FX817CVBTH-N0P1GB

FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler SCHEMATIC Description The FX817 series combine an AlGaAs infrared emitting diode as the emitter which is optically 1 4 2 3 coupled to a silicon planar phototransistor detector in a plastic DIP4 package with different lead forming options. With the robust coplanar double mold structure, FX817 series provide the most stable isolation feature. Features ⚫ High isolation 5000 VRMS ⚫ CTR flexibility available see order information ⚫ DC input with transistor output ⚫ Operating temperature range - 55 °C to 110 °C ⚫ REACH Compliance ⚫ Halogen free ⚫ MSL class 1 ⚫ Regulatory Approval ◼ VDE - EN60747-5-5(VDE0884-5) ◼ CQC - GB4943.1, GB8898 Applications • Switch mode power supplies • Programmable controllers • Household appliances • Office equipment Rev: A06 PIN DEFINITION 1. Anode 2. Cathode 3. Emitter 4. Collector PACKAGE OUTLINE FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNIT NOTE INPUT Forward Current IF 60 mA Peak Forward Current IFP 1 A Reverse Voltage VR 6 V Input Power Dissipation PI 100 mW Collector - Emitter Voltage VCEO 35 V Emitter - Collector Voltage VECO 7 V Collector Current IC 50 mA Output Power Dissipation PO 150 mW Total Power Dissipation Ptot 200 mW Isolation Voltage Viso 5000 Vrms Operating Temperature Topr -55~110 °C Storage Temperature Tstg -55~125 °C Soldering Temperature Tsol 260 °C 1 OUTPUT COMMON Note 1. 100μs pulse, 100Hz frequency Note 2. AC For 1 Minute, R.H. = 40 ~ 60% Rev: A06 2 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler ELECTRICAL OPTICAL CHARACTERISTICS at Ta=25°C PARAMETER SYMBOL MIN TYP. MAX. UNIT TEST CONDITION NOTE INPUT Forward Voltage VF - 1.24 1.4 V IF=10mA Reverse Current IR - - 10 μA VR=6V Input Capacitance Cin - 10 - pF V=0, f=1kHz OUTPUT Collector Dark Current ICEO - - 100 nA VCE=20V, IF=0 Collector-Emitter Breakdown Voltage BVCEO 35 - - V IC=0.1mA, IF=0 Emitter-Collector Breakdown Voltage BVECO 7 - - V IE=0.1mA, IF=0 TRANSFER CHARACTERISTICS Current Transfer Ratio FX8170 50 - 600 FX817A 80 - 160 130 - 260 200 - 400 FX817D 300 - 600 FX817E 100 FX817B FX817C CTR % IF=5mA, VCE=5V 0.2 V IF=20mA, IC=1mA - Ω DC500V, 40 ~ 60% R.H. 200 Collector-Emitter Saturation Voltage VCE(sat) Isolation Resistance RISO Floating Capacitance CIO - 0.4 1 pF V=0, f=1MHz Response Time (Rise) tr - 3 18 μs Response Time (Fall) tf - 4 18 μs VCE=2V, IC=2mA RL=100Ω Cut-off Frequency fc - 80 - kHz Note 3. Fig.12&13 Note 4. Fig.14 Rev: A06 - 0.06 10^12 10^14 VCE=2V, IC=2mA RL=100Ω,-3dB 3 3 4 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler CHARACTERISTIC CURVES Rev: A06 Fig.1 Forward Current vs. Ambient Temperature Fig.2 Collector Power Dissipation vs. Ambient Temperature Fig.3 Forward Current vs. Forward Voltage Fig.4 Collector Dark Current vs. Ambient Temperature Fig.5 Collector Current vs. Collector-emitter Voltage Fig.6 Collector Current vs. Collector-emitter Voltage FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler CHARACTERISTIC CURVES Fig.7 Normalized Current Transfer Ratio vs. Forward Current Fig.8 Normalized Current Transfer Ratio vs. Ambient Temperature Fig.9 Collector-emitter Saturation Voltage vs. Ambient Temperature Fig.10 Switching Time vs. Load Resistance Fig.11 Frequency Response Rev: A06 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler TEST CIRCUITS Fig.12 Test Circuits of Response Time Fig.13 Curves of Response Time Fig.14 Test Circuits of Frequency Response Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated) Standard DIP – Through Hole (N Type) Gullwing (400mil) Lead Forming – Through Hole (M Type) Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated) Surface Mount Lead Forming (S Type) Surface Mount (Low Profile) Lead Forming (T Type) Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated) Surface Mount (Gullwing) Lead Forming (U Type) RECOMMENDED SOLDER MASK (Dimensions in mm unless otherwise stated) Surface Mount Lead Forming & Surface Mount (Low Profile) Lead Forming Surface Mount (Gullwing) Lead Forming Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler TUBE SPECIFICATIONS (Dimensions in mm unless otherwise stated) Packing Option 0 for N / M Type Rev: A06 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler BOX SPECIFICATIONS (Tube Type) Inner Box ⚫ L x W x H = 52.5cm x 10.7cm x 4.7cm Outer Box ⚫ L x W x H = 53.5cm x 23.5cm x 25.5cm Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler CARRIER TAPE SPECIFICATIONS (Dimensions in mm unless otherwise stated) Packing Option 1 for S / T Type Packing Option 1 for U Type Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler CARRIER TAPE SPECIFICATIONS (Dimensions in mm unless otherwise stated) Packing Option 2 for S / T Type Packing Option 2 for U Type Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler CARRIER TAPE SPECIFICATIONS (Dimensions in mm unless otherwise stated) Packing Option 3 for S / T Type Packing Option 4 for S / T Type Rev: A06 www.lyg-semi.com FX817 Series DIP4, DC Input, Photo Transistor Coupler REEL SPECIFICATIONS (Dimensions in mm unless otherwise stated) Reel Dimension for S / T Type Reel Dimension for U Type Rev: A06 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler BOX SPECIFICATIONS (Reel Type) Inner Box ⚫ L x W x H = 36cm x 36cm x 6.9cm Outer Box ⚫ L x W x H = 45cm x 38cm x 38cm Rev: A06 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler ORDERING AND MARKING INFORMATION MARKING INFORMATION FX817R FVYAWW LYG FX214 R F V Y : Company Abbr. : Part Number : CTR Rank : Iron Leadframe : VDE Option : Fiscal Year A WW : Manufacturing Code : Work Week ORDERING INFORMATION LABEL INFORMATION FX817RVBTH-LZP1GCM FX817 – Part Number R – Rank Option (0/A/B/C/D/E) V – VDE BTH – Fixed Character L – Lead Form Option (N/M/S/T/U) Z – Packing Option (0/1/2/3/4) P1 –Fixed Character G – Material Option (G: Green Material / None: None Green Material) C – Color Option(W: White / B: Black) M – Leadframe Option (F: Iron Leadframe / None: Copper Leadframe) Packing Quantity Option Quantity Quantity – Inner box Quantity – Outer box N0 / M0 100 Units/Tube 32 Tubes/Inner box 10 Inner box/Outer box = 32k Units S1 / S2 / T1 / T2 1500 Units/Reel 3 Reels/Inner box 5 Inner box/Outer box = 22.5k Units S3 / S4 / T3 / T4 / U1 / U2 1000 Units/Reel 3 Reels/Inner box 5 Inner box/Outer box = 15k Units Rev: A06 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler REFLOW INFORMATION REFLOW PROFILE Profile Feature Sn-Pb Assembly Profile Pb-Free Assembly Profile Temperature Min. (Tsmin) 100 150°C Temperature Max. (Tsmax) 150 200°C Time (ts) from (Tsmin to Tsmax) 60-120 seconds 60-120 seconds Ramp-up Rate (tL to tP) 3°C/second max. 3°C/second max. Liquidous Temperature (TL) 183°C 217°C Time (tL) Maintained Above (TL) 60 – 150 seconds 60 – 150 seconds Peak Body Package Temperature 235°C +0°C / -5°C 260°C +0°C / -5°C Time (tP) within 5°C of 260°C 20 seconds 30 seconds Ramp-down Rate (TP to TL) 6°C/second max 6°C/second max Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Rev: A06 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler TEMPERATURE PROFILE OF SOLDERING WAVE SOLDERING(JESD22-A111 COMPLIANT) HAND SOLDERING BY SOLDERING IRON Soldering Temperature Soldering Time 380+0/-5oC 3 sec max. ⚫ One time soldering is recommended for all soldering method. ⚫ Do not solder more than three times for IR reflow soldering. Rev: A06 FX817 Series www.lyg-semi.com DIP4, DC Input, Photo Transistor Coupler DISCLAIMER ⚫ LYG is continually improving the quality, reliability, function and design. LYG reserves the right to make changes without further notices. ⚫ The characteristic curves shown in this datasheet are representing typical performance which are not guaranteed. ⚫ LYG makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, LYG disclaims (a) any and all liability arising out of the application or use of any product, (b) any and all liability, including without limitation special, consequential or incidental damages, and (c) any and all implied warranties, including warranties of fitness for particular ⚫ The products shown in this publication are designed for the general use in electronic applications such as office automation, equipment, communications devices, audio/visual equipment, electrical application and instrumentation purpose, non-infringement and merchantability. ⚫ This product is not intended to be used for military, aircraft, automotive, medical, life sustaining or lifesaving applications or any other application which can result in human injury or death. ⚫ Please contact LYG sales agent for special application request. ⚫ Immerge unit’s body in solder paste is not recommended. ⚫ Parameters provided in datasheets may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated in each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify LYG’s terms and conditions of purchase, including but not limited to the warranty expressed therein. ⚫ Discoloration might be occurred on the package surface after soldering, reflow or long-time use. It neither impacts the performance nor reliability. Rev: A06