TFT LCD
DISPLAY MODULE
Product Specification
Customer
Standard
Product
Number
DMT024QVNUCMI-2A
Customer Part
Number
Customer
Approval
Date:
Internal Approvals
Product Mgr
Doc. Control
Electr. Eng.
Luo Luo
Filip Kaczorowski
Filip Kaczorowski
Date: 17/12/2018
Date: 17/12/18
Date: 17/12/18
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Revision Record
Rev.
Date
Page
Chapt.
Comment
A
17/12/18
--
--
Initial Release
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Table of Contents
1.0 GENERAL DESCRIPTION
5
1.1 Introduction
5
1.2 Main Features
5
2.0 MECHANICAL SPECIFICATION
6
2.1 Mechanical Characteristics
6
2.2 Mechanical Drawing
7
3.0 ELECTRICAL SPECIFICATION
8
3.1 Absolute Maximum Ratings
3.1.1 TFT
3.1.2 PCT
8
8
8
3.2 Electrical Characteristics
3.2.1 TFT
3.2.2 PCT
9
9
9
3.4 Interface Pin Assignment
3.4.1 TFT Pin Assignment
3.4.2 PCT Pins Assignment
10
10
11
3.5 Block Diagram
12
3.6 Timing Characteristics
3.6.1 TFT
3.6.2 PCT
13
13
16
4.0 OPTICAL SPECIFICATION
18
4.1 Optical Characteristics
18
5.0 LED BACKLIGHT SPECIFICATION
20
5.1 LED Backlight Characteristics
20
5.2 Internal Circuit Diagram
21
6.0 QUALITY ASSURANCE SPECIFICATION
22
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6.1 Delivery Inspection Standards
6.1.1 Inspection Conditions
6.1.2 Environmental Conditions
6.1.3 Sampling Conditions
6.1.4 Zone Definition
6.1.5 Basic Principle
6.1.6 Inspection Criteria
22
22
22
22
23
23
24
6.2 Dealing with Customer Complaints
6.2.1 Non-conforming Analysis
6.2.2 Handling of Non-conforming Displays
28
28
28
7.0 RELIABILITY SPECIFICATION
29
7.1 Reliability Tests
29
8.0 HANDLING PRECAUTIONS
30
8.1 Handling Precautions
30
8.2 Storage Precautions
31
8.3 Designing Precautions
31
8.4 Operation Precautions
32
8.5 Other Precautions
32
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1.0 General Description
1.1 Introduction
This is a colour active matrix TFT (Thin Film Transistor) LCD (liquid crystal display) that uses
amorphous silicon TFT as a switching device. This model is composed of a Transmissive type TFTLCD Panel, driver circuit, back-light unit. The resolution of a 2.4’TFT-LCD contains 240X320 pixels
and can display up to 65K/262K colours.
1.2 Main Features
Item
Contents
Screen Size
2.4” Diagonal
Display Format
240 x RGB x 320 Dots
N° of Colour
65K/262K colours
Overall Dimensions
42.72 mm(H) x 60.40 mm(V) x 3.57 mm (D)
Active Area
36.72 mm (H) x 48.96 mm (V)
Display Mode
Transmissive / Normally Black
Viewing Direction
All
TFT Interface
8/9/16/18 Bit MCU
PCT Interface
I2C
TFT Driver IC
ST7789V
PCT Controller IC
FT6336U
Backlight Type
LED, White, 4 chips
Operating Temperature
-20C ~ +70°C
Storage Temperature
-30°C ~ +80°C
Module Bonding Technology
Optical Bonding
ROHS
Compliant to 2011/65/EU
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2.0 Mechanical Specification
2.1 Mechanical Characteristics
Item
Characteristic
Unit
Display Format
240 x RGB x 320 Dots
Dots
Overall Dimensions
42.72 mm(H) x 60.40 mm(V) x 3.57 mm(D)
mm
Active Area
36.72 mm (H) x 48.96 mm (V)
mm
Pixel Pitch
0.153 (H) x 0.153 (V)
mm
Weight
TBD
g
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2.2 Mechanical Drawing
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3.0 Electrical Specification
3.1 Absolute Maximum Ratings
3.1.1 TFT
Item
Symbol
Min.
Max.
Unit
Note
Power Supply Voltage
VDD
-0.3
4.6
V
-
Digital Interface Supply Voltage
IOVCC
-0.3
4.6
V
-
Operating Temperature
TOP
-20
+70
°C
-
Storage Temperature
TST
-30
+80
°C
-
(Ta=25 VSS=0V)
Note: If the absolute maximum rating of even is one of the above parameters is exceeded even
momentarily, the quality of the product may be degraded. Absolute maximum ratings, therefore,
specify the values exceeding which the product may be physically damaged. Be sure to use the
product within the range of the absolute maximum ratings.
3.1.2 PCT
Item
Symbol
Min.
Max.
Unit
Note
Power Supply Voltage
VDD
-0.3
3.6
V
1
Operating Temperature
TOP
-20
+70
°C
-
Storage Temperature
TST
-30
+80
°C
-
Note 1: If used beyond the absolute maximum ratings, FT6336U may be permanently damaged. It is
strongly recommended that the device be used within the electrical characteristics in normal
operations. If exposed to the condition not within the electrical characteristics, it may affect the
reliability of the device.
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3.2 Electrical Characteristics
3.2.1 TFT
Item
Symbol
Min.
Typ.
Max.
Unit
VCI
2.4
3.3
3.6
V
IOVCC
1.65
1.8
3.3
V
Normal Mode Current
Consumption
IDD
-
5
-
mA
High Level Input
VIH
0.7xIOVCC
-
IOVCC
V
Low Level Input
VIL
GND
-
0.3xIOVCC
V
High Level Output
VOH
0.8IOVCC
-
IOVCC
V
Low Level Output
VOL
GND
-
0.2xIOVCC
V
Symbol
Min.
Typ.
Max.
Unit
VDD
2.8
3.3
3.6
V
Iopr
-
4
-
mA
Imon
-
1.5
-
mA
Sleep mode Current consumption
Islp
-
50
-
µA
High Level Input
VIH
0.75xVDDIO
-
VDDIO
V
Low Level Input
VIL
-0.3
-
0.3xVDDIO
V
High Level Output
VOH
0.7xVDDIO
-
-
V
Low Level Output
VOL
-
-
0.3xVDD
V
Digital Supply Voltage
Digital Interface Supply Voltage
3.2.2 PCT
Item
Supply Voltage
Normal operation mode Current
consumption
Monitor mode Current
consumption
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3.4 Interface Pin Assignment
3.4.1 TFT Pin Assignment
No.
Symbol
1
GND
2
IM0
3
IM1
4
FMARK
5
GND
6-15
DB17-DB8
16
IOVCC
17-24
DB7-DB0
25
CS
26
RS
27
WR
28
RD
29
RESET
30
VCI
31
GND
32
LED+
33
GND
Function
Ground of Logic Circuit.
This is a ground pin, to be connected to external ground.
MPU Parallel interface bus select.
Fix this pin at IOVCC and GND.
IM0
IM1
Mode
Pins Used
1
0
8-bit
DB10-DB17
1
1
9-bit
DB9-DB17
DB1-DB8,
0
0
16-bit
DB10-DB17
0
1
18-bit
DB0-DB17
Tearing effect output pin to synchronise MPU to frame writing,
activated by S/W command. When this pin is not activated this pin
is low.
If not used, leave open.
Ground of Logic Circuit.
This is a ground pin, to be connected to external ground.
Data bus.
If not used fix this pin at IOVCC and GND.
Supply voltage for IO. (1.65V-3.3V).
Data bus.
If not used fix this pin at IOVCC and GND.
Chip select input pin (“Low” enable).
This pin is used to select “Data or Command” in the parallel
interface. Fix this pin at IOVCC or GND when not in use.
Serves as a write signal and writes data at the rising edge. Fix this
pin at IOVCC or GND when not in use.
Serves as a read signal and MCU read data at the rising edge. Fix
this pin at IOVCC or GND when not in use.
This signal will reset the device and must be applied to properly
initialize the chip.
Supply voltage (3.3V)
Ground of Logic Circuit.
This is a ground pin, to be connected to external ground.
Anode pin of backlight.
Ground of Logic Circuit.
This is a ground pin, to be connected to external ground.
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No.
Symbol
Function
34
LED-
Cathode pin of backlight.
35
GND
Ground of Logic Circuit.
This is a ground pin, to be connected to external ground.
3.4.2 PCT Pins Assignment
No.
Symbol
Function
1
VDD
Supply voltage.
2
SCL
I2C clock input.
3
SDA
I2C data input and output.
4
INT
External interrupt to the host.
5
RST
External Reset, Low is active.
6
GND
Ground.
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3.5 Block Diagram
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3.6 Timing Characteristics
3.6.1 TFT
3.6.1.1 8080 Series MCU Parallel Interface Characteristics: 8/9/16/18-bit Bus
VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta=-30 to 70°C
Signal Symbol
Parameter
Min.
Max.
Unit
TAST
D/CX
TAHT
TCHW
TCS
TRCS
CSX
TRCSFM
TCSF
WRX
TCSH
TWC
Address setup time
Address hold time
(Write/Read)
Chip select “H” pulse width
Chip select setup time
(Write)
Chip select setup time (Read
ID)
Chip select setup time (Read
FM)
Chip select wait time
(Write/Read)
Chip select hold time
Write cycle
Description
0
-
ns
-
10
-
ns
-
0
-
ns
-
15
-
ns
-
45
-
ns
-
355
-
ns
-
10
-
ns
-
10
66
-
ns
ns
-
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TWRH
TWRL
TRC
RDX
(ID)
TRDH
TRDL
RDX
(FM)
D[17:0]
TRCFM
TRDHFM
TRDLFM
TDST
TDHT
TRAT
TRATFM
TODH
Control pulse “H” duration
Control pulse “L” duration
Read cycle (ID)
Control pulse “H” duration
(ID)
Control pulse “L” duration
(ID)
Read cycle (FM)
Control pulse “H” duration
Control pulse “L” duration
Data setup time
Data hold time
Read access time (ID)
Read access time (FM)
Output disable time
•
Rising and Falling Timing for I/O Signal
•
Write-to-Read and Read-to-Write Timing
15
15
160
-
ns
ns
ns
-
90
-
ns
When read
ID data
45
-
ns
450
90
355
10
10
20
40
340
80
ns
ns
ns
ns
ns
ns
ns
ns
When read
from frame
memory
For CL=30pF
Note: The rising time and falling time (Tr, Tf) of input signal and fall time are specified at 15 ns or
less. Logic high and low levels are specified as 30% and 70% of VDDI for input signals.
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3.6.1.2 Reset Timing
Related Pins
RESX
Symbol
Parameter
Min.
Max.
Unit
TRW
Reset pulse duration
TRT
Reset cancel
10
-
5(Note 1,5)
120(Note 1,6,7)
µs
ms
ms
Note:
1. The reset cancel includes also required time for loading ID bytes, VCOM setting and other
settings from NVM (or similar device) to registers. This loading is done every time when there is HW
reset cancel time (tRT) within 5 ms after a rising edge of RESX.
2. Spike due to an electrostatic discharge on RESX line does not cause irregular system reset
according to the table below:
RESX Pulse
Action
Shorter than 5µs
Longer than 9µs
Between 5µs and 9 µs
Reset Rejected
Reset
Reset starts
3. Suring the Resetting period, the display will be blanked (The display is entering blanking
sequence, which maximum time is 120 ms, when Reset Starts is Sleep Out-mode. The display
remains the blank state in Sleep In-mode.) and then return to Default condition for Hardware Reset.
4. Spike Rejection also applies during a valid reset pulse as shown below:
5. When Reset is applied during Sleep In Mode.
6. When Reset applied during Sleep Out Model.
7. It’s necessary to wait 5msec after releasing RESX before sending commands. Also Sleep Out
command cannot be sent for 120 ms.
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3.6.2 PCT
3.6.2.1 AC Characteristics
AC Characteristics of Oscillators
AC Characteristics of sensor
3.6.2.2 I2C Interface
The I2C is always configured in the Slave mode. The data transfer format is shown in figure
4-1.
Table 4-3 lists the meanings of the mnemonics used in above figures.
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I2C Interface Timing Characteristics are shown in table 4-4.
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4.0 Optical Specification
4.1 Optical Characteristics
Measuring instruments:
Driving condition:
Backlight:
Measured temperature:
Characteristics
Response time
LCD-5100, Eldim, Topcon BM-7
VDD = 3.3V, VSS = 0V
IF = 75mA
Ta = 25°C
Symbol
Conditions
Min
Typ
Max
Unit
Note
TR+TF
θ=Ф=0°
Normal
Viewing Angle
-
35
45
ms
2
640
800
-
-
3
%
CR
Uniformity
S(%)
-
70
-
Left
θL
-
80
-
Right
θR
-
80
-
Up
θU
-
80
-
Down
θD
-
80
-
Rx
0.5931
0.6331
0.6731
Ry
0.2936
0.3336
0.3736
Gx
0.2822
0.3222
0.3622
0.5718
0.6118
0.6518
0.1084
0.1484
0.1884
By
0.0034
0.0434
0.0834
Wx
0.3585
0.2985
0.3385
Wy
0.2786
0.3186
0.3586
Viewing Angle
Contrast Ratio
Colour Chromaticity
Red
Green
Gy
Bx
Blue
White
Option View Direction
CR≥10
CR≥10
deg
4
-
5
All
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Note
Item
Test method
The display should be stabilised at a given temperature for 30 minutes to
avoid abrupt temperature change during measuring. To stabilise the
luminance, measurements should be executed after lighting the backlight
for 30 minutes in a windless room.
1
Setup
Measure output signal waveform by the luminance meter when raster of
window pattern is changed from white to black and from black to white.
2
Response time
Measure maximum brightness and minimum brightness at the centre of the
screen by displaying raster or window pattern. Then calculate the ratio
between these two values.
3
Contrast ratio
Brightness of unselected position (white)
Contrast Ratio (CR) =
Brightness of selected position (black)
Move the luminance meter from right to left and up and down and
determinate the angles where contrast ratio is 10
4
Viewing angle
Horizontal θ
Vertical Ø
5
Colour chromaticity
6
Brightness
distribution
Measure chromaticity coordinates x and y of CIE1931 colorimetric system
(Brightness distribution) = 100 x B/A %
A: max. brightness of the 9 points
B: min. brightness of the 9 points
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5.0 LED Backlight Specification
5.1 LED Backlight Characteristics
The back-light system is edge-lighting type with 4 chips LED
Characteristics
Symbol
Min
Typ.
Max
Unit
Note
Forward Current
IF
15
20
-
mA
-
Forward Voltage
VF
-
12.8
-
V
-
LCM Luminance
LV
330
380
-
Cd/m2
3
LED life time
Hr
50000
-
-
Hour
1,2
Uniformity
Avg
80
-
-
%
3
Note 1: LED life time (Hr) can be defined as the time in which it continues to operate under the
condition: Ta=25±3 ℃, typical IL value indicated in the above table until the brightness becomes
less than 50%.
Note 2: The “LED life time” is defined as the module brightness decrease to 50% original brightness
at Ta=25℃ and IL=80mA. The LED lifetime could be decreased if operating IL is larger than 80mA.
The constant current driving method is suggested.
Note 3: Luminance Uniformity of these 9 points is defined as below:
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5.2 Internal Circuit Diagram
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6.0 Quality Assurance Specification
6.1 Delivery Inspection Standards
6.1.1 Inspection Conditions
Inspection distance:
Viewing angle:
30 cm - 50cm
±45°
6.1.2 Environmental Conditions
Ambient temperature:
Ambient humidity:
Ambient illumination:
25°C ± 5°C
65±10% RH
300~700 lux
6.1.3 Sampling Conditions
1.
2.
Lot size: quantity of shipment lot per model
Sampling method:
Sampling plan
Major Defect
Minor Defect
AQL
No.
Items to be
inspected
1
Functional defects
2
Missing
3
Outline dimension
4
Colour tone
5
Spot Line defect
6
7
Soldering appearance
LCD/Polarizer/TP
GB/T 2828-2003
Normal inspection, Class II
0.65%
1.5%
Criteria
1) No display, Open or miss line
2) Display abnormally, Short
3) Backlight no lighting, abnormal lighting.
4) TP no function
Missing component
Overall outline dimension beyond the
drawing is not allowed
Colour unevenness, refer to limited sample
Light dot, Dim spot, Polarizer bubble;
Polarizer accidented spot.
Good soldering, peeling off is not allowed.
Black/White spot/line, scratch, crack, etc.
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Classification
of defects
Major
Minor
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6.1.4 Zone Definition
Zone A: Effective Viewing Area (Character or Digit can be seen)
Zone B: Viewing Area except Zone A
Zone C: Outside (ZoneA+ZoneB) which can’t be seen after assembly by customer.
Zone D: IC Bonding Area
Note: Generally, visual defects in Zone C can be ignored when it doesn’t affect product function or
appearance after assembly by customer.
6.1.5 Basic Principle
A set of sample to indicate the limit of acceptable quality level shall be discussed should a dispute
occur.
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6.1.6 Inspection Criteria
Number
Items
Criteria (mm)
1.0 LCD
Crack/
Broken
(1) The
edge of
LCD
broken
X
Note:
X: Length
Y: Width
Z: Height
L: Length
of ITO
T: Height
of LCD
≤3.0mm
Y