GD50FSY120L3S

GD50FSY120L3S IGBT Module STARPOWER IGBT SEMICONDUCTOR GD50FSY120L3S 1200V/50A 6 in one-package General Description STARPOWER IGBT Power Module provides ultra low conduction loss as well as short circuit ruggedness. They are designed for the applications such as general inverters and UPS. Features        Low VCE(sat) Trench IGBT technology 10μs short circuit capability VCE(sat) with positive temperature coefficient Maximum junction temperature 175oC Low inductance case Fast & soft reverse recovery anti-parallel FWD Isolated heatsink using DBC technology Typical Applications    Inverter for motor drive AC and DC servo drive amplifier Uninterruptible power supply Equivalent Circuit Schematic ©2016 STARPOWER Semiconductor Ltd. 4/7/2016 1/9 SN0A GD50FSY120L3S IGBT Module Absolute Maximum Ratings TC=25oC unless otherwise noted IGBT Symbol VCES VGES IC ICM PD Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current @ TC=25oC @ TC=100oC Pulsed Collector Current tp=1ms Maximum Power Dissipation @ Tj=175oC Value 1200 ±20 100 50 100 380 Unit V V Description Repetitive Peak Reverse Voltage Diode Continuous Forward Current Diode Maximum Forward Current tp=1ms Value 1200 50 100 Unit V A A A A W Diode Symbol VRRM IF IFM Module Symbol Tjmax Tjop TSTG VISO Description Maximum Junction Temperature Operating Junction Temperature Storage Temperature Range Isolation Voltage RMS,f=50Hz,t=1min ©2016 STARPOWER Semiconductor Ltd. Value 175 -40 to +150 -40 to +125 4000 4/7/2016 2/9 Unit o C o C o C V SN0A GD50FSY120L3S IGBT Module IGBT Characteristics TC=25oC unless otherwise noted Symbol VCE(sat) VGE(th) ICES IGES RGint td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff ISC Parameter Collector to Emitter Saturation Voltage Gate-Emitter Threshold Voltage Collector Cut-Off Current Gate-Emitter Leakage Current Internal Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss SC Data Test Conditions IC=50A,VGE=15V, Tj=25oC IC=50A,VGE=15V, Tj=125oC IC=50A,VGE=15V, Tj=150oC IC=1.25mA,VCE=VGE, Tj=25oC VCE=VCES,VGE=0V, Tj=25oC VGE=VGES,VCE=0V, Tj=25oC Min. VCC=600V,IC=50A, RG=15Ω,VGE=±15V, Tj=25oC VCC=600V,IC=50A, RG=15Ω,VGE=±15V, Tj=125oC VCC=600V,IC=50A, RG=15Ω,VGE=±15V, Tj=150oC tP≤10μs,VGE=15V, Tj=150oC,VCC=900V, VCEM≤1200V ©2016 STARPOWER Semiconductor Ltd. 4/7/2016 Typ. Max. 1.70 2.15 1.95 Unit V 2.00 5.2 6.0 6.8 V 1.0 mA 100 nA 0 171 32 340 82 Ω ns ns ns ns 6.10 mJ 2.88 mJ 182 43 443 155 ns ns ns ns 8.24 mJ 4.43 mJ 182 43 464 175 ns ns ns ns 8.99 mJ 4.94 mJ 200 A 3/9 SN0A GD50FSY120L3S IGBT Module Diode Characteristics TC=25oC unless otherwise noted Symbol VF Qr IRM Erec Qr IRM Erec Qr IRM Erec Parameter Diode Forward Voltage Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Test Conditions IF=50A,VGE=0V,Tj=25oC IF=50A,VGE=0V,Tj=125oC IF=50A,VGE=0V,Tj=150oC Min. Typ. 1.70 1.65 1.65 5.2 VR=600V,IF=50A, -di/dt=1400A/μs,VGE=-15V Tj=25oC VR=600V,IF=50A, -di/dt=1400A/μs,VGE=-15V Tj=125oC VR=600V,IF=50A, -di/dt=1400A/μs,VGE=-15V Tj=150oC Max. 2.15 Unit V μC 51 A 1.62 mJ 8.4 μC 57 A 2.85 mJ 9.5 μC 60 A 3.52 mJ NTC Characteristics TC=25oC unless otherwise noted Symbol R25 ∆R/R P25 Parameter Rated Resistance Deviation of R100 Power Dissipation B25/50 B-value B25/80 B-value B25/100 B-value Test Conditions Min. TC=100 oC,R100=493.3Ω Typ. 5.0 -5 R2=R25exp[B25/50(1/T21/(298.15K))] R2=R25exp[B25/80(1/T21/(298.15K))] R2=R25exp[B25/100(1/T21/(298.15K))] Max. 5 Unit kΩ % 20.0 mW 3375 K 3411 K 3433 K Module Characteristics TC=25oC unless otherwise noted Symbol LCE RCC’+EE’ RthJC RthCH F G Parameter Stray Inductance Module Lead Resistance, Terminal to Chip Junction-to-Case (per IGBT) Junction-to-Case (per Diode) Case-to-Heatsink (per IGBT) Case-to-Heatsink (per Diode) Case-to-Heatsink (per Module) Mounting Force Per Clamp Weight of Module ©2016 STARPOWER Semiconductor Ltd. Min. Typ. 40 4.00 0.358 0.537 0.370 0.555 0.037 40 4/7/2016 Max. 0.394 0.591 4/9 K/W K/W 80 39 Unit nH mΩ N g SN0A GD50FSY120L3S IGBT Module 100 100 90 VGE=15V 80 80 70 70 60 60 IC [A] IC [A] 90 50 50 40 40 30 30 20 20 Tj=25℃ Tj=125℃ Tj=150℃ 10 VCE=20V Tj=25℃ Tj=125℃ Tj=150℃ 10 0 0 0 0.5 1 1.5 2 2.5 VCE [V] 3 3.5 5 Fig 1. IGBT Output Characteristics 7 8 9 10 11 12 13 VGE [V] Fig 2. IGBT Transfer Characteristics 30 28 Eon Tj=125℃ Eoff Tj=125℃ Eon Tj=150℃ Eoff Tj=150℃ 25 Eon Tj=125℃ Eoff Tj=125℃ Eon Tj=150℃ Eoff Tj=150℃ 24 20 20 VCC=600V RG=15Ω VGE=±15V 15 E [mJ] E [mJ] 6 VCC=600V IC=50A VGE=±15V 16 12 10 8 5 4 0 0 0 20 40 60 IC [A] 80 100 Fig 3. IGBT Switching Loss vs. IC ©2016 STARPOWER Semiconductor Ltd. 0 30 60 90 RG [Ω] 120 Fig 4. IGBT Switching Loss vs. RG 4/7/2016 5/9 SN0A 150 GD50FSY120L3S IGBT Module 1 110 100 IGBT Module 90 80 ZthJH [K/W] IC [A] 70 60 50 0.1 40 30 RG=15Ω VGE=±15V Tj=150oC 20 10 i: 1 2 3 4 ri[K/W]: 0.0282 0.0644 0.2683 0.3661 0.0005 0.005 0.05 0.2 τi[s]: 0 0 350 700 VCE [V] 1050 0.01 0.001 1400 Fig 5. RBSOA 0.01 0.1 t [s] 1 10 Fig 6. IGBT Transient Thermal Impedance 100 5 Tj=25℃ Tj=125℃ Tj=150℃ 80 Erec Tj=125℃ Erec Tj=150℃ 4 3 IF [A] E [mJ] 60 40 2 20 1 0 VCC=600V RG=15Ω VGE=-15V 0 0 0.5 1 1.5 VF [V] 2 2.5 Fig 7. Diode Forward Characteristics ©2016 STARPOWER Semiconductor Ltd. 0 20 40 60 IF [A] 80 Fig 8. Diode Switching Loss vs. IF 4/7/2016 6/9 SN0A 100 GD50FSY120L3S IGBT Module 10 4 Erec Tj=125℃ Erec Tj=150℃ 3.5 Diode 1 ZthJH [K/W] E [mJ] 3 2.5 0.1 2 VCC=600V IF=50A VGE=-15V 1.5 i: 1 2 3 4 ri[K/W]: 0.0437 0.0966 0.4026 0.5491 0.0005 0.005 0.05 0.2 τi[s]: 1 0 30 60 90 RG [Ω] 120 150 Fig 9. Diode Switching Loss vs. RG 0.01 0.001 0.01 0.1 t [s] 1 Fig 10. Diode Transient Thermal Impedance 100 R [kΩ] 10 1 0.1 0 30 60 90 o TC [ C] 120 10 150 Fig 11. NTC Temperature Characteristic ©2016 STARPOWER Semiconductor Ltd. 4/7/2016 7/9 SN0A GD50FSY120L3S IGBT Module Circuit Schematic Package Dimensions Dimensions in Millimeters ©2016 STARPOWER Semiconductor Ltd. 4/7/2016 8/9 SN0A GD50FSY120L3S IGBT Module Terms and Conditions of Usage The data contained in this product datasheet is exclusively intended for technically trained staff. you and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.powersemi.cc), For those that are specifically interested we may provide application notes. Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. ©2016 STARPOWER Semiconductor Ltd. 4/7/2016 9/9 SN0A