GD400HFX170C2S
IGBT Module
STARPOWER
IGBT
SEMICONDUCTOR
GD400HFX170C2S
1700V/400A 2 in one-package
General Description
STARPOWER IGBT Power Module provides ultra
low conduction loss as well as short circuit ruggedness.
They are designed for the applications such as
general inverters and UPS.
Features
Low VCE(sat) Trench IGBT technology
10μs short circuit capability
VCE(sat) with positive temperature coefficient
Maximum junction temperature 175oC
Low inductance case
Fast & soft reverse recovery anti-parallel FWD
Isolated copper baseplate using DBC technology
Typical Applications
Inverter for motor drive
AC and DC servo drive amplifier
Uninterruptible power supply
Equivalent Circuit Schematic
©2018 STARPOWER Semiconductor Ltd.
10/24/2018
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preliminary
GD400HFX170C2S
IGBT Module
Absolute Maximum Ratings TC=25oC unless otherwise noted
IGBT
Symbol
VCES
VGES
IC
ICM
PD
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Current @ TC=25oC
@ TC=100oC
Pulsed Collector Current tp=1ms
Maximum Power Dissipation @ Tj=175oC
Value
1700
±20
648
400
800
2380
Unit
V
V
Description
Repetitive Peak Reverse Voltage
Diode Continuous Forward Current
Diode Maximum Forward Current tp=1ms
Value
1700
400
800
Unit
V
A
A
Value
175
-40 to +150
-40 to +125
4000
Unit
o
C
o
C
o
C
V
A
A
W
Diode
Symbol
VRRM
IF
IFM
Module
Symbol
Tjmax
Tjop
TSTG
VISO
Description
Maximum Junction Temperature
Operating Junction Temperature
Storage Temperature Range
Isolation Voltage RMS,f=50Hz,t=1min
©2018 STARPOWER Semiconductor Ltd.
10/24/2018
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GD400HFX170C2S
IGBT Module
IGBT Characteristics TC=25oC unless otherwise noted
Symbol
VCE(sat)
VGE(th)
ICES
IGES
RGint
Cies
Cres
QG
td(on)
tr
td(off)
tf
Eon
Eoff
td(on)
tr
td(off)
tf
Eon
Eoff
td(on)
tr
td(off)
tf
Eon
Eoff
ISC
Parameter
Collector to Emitter
Saturation Voltage
Gate-Emitter Threshold
Voltage
Collector Cut-Off
Current
Gate-Emitter Leakage
Current
Internal Gate Resistance
Input Capacitance
Reverse Transfer
Capacitance
Gate Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching
Loss
Turn-Off Switching
Loss
SC Data
Test Conditions
IC=400A,VGE=15V,
Tj=25oC
IC=400A,VGE=15V,
Tj=125oC
IC=400A,VGE=15V,
Tj=150oC
IC=16.0mA,VCE=VGE,
Tj=25oC
VCE=VCES,VGE=0V,
Tj=25oC
VGE=VGES,VCE=0V,
Tj=25oC
Min.
Max.
1.85
2.20
2.25
Unit
V
2.35
5.6
VCE=25V,f=1MHz,
VGE=0V
VGE=-15V…+15V
VCC=900V,IC=400A,
RG=0.82Ω,VGE=±15V,
Tj=25oC
VCC=900V,IC=400A,
RG=0.82Ω,VGE=±15V,
Tj=125oC
VCC=900V,IC=400A,
RG=0.82Ω,VGE=±15V,
Tj=150oC
tP≤10μs,VGE=15V,
Tj=150oC,VCC=100V,
VCEM≤1700V
©2018 STARPOWER Semiconductor Ltd.
Typ.
10/24/2018
6.2
6.8
V
5.0
mA
400
nA
1.88
48.2
Ω
nF
1.17
nF
3.77
204
38
425
113
μC
ns
ns
ns
ns
97.9
mJ
84.0
mJ
208
50
528
184
ns
ns
ns
ns
141
mJ
132
mJ
216
50
544
204
ns
ns
ns
ns
161
mJ
137
mJ
1600
A
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GD400HFX170C2S
IGBT Module
Diode Characteristics TC=25oC unless otherwise noted
Symbol
VF
Qr
IRM
Erec
Qr
IRM
Erec
Qr
IRM
Erec
Parameter
Diode Forward
Voltage
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Recovered Charge
Peak Reverse
Recovery Current
Reverse Recovery
Energy
Test Conditions
IF=400A,VGE=0V,Tj=25oC
IF=400A,VGE=0V,Tj=125oC
IF=400A,VGE=0V,Tj=150oC
Min.
Typ.
1.80
1.90
1.95
116
VR=900V,IF=400A,
-di/dt=8800A/μs,VGE=-15V
Tj=25oC
VR=900V,IF=400A,
-di/dt=8800A/μs,VGE=-15V
Tj=125oC
VR=900V,IF=400A,
-di/dt=8800A/μs,VGE=-15V
Tj=150oC
Max.
2.25
Unit
V
μC
666
A
63.8
mJ
187
μC
662
A
114
mJ
209
μC
640
A
132
mJ
Module Characteristics TC=25oC unless otherwise noted
Symbol
LCE
RCC’+EE’
RthJC
RthCH
M
G
Parameter
Min.
Stray Inductance
Module Lead Resistance, Terminal to Chip
Junction-to-Case (per IGBT)
Junction-to-Case (per Diode)
Case-to-Heatsink (per IGBT)
Case-to-Heatsink (per Diode)
Case-to-Heatsink (per Module)
Terminal Connection Torque, Screw M6
Mounting Torque, Screw M6
Weight of Module
©2018 STARPOWER Semiconductor Ltd.
Typ.
Max.
20
0.35
0.063
0.105
0.032
0.053
0.010
2.5
3.0
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K/W
K/W
5.0
5.0
300
Unit
nH
mΩ
N.m
g
preliminary
GD400HFX170C2S
IGBT Module
800
800
VGE=15V
700
600
600
500
500
IC [A]
IC [A]
700
400
VCE=20V
400
300
300
200
200
Tj=25℃
100
Tj=25℃
Tj=125℃
Tj=150℃
100
Tj=125℃
Tj=150℃
0
0
0
0.5
1
1.5 2 2.5
VCE [V]
3
3.5
4
5
Fig 1. IGBT Output Characteristics
400
7
8
9
VGE [V]
10
11
12
Fig 2. IGBT Transfer Characteristics
400
500
450
6
Eon Tj=125℃
Eoff Tj=125℃
Eon Tj=150℃
Eoff Tj=150℃
Eon Tj=125℃
Eoff Tj=125℃
Eon Tj=150℃
Eoff Tj=150℃
350
300
350
250
VCC=900V
RGon=0.82Ω
VGE=±15V
200
250
E [mJ]
E [mJ]
300
200
150
150
100
100
VCC=900V
IC=400A
VGE=±15V
50
50
0
0
0 100 200 300 400 500 600 700 800
IC [A]
Fig 3. IGBT Switching Loss vs. IC
©2018 STARPOWER Semiconductor Ltd.
0 1 2 3 4 5 6 7 8 9 10
RG [Ω]
Fig 4. IGBT Switching Loss vs. RG
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preliminary
GD400HFX170C2S
IGBT Module
900
0.1
IGBT
Module
800
700
ZthJC [K/W]
IC [A]
600
500
400
0.01
300
RGon=0.82Ω
VGE=±15V
Tj=150oC
200
100
i:
1
2
3
4
ri[K/W]: 0.0036 0.0209 0.0202 0.0183
0.01
0.02
0.05
0.1
τi[s]:
0
0
0.001
0.001
300 600 900 1200 1500 1800
VCE [V]
Fig 5. RBSOA
0.1
t [s]
1
10
Fig 6. IGBT Transient Thermal Impedance
800
180
Tj=25℃
Tj=125℃
Tj=150℃
700
Erec Tj=125℃
160
Erec Tj=150℃
140
600
120
E [mJ]
500
IF [A]
0.01
400
300
100
80
60
200
40
100
VCC=900V
RGon=0.82Ω
VGE=±15V
20
0
0
0.0
0.5
1.0
1.5 2.0
VF [V]
2.5
3.0
Fig 7. Diode Forward Characteristics
©2018 STARPOWER Semiconductor Ltd.
0 100 200 300 400 500 600 700 800
IF [A]
Fig 8. Diode Switching Loss vs. IF
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preliminary
GD400HFX170C2S
IGBT Module
140
1
Erec Tj=125℃
130
Erec Tj=150℃
Diode
120
0.1
ZthJC [K/W]
E [mJ]
110
100
90
0.01
80
VCC=900V
IF=400A
VGE=-15V
70
i:
1
2
3
4
ri[K/W]: 0.0062 0.0347 0.0336 0.0305
τi[s]:
0.01
0.02
0.05
0.1
60
0
1
2
3
4 5 6
RG [Ω]
7
8
9
Fig 9. Diode Switching Loss vs. RG
©2018 STARPOWER Semiconductor Ltd.
0.001
0.001
0.01
0.1
t [s]
1
10
Fig 10. Diode Transient Thermal Impedance
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preliminary
GD400HFX170C2S
IGBT Module
Circuit Schematic
Package Dimensions
Dimensions in Millimeters
©2018 STARPOWER Semiconductor Ltd.
10/24/2018
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preliminary
GD400HFX170C2S
IGBT Module
Terms and Conditions of Usage
The data contained in this product datasheet is exclusively intended for technically trained
staff. you and your technical departments will have to evaluate the suitability of the product
for the intended application and the completeness of the product data with respect to such
application.
This product data sheet is describing the characteristics of this product for which a warranty is
granted. Any such warranty is granted exclusively pursuant the terms and conditions of the
supply agreement. There will be no guarantee of any kind for the product and its
characteristics.
Should you require product information in excess of the data given in this product data sheet
or which concerns the specific application of our product, please contact the sales office,
which is responsible for you (see www.powersemi.cc), For those that are specifically
interested we may provide application notes.
Due to technical requirements our product may contain dangerous substances. For
information on the types in question please contact the sales office, which is responsible for
you.
Should you intend to use the Product in aviation applications, in health or live endangering or
life support applications, please notify.
If and to the extent necessary, please forward equivalent notices to your customers.
Changes of this product data sheet are reserved.
©2018 STARPOWER Semiconductor Ltd.
10/24/2018
9/9
preliminary