GD600HFY120P1S
IGBT Module
STARPOWER
SEMICONDUCTOR
IGBT
GD600HFY120P1S
1200V/600A 2 in one-package
General Description
STARPOWER IGBT Power Module provides ultra
low conduction loss as well as short circuit ruggedness.
They are designed for the applications such as
electric vehicle and solar power.
Features
Low VCE(sat) Trench IGBT technology
10μs short circuit capability
VCE(sat) with positive temperature coefficient
Maximum junction temperature 175oC
Low inductance case
Isolated copper baseplate using DBC technology
High power and thermal cycling capability
Typical Applications
High Power Converter
Solar Power
Hybrid and Electric Vehicle
Equivalent Circuit Schematic
©2016 STARPOWER Semiconductor Ltd.
4/21/2016
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GD600HFY120P1S
IGBT Module
Absolute Maximum Ratings TC=25oC unless otherwise noted
IGBT
Symbol
VCES
VGES
IC
ICM
PD
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Current @ TC=25oC
@ TC=100oC
Pulsed Collector Current tp=1ms
Maximum Power Dissipation @ Tj=175oC
Value
1200
±20
951
600
1200
3.1
Unit
V
V
Description
Repetitive Peak Reverse Voltage
Diode Continuous Forward Current
Diode Maximum Forward Current tp=1ms
Value
1200
600
1200
Unit
V
A
A
Value
175
-40 to +150
-40 to +125
2500
Unit
o
C
o
C
o
C
V
A
A
kW
Diode
Symbol
VRRM
IF
IFM
Module
Symbol
Tjmax
Tjop
TSTG
VISO
Description
Maximum Junction Temperature
Operating Junction Temperature
Storage Temperature Range
Isolation Voltage RMS,f=50Hz,t=1min
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GD600HFY120P1S
IGBT Module
IGBT Characteristics TC=25oC unless otherwise noted
Symbol
VCE(sat)
VGE(th)
ICES
IGES
RGint
td(on)
tr
td(off)
tf
Eon
Eoff
td(on)
tr
td(off)
tf
Eon
Eoff
td(on)
tr
td(off)
tf
Eon
Eoff
ISC
Parameter
Collector to Emitter
Saturation Voltage
Gate-Emitter Threshold
Voltage
Collector Cut-Off
Current
Gate-Emitter Leakage
Current
Internal Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
SC Data
Test Conditions
IC=600A,VGE=15V,
Tj=25oC
IC=600A,VGE=15V,
Tj=125oC
IC=600A,VGE=15V,
Tj=150oC
IC=15.0mA,VCE=VGE,
Tj=25oC
VCE=VCES,VGE=0V,
Tj=25oC
VGE=VGES,VCE=0V,
Tj=25oC
Min.
Max.
1.70
2.15
1.95
Unit
V
2.00
5.2
VCC=600V,IC=600A,
RG=1.8Ω,VGE=±15V,
Tj=25oC
VCC=600V,IC=600A,
RG=1.8Ω,VGE=±15V,
Tj=125oC
VCC=600V,IC=600A,
RG=1.8Ω,VGE=±15V,
Tj=150oC
tP≤10μs,VGE=15V,
Tj=150oC,VCC=800V,
VCEM≤1200V
©2016 STARPOWER Semiconductor Ltd.
Typ.
4/21/2016
6.0
6.8
V
1.0
mA
400
nA
1.3
257
96
721
155
Ω
ns
ns
ns
ns
52.4
mJ
54.6
mJ
310
107
824
165
ns
ns
ns
ns
65.3
mJ
75.2
mJ
332
107
876
175
ns
ns
ns
ns
69.6
mJ
84.5
mJ
2400
A
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GD600HFY120P1S
IGBT Module
Diode Characteristics TC=25oC unless otherwise noted
Symbol
VF
Qr
IRM
Erec
Qr
IRM
Erec
Qr
IRM
Erec
Parameter
Diode Forward
Voltage
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Test Conditions
IF=600A,VGE=0V,Tj=25oC
IF=600A,VGE=0V,Tj=125oC
IF=600A,VGE=0V,Tj=150oC
Min.
VCC=600V,IF=600A,
-di/dt=4800A/μs,VGE=-15V,
Tj=25oC
VCC=600V,IF=600A,
-di/dt=4800A/μs,VGE=-15V,
Tj=125oC
VCC=600V,IF=600A,
-di/dt=4800A/μs,VGE=-15V,
Tj=150oC
Typ.
1.65
1.65
1.65
54
Max.
2.10
Unit
V
μC
375
A
29.5
mJ
105
μC
428
A
42.8
mJ
119
μC
470
A
54.2
mJ
NTC Characteristics TC=25oC unless otherwise noted
Symbol
R25
∆R/R
P25
Parameter
Rated Resistance
Deviation of R100
Power
Dissipation
B25/50
B-value
B25/80
B-value
B25/100
B-value
Test Conditions
Min.
TC=100 oC,R100=493.3Ω
Max.
-5
R2=R25exp[B25/50(1/T21/(298.15K))]
R2=R25exp[B25/80(1/T21/(298.15K))]
R2=R25exp[B25/100(1/T21/(298.15K))]
©2016 STARPOWER Semiconductor Ltd.
Typ.
5.0
4/21/2016
5
Unit
kΩ
%
20.0
mW
3375
K
3411
K
3433
K
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GD600HFY120P1S
IGBT Module
Module Characteristics TC=25oC unless otherwise noted
Symbol
LCE
RCC’+EE’
RthJC
RthCH
M
G
Parameter
Stray Inductance
Module Lead Resistance, Terminal to Chip
Junction-to-Case (per IGBT)
Junction-to-Case (per Diode)
Case-to-Heatsink (per IGBT)
Case-to-Heatsink (per Diode)
Case-to-Heatsink (per Module)
Terminal Connection Torque, Screw M4
Terminal Connection Torque, Screw M8
Mounting Torque, Screw M5
Weight of Module
©2016 STARPOWER Semiconductor Ltd.
Min.
Typ.
18
0.30
Max.
47.8
81.8
14.4
24.4
4.5
K/kW
K/kW
1.8
8.0
3.0
2.1
10
6.0
825
4/21/2016
Unit
nH
mΩ
N.m
g
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GD600HFY120P1S
IGBT Module
1200
1200
1000
1000
800
800
IC [A]
IC [A]
VGE=15V
600
400
VCE=20V
600
400
200
200
Tj=25℃
Tj=125℃
Tj=150℃
0
Tj=25℃
Tj=125℃
Tj=150℃
0
0
0.5
1
1.5 2 2.5
VCE [V]
3
3.5
5
Fig 1. IGBT Output Characteristics
6
7
8 9 10 11 12 13
VGE [V]
Fig 2. IGBT Transfer Characteristics
275
350
Eon Tj=125℃
Eoff Tj=125℃
Eon Tj=150℃
Eoff Tj=150℃
250
225
Eon Tj=125℃
Eoff Tj=125℃
Eon Tj=150℃
Eoff Tj=150℃
300
200
250
E [mJ]
E [mJ]
175
150
125
200
150
100
100
75
VCC=600V
RG=1.8Ω
VGE=±15V
50
25
0
VCC=600V
IC=600A
VGE=±15V
50
0
0
200 400 600 800 1000 1200
IC [A]
Fig 3. IGBT Switching Loss vs. IC
©2016 STARPOWER Semiconductor Ltd.
0
3
6
9
12
RG [Ω]
15
Fig 4. IGBT Switching Loss vs. RG
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18
GD600HFY120P1S
IGBT Module
100
1400
Module
IGBT
1200
ZthJC [K/kW]
IC [A]
1000
800
600
10
400
RG=1.8Ω
VGE=±15V
Tj=150oC
200
i:
1
2
3
ri[K/kW]: 1.7
9.9
32.4
0.0008 0.013 0.05
τi[s]:
0
0
1
0.001
200 400 600 800 100012001400
VCE [V]
Fig 5. RBSOA
0.01
0.1
t [s]
4
3.8
0.6
1
10
Fig 6. IGBT Transient Thermal Impedance
1200
70
Tj=25℃
Tj=125℃
Tj=150℃
1000
Erec Tj=125℃
60
Erec Tj=150℃
50
E [mJ]
IF [A]
800
600
40
30
400
20
200
VCC=600V
RG=1.8Ω
VGE=-15V
10
0
0
0
0.4
0.8
1.2 1.6
VF [V]
2
2.4
Fig 7. Diode Forward Characteristics
©2016 STARPOWER Semiconductor Ltd.
0
200
400
600 800 1000 1200
IF [A]
Fig 8. Diode Switching Loss vs. IF
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GD600HFY120P1S
IGBT Module
100
60
Erec Tj=125℃
Diode
Erec Tj=150℃
50
ZthJC [K/kW]
E [mJ]
40
30
10
20
VCC=600V
IF=600A
VGE=-15V
10
i:
1
2
3
ri[K/kW]: 6.8
19.2
54.2
0.0008 0.013 0.05
τi[s]:
0
0
3
6
9
12
RG [Ω]
15
18
Fig 9. Diode Switching Loss vs. RG
1
0.001
0.01
0.1
t [s]
1
R [kΩ]
10
1
0.1
30
60
90
o
TC [ C]
120
10
Fig 10. Diode Transient Thermal Impedance
100
0
4
1.6
0.6
150
Fig 11. NTC Temperature Characteristic
©2016 STARPOWER Semiconductor Ltd.
4/21/2016
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GD600HFY120P1S
IGBT Module
Circuit Schematic
9
5
6
4
3
8
7
1
2
10
Package Dimensions
Dimensions in Millimeters
©2016 STARPOWER Semiconductor Ltd.
4/21/2016
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GD600HFY120P1S
IGBT Module
Terms and Conditions of Usage
The data contained in this product datasheet is exclusively intended for technically trained
staff. you and your technical departments will have to evaluate the suitability of the product
for the intended application and the completeness of the product data with respect to such
application.
This product data sheet is describing the characteristics of this product for which a warranty is
granted. Any such warranty is granted exclusively pursuant the terms and conditions of the
supply agreement. There will be no guarantee of any kind for the product and its
characteristics.
Should you require product information in excess of the data given in this product data sheet
or which concerns the specific application of our product, please contact the sales office,
which is responsible for you (see www.powersemi.cc), For those that are specifically
interested we may provide application notes.
Due to technical requirements our product may contain dangerous substances. For
information on the types in question please contact the sales office, which is responsible for
you.
Should you intend to use the Product in aviation applications, in health or live endangering or
life support applications, please notify.
If and to the extent necessary, please forward equivalent notices to your customers.
Changes of this product data sheet are reserved.
©2016 STARPOWER Semiconductor Ltd.
4/21/2016
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