 hrs The brightness should be greater than 50% of the initial brightness. The operational functions work. -40°C ↔85°C, 100 cycles 30 min. dwell All operation tests are conducted in all display on pattern. The samples used for above tests do not include polarizer. No moisture condensation is observed during tests. Thermal Shock Storage    8.2 LIFE TIME Item 1 2 Description Display Colour Min Max Blue 10,000 hr - Green 40,000 hr - Yellow 40,000 hr White 10,000 hr - Condition 80 cd/m2, 50% Checkerboard 100 cd/m2, 50% Checkerboard 80 cd/m2, 50% Checkerboard 80 cd/m2, 50% Checkerboard Note 1 End of lifetime is specified as 50% of initial brightness. Note 1: The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions. 8.3 FAILURE CHECK STANDARD After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH. Product No. CLDD-256644A-Series REV. A Page 29 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 9 PART NUMBER DESCRIPTION FOR AVAILABLE OPTIONS ①② ③ ④ OLED Colour BE = Blue GE = Green YW = Yellow WE = White Cover Lens Material D = Dark Neutral 1mm Acrylic N = Neutral 1mm Acrylic C = Clear 1mm Acrylic with single colour black silkscreen printed border G = Clear 1mm Chemically Strengthen Glass with single colour black silkscreen printed border Bonding Method E = Edge Bonded O = Optically Bonded (SolisBond ®) Lens Finish G = Anti Glare R = Anti Reflective 10 HANDLING PRECAUTIONS 10.1 HANDLING PRECAUTIONS Product No. CLDD-256644A-Series REV. A Page 30 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 1) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. 2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. 3) If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. 4) The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. 5) When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water * Ketone * Aromatic Solvents 6) Hold OEL display module very carefully when placing OEL display module into the system housing. Do not apply excessive stress or pressure to OEL display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 7) Do not apply stress to the LSI chips and the surrounding molded sections. 8) Do not disassemble nor modify the OEL display module. 9) Do not apply input signals while the logic power is off. 10) Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work under dry environments. * Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection Product No. CLDD-256644A-Series REV. A Page 31 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5). 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above. 10.2 STORAGE PRECAUTIONS 1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0°C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Densitron Technologies Plc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. 2) If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above. 10.3 DESIGNING PRECAUTIONS 1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen. 2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. 3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) 4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. 5) As for EMI, take necessary measures on the equipment side basically. 6) When fastening the OEL display module, fasten the external plastic housing section. 7) If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. 8) The electric potential to be connected to the rear face of the IC chip should be as follows: US2066 * Connection (contact) to any other potential than the above may lead to rupture of the IC. 10.4 OTHER PRECAUTIONS 1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. Product No. CLDD-256644A-Series REV. A Page 32 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 2) To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the FPC 3) With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in actual usage. * Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. 4) Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. 5) We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. 10.5 PRECAUTIONS WHEN DISPOSING OF THE OEL DISPLAY MODULES 1) Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 11 SUPPORTED ACCESSORIES 11.1 DUO KIT Densitron has developed an easy to use yet powerful development and demonstration tool for driving its range of Passive Matrix OLED displays from the USB port of a PC. Product No. CLDD-256644A-Series REV. A Page 33 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data DUO (Densitron USB OLED) kit is hot pluggable and does not require extra cables or power supply to run, allowing users to be up and running in minutes. The kit consists of an OLED display with transition Board, USB controller card, mini USB cable and a CD with software application and drivers. Part number: PDK-N-25664xx-4A 11.2 TRANSITION BOARD CARD A Transition board card is like a daughterboard which is meant to be a circuit board for connections between the baseboards (DUO). It has connector pins for interfacing between the display and the baseboards. It also includes the OLED display. Part number: PDT-N-25664xx-4A 11.3 CONNECTOR BOARD CARD A Connector board card is also a daughterboard which is a circuit board for connection between a microprocessor or microcontroller (customer’s system). Part number: EVK-CONNECT-021 11.4 CONNECTOR Type: ZIF connector No. of Pitch connections (mm) 30 0.50 Manufacturer Omron Manufacturer part no. Distributor part no. XF2M-3015-1A Farnell/1112560 Digikey/ OR723CT-ND 11.5 OPTICAL BONDING SERVICE SolisBond®, Densitron's optical bonding service, offers optically bonded engineered solutions created in our new class 10,000 clean room bonding facility. SolisBond® optical bonding can be tailored to each specific display, cover lens and touchscreen combination. Product No. CLDD-256644A-Series REV. A Page 34 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data We will advise our customers on the design of the cover lens, helping with the selection of the right material, treatment and printing process. We can also manufacture the cover lenses to request and provide a suitable display and touchscreen combinations. SolisBond® bonded displays can be customized to meet automotive, high humidity and marine standards (-30C to +85C). Environmental testing and tolerance analysis are for us an obvious standard. Documentation for the tests and calculations are of course also available. Mechanism   Reflection loss is about 8% due to air gap. SolisBond® reduces sunshine reflection and loss of light from backlight units. Key Benefits        Improved Sunlight Readability Decreases reflection on the display glass from external light source, hence improves the contrast ratio. Shock-resistant Adhesive is soft and not brittle. Re-workable process High yield: 1%~5% yield loss of display, 1% yield loss of cover lens and touch panel. Improved Luminance Reduces light loss from backlight units which increases luminance for about 8%. Straightforward process No UV curing required Green process and material Cost-effective Test Summary Product No. CLDD-256644A-Series REV. A Page 35 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data   SolisBond® can withstand temperature ranges between -40C to +200C. It does not suffer from the UV effects, so it doesn’t become brittle or yellow when exposed to direct sunlight. Product No. CLDD-256644A-Series REV. A Page 36 / 36 Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
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