GD225HFX170C6S
IGBT Module
STARPOWER
IGBT
SEMICONDUCTOR
GD225HFX170C6S
1700V/225A 2 in one-package
General Description
STARPOWER IGBT Power Module provides ultra
low conduction loss as well as short circuit ruggedness.
They are designed for the applications such as
general inverters and UPS.
Features
Low VCE(sat) Trench IGBT technology
10μs short circuit capability
VCE(sat) with positive temperature coefficient
Maximum junction temperature 175oC
Low inductance case
Fast & soft reverse recovery anti-parallel FWD
Isolated copper baseplate using DBC technology
Typical Applications
Inverter for motor drive
AC and DC servo drive amplifier
Uninterruptible power supply
Equivalent Circuit Schematic
©2019 STARPOWER Semiconductor Ltd.
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preliminary
GD225HFX170C6S
IGBT Module
Absolute Maximum Ratings TC=25oC unless otherwise noted
IGBT
Symbol
VCES
VGES
IC
ICM
PD
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Current @ TC=25oC
@ TC=100oC
Pulsed Collector Current tp=1ms
Maximum Power Dissipation @ Tj=175oC
Value
1700
±20
396
225
450
1530
Unit
V
V
Description
Repetitive Peak Reverse Voltage
Diode Continuous Forward Current
Diode Maximum Forward Current tp=1ms
Value
1700
225
450
Unit
V
A
A
Value
175
-40 to +150
-40 to +125
4000
Unit
o
C
o
C
o
C
V
A
A
W
Diode
Symbol
VRRM
IF
IFM
Module
Symbol
Tjmax
Tjop
TSTG
VISO
Description
Maximum Junction Temperature
Operating Junction Temperature
Storage Temperature Range
Isolation Voltage RMS,f=50Hz,t=1min
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preliminary
GD225HFX170C6S
IGBT Module
IGBT Characteristics TC=25oC unless otherwise noted
Symbol
VCE(sat)
VGE(th)
ICES
IGES
RGint
Cies
Cres
QG
td(on)
tr
td(off)
tf
Eon
Eoff
td(on)
tr
td(off)
tf
Eon
Eoff
td(on)
tr
td(off)
tf
Eon
Eoff
ISC
Parameter
Collector to Emitter
Saturation Voltage
Gate-Emitter Threshold
Voltage
Collector Cut-Off
Current
Gate-Emitter Leakage
Current
Internal Gate Resistance
Input Capacitance
Reverse Transfer
Capacitance
Gate Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
SC Data
Test Conditions
IC=225A,VGE=15V,
Tj=25oC
IC=225A,VGE=15V,
Tj=125oC
IC=225A,VGE=15V,
Tj=150oC
IC=9.0mA,VCE=VGE,
Tj=25oC
VCE=VCES,VGE=0V,
Tj=25oC
VGE=VGES,VCE=0V,
Tj=25oC
Min.
VCE=25V,f=1MHz,
VGE=0V
VGE=-15…+15V
VCC=900V,IC=225A,
RGon=3.3Ω,RGoff=6.2Ω,
VGE=±15V,
Tj=25oC
VCC=900V,IC=225A,
RGon=3.3Ω,RGoff=6.2Ω,
VGE=±15V,
Tj=125oC
VCC=900V,IC=225A,
RGon=3.3Ω,RGoff=6.2Ω,
VGE=±15V,
Tj=150oC
tP≤10μs,VGE=15V,
Tj=150oC,VCC=1000V,
VCEM≤1700V
©2019 STARPOWER Semiconductor Ltd.
1/29/2019
Typ.
Max.
1.85
2.20
2.25
Unit
V
2.35
5.6
6.2
6.8
V
5.0
mA
400
nA
2.8
27.1
Ω
nF
0.66
nF
2.12
187
76
587
350
μC
ns
ns
ns
ns
56.1
mJ
52.3
mJ
200
85
693
662
ns
ns
ns
ns
75.9
mJ
80.9
mJ
208
90
704
744
ns
ns
ns
ns
82.8
mJ
87.7
mJ
900
A
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preliminary
GD225HFX170C6S
IGBT Module
Diode Characteristics TC=25oC unless otherwise noted
Symbol
VF
Qr
IRM
Erec
Qr
IRM
Erec
Qr
IRM
Erec
Parameter
Diode Forward
Voltage
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Test Conditions
IF=225A,VGE=0V,Tj=25oC
IF=225A,VGE=0V,Tj=125oC
IF=225A,VGE=0V,Tj=150oC
Min.
Typ.
1.80
1.90
1.95
63.0
VR=900V,IF=225A,
-di/dt=3565A/μs,VGE=-15V
Tj=25oC
VR=900V,IF=225A,
-di/dt=3565A/μs,VGE=-15V
Tj=125oC
VR=900V,IF=225A,
-di/dt=3565A/μs,VGE=-15V
Tj=150oC
Max.
2.25
Units
V
μC
352
A
37.4
mJ
107
μC
394
A
71.0
mJ
121
μC
385
A
82.8
mJ
NTC Characteristics TC=25oC unless otherwise noted
Symbol
R25
∆R/R
P25
Parameter
Rated Resistance
Deviation of R100
Power
Dissipation
B25/50
B-value
B25/80
B-value
B25/100
B-value
Test Conditions
Min.
TC=100 oC,R100=493.3Ω
Typ.
5.0
-5
R2=R25exp[B25/50(1/T21/(298.15K))]
R2=R25exp[B25/80(1/T21/(298.15K))]
R2=R25exp[B25/100(1/T21/(298.15K))]
Max.
5
Unit
kΩ
%
20.0
mW
3375
K
3411
K
3433
K
Module Characteristics TC=25oC unless otherwise noted
Symbol
LCE
RCC’+EE’
RthJC
RthCH
M
G
Parameter
Stray Inductance
Module Lead Resistance, Terminal to Chip
Junction-to-Case (per IGBT)
Junction-to-Case (per Diode)
Case-to-Heatsink (per IGBT)
Case-to-Heatsink (per Diode)
Case-to-Heatsink (per Module)
Terminal Connection Torque, Screw M6
Mounting Torque, Screw M5
Weight of Module
©2019 STARPOWER Semiconductor Ltd.
Min.
Typ.
20
1.10
Max.
0.098
0.158
0.029
0.047
0.009
3.0
3.0
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K/W
K/W
6.0
6.0
350
Unit
nH
mΩ
N.m
g
preliminary
GD225HFX170C6S
IGBT Module
450
450
VGE=15V
400
350
350
300
300
250
250
IC [A]
IC [A]
400
200
150
VCE=20V
200
150
100
100
Tj=25℃
Tj=125℃
50
Tj=25℃
Tj=125℃
Tj=150℃
50
Tj=150℃
0
0
0
0.5
1
1.5 2 2.5
VCE [V]
3
3.5
4
5
Fig 1. IGBT Output Characteristics
7
8
9
VGE [V]
10
11
12
Fig 2. IGBT Transfer Characteristics
400
350
Eon Tj=125℃
Eoff Tj=125℃
Eon Tj=150℃
Eoff Tj=150℃
300
300
VCC=900V
RGon=3.3Ω
RGoff=6.2Ω
VGE=±15V
250
E [mJ]
200
Eon Tj=125℃
Eoff Tj=125℃
Eon Tj=150℃
Eoff Tj=150℃
350
250
E [mJ]
6
150
200
150
100
100
50
VCC=900V
IC=225A
VGE=±15V
50
0
0
0
90
180 270
IC [A]
360
450
Fig 3. IGBT Switching Loss vs. IC
©2019 STARPOWER Semiconductor Ltd.
0
10
20
30 40
RG [Ω]
50
60
Fig 4. IGBT Switching Loss vs. RG
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preliminary
70
GD225HFX170C6S
IGBT Module
0.1
500
IGBT
Module
400
IC [A]
ZthJC [K/W]
300
200
0.01
RGoff=6.2Ω
VGE=±15V
Tj=150oC
100
i:
1
2
3
4
ri[K/W]: 0.0056 0.0325 0.0314 0.0285
0.01
0.02
0.05
0.1
τi[s]:
0
0
0.001
0.001
300 600 900 1200 1500 1800
VCE [V]
Fig 5. RBSOA
0.01
0.1
t [s]
1
10
Fig 6. IGBT Transient Thermal Impedance
450
120
Tj=25℃
Tj=125℃
Tj=150℃
400
Erec Tj=125℃
Erec Tj=150℃
100
350
80
250
E [mJ]
IF [A]
300
200
150
60
40
100
VCC=900V
RGon=3.3Ω
VGE=±15V
20
50
0
0
0.0
0.5
1.0
1.5 2.0
VF [V]
2.5
3.0
Fig 7. Diode Forward Characteristics
©2019 STARPOWER Semiconductor Ltd.
0
90
180 270
IF [A]
360
Fig 8. Diode Switching Loss vs. IF
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preliminary
450
GD225HFX170C6S
IGBT Module
1
100
Erec Tj=125℃
Erec Tj=150℃
Diode
80
0.1
E [mJ]
ZthJC [K/W]
60
40
0.01
20
VCC=900V
IF=225A
VGE=-15V
i:
1
2
3
4
ri[K/W]: 0.0093 0.0519 0.0507 0.0461
τi[s]:
0.01
0.02
0.05
0.1
0
0
5
10
15 20
RG [Ω]
25
30
35
Fig 9. Diode Switching Loss vs. RG
0.001
0.001
0.01
0.1
t [s]
1
Fig 10. Diode Transient Thermal Impedance
100
R [kΩ]
10
1
0.1
0
30
60
90
o
TC [ C]
120
10
150
Fig 11. NTC Temperature Characteristic
©2019 STARPOWER Semiconductor Ltd.
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preliminary
GD225HFX170C6S
IGBT Module
Circuit Schematic
Package Dimensions
Dimensions in Millimeters
9
8
6
7
5
4
10
11
3
1 2
A
B
©2019 STARPOWER Semiconductor Ltd.
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preliminary
GD225HFX170C6S
IGBT Module
Terms and Conditions of Usage
The data contained in this product datasheet is exclusively intended for technically trained
staff. you and your technical departments will have to evaluate the suitability of the product
for the intended application and the completeness of the product data with respect to such
application.
This product data sheet is describing the characteristics of this product for which a warranty is
granted. Any such warranty is granted exclusively pursuant the terms and conditions of the
supply agreement. There will be no guarantee of any kind for the product and its
characteristics.
Should you require product information in excess of the data given in this product data sheet
or which concerns the specific application of our product, please contact the sales office,
which is responsible for you (see www.powersemi.cc), For those that are specifically
interested we may provide application notes.
Due to technical requirements our product may contain dangerous substances. For
information on the types in question please contact the sales office, which is responsible for
you.
Should you intend to use the Product in aviation applications, in health or live endangering or
life support applications, please notify.
If and to the extent necessary, please forward equivalent notices to your customers.
Changes of this product data sheet are reserved.
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1/29/2019
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preliminary