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9HU
Typical Performance Characteristics
ൟ⡍ᗻ᳆㒓
10
100
VGS = 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
ID,Drain Current[A]
ID,Drain Current[A]
80
o
15 C
10
o
25 C
*Notes:
1. 250Ps Pulse Test
1
*Notes:
1. VDS = 20V
2. 250Ps Pulse Test
o
0.5
0.1
2. TC = 25 C
1
1
VDS,Drain-Source Voltage[V]
10
Figure 1. On-Region Characteristics
VGS,Gate-Source Voltage[V]
Figure 2. Transfer Characteristics
100
0.8
IS, Reverse Drain Current [A]
RDS(ON) [:],
Drain-Source On-Resistance
0.7
0.6
0.5
0.4
VGS = 10V
0.3
VGS = 20V
0.2
o
15 C
10
o
25 C
1
*Notes:
1. VGS = 0V
o
*Note: TJ = 25 C
0.1
0
25
50
ID, Drain Current [A]
0.2
0.0
75
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
10
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
4500
Coss
3000
Ciss
1.5
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
VGS, Gate-Source Voltage [V]
Capacitances [pF]
6000
2. 250Ps Pulse Test
0.5
1.0
VSD, Body Diode Forward Voltage [V]
*Note:
1. VGS = 0V
2. f = 1MHz
1500
VDS = 100V
VDS = 250V
VDS = 400V
8
6
4
2
Crss
0
0.1
1
10
VDS, Drain-Source Voltage [V]
*Note: ID = 20A
0
50
0
Figure 5. Capacitance Characteristics
10
20
30
40
50
Qg, Total Gate Charge [nC]
60
Figure 6. Gate Charge Characteristics
9HU
Typical Performance Characteristics (Continued)
ൟ⡍ᗻ᳆㒓˄㓁˅
200
100
1.1
ID, Drain Current [A]
BVDSS, [Normalized]
Drain-Source Breakdown Voltage
1.2
1.0
0.9
1 ms
10 ms
10
100 ms
Operation in This Area
is Limited by R DS(on)
1
DC
*Notes:
0.1
o
1. TC = 25 C
*Notes:
1. VGS = 0V
2. ID = 1mA
0.8
-100
o
2. TJ = 150 C
3. Single Pulse
0.01
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
1
200
10
100
VDS, Drain-Source Voltage [V]
800
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. Maximum Safe Operating Area
- FHP20N50A
200
100
25
40Ps
100Ps
20
ID, Drain Current [A]
10
1ms
10ms
1
Operation in This Area
is Limited by R DS(on)
DC
*Notes:
0.1
o
15
10
5
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
0.01
1
10
100
VDS, Drain-Source Voltage [V]
0
25
800
Figure 9. Maximum Safe Operating Area
- FHF20N50A
50
75
100
125
o
TC, Case Temperature [ C]
150
Figure 10. Maximum Drain Current
vs. Case Temperature
1
Thermal Response [ZTJC]
ID, Drain Current [A]
10 Ps
100 Ps
0.5
0.2
0.1
PDM
0.1
PDM
t1
t2
t1
0.05
t2
0.02
0.01
*Notes:
0.01
o
1. ZTJC(t) = 0.5 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZTJC(t)
single pulse
0.002
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
Rectangular Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve - FHP20N50A
9HU
Typical Performance Characteristics (Continued)
ൟ⡍ᗻ᳆㒓˄㓁˅
Thermal Response [ZTJC]
5
0.5
1
0.2
0.1
PDM
0.05
0.1
t1
t2
0.02
*Notes:
0.01
o
1. ZTJC(t) = 3.3 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZTJC(t)
Single pulse
0.01
-4
10
-3
10
-2
-1
0
1
10
10
10
10
Rectangular Pulse Duration [sec]
2
10
3
10
Figure 12. Transient Thermal Response Curve - FHF20N50A
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Fig 13. Gate Charge Test Circuit & Waveform
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Fig 14. Resistive Switching Test Circuit & Waveforms
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Fig 15. Unclamped Inductive Switching Test Circuit & Waveforms
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GYGWFRQWUROOHGE\5*
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9
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Fig 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms
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