GD200HFX170C2S

GD200HFX170C2S IGBT Module STARPOWER IGBT SEMICONDUCTOR GD200HFX170C2S 1700V/200A 2 in one-package General Description STARPOWER IGBT Power Module provides ultra low conduction loss as well as short circuit ruggedness. They are designed for the applications such as general inverters and UPS. Features        Low VCE(sat) Trench IGBT technology 10μs short circuit capability VCE(sat) with positive temperature coefficient Maximum junction temperature 175oC Low inductance case Fast & soft reverse recovery anti-parallel FWD Isolated copper baseplate using DBC technology Typical Applications    Inverter for motor drive AC and DC servo drive amplifier Uninterruptible power supply Equivalent Circuit Schematic ©2019 STARPOWER Semiconductor Ltd. 3/15/2019 1/9 preliminary GD200HFX170C2S IGBT Module Absolute Maximum Ratings TC=25oC unless otherwise noted IGBT Symbol VCES VGES IC ICM PD Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current @ TC=25oC @ TC=100oC Pulsed Collector Current tp=1ms Maximum Power Dissipation @ Tj=175oC Values 1700 ±20 337 200 400 1271 Unit V V Description Repetitive Peak Reverse Voltage Diode Continuous Forward Current Diode Maximum Forward Current tp=1ms Values 1700 200 400 Unit V A A Values 175 -40 to +150 -40 to +125 4000 Unit o C o C o C V A A W Diode Symbol VRRM IF IFM Module Symbol Tjmax Tjop TSTG VISO Description Maximum Junction Temperature Operating Junction Temperature Storage Temperature Range Isolation Voltage RMS,f=50Hz,t=1min ©2019 STARPOWER Semiconductor Ltd. 3/15/2019 2/9 preliminary GD200HFX170C2S IGBT Module IGBT Characteristics TC=25oC unless otherwise noted Symbol VCE(sat) VGE(th) ICES IGES RGint Cies Cres QG td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff td(on) tr td(off) tf Eon Eoff ISC Parameter Collector to Emitter Saturation Voltage Gate-Emitter Threshold Voltage Collector Cut-Off Current Gate-Emitter Leakage Current Internal Gate Resistance Input Capacitance Reverse Transfer Capacitance Gate Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss SC Data Test Conditions IC=200A,VGE=15V, Tj=25oC IC=200A,VGE=15V, Tj=125oC IC=200A,VGE=15V, Tj=150oC IC=8.00mA,VCE=VGE, Tj=25oC VCE=VCES,VGE=0V, Tj=25oC VGE=VGES,VCE=0V, Tj=25oC Min. Max. 1.85 2.20 2.25 Unit V 2.35 5.6 VCE=25V,f=1MHz, VGE=0V VGE=-15…+15V VCC=900V,IC=200A, RG=3.6Ω,VGE=±15V, Tj=25oC VCC=900V,IC=200A, RG=3.6Ω,VGE=±15V, Tj=125oC VCC=900V,IC=200A, RG=3.6Ω,VGE=±15V, Tj=150oC tP≤10μs,VGE=15V, Tj=150oC,VCC=1000V, VCEM≤1700V ©2019 STARPOWER Semiconductor Ltd. Typ. 3/15/2019 6.2 6.8 V 5.0 mA 400 nA 3.8 24.1 Ω nF 0.58 nF 1.89 204 48 595 100 μC ns ns ns ns 58.3 mJ 40.3 mJ 224 55 611 159 ns ns ns ns 81.0 mJ 62.7 mJ 240 55 624 180 ns ns ns ns 88.6 mJ 67.2 mJ 800 A 3/9 preliminary GD200HFX170C2S IGBT Module Diode Characteristics TC=25oC unless otherwise noted Symbol VF Qr IRM Erec Qr IRM Erec Qr IRM Erec Parameter Diode Forward Voltage Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Recovered Charge Peak Reverse Recovery Current Reverse Recovery Energy Test Conditions IF=200A,VGE=0V,Tj=25oC IF=200A,VGE=0V,Tj=125oC IF=200A,VGE=0V,Tj=150oC Min. Typ. 1.80 1.90 1.95 55.0 VR=900V,IF=200A, -di/dt=3520A/μs,VGE=-15V Tj=25oC VR=900V,IF=200A, -di/dt=3520A/μs,VGE=-15V Tj=125oC VR=900V,IF=200A, -di/dt=3520A/μs,VGE=-15V Tj=150oC Max. 2.25 Unit V μC 220 A 26.5 mJ 93.5 μC 252 A 52.9 mJ 99.0 μC 260 A 60.0 mJ Module Characteristics TC=25oC unless otherwise noted Symbol LCE RCC’+EE’ RthJC RthCH M G Parameter Min. Stray Inductance Module Lead Resistance, Terminal to Chip Junction-to-Case (per IGBT) Junction-to-Case (per Diode) Case-to-Heatsink (per IGBT) Case-to-Heatsink (per Diode) Case-to-Heatsink (per Module) Terminal Connection Torque, Screw M6 Mounting Torque, Screw M6 Weight of Module ©2019 STARPOWER Semiconductor Ltd. Typ. Max. 20 0.35 0.118 0.159 0.035 0.047 0.010 2.5 3.0 3/15/2019 4/9 K/W K/W 5.0 5.0 300 Unit nH mΩ N.m g preliminary GD200HFX170C2S IGBT Module 400 400 VGE=15V 350 300 300 250 250 IC [A] IC [A] 350 200 VCE=20V 200 150 150 100 100 Tj=25℃ 50 Tj=25℃ Tj=125℃ Tj=150℃ 50 Tj=125℃ Tj=150℃ 0 0 0 0.5 1 1.5 2 2.5 VCE [V] 3 3.5 4 5 Fig 1. IGBT Output Characteristics 6 7 8 9 VGE [V] 10 11 12 Fig 2. IGBT Transfer Characteristics 250 250 Eon Tj=125℃ Eoff Tj=125℃ Eon Tj=150℃ Eoff Tj=150℃ 200 200 VCC=900V RG=3.6Ω VGE=±15V 150 E [mJ] E [mJ] 150 Eon Tj=125℃ Eoff Tj=125℃ Eon Tj=150℃ Eoff Tj=150℃ 100 100 50 50 0 VCC=900V IC=200A VGE=±15V 0 0 80 160 240 IC [A] 320 400 Fig 3. IGBT Switching Loss vs. IC ©2019 STARPOWER Semiconductor Ltd. 0 5 10 15 20 25 30 35 40 RG [Ω] Fig 4. IGBT Switching Loss vs. RG 3/15/2019 5/9 preliminary GD200HFX170C2S IGBT Module 1 500 Module 400 IGBT 0.1 IC [A] ZthJC [K/W] 300 200 0.01 RG=3.6Ω VGE=±15V Tj=150oC 100 i: 1 2 3 4 ri[K/W]: 0.0067 0.0392 0.0378 0.0343 0.01 0.02 0.05 0.1 τi[s]: 0 0 0.001 0.001 300 600 900 1200 1500 1800 VCE [V] Fig 5. RBSOA 0.1 t [s] 1 10 Fig 6. IGBT Transient Thermal Impedance 400 80 Tj=25℃ Tj=125℃ Tj=150℃ 350 Erec Tj=125℃ 70 300 60 250 50 E [mJ] IF [A] 0.01 200 40 150 30 100 20 50 10 0 Erec Tj=150℃ VCC=900V RG=3.6Ω VGE=-15V 0 0.0 0.5 1.0 1.5 2.0 VF [V] 2.5 3.0 Fig 7. Diode Forward Characteristics ©2019 STARPOWER Semiconductor Ltd. 0 50 100 150 200 250 300 350 400 IF [A] Fig 8. Diode Switching Loss vs. IF 3/15/2019 6/9 preliminary GD200HFX170C2S IGBT Module 1 70 Erec Tj=125℃ Erec Tj=150℃ 60 Diode 50 ZthJC [K/W] E [mJ] 0.1 40 30 0.01 20 VCC=900V IF=200A VGE=-15V 10 0 0 5 10 15 20 25 30 35 40 RG [Ω] Fig 9. Diode Switching Loss vs. RG ©2019 STARPOWER Semiconductor Ltd. i: 1 2 3 4 ri[K/W]: 0.0095 0.0524 0.0509 0.0462 τi[s]: 0.01 0.02 0.05 0.1 0.001 0.001 0.01 0.1 t [s] 1 10 Fig 10. Diode Transient Thermal Impedance 3/15/2019 7/9 preliminary GD200HFX170C2S IGBT Module Circuit Schematic Package Dimensions Dimensions in Millimeters ©2019 STARPOWER Semiconductor Ltd. 3/15/2019 8/9 preliminary GD200HFX170C2S IGBT Module Terms and Conditions of Usage The data contained in this product datasheet is exclusively intended for technically trained staff. you and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.powersemi.cc), For those that are specifically interested we may provide application notes. Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. ©2019 STARPOWER Semiconductor Ltd. 3/15/2019 9/9 preliminary