OLED DISPLAY MODULE
Product Specification
CUSTOMER
Standard
PRODUCT
NUMBER
CLDD-256644A-Series
CUSTOMER
APPROVAL
Date
INTERNAL APPROVALS
Product Mgr
Doc. Control
Electr. Eng
Richard
Applin
Richard
Applin
Alan
Wang
Date: 10/07/13
Date: 10/07/13
Date: 10/07/13
Approval for Specification only
Approval for Specification and Sample
Copyright ©2013 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data
FORM No. DT-029
TABLE OF CONTENTS
1
MAIN FEATURES ..................................................................................................... 5
2
MECHANICAL SPECIFICATION .......................................................................... 6
2.1
2.2
3
MECHANICAL CHARACTERISTICS ............................................................... 6
MECHANICAL DRAWING ................................................................................ 7
ELECTRICAL SPECIFICATION ............................................................................ 8
3.1
3.2
3.3
3.4
3.5
4
ABSOLUTE MAXIMUM RATINGS .................................................................. 8
ELECTRICAL CHARACTERISTICS ................................................................. 9
INTERFACE PIN ASSIGNMENT ..................................................................... 10
BLOCK DIAGRAM ........................................................................................... 12
TIMING CHARACTERISTICS ......................................................................... 13
OPTICAL SPECIFICATION .................................................................................. 17
4.1
4.2
5
OPTICAL CHARACTERISTICS ....................................................................... 17
BRIGHTNESS LOSS OF COVER LENS........................................................... 18
FUNCTIONAL SPECIFICATION ......................................................................... 19
5.1
5.2
5.3
5.4
6
COMMANDS ..................................................................................................... 19
POWER DOWN AND UP SEQUENCE............................................................. 19
RESET CIRCUIT ................................................................................................ 19
ACTUAL APPLICATION EXAMPLE .............................................................. 20
PACKAGING AND LABELLING SPECIFICATION ......................................... 21
6.1
7
LABELLING & MARKING............................................................................... 21
QUALITY ASSURANCE SPECIFICATION ........................................................ 22
7.1
7.2
7.3
8
CONFORMITY .................................................................................................. 22
DELIVERY ASSURANCE ................................................................................ 22
DEALING WITH CUSTOMER COMPLAINTS ............................................... 28
RELIABILITY SPECIFICATION ......................................................................... 29
8.1
8.2
8.3
RELIABILITY TESTS ....................................................................................... 29
LIFE TIME .......................................................................................................... 29
FAILURE CHECK STANDARD ....................................................................... 29
9
PART NUMBER DESCRIPTION FOR AVAILABLE OPTIONS ..................... 30
10
HANDLING PRECAUTIONS ................................................................................. 30
10.1
10.2
10.3
10.4
10.5
11
HANDLING PRECAUTIONS ........................................................................... 30
STORAGE PRECAUTIONS .............................................................................. 32
DESIGNING PRECAUTIONS ........................................................................... 32
OTHER PRECAUTIONS ................................................................................... 32
PRECAUTIONS WHEN DISPOSING OF THE OEL DISPLAY MODULES .. 33
SUPPORTED ACCESSORIES ............................................................................... 33
11.1
DUO KIT ............................................................................................................. 33
Product No.
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11.2
11.3
11.4
11.5
TRANSITION BOARD CARD .......................................................................... 34
CONNECTOR BOARD CARD .......................................................................... 34
CONNECTOR .................................................................................................... 34
OPTICAL BONDING SERVICE ....................................................................... 34
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REVISION RECORD
Rev.
Date
Page
Chapt.
A
10/07/13
--
--
Product No.
Comment
ECR no.
Initial Release
CLDD-256644A-Series
REV. A
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1 MAIN FEATURES
ITEM
CONTENTS
Display Format
256 x 64 Dots
Colour
(Blue, Green, White, Yellow) Monochrome
Overall Dimensions
101.30 (W) 34.00 (H) 4.00 (D) mm
Viewing Area
78.78 (W) x 21.18 (H) mm
Screen Size
3.12”
Mode
Passive Matrix
Duty ratio
1/64
Driver IC
SSD1322
Operating temperature
-30°C ~ +85°C
Storage temperature
-40°C ~ +90°C
Product No.
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2 MECHANICAL SPECIFICATION
2.1 MECHANICAL CHARACTERISTICS
ITEM
CHARACTERISTIC
UNIT
256 x 64
Dots
101.30 (W) 34.00 (H) 4.00 (D)
mm
78.78 (W) x 21.18 (H) mm
mm
76.78 (W) x 19.18 (H)
mm
Dot Size
0.28 (W) 0.28 (H)
mm
Dot Pitch
0.30 (W) x 0.30 (H)
mm
9.95
g
Display Format
Overall Dimensions
Viewing Area
Active Area
Weight
IC Controller/Driver
Product No.
SSD1322
CLDD-256644A-Series
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2.2 MECHANICAL DRAWING
Product No.
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3 ELECTRICAL SPECIFICATION
3.1 ABSOLUTE MAXIMUM RATINGS
Item
Symbol
Min
Max
Unit
Note
VCI
-0.3
4
V
1, 2
Supply Voltage for
Operation
Supply Voltage for
Logic
Supply Voltage for I/O
pins
Supply Voltage for
Display
Operating Current for
VCC
VDD
-0.5
2.75
V
1, 2
VDDIO
-0.5
VCI
V
1, 2
VCC
-0.5
16
V
1, 2
ICC
-
55
mA
1,2
Operating Temperature
Top
-30
+85
°C
Storage Temperature
Tst
-40
+90
°C
Static Electricity
Be sure that you are grounded when handling displays.
Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings,
permanent breakage of the module may occur. Also, for normal operations, it is
desirable to use this module under the conditions according to Section 3.2
“Electrical Characteristics”. If this module is used beyond these conditions,
malfunctioning of the module can occur and the reliability of the module may
deteriorate.
Product No.
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3.2 ELECTRICAL CHARACTERISTICS
Item
Symbol
Min
Typ
Max
Unit
VCI
2.4
2.8
3.5
V
VDD
2.4
2.5
2.6
V
VDDIO
1.65
1.8
VCI
V
VCC
11.5
12
12.5
V
High Level Input
VIH
0.8xVDDIO
--
VDDIO
V
Low Level Input
VIL
0
--
0.2xVDDIO
V
High Level Output
VOH
0.9xVDDIO
--
VDDIO
V
Low Level Output
VOL
0
--
0.1xVDDIO
V
Note 4
-
1.8
2.25
mA
Note 5
-
1.8
2.25
mA
Note 4
-
26.3
32.9
mA
Note 5
-
41.1
51.4
mA
ICI,SLEEP
-
1
5
µA
ICC,SLEEP
-
1
5
µA
Supply Voltage for
Operation
Supply Voltage for
Logic
Supply Voltage for I/O
Pins
Supply Voltage for
Display
Operating Current for
VCI
ICI
Operating Current for
VCC
ICC
Sleep Mode Current for
VCI
Sleep Mode Current for
VCC
Condition
IOUT=100µA,
3.3MHz
IOUT=100µA,
3.3MHz
Note 3: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of
panel characteristics and the customers request.
Note 4: VCI = 2.8V, VCC = 12V, 50% Display Area Turn on.
Note 5: VCI = 2.8V, VCC = 12V, 100% Display Area Turn on.
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3.3 INTERFACE PIN ASSIGNMENT
No.
Symbol
I/O
1
N.C. (GND)
--
2
VSS
P
3
VCC
P
Function
Reserved Pin (Supporting Pin).
The supporting pins can reduce the influences from stresses on the
function pins. This pin must be connected to external ground.
Ground of Logic Circuit
This is a ground pin. It also acts as a reference for the logic pins. It
must be connected to external ground
Power Supply for OEL Panel
This is the most positive supply pin of the chip. They must be
connected to external source.
Voltage Output High Level for COM Signal
4
VCOMH
P
5
VLSS
P
This pin is the input pin for the voltage output high level for COM
signals. A tantalum capacitor should be connected between this pin
and VSS.
Ground of Analog Circuit
This is analog ground pin. IT should be connected to VSS
externally
Host Data Input/Output Bus
6~13
D7~D0
I/O
These pins are 8-bit bi-directional data bus to be connected to the
microprocessors data bus. When serial mode is selected, D1 will be
the serial data input SDIN and D0 will be the serial clock input
SCLK.
Unused pins must be connected to VSS except for D2 in serial
mode.
Read/Write Enable or Read
14
E/RD#
I
This pin is MCU interface input. When interfacing to a 68XXsseries microprocessor, this pin will be used as the Enable (E)
signal. Read/write operation is initiated when this pin is pulled high
and the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives the
Read (RD#) signal. Data read operation is initiated when this pin is
low and CS# is pulled low.
When serial mode is selected, this pin must be connected to VSS.
Read/Write Select or Write
15
R/W#
I
This pin is MCU interface input. When interfacing to a 68XX-series
microprocessor, this pin will be used as Read/Write (R/W#)
selection input. Pull this pin to “High” for read mode and pull it
“Low” for write mode.
When 80XX interface mode is selected, this pin will be the Write
(WR#) input. Data write operation is initiated when this pin is
pulled low and the CS# is pulled low.
When serial mode is selected, this pin must be connected to VSS.
Communicating Protocol Select
16
17
Product No.
BS0
BS1
I
These pins are MCU interface selection input. See the following
table:
BS0
BS1
3-wire SPI
1
0
4-wire SPI
0
0
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8-bit 68XX Parallel
8-bit 80XX Parallel
1
0
1
1
Data/Command Control
18
D/C#
I
19
CS#
I
20
RES#
I
21
FR
O
This pin is Data/Command control pin. When the pin is pulled high,
the input at D7~D0 is treated as display data. When the pin is
pulled low, the input at D7~D0 will be transferred to the command
register. For detailed relationship to MCU interface signals, please
refer to the Timing Characteristics Diagrams
Chip Select
This pin is the chip select input. When the pin is enabled for MCU
communication only when CS# is pulled low..
Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization of
the chip is executed.
Cascade Application Connection Pin
This pin is No Connection pins. Nothing should be connected to this
pin. It should be left open individually.
Current Reference for Brightness Adjustment
22
IREF
I
23
N.C.
-
This pin is segment current reference pin. A resistor should be
connected between this pin and VSS. Set the current lower than
10µA
Reserved Pin
The N.C. pin between function pins are reserved for compatible and
flexible design.
Power Supply for I/O Pin
24
VDDIO
P
This pin is a power supply pin of I/O buffer. It should be connected
to VDD or external source. All I/O signals should have VIH
reference to VDDIO. When I/O signal pins (BS0~BS1, D0~D7,
control signals…) pull high, they should be connected to VDDIO.
Power Supply for Core Logic Circuit
25
VDD
P
26
VCI
P
This is a voltage supply pin. It can be supplied externally (within the
range of 2.4~2.6V) or regulated internally from VCI. A capacitor
should be connected between this pin & VSS under all
circumstances.
Power Supply for Operation
This is a voltage supply pin. It must be connected to external source
& always be equal or higher than VDD & VDDIO.
Voltage Output Low Level for SEG Signal
27
VSL
P
28
VLSS
P
29
VCC
I
This is segment voltage reference pin.
When external VSL is not used, this pin should be left open.
When external VSL is used, this pin should connect with resistor and
diode to ground.
Ground of Analog Circuit
This is the analog ground pin. It should be connected to VSS
externally
Power Supply for OEL Panel
Product No.
This is the most positive supply pin of the chip. They should be
connected to external source.
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Reserved Pin (Supporting Pin).
30
N.C. (GND)
-
The supporting pins can reduce the influences from stresses on the
function pins. This pin must be connected to external ground.
3.4 BLOCK DIAGRAM
MCU Interface Selection: BS0 and BS1
Pins connected to MCU interface: D7~D0, E/RD#, R/W#, D/C#, CS#, and RES#
C1, C3, C5: 0.1μF
C2, C4: 4.7μF
C6: 10μF
C7: 1μF
C8: 4.7uF / 25V Tantalum Capacitor R1: 680kΩ,
R1 = 680kΩ, R1= (Voltage at IREF – VSS) / IREF
R2: 50Ω, 1/4W
D1: ≤1.4V, 0.5W
Product No.
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3.5 TIMING CHARACTERISTICS
3.5.1 68XX-Series MPU Parallel Interface Timing Characteristics:
Symbol
Description
Min
Max
Unit
tcycle
300
10
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
0
-
ns
tDSW
Write Data Setup Time
40
-
ns
tDHW
Write Data Hold Time
7
-
ns
tDHR
Read Data Hold Time
20
-
ns
tOH
Output Disable Time
-
70
ns
tACC
Access Time
-
140
ns
PWCSL
Chip Select Low Pulse Width (Read)
Chip Select Low Pulse Width (Write)
120
60
-
ns
PWCSH
Chip Select High Pulse Width (Read)
Chip Select High Pulse Width (Write)
60
60
-
ns
tR
Rise Time
-
15
ns
tF
Fall Time
-
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
Product No.
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3.5.2 80XX-Series MPU Parallel Interface Timing Characteristics:
Symbol
Description
Min
Max
Unit
300
10
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
0
-
ns
tDSW
Write Data Setup Time
40
-
ns
tDHW
Write Data Hold Time
7
-
ns
tDHR
Read Data Hold Time
20
-
ns
tOH
-
70
140
ns
tACC
Output Disable Time
Access Time
tPWLR
Read Low Time
150
-
ns
tPWLW
Write Low Time
60
-
ns
tPWHR
Read High Time
Write High Time
60
60
-
ns
-
ns
Chip Select Setup Time
0
-
ns
Chip Select Hold Time to Read
Signal
Chip Select Hold Time
0
-
ns
20
-
ns
-
15
ns
tcycle
tPWHW
tCS
tCSH
tCSF
tR
tF
Product No.
Rise Time
ns
Fall Time
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
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3.5.3 Serial Interface Timing Characteristics: (4-wire SPI)
Symbol
Description
Min
Max
Unit
100
15
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
15
-
ns
tCSS
20
10
-
ns
tCSH
Chip Select Setup Time
Chip Select Hold Time
-
ns
tDSW
Write Data Setup Time
15
-
ns
tDHW
Write Data Hold Time
15
-
ns
tCLKL
Clock Low Time
20
-
ns
tCLKH
Clock High Time
20
-
ns
-
15
ns
tcycle
tR
tF
Product No.
Rise Time
Fall Time
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
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3.5.4 Serial Interface Timing Characteristics: (3-wire SPI)
Symbol
Description
Min
Max
Unit
100
15
-
ns
tAS
Clock Cycle Time
Address Setup Time
-
ns
tAH
Address Hold Time
15
-
ns
tCSS
20
10
-
ns
tCSH
Chip Select Setup Time
Chip Select Hold Time
-
ns
tDSW
Write Data Setup Time
15
-
ns
tDHW
Write Data Hold Time
15
-
ns
tCLKL
Clock Low Time
20
-
ns
tCLKH
Clock High Time
20
-
ns
-
15
ns
tcycle
tR
tF
Product No.
Rise Time
Fall Time
15
ns
(VDD-VSS = 2.4V to 2.6V, VDDIO = 1.6V, VCI = 2.8V, Ta = 25°C)
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4 OPTICAL SPECIFICATION
4.1 OPTICAL CHARACTERISTICS
Colour
Characteristics
Symbol
Conditions
Min
Typ.
Brightness
Lbr
With Polarizer
(Note 3)
60
80
-
C.I.E. (Blue)
(x)
(y)
Without Polarizer
0.12
0.22
0.16
0.26
0.20
0.30
Brightness
Lbr
With Polarizer
(Note 3)
100
120
-
C.I.E. (Green)
(x)
(y)
Without Polarizer
0.27
0.58
0.31
0.62
0.35
0.66
Brightness
Lbr
With Polarizer
(Note 3)
60
80
-
C.I.E. (White)
(x)
(y)
Without Polarizer
0.28
0.29
0.32
0.33
0.36
0.37
Brightness
Lbr
With Polarizer
(Note 3)
60
80
-
C.I.E. (Yellow)
(x)
(y)
Without Polarizer
0.44
0.46
0.48
0.50
0.52
0.54
-
Dark Room Contrast
CR
-
-
>2000:1
-
-
View Angle
-
-
>160
-
-
Blue
Green
White
Yellow
Max Unit
cd/m2
cd/m2
cd/m2
cd/m2
degree
Note 3: Optical measurement taken at VCI = 2.8V, VCC = 12V
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4.2 BRIGHTNESS LOSS OF COVER LENS
Depending on the different materials of cover lens, the brightness loss is given by the
following table.
Cover Lens Material
Brightness Loss
(%)
Dark Neutral 1mm
Acrylic
25%
Neutral 1mm Acrylic
50%
Clear 1mm Acrylic
with single colour
black silkscreen printed
border
No Loss
Colour
Blue
Green
White
Yellow
Blue
Green
White
Yellow
Blue
Green
White
Yellow
Brightness
Min
Typ.
45
60
75
90
45
60
45
60
30
40
50
60
30
40
30
40
60
80
100
120
60
80
60
80
Unit
cd/m2
(Test Conditions: Without Polarizer, VCI = 2.8V, VCC = 12V)
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5 FUNCTIONAL SPECIFICATION
5.1 COMMANDS
Refer to the Technical Manual for the SSD1322
5.2 POWER DOWN AND UP SEQUENCE
To protect the panel and extend the panel life time, the driver IC power up/down routine
should include a delay period between high voltage and low voltage power sources during
turn on/off. Such that panel has enough time to charge and discharge before/after
operation.
5.2.1 Power up Sequence:
1. Power up VCI & VDDIO
2. Send Display off command
3. Initialization
4. Clear Screen
5. Power up VCC
6. Delay 100ms (when VCC is stable)
7. Send Display on command
5.2.2 Power down Sequence:
1. Send Display off command
2. Power down VCC
3. Delay 100ms (when VCC is reach
0 and panel is completely discharges)
4. Power down VCI & VDDIO
5.3
RESET CIRCUIT
When RES# input is low, the chip initialized with the following status:
1. Display is OFF
2. 480x128 Display Mode
3. Normal segment and display data column and row address mapping (SEG0
mapped to column address 00h and COM0 mapped to row address 00h)
4. Display start line is set at display RAM address 0
5. Column address counter is set at 0
6. Normal scan direction of the COM outputs
7. Contrast control registers is set at 7Fh
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5.4 ACTUAL APPLICATION EXAMPLE
Command usage and explanation of an actual example
If the noise is accidentally occurred at the displaying window during the operation, please
reset the display in order to recover the display function.
Product No.
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6 PACKAGING AND LABELLING SPECIFICATION
6.1 LABELLING & MARKING
DENSITRON
CLDD-256644A-Series
TW YY MM
Product No.
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7 QUALITY ASSURANCE SPECIFICATION
7.1 CONFORMITY
The performance, function and reliability of the shipped products conform to the Product
Specification.
7.2 DELIVERY ASSURANCE
7.2.1 Delivery inspection standards
IPC-AA610 rev. C, class 2 electronic assemblies standard
7.2.2 Zone definition
A Viewing area
B Outside viewing area
7.2.3 Visual inspection
Test and measurement to be conducted under following conditions:
Temperature:
Humidity:
Fluorescent lamp:
23±5℃
55±15%RH
30 W
Distance between the Panel & Eyes of the Inspector:
≧30cm
Distance between the Panel & the lamp:
≧50cm
Finger glove (or finger cover) must be worn by the inspector.
Inspection table or jig must be anti-electrostatic
eye
45°
Product No.
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7.2.1 Standard of appearance inspection
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7.3 DEALING WITH CUSTOMER COMPLAINTS
7.3.1 Non-conforming analysis
Purchaser should supply Densitron with detailed data of non-conforming sample.
After accepting it, Densitron should complete the analysis in two weeks from receiving the
sample.
If the analysis cannot be completed on time, Densitron must inform the purchaser.
7.3.2 Handling of non-conforming displays
If any non-conforming displays are found during customer acceptance inspection which
Densitron is clearly responsible for, return them to Densitron.
Both Densitron and customer should analyse the reason and discuss the handling of nonconforming displays when the reason is not clear.
Equally, both sides should discuss and come to agreement for issues pertaining to
modification of Densitron quality assurance standard.
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8 RELIABILITY SPECIFICATION
8.1 RELIABILITY TESTS
Test Item
Test Condition
Evaluation and assessment
High Temperature Operation 85°C, 500 hrs
Low Temperature Operation
-30°C, 500 hrs
High Temperature Storage
90°C, 500 hrs
Low Temperature Storage
-40°C, 500 hrs
High Temperature & High
Humidity Storage
60°C, 90% RH, 500 hrs
The brightness should be
greater than 50% of the
initial brightness. The
operational functions work.
-40°C ↔85°C, 100 cycles
30 min. dwell
All operation tests are conducted in all display on pattern.
The samples used for above tests do not include polarizer.
No moisture condensation is observed during tests.
Thermal Shock Storage
8.2 LIFE TIME
Item
1
2
Description
Display Colour
Min
Max
Blue
10,000 hr
-
Green
40,000 hr
-
Yellow
40,000 hr
White
10,000 hr
-
Condition
80 cd/m2, 50%
Checkerboard
100 cd/m2, 50%
Checkerboard
80 cd/m2, 50%
Checkerboard
80 cd/m2, 50%
Checkerboard
Note
1
End of lifetime is specified as 50% of initial brightness.
Note 1: The average operating lifetime at room temperature is estimated by the accelerated
operation at high temperature conditions.
8.3 FAILURE CHECK STANDARD
After the completion of the described reliability test, the samples were left at room
temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
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9 PART NUMBER DESCRIPTION FOR AVAILABLE
OPTIONS
①②
③
④
OLED Colour
BE = Blue
GE = Green
YW = Yellow
WE = White
Cover Lens Material
D = Dark Neutral 1mm Acrylic
N = Neutral 1mm Acrylic
C = Clear 1mm Acrylic with single colour black silkscreen printed border
G = Clear 1mm Chemically Strengthen Glass with single colour black
silkscreen printed border
Bonding Method
E = Edge Bonded
O = Optically Bonded (SolisBond ®)
Lens Finish
G = Anti Glare
R = Anti Reflective
10 HANDLING PRECAUTIONS
10.1 HANDLING PRECAUTIONS
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1) Since the display panel is being made of glass, do not apply mechanical impacts
such us dropping from a high position.
2) If the display panel is broken by some accident and the internal organic substance
leaks out, be careful not to inhale nor lick the organic substance.
3) If pressure is applied to the display surface or its neighborhood of the OEL display
module, the cell structure may be damaged and be careful not to apply pressure to
these sections.
4) The polarizer covering the surface of the OEL display module is soft and easily
scratched. Please be careful when handling the OEL display module.
5) When the surface of the polarizer of the OEL display module has soil, clean the
surface. It takes advantage of by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth
containing solvent such as ethyl alcohol, since the surface of the polarizer will
become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents
6) Hold OEL display module very carefully when placing OEL display module into
the system housing. Do not apply excessive stress or pressure to OEL display
module. And, do not over bend the film with electrode pattern layouts. These
stresses will influence the display performance. Also, secure sufficient rigidity for
the outer cases.
7) Do not apply stress to the LSI chips and the surrounding molded sections.
8) Do not disassemble nor modify the OEL display module.
9) Do not apply input signals while the logic power is off.
10) Pay sufficient attention to the working environments when handing OEL display
modules to prevent occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OEL display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work
under dry environments.
* Protective film is being applied to the surface of the display panel of the OEL
display module. Be careful since static electricity may be generated when
exfoliating the protective film.
11) Protection film is being applied to the surface of the display panel and removes the
protection film before assembling it. At this time, if the OEL display module has
been stored for a long period of time, residue adhesive material of the protection
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film may remain on the surface of the display panel after removed of the film. In
such case, remove the residue material by the method introduced in the above
Section 5).
12) If electric current is applied when the OEL display module is being dewed or when
it is placed under high humidity environments, the electrodes may be corroded and
be careful to avoid the above.
10.2 STORAGE PRECAUTIONS
1) When storing OEL display modules, put them in static electricity preventive bags
avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and,
also, avoiding high temperature and high humidity environments or low
temperature (less than 0°C) environments. (We recommend you to store these
modules in the packaged state when they were shipped from Densitron
Technologies Plc.) At that time, be careful not to let water drops adhere to the
packages or bags nor let dewing occur with them.
2) If electric current is applied when water drops are adhering to the surface of the
OEL display module, when the OEL display module is being dewed or when it is
placed under high humidity environments, the electrodes may be corroded and be
careful about the above.
10.3 DESIGNING PRECAUTIONS
1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL
display module, and if these values are exceeded, panel damage may be happen.
2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL
and VIH specifications and, at the same time, to make the signal line cable as short
as possible.
3) We recommend you to install excess current preventive unit (fuses, etc.) to the
power circuit (VDD). (Recommend value: 0.5A)
4) Pay sufficient attention to avoid occurrence of mutual noise interference with the
neighboring devices.
5) As for EMI, take necessary measures on the equipment side basically.
6) When fastening the OEL display module, fasten the external plastic housing section.
7) If power supply to the OEL display module is forcibly shut down by such errors as
taking out the main battery while the OEL display panel is in operation, we cannot
guarantee the quality of this OEL display module.
8) The electric potential to be connected to the rear face of the IC chip should be as
follows: US2066
* Connection (contact) to any other potential than the above may lead to rupture of
the IC.
10.4 OTHER PRECAUTIONS
1) When an OEL display module is operated for a long of time with fixed pattern may
remain as an after image or slight contrast deviation may occur. Nonetheless, if the
operation is interrupted and left unused for a while, normal state can be restored.
Also, there will be no problem in the reliability of the module.
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2) To protect OEL display modules from performance drops by static electricity
rapture, etc., do not touch the following sections whenever possible while handling
the OEL display modules.
* Pins and electrodes
* Pattern layouts such as the FPC
3) With this OEL display module, the OEL driver is being exposed. Generally
speaking, semiconductor elements change their characteristics when light is
radiated according to the principle of the solar battery. Consequently, if this OEL
driver is exposed to light, malfunctioning may occur.
* Design the product and installation method so that the OEL driver may be
shielded from light in actual usage.
* Design the product and installation method so that the OEL driver may be
shielded from light during the inspection processes.
4) Although this OEL display module stores the operation state data by the commands
and the indication data, when excessive external noise, etc. enters into the module,
the internal status may be changed. It therefore is necessary to take appropriate
measures to suppress noise generation or to protect from influences of noise on the
system design.
5) We recommend you to construct its software to make periodical refreshment of the
operation statuses (re-setting of the commands and re-transference of the display
data) to cope with catastrophic noise.
10.5 PRECAUTIONS WHEN DISPOSING OF THE OEL DISPLAY
MODULES
1) Request the qualified companies to handle industrial wastes when disposing of the
OEL display modules. Or, when burning them, be sure to observe the
environmental and hygienic laws and regulations.
11 SUPPORTED ACCESSORIES
11.1 DUO KIT
Densitron has developed an easy to use yet powerful development and demonstration tool
for driving its range of Passive Matrix OLED displays from the USB port of a PC.
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DUO (Densitron USB OLED) kit is hot pluggable and does not require extra cables or
power supply to run, allowing users to be up and running in minutes.
The kit consists of an OLED display with transition Board, USB controller card, mini USB
cable and a CD with software application and drivers.
Part number: PDK-N-25664xx-4A
11.2 TRANSITION BOARD CARD
A Transition board card is like a daughterboard which is meant to be a circuit board for
connections between the baseboards (DUO).
It has connector pins for interfacing between the display and the baseboards.
It also includes the OLED display.
Part number: PDT-N-25664xx-4A
11.3 CONNECTOR BOARD CARD
A Connector board card is also a daughterboard which is a circuit board for connection
between a microprocessor or microcontroller (customer’s system).
Part number: EVK-CONNECT-021
11.4 CONNECTOR
Type: ZIF connector
No. of
Pitch
connections
(mm)
30
0.50
Manufacturer
Omron
Manufacturer part
no.
Distributor part no.
XF2M-3015-1A
Farnell/1112560
Digikey/ OR723CT-ND
11.5 OPTICAL BONDING SERVICE
SolisBond®, Densitron's optical bonding service, offers optically bonded engineered
solutions created in our new class 10,000 clean room bonding facility. SolisBond® optical
bonding can be tailored to each specific display, cover lens and touchscreen combination.
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We will advise our customers on the design of the cover lens, helping with the selection of
the right material, treatment and printing process. We can also manufacture the cover
lenses to request and provide a suitable display and touchscreen combinations.
SolisBond® bonded displays can be customized to meet automotive, high humidity and
marine standards (-30C to +85C). Environmental testing and tolerance analysis are for us
an obvious standard. Documentation for the tests and calculations are of course also
available.
Mechanism
Reflection loss is about 8% due to air gap.
SolisBond® reduces sunshine reflection and loss of light from backlight units.
Key Benefits
Improved Sunlight Readability
Decreases reflection on the display glass from external light source, hence improves
the contrast ratio.
Shock-resistant
Adhesive is soft and not brittle.
Re-workable process
High yield: 1%~5% yield loss of display, 1% yield loss of cover lens and touch panel.
Improved Luminance
Reduces light loss from backlight units which increases luminance for about 8%.
Straightforward process
No UV curing required
Green process and material
Cost-effective
Test Summary
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SolisBond® can withstand temperature ranges between -40C to +200C.
It does not suffer from the UV effects, so it doesn’t become brittle or yellow when
exposed to direct sunlight.
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