GigaDevice Semiconductor Inc.
GD32F103xx
Arm® Cortex®-M3 32-bit MCU
Datasheet
GD32F103xx Datasheet
Table of Contents
Table of Contents ........................................................................................................... 1
List of Figures ................................................................................................................ 4
List of Tables .................................................................................................................. 5
1. General description ................................................................................................. 7
2. Device overview ....................................................................................................... 8
2.1. Device information .......................................................................................................... 8
2.2. Block diagram ............................................................................................................... 12
2.3. Pinouts and pin assignment ........................................................................................ 14
2.4. Memory map .................................................................................................................. 18
2.5. Clock tree ...................................................................................................................... 22
2.6. Pin definitions ............................................................................................................... 23
2.6.1.
GD32F103Zx LQFP144 pin definitions ................................................................................. 23
2.6.2.
GD32F103Vx LQFP100 pin definitions ................................................................................ 31
2.6.3.
GD32F103Rx LQFP64 pin definitions .................................................................................. 38
2.6.4.
GD32F103Cx LQFP48 pin definitions .................................................................................. 42
2.6.5.
GD32F103Tx QFN36 pin definitions .................................................................................... 45
3. Functional description .......................................................................................... 47
3.1. Arm® Cortex®-M3 core .................................................................................................. 47
3.2. On-chip memory ........................................................................................................... 47
3.3. Clock, reset and supply management ......................................................................... 48
3.4. Boot modes ................................................................................................................... 48
3.5. Power saving modes .................................................................................................... 50
3.6. Analog to digital converter (ADC) ................................................................................ 50
3.7. Digital to analog converter (DAC) ................................................................................ 51
3.8. DMA ............................................................................................................................... 51
3.9. General-purpose inputs/outputs (GPIOs) .................................................................... 51
3.10.
Timers and PWM generation ................................................................................. 52
3.11.
Real time clock (RTC) ............................................................................................ 53
3.12.
Inter-integrated circuit (I2C) .................................................................................. 53
3.13.
Serial peripheral interface (SPI) ............................................................................ 54
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GD32F103xx Datasheet
3.14.
Universal synchronous asynchronous receiver transmitter (USART) ............... 54
3.15.
Inter-IC sound (I2S) ................................................................................................ 54
3.16.
Secure digital input and output card interface (SDIO) ......................................... 55
3.17.
Universal serial bus full-speed device (USBD) .................................................... 55
3.18.
Controller area network (CAN) .............................................................................. 55
3.19.
External memory controller (EXMC) ..................................................................... 55
3.20.
Debug mode ........................................................................................................... 56
3.21.
Package and operation temperature ..................................................................... 56
4. Electrical characteristics ....................................................................................... 57
4.1. Absolute maximum ratings .......................................................................................... 57
4.2. Operating conditions characteristics .......................................................................... 57
4.3. Power consumption ...................................................................................................... 59
4.4. EMC characteristics ...................................................................................................... 67
4.5. Power supply supervisor characteristics.................................................................... 68
4.6. Electrical sensitivity ..................................................................................................... 69
4.7. External clock characteristics...................................................................................... 70
4.8. Internal clock characteristics ....................................................................................... 72
4.9. PLL characteristics ....................................................................................................... 74
4.10.
Memory characteristics ......................................................................................... 75
4.11.
NRST pin characteristics ....................................................................................... 76
4.12.
GPIO characteristics .............................................................................................. 76
4.13.
ADC characteristics ............................................................................................... 80
4.14.
Temperature sensor characteristics ..................................................................... 82
4.15.
DAC characteristics ............................................................................................... 82
4.16.
I2C characteristics ................................................................................................. 83
4.17.
SPI characteristics ................................................................................................. 84
4.18.
I2S characteristics.................................................................................................. 85
4.19.
USART characteristics ........................................................................................... 87
4.20.
SDIO characteristics .............................................................................................. 87
4.21.
CAN characteristics ............................................................................................... 88
4.22.
USBD characteristics ............................................................................................. 88
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GD32F103xx Datasheet
4.23.
EXMC characteristics............................................................................................. 89
4.24.
TIMER characteristics ............................................................................................ 91
4.25.
WDGT characteristics ............................................................................................ 91
4.26.
Parameter conditions............................................................................................. 92
5. Package information.............................................................................................. 93
5.1 LQFP144 package outline dimensions ........................................................................ 93
5.2 LQFP100 package outline dimensions ........................................................................ 95
5.3 LQFP64 package outline dimensions .......................................................................... 97
5.4 LQFP48 package outline dimensions .......................................................................... 99
5.5 QFN36 package outline dimensions .......................................................................... 101
5.6 Thermal characteristics .............................................................................................. 103
6. Ordering Information ........................................................................................... 105
7. Revision History................................................................................................... 107
3
GD32F103xx Datasheet
List of Figures
Figure 2-1. GD32F103x4/6/8/B block diagram ......................................................................................... 12
Figure 2-2. GD32F103xC/D/E/F/G/I/K block diagram .............................................................................. 13
Figure 2-3. GD32F103Zx LQFP144 pinouts ............................................................................................. 14
Figure 2-4. GD32F103Vx LQFP100 pinouts ............................................................................................. 15
Figure 2-5. GD32F103Rx LQFP64 pinouts .............................................................................................. 16
Figure 2-6. GD32F103Cx LQFP48 pinouts .............................................................................................. 16
Figure 2-7. GD32F103Tx QFN36 pinouts ................................................................................................. 17
Figure 2-8. GD32F103xx clock tree .......................................................................................................... 22
Figure 4-1. Recommended power supply decoupling capacitors (1) (2) ................................................. 58
Figure 4-2. Typical supply current consumption in Run mode (For GD32F103x4/6/8/B devices) .... 66
Figure 4-3. Typical supply current consumption in Run mode (For GD32F103xC/D/E/F/G/I/K
devices) ...................................................................................................................................................... 66
Figure 4-4. Typical supply current consumption in Sleep mode (For GD32F103x4/6/8/B devices) .. 66
Figure 4-5. Typical supply current consumption in Sleep mode (For GD32F103xC/D/E/F/G/I/K
devices) ...................................................................................................................................................... 67
Figure 4-6. Recommended external NRST pin circuit(1) ......................................................................... 76
Figure 4-7. I2C bus timing diagram.......................................................................................................... 84
Figure 4-8. SPI timing diagram - master mode ....................................................................................... 85
Figure 4-9. SPI timing diagram - slave mode .......................................................................................... 85
Figure 4-10. I2S timing diagram - master mode ..................................................................................... 86
Figure 4-11. I2S timing diagram - slave mode ........................................................................................ 87
Figure 4-12. USBD timings: definition of data signal rise and fall time ............................................... 89
Figure 5-1. LQFP144 package outline ..................................................................................................... 93
Figure 5-2. LQFP144 recommended footprint ........................................................................................ 94
Figure 5-3. LQFP100 package outline ..................................................................................................... 95
Figure 5-4. LQFP100 recommended footprint ........................................................................................ 96
Figure 5-5. LQFP64 package outline ....................................................................................................... 97
Figure 5-6. LQFP64 recommended footprint .......................................................................................... 98
Figure 5-7. LQFP48 package outline ....................................................................................................... 99
Figure 5-8. LQFP48 recommended footprint ........................................................................................ 100
Figure 5-9. QFN36 package outline ....................................................................................................... 101
Figure 5-10. QFN36 recommended footprint ........................................................................................ 102
4
GD32F103xx Datasheet
List of Tables
Table 2-1. GD32F103xx devices features and peripheral list .................................................................. 8
Table 2-2. GD32F103xx devices features and peripheral list (continued) ............................................. 9
Table 2-3. GD32F103xx devices features and peripheral list (continued) ............................................ 11
Table 2-4. GD32F103xx memory map ...................................................................................................... 18
Table 2-5. GD32F103Zx LQFP144 pin definitions ................................................................................... 23
Table 2-6. GD32F103Vx LQFP100 pin definitions ................................................................................... 31
Table 2-7. GD32F103Rx LQFP64 pin definitions .................................................................................... 38
Table 2-8. GD32F103Cx LQFP48 pin definitions .................................................................................... 42
Table 2-9. GD32F103Tx QFN36 pin definitions ....................................................................................... 45
Table 4-1. Absolute maximum ratings (1)(4) .............................................................................................. 57
Table 4-2. DC operating conditions ......................................................................................................... 57
Table 4-3. Clock frequency(1) .................................................................................................................... 58
Table 4-4. Operating conditions at Power up/ Power down (1) .............................................................. 58
Table 4-5. Start-up timings of Operating conditions (For GD32F103x4/6/8/B devices)(1)(2)(3) ............. 58
Table 4-6. Start-up timings of Operating conditions (For GD32F103xC/D/E/F/G/I/K devices)(1)(2)(3) .. 58
Table 4-7. Power saving mode wakeup timings characteristics (for GD32F103x4/6/8/B devices)(1)(2)
..................................................................................................................................................................... 59
Table 4-8. Power saving mode wakeup timings characteristics (for GD32F103xC/D/E/F/G/I/K
devices)(1)(2) ................................................................................................................................................. 59
Table 4-9. Power consumption characteristics (for GD32F103x4/6/8/B devices) (2)(3)(4)(5).................... 59
Table 4-10. Power consumption characteristics (for GD32F103xC/D/E/F/G/I/K devices) (2)(3)(4)(5) ....... 63
Table 4-11. EMS characteristics (1) ........................................................................................................... 67
Table 4-12. Power supply supervisor characteristics (For GD32F103x4/6/8/B devices) ................... 68
Table 4-13. Power supply supervisor characteristics (For GD32F103xC/D/E/F/G/I/K devices) ......... 68
Table 4-14. ESD characteristics (1) ............................................................................................................ 69
Table 4-15. Static latch-up characteristics (1) .......................................................................................... 70
Table 4-16. High speed external clock (HXTAL) generated from a crystal/ceramic
characteristics(For GD32F103x4/6/8/B devices) .................................................................................... 70
Table 4-17. High speed external clock (HXTAL) generated from a crystal/ceramic
characteristics(For GD32F103xC/D/E/F/G/I/K devices) .......................................................................... 70
Table 4-18. High speed external clock characteristics (HXTAL in bypass mode) .............................. 71
Table 4-19. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics(For
GD32F103x4/6/8/B devices) ...................................................................................................................... 71
Table 4-20. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics(For
GD32F103xC/D/E/F/G/I/K devices) ........................................................................................................... 71
Table 4-21. Low speed external user clock characteristics (LXTAL in bypass mode) ....................... 72
Table 4-22. High speed internal clock (IRC8M) characteristics (For GD32F103x4/6/8/B devices) .... 72
Table 4-23. High speed internal clock (IRC8M) characteristics (For GD32F103 xC/D/E/F/G/I/K
devices) ...................................................................................................................................................... 73
Table 4-24. Low speed internal clock (IRC40K) characteristics (For GD32F103x4/6/8/B devices) ... 73
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GD32F103xx Datasheet
Table 4-25. Low speed internal clock (IRC40K) characteristics(For GD32F103 xC/D/E/F/G/I/K
devices) ...................................................................................................................................................... 74
Table 4-26. PLL characteristics ................................................................................................................ 74
Table 4-27. Flash memory characteristics (For GD32F103x4/6/8/B devices) ...................................... 75
Table 4-28. Flash memory characteristics (For GD32F103xC/D/E/F/G/I/K devices) ........................... 75
Table 4-29. NRST pin characteristics ...................................................................................................... 76
Table 4-30. I/O port DC characteristics(For GD32F103x4/6/8/B devices)(1) (3) ...................................... 76
Table 4-31. I/O port DC characteristics(For GD32F103xC/D/E/F/G/I/K devices)(1) (3) ........................... 78
Table 4-32. I/O port AC characteristics(For GD32F103x4/6/8/B devices) (1)(2)(4) ................................... 79
Table 4-33. I/O port AC characteristics(For GD32F103xC/D/E/F/G/I/K devices) (1)(2)(4)......................... 80
Table 4-34. ADC characteristics(For GD32F103x4/6/8/B devices) ........................................................ 80
Table 4-35. ADC characteristics(For GD32F103xC/D/E/F/G/I/K devices) ............................................. 81
Table 4-36. ADC RAIN max for fADC = 14 MHz (For GD32F103x4/6/8/B devices) ....................................... 81
Table 4-37. ADC RAIN max for fADC = 14 MHz (For GD32F103xC/D/E/F/G/I/K devices) ............................ 81
Table 4-38. Temperature sensor characteristics (1) ................................................................................ 82
Table 4-39. DAC characteristics(For GD32F103xC/D/E/F/G/I/K devices) ............................................. 82
Table 4-40. I2C characteristics(1) (2)........................................................................................................... 83
Table 4-41. Standard SPI characteristics(1) ............................................................................................. 84
Table 4-42. I2S characteristics (For GD32F103xC/D/E/F/G/I/K devices) (1) (2) ....................................... 85
Table 4-43. USART characteristics(1) ....................................................................................................... 87
Table 4-44. SDIO characteristics (For GD32F103xC/D/E/F/G/I/K devices)(1)(2) ..................................... 87
Table 4-45. USBD start up time (For GD32F103x4/6/8/B devices) ........................................................ 88
Table 4-46. USBD start up time (For GD32F103xC/D/E/F/G/I/K devices).............................................. 88
Table 4-47. USBD DC electrical characteristics (For GD32F103x4/6/8/B devices) ............................. 88
Table 4-48. USBD DC electrical characteristics (For GD32F103xC/D/E/F/G/I/K devices) ................... 88
Table 4-49. USBD full speed-electrical characteristics (For GD32F103x4/6/8/B devices) (1) .............. 89
Table 4-50. USBD full speed-electrical characteristics (For GD32F103xC/D/E/F/G/I/K devices)(1) .... 89
Table 4-51. Synchronous multiplexed PSRAM/NOR read timings(1)(2)(3)............................................... 89
Table 4-52. Synchronous multiplexed PSRAM write timings(1)(2)(3) ....................................................... 90
Table 4-53. Synchronous non-multiplexed PSRAM/NOR read timings(1)(2)(3) ....................................... 90
Table 4-54. Synchronous non-multiplexed PSRAM write timings(1)(2)(3) ............................................... 91
Table 4-55. TIMER characteristics(1) ........................................................................................................ 91
Table 4-56. FWDGT min/max timeout period at 40 kHz (IRC40K)(1) ...................................................... 91
Table 4-57. WWDGT min-max timeout value at 54 MHz (fPCLK1)(1).......................................................... 92
Table 5-1. LQFP144 package dimensions ............................................................................................... 93
Table 5-2. LQFP100 package dimensions ............................................................................................... 95
Table 5-3. LQFP64 package dimensions ................................................................................................. 97
Table 5-4. LQFP48 package dimensions ................................................................................................. 99
Table 5-5. QFN36 package dimensions ................................................................................................. 101
Table 5-6. Package thermal characteristics(1) ....................................................................................... 103
Table 6-1. Part ordering code for GD32F103xx devices ...................................................................... 105
Table 7-1. Revision history ..................................................................................................................... 107
6
GD32F103xx Datasheet
1.
General description
The GD32F103xx device is a 32-bit general-purpose microcontroller based on the Arm®
Cortex®-M3 RISC core with best ratio in terms of processing power, reduced power
consumption and peripheral set. The Cortex®-M3 is a next generation processor core which
is tightly coupled with a Nested Vectored Interrupt Controller (NVIC), SysTick timer and
advanced debug support.
The GD32F103xx device incorporates the Arm® Cortex®-M3 32-bit processor core operating
at 108 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It
provides up to 3 MB on-chip Flash memory and up to 96 KB SRAM memory. An extensive
range of enhanced I/Os and peripherals connected to two APB buses. The devices offer up
to three 12-bit ADCs, up to two 12-bit DACs, up to ten general 16-bit timers, two basic timers
plus two PWM advanced timer, as well as standard and advanced communication interfaces:
up to three SPIs, two I2Cs, three USARTs, two UARTs, two I2Ss, an USBD, a CAN and a
SDIO.
The device operates from a 2.6 to 3.6 V power supply and available in –40 to +85 °C
temperature range. Several power saving modes provide the flexibility for maximum
optimization between wakeup latency and power consumption, an especially important
consideration in low power applications.
The above features make the GD32F103xx devices suitable for a wide range of applications,
especially in areas such as industrial control, motor drives, power monitor and alarm systems,
consumer and handheld equipment, POS, vehicle GPS, video intercom, PC peripherals and
so on.
7
GD32F103xx Datasheet
2.
Device overview
2.1.
Device information
Table 2-1. GD32F103xx devices features and peripheral list
GD32F103xx
Part Number
Code Area
Flash
(KB)
Data Area
(KB)
Total (KB)
Timers
SRAM (KB)
Connectivity
T6
T8
TB
C4
C6
C8
CB
R4
R6
R8
RB
V8
VB
16
32
64
128
16
32
64
128
16
32
64
128
64
128
0
0
0
0
0
0
0
0
0
0
0
0
0
0
16
32
64
128
16
32
64
128
16
32
64
128
64
128
6
10
20
20
6
10
20
20
6
10
20
20
20
20
General
2
2
3
3
2
2
3
3
2
2
3
3
3
3
timer(16-bit)
(1-2)
(1-2)
(1-3)
(1-3)
(1-2)
(1-2)
(1-3)
(1-3)
(1-2)
(1-2)
(1-3)
(1-3)
(1-3)
(1-3)
Advanced
1
1
1
1
1
1
1
1
1
1
1
1
1
1
timer(16-bit)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
SysTick
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Watchdog
2
2
2
2
2
2
2
2
2
2
2
2
2
2
RTC
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
3
3
2
2
3
3
3
3
(0-1)
(0-1)
(0-1)
(0-1)
(0-1)
(0-1)
(0-2)
(0-2)
(0-1)
(0-1)
(0-2)
(0-2)
(0-2)
(0-2)
1
1
1
1
1
1
2
2
1
1
2
2
2
2
(0)
(0)
(0)
(0)
(0)
(0)
(0-1)
(0-1)
(0)
(0)
(0-1)
(0-1)
(0-1)
(0-1)
1
1
1
1
1
1
2
2
1
1
2
2
2
2
(0)
(0)
(0)
(0)
(0)
(0)
(0-1)
(0-1)
(0)
(0)
(0-1)
(0-1)
(0-1)
(0-1)
CAN
1
1
1
1
1
1
1
1
1
1
1
1
1
1
USBD
1
1
1
1
1
1
1
1
1
1
1
1
1
1
GPIO
26
26
26
26
37
37
37
37
51
51
51
51
80
80
EXMC
0
0
0
0
0
0
0
0
0
0
0
0
1
1
EXTI
16
16
16
16
16
16
16
16
16
16
16
16
16
16
Units
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Channels
10
10
10
10
10
10
10
10
16
16
16
16
16
16
USART
ADC
T4
I2C
SPI
Package
QFN36
LQFP48
LQFP64
LQFP100
8
GD32F103xx Datasheet
Table 2-2. GD32F103xx devices features and peripheral list (continued)
GD32F103xx
Part Number
RC
Code Area
Flash
(KB)
Data Area
(KB)
Total (KB)
SRAM (KB)
General
timer(16-
RE
RF
RG
RK
VC
VD
VF
VG
256 256 256
256
256 256 256
256
256 256 256
256
512
768 1792 2816
0
128 256 512
768 1792 2816
0
RD
128 256
RI
VE
VI
VK
256 256
256 384 512
768 1024 2048 3072 256
384 512 768 1024 2048 3072
48
96
64
64
64
96
96
96
48
64
96
96
96
96
4
4
4
10
10
10
10
4
4
4
10
10
10
10
(1-4)
(1-4)
(1-4)
(1-4,8-13)
(1-4,8-13)
(1-4,8-13)
(1-4,8-13)
(1-4)
(1-4)
(1-4)
(1-4,8-13)
(1-4,8-13)
(1-4,8-13)
(1-4,8-13)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
bit)
Advanced
Timers
timer(16bit)
SysTick
Basic
2
2
2
2
2
2
2
2
2
2
2
2
2
2
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
Watchdog
2
2
2
2
2
2
2
2
2
2
2
2
2
2
RTC
1
1
1
1
1
1
1
1
1
1
1
1
1
1
USART
3
3
3
3
3
3
3
3
3
3
3
3
3
3
UART
2
2
2
2
2
2
2
2
2
2
2
2
2
2
I2C
2
2
2
2
2
2
2
2
2
2
2
2
2
2
timer(16-
Connectivity
bit)
3
3
3
3
3
3
3
3
3
3
3
3
3
3
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
CAN
1
1
1
1
1
1
1
1
1
1
1
1
1
1
USBD
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
GPIO
51
51
51
51
51
51
51
80
80
80
80
80
80
80
EXMC
0
0
0
0
0
0
0
1
1
1
1
1
1
1
EXTI
16
16
16
16
16
16
16
16
16
16
16
16
16
16
Units
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Channels
16
16
16
16
16
16
16
16
16
16
16
16
16
16
SPI
I2S
ADC
SDIO
9
GD32F103xx Datasheet
GD32F103xx
Part Number
DAC
Package
RC
RD
RE
RF
RG
RI
RK
VC
VD
VE
VF
VG
VI
VK
2
2
2
2
2
2
2
2
2
2
2
2
2
2
LQFP64
LQFP100
10
GD32F103xx Datasheet
Table 2-3. GD32F103xx devices features and peripheral list (continued)
GD32F103xx
Flash
Part Number
ZC
ZD
ZE
ZF
ZG
ZI
ZK
Code Area (KB)
256
256
256
256
256
256
256
Data Area (KB)
0
128
256
512
768
1792
2816
Total (KB)
256
384
512
768
1024
2048
3072
48
64
64
96
96
96
96
Connectivity
Timers
SRAM (KB)
General
4
4
4
10
10
10
10
timer(16-bit)
(1-4)
(1-4)
(1-4)
(1-4,8-13)
(1-4,8-13)
(1-4,8-13)
(1-4,8-13)
Advanced
2
2
2
2
2
2
2
timer(16-bit)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
(0,7)
SysTick
1
1
1
1
1
1
1
Basic timer(16-
2
2
2
2
2
2
2
bit)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
Watchdog
2
2
2
2
2
2
2
RTC
1
1
1
1
1
1
1
USART
3
3
3
3
3
3
3
UART
2
2
2
2
2
2
2
I2C
2
2
2
2
2
2
2
3
3
3
3
3
3
3
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
CAN
1
1
1
1
1
1
1
USBD
1
1
1
1
1
1
1
SPI
2
2
2
2
2
2
2
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
1
1
1
1
1
1
1
GPIO
112
112
112
112
112
112
112
EXMC
1
1
1
1
1
1
1
EXTI
16
16
16
16
16
16
16
Units
3
3
3
3
3
3
3
Channels
21
21
21
21
21
21
21
2
2
2
2
2
2
2
I2S
ADC
SDIO
DAC
Package
LQFP144
11
GD32F103xx Datasheet
2.2.
Block diagram
Figure 2-1. GD32F103x4/6/8/B block diagram
TPIU
SW/JTAG
Flash
Memory
Controller
Ibus
Flash
Memory
PLL
Fmax: 108MHz
Dbus
FMC
Master
DMA0 7chs
AHB Matrix: Fmax =
108MHz
NVIC
ICode DCode System
ARM Cortex-M3
Processor
Fmax: 108MHz
POR/PDR
Master
EXMC
Slave
Slave
LDO
1.2V
RCU
AHB Peripherals
Slave
Slave
CRC
SRAM
Controller
AHB to APB
Bridge 2
IRC
8MHz
SRAM
HXTAL
4-16MHz
AHB to APB
Bridge 1
LVD
Interrput request
CAN0
USART0
Slave
12-bit
SAR ADC
Slave
WWDGT
ADC0
TIMER1
ADC1
TIMER2
GPIOA
TIMER3
GPIOB
GPIOC
GPIOD
APB1: Fmax = 54MHz
SPI0
APB2: Fmax = 108MHz
Powered By V DDA
Powered By V DDA
SPI1
USART1
USART2
GPIOE
I2C0
TIMER0
I2C1
EXTI
USBD
FWDGT
RTC
12
GD32F103xx Datasheet
Figure 2-2. GD32F103xC/D/E/F/G/I/K block diagram
POR/PDR
TPIU
SW/JTAG
DMA0
7chs
DMA1
5chs
PLL
Ibus
Dbus
Master
Master
AHB Matrix: Fmax = 108MHz
NVIC
ICode DCode System
ARM Cortex-M3
Processor
Fmax: 108MHz
Master
Flash Memory
Controller 1
Flash
Memory
Flash Memory
Controller 2
Flash
Memory
FMC
CRC
Fmax: 108MHz
LDO
1.2V
RCU
IRC
8MHz
AHB Peripherals
Slave
EXMC
HXTAL
4-16MHz
Slave
Slave
SRAM
Controller
SRAM
SDIO
LVD
Slave
Slave
AHB to APB
Bridge 2
AHB to APB
Bridge 1
Powered By V DDA
Interrput request
CAN0
USART0
Slave
SPI0
Slave
WWDGT
TIMER1
ADC0
12-bit
SAR ADC
GPIOB
GPIOC
APB1: Fmax = 54MHz
GPIOA
TIMER3
APB2: Fmax = 108MHz
ADC2
Powered By V DDA
TIMER2
ADC1
TIMER4
TIMER11
TIMER12
TIMER13
GPIOD
SPI1/I2S1
GPIOE
SPI2/I2S2
GPIOF
USART1
GPIOG
USART2
TIMER0
UART3
TIMER7
UART4
TIMER8
I2C0
TIMER9
TIMER5
I2C1
TIMER10
TIMER6
USBD
EXTI
DAC0
DAC1
FWDGT
RTC
: Blocks are available in GD32F103xF/G/I/K devices
13
GD32F103xx Datasheet
2.3.
Pinouts and pin assignment
Figure 2-3. GD32F103Zx LQFP144 pinouts
PA14
PA15
PC10
PC11
PC12
PD0
PD1
PD2
PD3
PD4
PD5
VSS_10
VDD_10
PD6
PD7
PG9
PG10
PG11
PG12
PG13
PG14
VSS_11
VDD_11
PG15
PB4
PB3
PB5
PB6
PB7
BOOT0
PB8
PB9
PE0
PE1
VSS_3
VDD_3
144143142141140139138137136135134133 132131130129128127126125124123122121120 119118117116115114113112111110109
PE2
1
108
PE3
PE4
2
107
VSS_2
3
106
NC
PE5
PE6
4
105
PA13
5
104
PA12
VBAT
6
103
PA11
PC13-TAMPER-RTC
PC14-OSC32IN
7
102
PA10
8
101
PA9
PC15-OSC32OUT
9
100
PA8
PF0
10
99
PC9
PF1
11
98
PC8
PF2
12
97
PC7
PF3
PF4
13
96
PC6
14
95
VDD_9
PF5
15
94
VSS_9
VSS_5
16
93
PG8
92
PG7
91
PG6
90
PG5
89
PG4
88
PG3
VDD_2
VDD_5
17
PF6
18
PF7
19
PF8
20
PF9
21
PF10
22
87
PG2
OSCIN
23
86
PD15
OSCOUT
24
85
PD14
NRST
25
84
VDD_8
PC0
26
83
VSS_8
PC1
27
82
PD13
PC2
28
81
PD12
PC3
VSSA
29
80
PD11
30
79
PD10
VREFVREF+
31
78
PD9
32
77
PD8
VDDA
33
76
PB15
PA0_WKUP
34
75
PB14
PA1
35
74
PB13
PA2
36
73
PB12
GigaDevice GD32F103Zx
LQFP144
37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72
VDD_1
VSS_1
PB11
PB10
PE15
PE13
PE14
PE12
PE11
VDD_7
PE10
VSS_7
PE8
PE9
PE7
PG1
PG0
PF15
PF14
VDD_6
PF13
VSS_6
PF12
PB2
PF11
PB1
PC5
PB0
PA7
PC4
PA6
PA5
VDD_4
PA4
VSS_4
PA3
14
GD32F103xx Datasheet
Figure 2-4. GD32F103Vx LQFP100 pinouts
PA14
PA15
PC10
PC11
PC12
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PB4
PB3
PB5
PB6
PB7
BOOT0
PB8
PB9
PE0
PE1
VSS_3
VDD_3
PE2
1
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
75
PE3
PE4
2
74
VSS_2
3
73
NC
PE5
PE6
4
72
PA13
5
71
PA12
VBAT
6
PC13-TAMPER-RTC
PC14-OSC32IN
7
70
69
PA10
8
68
PA9
PC15-OSC32OUT
9
67
PA8
VSS_5
10
66
PC9
VDD_5
11
65
PC8
64
PC7
63
PC6
14
62
PD15
OSCIN
12
GigaDevice GD32F103Vx
LQFP100
VDD_2
PA11
OSCOUT
NRST
PC0
13
15
61
PD14
PC1
16
60
PD13
PC2
PC3
17
59
PD12
18
58
PD11
VSSA
19
57
PD10
VREFVREF+
20
56
PD9
21
55
PD8
VDDA
22
54
PB15
PA0-WKUP
23
53
PB14
PA1
24
52
PB13
PA2
25
51
PB12
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
VSS_1
VDD_1
PB11
PB10
PE15
PE14
PE13
PE11
PE12
PE10
PE9
PE8
PE7
PB2
PB1
PC5
PB0
PA7
PC4
PA6
PA5
PA4
VDD_4
PA3
VSS_4
15
GD32F103xx Datasheet
Figure 2-5. GD32F103Rx LQFP64 pinouts
PA14
PA15
PC10
PC11
PD2
PC12
PB3
PB4
PB5
PB6
PB7
BOOT0
PB8
PB9
VSS_3
VDD_3
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
VBAT
1
48
VDD_2
PC13-TAMPER-RTC
2
47
VSS_2
PA13
PC14-OSC32IN
3
46
PC15-OSC32OUT
OSCIN
4
45
PA12
5
44
PA11
OSCOUT
6
43
PA10
NRST
PC0
7
42
PA9
PC1
9
PC2
PC3
VSSA
GigaDevice GD32F103Rx
LQFP64
41
PA8
40
PC9
10
39
PC8
11
38
PC7
12
37
PC6
VDDA
13
36
PB15
PA0-WKUP
14
35
PB14
PA1
15
34
PB13
PA2
16
33
PB12
8
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
VDD_1
VSS_1
PA15
PB11
PB1
PB10
PB0
PB3
PB2
PC5
PB4
PC4
PA7
PA6
PA5
PA4
VDD_4
VSS_4
PA3
Figure 2-6. GD32F103Cx LQFP48 pinouts
PA14
PB5
PB6
PB7
BOOT0
PB8
PB9
VSS_3
VDD_3
48 47 46 45 44 43 42 41 40 39 38 37
VBAT
1
36
VDD_2
PC13-TAMPER-RTC
2
35
VSS_2
PC14-OSC32IN
3
34
PA13
PC15-OSC32OUT
OSCIN
4
33
PA12
5
32
PA11
OSCOUT
NRST
VSSA
6
31
PA10
30
PA9
8
29
VDDA
9
28
PA8
PB15
PA0-WKUP
10
27
PB14
PA1
PA2
11
26
PB13
12
25
PB12
GigaDevice GD32F103Cx
LQFP48
7
13 14 15 16 17 18 19 20 21 22 23 24
VSS_1
VDD_1
PB11
PB10
PB2
PB1
PA7
PB0
PA6
PA5
PA4
PA3
16
GD32F103xx Datasheet
Figure 2-7. GD32F103Tx QFN36 pinouts
PA14
PA2
PA15
PA1
PB3
PB4
PA0-WKUP
PB5
VDDA
PB6
OSCIN
OSCOUT
NRST
VSSA
PB7
BOOT0
VSS_3
VDD_3
36 35 34 33 32 31 30 29 28
1
27
2
26
VDD_2
3
25
PA13
24
5 GigaDevice GD32F103Tx 23
QFN36
6
22
7
21
PA12
PA9
8
PA8
4
20
9
19
10 11 12 13 14 15 16 17 18
VSS_2
PA11
PA10
VDD_1
VSS_1
PB2
PB1
PB0
PA7
PA6
PA5
PA4
PA3
17
GD32F103xx Datasheet
2.4.
Memory map
Table 2-4. GD32F103xx memory map
Pre-defined
Regions
Bus
External
device
AHB
Address
Peripherals
0xA000 0000 - 0xA000 0FFF
EXMC - SWREG
0x9000 0000 - 0x9FFF FFFF
EXMC - PC CARD
0x7000 0000 - 0x8FFF FFFF
EXMC - NAND
External RAM
EXMC 0x6000 0000 - 0x6FFF FFFF
NOR/PSRAM/SRA
M
Peripheral
AHB
0x5000 0000 - 0x5003 FFFF
Reserved
0x4008 0000 - 0x4FFF FFFF
Reserved
0x4004 0000 - 0x4007 FFFF
Reserved
0x4002 BC00 - 0x4003 FFFF
Reserved
0x4002 B000 - 0x4002 BBFF
Reserved
0x4002 A000 - 0x4002 AFFF
Reserved
0x4002 8000 - 0x4002 9FFF
Reserved
0x4002 6800 - 0x4002 7FFF
Reserved
0x4002 6400 - 0x4002 67FF
Reserved
0x4002 6000 - 0x4002 63FF
Reserved
0x4002 5000 - 0x4002 5FFF
Reserved
0x4002 4000 - 0x4002 4FFF
Reserved
0x4002 3C00 - 0x4002 3FFF
Reserved
0x4002 3800 - 0x4002 3BFF
Reserved
0x4002 3400 - 0x4002 37FF
Reserved
0x4002 3000 - 0x4002 33FF
CRC
0x4002 2C00 - 0x4002 2FFF
Reserved
0x4002 2800 - 0x4002 2BFF
Reserved
0x4002 2400 - 0x4002 27FF
Reserved
0x4002 2000 - 0x4002 23FF
FMC
0x4002 1C00 - 0x4002 1FFF
Reserved
0x4002 1800 - 0x4002 1BFF
Reserved
0x4002 1400 - 0x4002 17FF
Reserved
0x4002 1000 - 0x4002 13FF
RCU
0x4002 0C00 - 0x4002 0FFF
Reserved
0x4002 0800 - 0x4002 0BFF
Reserved
0x4002 0400 - 0x4002 07FF
DMA1
0x4002 0000 - 0x4002 03FF
DMA0
0x4001 8400 - 0x4001 FFFF
Reserved
18
GD32F103xx Datasheet
Pre-defined
Regions
Bus
APB2
APB1
Address
Peripherals
0x4001 8000 - 0x4001 83FF
SDIO
0x4001 7C00 - 0x4001 7FFF
Reserved
0x4001 7800 - 0x4001 7BFF
Reserved
0x4001 7400 - 0x4001 77FF
Reserved
0x4001 7000 - 0x4001 73FF
Reserved
0x4001 6C00 - 0x4001 6FFF
Reserved
0x4001 6800 - 0x4001 6BFF
Reserved
0x4001 5C00 - 0x4001 67FF
Reserved
0x4001 5800 - 0x4001 5BFF
Reserved
0x4001 5400 - 0x4001 57FF
TIMER10
0x4001 5000 - 0x4001 53FF
TIMER9
0x4001 4C00 - 0x4001 4FFF
TIMER8
0x4001 4800 - 0x4001 4BFF
Reserved
0x4001 4400 - 0x4001 47FF
Reserved
0x4001 4000 - 0x4001 43FF
Reserved
0x4001 3C00 - 0x4001 3FFF
ADC2
0x4001 3800 - 0x4001 3BFF
USART0
0x4001 3400 - 0x4001 37FF
TIMER7
0x4001 3000 - 0x4001 33FF
SPI0
0x4001 2C00 - 0x4001 2FFF
TIMER0
0x4001 2800 - 0x4001 2BFF
ADC1
0x4001 2400 - 0x4001 27FF
ADC0
0x4001 2000 - 0x4001 23FF
GPIOG
0x4001 1C00 - 0x4001 1FFF
GPIOF
0x4001 1800 - 0x4001 1BFF
GPIOE
0x4001 1400 - 0x4001 17FF
GPIOD
0x4001 1000 - 0x4001 13FF
GPIOC
0x4001 0C00 - 0x4001 0FFF
GPIOB
0x4001 0800 - 0x4001 0BFF
GPIOA
0x4001 0400 - 0x4001 07FF
EXTI
0x4001 0000 - 0x4001 03FF
AFIO
0x4000 CC00 - 0x4000 FFFF
Reserved
0x4000 C800 - 0x4000 CBFF
Reserved
0x4000 C400 - 0x4000 C7FF
Reserved
0x4000 C000 - 0x4000 C3FF
Reserved
0x4000 8000 - 0x4000 BFFF
Reserved
0x4000 7C00 - 0x4000 7FFF
Reserved
0x4000 7800 - 0x4000 7BFF
Reserved
0x4000 7400 - 0x4000 77FF
DAC
0x4000 7000 - 0x4000 73FF
PMU
19
GD32F103xx Datasheet
Pre-defined
Regions
Bus
Address
Peripherals
0x4000 6C00 - 0x4000 6FFF
BKP
0x4000 6800 - 0x4000 6BFF
Reserved
0x4000 6400 - 0x4000 67FF
CAN0
0x4000 6000 - 0x4000 63FF
SRAM
Code
AHB
AHB
Shared USBD/CAN
SRAM 512 bytes
0x4000 5C00 - 0x4000 5FFF
USBD
0x4000 5800 - 0x4000 5BFF
I2C1
0x4000 5400 - 0x4000 57FF
I2C0
0x4000 5000 - 0x4000 53FF
UART4
0x4000 4C00 - 0x4000 4FFF
UART3
0x4000 4800 - 0x4000 4BFF
USART2
0x4000 4400 - 0x4000 47FF
USART1
0x4000 4000 - 0x4000 43FF
Reserved
0x4000 3C00 - 0x4000 3FFF
SPI2/I2S2
0x4000 3800 - 0x4000 3BFF
SPI1/I2S1
0x4000 3400 - 0x4000 37FF
Reserved
0x4000 3000 - 0x4000 33FF
FWDGT
0x4000 2C00 - 0x4000 2FFF
WWDGT
0x4000 2800 - 0x4000 2BFF
RTC
0x4000 2400 - 0x4000 27FF
Reserved
0x4000 2000 - 0x4000 23FF
TIMER13
0x4000 1C00 - 0x4000 1FFF
TIMER12
0x4000 1800 - 0x4000 1BFF
TIMER11
0x4000 1400 - 0x4000 17FF
TIMER6
0x4000 1000 - 0x4000 13FF
TIMER5
0x4000 0C00 - 0x4000 0FFF
TIMER4
0x4000 0800 - 0x4000 0BFF
TIMER3
0x4000 0400 - 0x4000 07FF
TIMER2
0x4000 0000 - 0x4000 03FF
TIMER1
0x2007 0000 - 0x3FFF FFFF
Reserved
0x2006 0000 - 0x2006 FFFF
Reserved
0x2003 0000 - 0x2005 FFFF
Reserved
0x2002 0000 - 0x2002 FFFF
Reserved
0x2001 C000 - 0x2001 FFFF
Reserved
0x2001 8000 - 0x2001 BFFF
Reserved
0x2000 0000 - 0x2001 7FFF
SRAM
0x1FFF F810 - 0x1FFF FFFF
Reserved
0x1FFF F800 - 0x1FFF F80F
Option Bytes
0x1FFF B000 - 0x1FFF F7FF
Boot loader
0x1FFF 7A10 - 0x1FFF AFFF
Reserved
20
GD32F103xx Datasheet
Pre-defined
Regions
Bus
Address
Peripherals
0x1FFF 7800 - 0x1FFF 7A0F
Reserved
0x1FFF 0000 - 0x1FFF 77FF
Reserved
0x1FFE C010 - 0x1FFE FFFF
Reserved
0x1FFE C000 - 0x1FFE C00F
Reserved
0x1001 0000 - 0x1FFE BFFF
Reserved
0x1000 0000 - 0x1000 FFFF
Reserved
0x083C 0000 - 0x0FFF FFFF
Reserved
0x0830 0000 - 0x083B FFFF
Reserved
0x0800 0000 - 0x082F FFFF
Main Flash
0x0030 0000 - 0x07FF FFFF
Reserved
0x0000 0000 - 0x002F FFFF
Aliased to Main
Flash or Boot loader
21
GD32F103xx Datasheet
2.5.
Clock tree
Figure 2-8. GD32F103xx clock tree
USBD
Prescaler
÷1,1.5,2,2.5
CK_USBD
48 MHz
(to USBD)
CK_I2S
I2S enable
(to I2S1,2)
CK_SDIO
SCS[1:0]
SDIO enable
(to SDIO)
CK_EXMC
CK_IRC8M
00
8 MHz
IRC8M
1
×2,3,4
…,32
PLL
PLLSEL
PLLMF
0
/2
CK_PLL
10
(to EXMC)
EXMC enable
CK_SYS
108 MHz max
AHB
Prescaler
÷1,2...512
CK_AHB
108 MHz max
HCLK
AHB enable
(to AHB bus,Cortex-M3,SRAM,DMA,FMC)
01
CK_CST
÷8
(to Cortex-M3 SysTick)
Clock
Monitor
/1 or /2
4-16 MHz
HXTAL
FCLK
(free running clock)
TIMER1,2,3,4,5,6,
11,12,13 if(APB1
prescale =1)x1
else x 2
CK_HXTAL
PREDV0
CK_TIMERx
TIMERx
enable
to TIMER1,2,3,4,
5,6,11,12,13
11
/128
32.768 KHz
LXTAL
CK_RTC
01
(to RTC)
APB1
Prescaler
÷1,2,4,8,16
CK_APB1
PCLK1
54 MHz max
to APB1 peripherals
10
RTCSRC[1:0]
40 KHz
IRC40K
CK_OUT0
Peripheral enable
CK_FWDGT
(to FWDGT)
0xx
100
101
110
111
NO CLK
CK_SYS
CK_IRC8M
CK_HXTAL
/2
CK_PLL
TIMER0,7,8,9,10
if(APB2 prescale
=1)x1
else x 2
APB2
Prescaler
÷1,2,4,8,16
CK_TIMERx
TIMERx
enable
to
TIMER0,7,8,9,10
CK_APB2
PCLK2
108 MHz max
Peripheral enable
ADC
Prescaler
÷2,4,8,12,16
to APB2
peripherals
CK_ADCX to ADC0,ADC1,ADC2
14 MHz max
CKOUT0SEL[2:0]
Legend:
HXTAL: High speed external clock
LXTAL: Low speed external clock
IRC8M: High speed internal clock
IRC40K: Low speed internal clock
22
GD32F103xx Datasheet
2.6.
Pin definitions
2.6.1.
GD32F103Zx LQFP144 pin definitions
Table 2-5. GD32F103Zx LQFP144 pin definitions
Pin
I/O
Type(1)
Level(2)
1
I/O
5VT
PE3
2
I/O
5VT
PE4
3
I/O
5VT
PE5
4
I/O
5VT
Pin Name
Pins
PE2
Functions description
Default: PE2
Alternate: TRACECK, EXMC_A23
Default: PE3
Alternate: TRACED0, EXMC_A19
Default: PE4
Alternate:TRACED1, EXMC_A20
Default: PE5
Alternate:TRACED2, EXMC_A21
Remap: TIMER8_CH0(3)
Default: PE6
PE6
5
I/O
5VT
Alternate:TRACED3, EXMC_A22
Remap: TIMER8_CH1(3)
VBAT
Default: VBAT
6
P
7
I/O
8
I/O
9
I/O
PF0
10
I/O
5VT
PF1
11
I/O
5VT
PF2
12
I/O
5VT
PF3
13
I/O
5VT
PF4
14
I/O
5VT
PF5
15
I/O
5VT
VSS_5
16
P
Default: VSS_5
VDD_5
17
P
Default: VDD_5
PF6
18
I/O
Default: PF6
PC13TAMPER-
Default: PC13
Alternate: TAMPER-RTC
RTC
PC14OSC32IN
PC15OSC32OUT
Default: PC14
Alternate: OSC32IN
Default: PC15
Alternate: OSC32OUT
Default: PF0
Alternate: EXMC_A0
Default: PF1
Alternate: EXMC_A1
Default: PF2
Alternate: EXMC_A2
Default: PF3
Alternate: EXMC_A3
Default: PF4
Alternate: EXMC_A4
Default: PF5
Alternate: EXMC_A5
23
GD32F103xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1)
Level(2)
Functions description
Alternate: ADC2_IN4, EXMC_NIORD
Remap: TIMER9_CH0(3)
Default: PF7
PF7
19
I/O
Alternate: ADC2_IN5, EXMC_NREG
Remap: TIMER10_CH0(3)
Default: PF8
PF8
20
I/O
Alternate: ADC2_IN6, EXMC_NIOWR
Remap: TIMER12_CH0(3)
Default: PF9
PF9
21
I/O
Alternate: ADC2_IN7, EXMC_CD
Remap: TIMER13_CH0(3)
Default: PF10
PF10
22
I/O
OSCIN
23
I
OSCOUT
24
O
NRST
25
I/O
PC0
26
I/O
PC1
27
I/O
PC2
28
I/O
PC3
29
I/O
VSSA
30
P
Default: VSSA
VREF-
31
P
Default: VREF-
VREF+
32
P
Default: VREF+
VDDA
33
P
Default: VDDA
PA0-WKUP
34
I/O
Alternate: ADC2_IN8, EXMC_INTR
Default: OSCIN
Remap: PD0
Default: OSCOUT
Remap: PD1
Default: NRST
Default: PC0
Alternate: ADC012_IN10
Default: PC1
Alternate: ADC012_IN11
Default: PC2
Alternate: ADC012_IN12
Default: PC3
Alternate: ADC012_IN13
Default: PA0
Alternate: WKUP, USART1_CTS, ADC012_IN0,
TIMER1_CH0, TIMER1_ETI, TIMER4_CH0, TIMER7_ETI
Default: PA1
PA1
35
I/O
Alternate: USART1_RTS, ADC012_IN1, TIMER1_CH1,
TIMER4_CH1
Default: PA2
PA2
36
I/O
Alternate: USART1_TX, ADC012_IN2, TIMER1_CH2,
TIMER4_CH2, TIMER8_CH0(3)
Default: PA3
PA3
37
I/O
Alternate: USART1_RX, ADC012_IN3, TIMER1_CH3,
TIMER4_CH3, TIMER8_CH1(3)
24
GD32F103xx Datasheet
Pin
I/O
Type(1)
Level(2)
Pin Name
Pins
Functions description
VSS_4
38
P
Default: VSS_4
VDD_4
39
P
Default: VDD_4
Default: PA4
PA4
40
Alternate: SPI0_NSS, USART1_CK, ADC01_IN4,
I/O
DAC_OUT0
Remap:SPI2_NSS, I2S2_WS
PA5
41
Default: PA5
I/O
Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1
Default: PA6
PA6
42
Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0,
I/O
TIMER7_BRKIN, TIMER12_CH0(3)
Remap: TIMER0_BRKIN
Default: PA7
PA7
43
Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1,
I/O
TIMER7_CH0_ON, TIMER13_CH0(3)
Remap: TIMER0_CH0_ON
PC4
44
I/O
PC5
45
I/O
Default: PC4
Alternate: ADC01_IN14
Default: PC5
Alternate: ADC01_IN15
Default: PB0
PB0
46
Alternate: ADC01_IN8, TIMER2_CH2, TIMER7_CH1_ON
I/O
Remap: TIMER0_CH1_ON
Default: PB1
Alternate: ADC01_IN9, TIMER2_CH3, TIMER7_CH2_ON
PB1
47
I/O
PB2
48
I/O
5VT
PF11
49
I/O
5VT
PF12
50
I/O
5VT
Remap: TIMER0_CH2_ON
Default: PB2, BOOT1
Default: PF11
Alternate: EXMC_NIOS16
Default: PF12
Alternate: EXMC_A6
VSS_6
51
P
Default: VSS_6
VDD_6
52
P
Default: VDD_6
PF13
53
I/O
5VT
PF14
54
I/O
5VT
PF15
55
I/O
5VT
PG0
56
I/O
5VT
PG1
57
I/O
5VT
Default: PF13
Alternate: EXMC_A7
Default: PF14
Alternate: EXMC_A8
Default: PF15
Alternate: EXMC_A9
Default: PG0
Alternate: EXMC_A10
Default: PG1
25
GD32F103xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1)
Level(2)
Functions description
Alternate: EXMC_A11
Default: PE7
PE7
58
I/O
5VT
Alternate: EXMC_D4
Remap: TIMER0_ETI
Default: PE8
PE8
59
I/O
5VT
Alternate: EXMC_D5
Remap: TIMER0_CH0_ON
Default: PE9
PE9
60
I/O
5VT
Alternate: EXMC_D6
Remap: TIMER0_CH0
VSS_7
61
P
Default: VSS_7
VDD_7
62
P
Default: VDD_7
PE10
63
I/O
Default: PE10
5VT
Alternate: EXMC_D7
Remap: TIMER0_CH1_ON
Default: PE11
PE11
64
I/O
5VT
Alternate: EXMC_D8
Remap: TIMER0_CH1
Default: PE12
PE12
65
I/O
5VT
Alternate: EXMC_D9
Remap: TIMER0_CH2_ON
Default: PE13
PE13
66
I/O
5VT
Alternate: EXMC_D10
Remap: TIMER0_CH2
Default: PE14
PE14
67
I/O
5VT
Alternate: EXMC_D11
Remap: TIMER0_CH3
Default: PE15
PE15
68
I/O
5VT
Alternate: EXMC_D12
Remap: TIMER0_BRKIN
Default: PB10
PB10
69
I/O
5VT
Alternate: I2C1_SCL, USART2_TX
Remap: TIMER1_CH2
Default: PB11
PB11
70
I/O
5VT
Alternate: I2C1_SDA, USART2_RX
Remap: TIMER1_CH3
VSS_1
71
P
Default: VSS_1
VDD_1
72
P
Default: VDD_1
PB12
73
I/O
5VT
PB13
74
I/O
5VT
Default: PB12
Alternate: SPI1_NSS, I2C1_SMBA, USART2_CK,
TIMER0_BRKIN, I2S1_WS
Default: PB13
26
GD32F103xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1)
Level(2)
Functions description
Alternate: SPI1_SCK, USART2_CTS, TIMER0_CH0_ON,
I2S1_CK
Default: PB14
PB14
75
I/O
5VT
Alternate: SPI1_MISO, USART2_RTS, TIMER0_CH1_ON,
TIMER11_CH0(3)
Default: PB15
PB15
76
I/O
5VT
Alternate: SPI1_MOSI, TIMER0_CH2_ON, I2S1_SD,
TIMER11_CH1(3)
Default: PD8
PD8
77
I/O
5VT
Alternate: EXMC_D13
Remap: USART2_TX
Default: PD9
PD9
78
I/O
5VT
Alternate: EXMC_D14
Remap: USART2_RX
Default: PD10
PD10
79
I/O
5VT
Alternate: EXMC_D15
Remap: USART2_CK
Default: PD11
PD11
80
I/O
5VT
Alternate: EXMC_A16/EXMC_CLE
Remap: USART2_CTS
Default: PD12
PD12
81
I/O
5VT
Alternate: EXMC_A17/EXMC_ALE
Remap: TIMER3_CH0, USART2_RTS
Default: PD13
PD13
82
I/O
5VT
Alternate: EXMC_A18
Remap: TIMER3_CH1
VSS_8
83
P
Default: VSS_8
VDD_8
84
P
Default: VDD_8
Default: PD14
PD14
85
I/O
5VT
Alternate: EXMC_D0
Remap: TIMER3_CH2
Default: PD15
PD15
86
I/O
5VT
Alternate: EXMC_D1
Remap: TIMER3_CH3
PG2
87
I/O
5VT
PG3
88
I/O
5VT
PG4
89
I/O
5VT
PG5
90
I/O
5VT
Default: PG2
Alternate: EXMC_A12
Default: PG3
Alternate: EXMC_A13
Default: PG4
Alternate: EXMC_A14
Default: PG5
Alternate: EXMC_A15
27
GD32F103xx Datasheet
Pin
I/O
Type(1)
Level(2)
91
I/O
5VT
PG7
92
I/O
5VT
PG8
93
I/O
5VT
VSS_9
94
P
Default: VSS_9
VDD_9
95
P
Default: VDD_9
Pin Name
Pins
PG6
Functions description
Default: PG6
Alternate: EXMC_INT1
Default: PG7
Alternate: EXMC_INT2
Default: PG8
Default: PC6
PC6
96
I/O
5VT
Alternate: I2S1_MCK, TIMER7_CH0, SDIO_D6
Remap: TIMER2_CH0
Default: PC7
PC7
97
I/O
5VT
Alternate: I2S2_MCK, TIMER7_CH1, SDIO_D7
Remap: TIMER2_CH1
Default: PC8
PC8
98
I/O
5VT
Alternate: TIMER7_CH2, SDIO_D0
Remap: TIMER2_CH2
Default: PC9
PC9
99
I/O
5VT
Alternate: TIMER7_CH3, SDIO_D1
Remap: TIMER2_CH3
PA8
100
I/O
5VT
PA9
101
I/O
5VT
PA10
102
I/O
5VT
Default: PA8
Alternate: USART0_CK, TIMER0_CH0, CK_OUT0
Default: PA9
Alternate: USART0_TX, TIMER0_CH1
Default: PA10
Alternate: USART0_RX, TIMER0_CH2
Default: PA11
PA11
103
I/O
5VT
Alternate: USART0_CTS, CAN0_RX, USBDM,
TIMER0_CH3
Default: PA12
PA12
104
I/O
5VT
Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI,
USBDP
I/O
5VT
Default: JTMS, SWDIO
PA13
105
NC
106
VSS_2
107
P
Default: VSS_2
VDD_2
108
P
Default: VDD_2
PA14
109
I/O
Remap: PA13
-
5VT
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
PA15
110
I/O
5VT
Alternate: SPI2_NSS, I2S2_WS
Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS
28
GD32F103xx Datasheet
Pin Name
Pins
PC10
111
Pin
I/O
Type(1)
Level(2)
I/O
5VT
Functions description
Default: PC10
Alternate: UART3_TX, SDIO_D2
Remap: USART2_TX, SPI2_SCK, I2S2_CK
Default: PC11
PC11
112
I/O
5VT
Alternate: UART3_RX, SDIO_D3
Remap: USART2_RX, SPI2_MISO
Default: PC12
PC12
113
I/O
5VT
Alternate: UART4_TX, SDIO_CK
Remap: USART2_CK, SPI2_MOSI, I2S2_SD
Default: PD0
PD0
114
I/O
5VT
Alternate: EXMC_D2
Remap: CAN0_RX
Default: PD1
PD1
115
I/O
5VT
Alternate: EXMC_D3
Remap: CAN0_TX
PD2
116
I/O
5VT
PD3
117
I/O
5VT
Default: PD2
Alternate: TIMER2_ETI, SDIO_CMD, UART4_RX
Default: PD3
Alternate: EXMC_CLK
Remap: USART1_CTS
Default: PD4
PD4
118
I/O
5VT
Alternate: EXMC_NOE
Remap: USART1_RTS
Default: PD5
PD5
119
I/O
5VT
Alternate: EXMC_NWE
Remap: USART1_TX
VSS_10
120
Default: VSS_10
VDD_10
121
Default: VDD_10
Default: PD6
PD6
122
I/O
5VT
Alternate: EXMC_NWAIT
Remap: USART1_RX
Default: PD7
PD7
123
I/O
5VT
Alternate: EXMC_NE0, EXMC_NCE1
Remap: USART1_CK
PG9
124
I/O
5VT
PG10
125
I/O
5VT
PG11
126
I/O
5VT
PG12
127
I/O
5VT
Default: PG9
Alternate: EXMC_NE1, EXMC_NCE2
Default: PG10
Alternate: EXMC_NCE3_0, EXMC_NE2
Default: PG11
Alternate: EXMC_NCE3_1
Default: PG12
Alternate: EXMC_NE3
29
GD32F103xx Datasheet
Pin
I/O
Type(1)
Level(2)
128
I/O
5VT
PG14
129
I/O
5VT
VSS_11
130
P
Default: VSS_11
VDD_11
131
P
Default: VDD_11
PG15
132
I/O
Pin Name
Pins
PG13
5VT
Functions description
Default: PG13
Alternate: EXMC_A24
Default: PG14
Alternate: EXMC_A25
Default: PG15
Default: JTDO
PB3
133
I/O
5VT
Alternate:SPI2_SCK, I2S2_CK
Remap: PB3, TRACESWO, TIMER1_CH1, SPI0_SCK
Default: NJTRST
PB4
134
I/O
5VT
Alternate: SPI2_MISO
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
PB5
135
Alternate: I2C0_SMBA, SPI2_MOSI, I2S2_SD
I/O
Remap: TIMER2_CH1, SPI0_MOSI
Default: PB6
PB6
136
I/O
5VT
Alternate: I2C0_SCL, TIMER3_CH0
Remap: USART0_TX
Default: PB7
PB7
137
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1, EXMC_NADV
Remap: USART0_RX
BOOT0
138
Default: BOOT0
I
Default: PB8
PB8
139
I/O
5VT
Alternate: TIMER3_CH2, SDIO_D4, TIMER9_CH0(3)
Remap: I2C0_SCL, CAN0_RX
Default: PB9
PB9
140
I/O
5VT
Alternate: TIMER3_CH3, SDIO_D5, TIMER10_CH0(3)
Remap: I2C0_SDA, CAN0_TX
Default: PE0
PE0
141
I/O
5VT
PE1
142
I/O
5VT
VSS_3
143
P
Default: VSS_3
VDD_3
144
P
Default: VDD_3
Alternate: TIMER3_ETI, EXMC_NBL0
Default: PE1
Alternate: EXMC_NBL1
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
(3) Functions are available in GD32F103ZF/G/I/K devices.
30
GD32F103xx Datasheet
2.6.2.
GD32F103Vx LQFP100 pin definitions
Table 2-6. GD32F103Vx LQFP100 pin definitions
Pin
I/O
Type(1)
Level(2)
1
I/O
5VT
PE3
2
I/O
5VT
PE4
3
I/O
5VT
PE5
4
I/O
5VT
Pin Name
Pins
PE2
Functions description
Default: PE2
Alternate: TRACECK(4), EXMC_A23
Default: PE3
Alternate: TRACED0(4), EXMC_A19
Default: PE4
Alternate:TRACED1(4), EXMC_A20
Default: PE5
Alternate:TRACED2(4), EXMC_A21
Remap: TIMER8_CH0(3)
Default: PE6
PE6
5
I/O
5VT
Alternate:TRACED3(4), EXMC_A22
Remap: TIMER8_CH1(3)
VBAT
Default: VBAT
6
P
7
I/O
8
I/O
9
I/O
VSS_5
10
P
Default: VSS_5
VDD_5
11
P
Default: VDD_5
OSCIN
12
I
OSCOUT
13
O
NRST
14
I/O
PC0
15
I/O
PC1
16
I/O
PC2
17
I/O
PC3
18
I/O
VSSA
19
P
Default: VSSA
VREF-
20
P
Default: VREF-
PC13TAMPERRTC
PC14OSC32IN
PC15OSC32OUT
Default: PC13
Alternate: TAMPER-RTC
Default: PC14
Alternate: OSC32IN
Default: PC15
Alternate: OSC32OUT
Default: OSCIN
Remap: PD0
Default: OSCOUT
Remap: PD1
Default: NRST
Default: PC0
Alternate: ADC012_IN10(5)
Default: PC1
Alternate: ADC012_IN11(5)
Default: PC2
Alternate: ADC012_IN12(5)
Default: PC3
Alternate: ADC012_IN13(5)
31
GD32F103xx Datasheet
Pin
I/O
Type(1)
Level(2)
Pin Name
Pins
Functions description
VREF+
21
P
Default: VREF+
VDDA
22
P
Default: VDDA
Default: PA0
PA0-WKUP
23
I/O
Alternate: WKUP, USART1_CTS, ADC012_IN0(5),
TIMER1_CH0, TIMER1_ETI, TIMER4_CH0(4),
TIMER7_ETI(4)
Default: PA1
PA1
24
I/O
Alternate: USART1_RTS, ADC012_IN1(5), TIMER1_CH1,
TIMER4_CH1(4)
Default: PA2
PA2
25
I/O
Alternate: USART1_TX, ADC012_IN2(5), TIMER1_CH2,
TIMER4_CH2(4), TIMER8_CH0(3)
Default: PA3
PA3
26
I/O
Alternate: USART1_RX, ADC012_IN3(5), TIMER1_CH3,
TIMER4_CH3(4), TIMER8_CH1(3)
VSS_4
27
P
Default: VSS_4
VDD_4
28
P
Default: VDD_4
Default: PA4
PA4
29
I/O
Alternate: SPI0_NSS, USART1_CK, ADC01_IN4,
DAC_OUT0(4)
Remap:SPI2_NSS(4), I2S2_WS(4)
PA5
30
I/O
Default: PA5
Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1(4)
Default: PA6
PA6
31
I/O
Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0,
TIMER7_BRKIN(4), TIMER12_CH0(3)
Remap: TIMER0_BRKIN
Default: PA7
PA7
32
I/O
Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1,
TIMER7_CH0_ON(4), TIMER13_CH0(3)
Remap: TIMER0_CH0_ON
PC4
33
I/O
PC5
34
I/O
Default: PC4
Alternate: ADC01_IN14
Default: PC5
Alternate: ADC01_IN15
Default: PB0
PB0
35
I/O
Alternate: ADC01_IN8, TIMER2_CH2,
TIMER7_CH1_ON(4)
Remap: TIMER0_CH1_ON
Default: PB1
PB1
36
I/O
Alternate: ADC01_IN9, TIMER2_CH3,
TIMER7_CH2_ON(4)
32
GD32F103xx Datasheet
Pin Name
Pins
PB2
37
Pin
I/O
Type(1)
Level(2)
I/O
5VT
Functions description
Remap: TIMER0_CH2_ON
Default: PB2, BOOT1
Default: PE7
PE7
38
I/O
5VT
Alternate: EXMC_D4
Remap: TIMER0_ETI
Default: PE8
PE8
39
I/O
5VT
Alternate: EXMC_D5
Remap: TIMER0_CH0_ON
Default: PE9
PE9
40
I/O
5VT
Alternate: EXMC_D6
Remap: TIMER0_CH0
VSS_7
-
P
Default: VSS_7
VDD_7
-
P
Default: VDD_7
PE10
41
I/O
Default: PE10
5VT
Alternate: EXMC_D7
Remap: TIMER0_CH1_ON
Default: PE11
PE11
42
I/O
5VT
Alternate: EXMC_D8
Remap: TIMER0_CH1
Default: PE12
PE12
43
I/O
5VT
Alternate: EXMC_D9
Remap: TIMER0_CH2_ON
Default: PE13
PE13
44
I/O
5VT
Alternate: EXMC_D10
Remap: TIMER0_CH2
Default: PE14
PE14
45
I/O
5VT
Alternate: EXMC_D11
Remap: TIMER0_CH3
Default: PE15
PE15
46
I/O
5VT
Alternate: EXMC_D12
Remap: TIMER0_BRKIN
Default: PB10
PB10
47
I/O
5VT
Alternate: I2C1_SCL, USART2_TX
Remap: TIMER1_CH2
Default: PB11
PB11
48
I/O
5VT
Alternate: I2C1_SDA, USART2_RX
Remap: TIMER1_CH3
VSS_1
49
P
Default: VSS_1
VDD_1
50
P
Default: VDD_1
Default: PB12
PB12
51
I/O
5VT
Alternate: SPI1_NSS, I2C1_SMBA, USART2_CK,
TIMER0_BRKIN, I2S1_WS(4)
33
GD32F103xx Datasheet
Pin Name
Pins
PB13
52
Pin
I/O
Type(1)
Level(2)
I/O
5VT
Functions description
Default: PB13
Alternate: SPI1_SCK, USART2_CTS, TIMER0_CH0_ON,
I2S1_CK(4)
Default: PB14
PB14
53
I/O
5VT
Alternate: SPI1_MISO, USART2_RTS,
TIMER0_CH1_ON, TIMER11_CH0(3)
Default: PB15
PB15
54
I/O
5VT
Alternate: SPI1_MOSI, TIMER0_CH2_ON, I2S1_SD(4),
TIMER11_CH1(3)
Default: PD8
PD8
55
I/O
5VT
Alternate: EXMC_D13
Remap: USART2_TX
Default: PD9
PD9
56
I/O
5VT
Alternate: EXMC_D14
Remap: USART2_RX
Default: PD10
PD10
57
I/O
5VT
Alternate: EXMC_D15
Remap: USART2_CK
Default: PD11
PD11
58
I/O
5VT
Alternate: EXMC_A16/EXMC_CLE
Remap: USART2_CTS
Default: PD12
PD12
59
I/O
5VT
Alternate: EXMC_A17/EXMC_ALE
Remap: TIMER3_CH0, USART2_RTS
Default: PD13
PD13
60
I/O
5VT
Alternate: EXMC_A18
Remap: TIMER3_CH1
Default: PD14
PD14
61
I/O
5VT
Alternate: EXMC_D0
Remap: TIMER3_CH2
Default: PD15
PD15
62
I/O
5VT
Alternate: EXMC_D1
Remap: TIMER3_CH3
Default: PC6
PC6
63
I/O
5VT
Alternate: I2S1_MCK(4), TIMER7_CH0(4), SDIO_D6(4)
Remap: TIMER2_CH0
Default: PC7
PC7
64
I/O
5VT
Alternate: I2S2_MCK(4), TIMER7_CH1(4), SDIO_D7(4)
Remap: TIMER2_CH1
Default: PC8
PC8
65
I/O
5VT
Alternate: TIMER7_CH2(4), SDIO_D0(4)
Remap: TIMER2_CH2
34
GD32F103xx Datasheet
Pin Name
Pins
PC9
66
Pin
I/O
Type(1)
Level(2)
I/O
5VT
Functions description
Default: PC9
Alternate: TIMER7_CH3(4), SDIO_D1(4)
Remap: TIMER2_CH3
PA8
67
I/O
5VT
PA9
68
I/O
5VT
PA10
69
I/O
5VT
PA11
70
I/O
5VT
Default: PA8
Alternate: USART0_CK, TIMER0_CH0, CK_OUT0
Default: PA9
Alternate: USART0_TX, TIMER0_CH1
Default: PA10
Alternate: USART0_RX, TIMER0_CH2
Default: PA11
Alternate: USART0_CTS, CAN0_RX, USBDM,
TIMER0_CH3
Default: PA12
PA12
71
I/O
5VT
Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI,
USBDP
I/O
5VT
Default: JTMS, SWDIO
PA13
72
NC
73
VSS_2
74
P
Default: VSS_2
VDD_2
75
P
Default: VDD_2
PA14
76
I/O
5VT
PA15
77
I/O
5VT
Remap: PA13
-
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
Alternate: SPI2_NSS(4), I2S2_WS(4)
Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS
Default: PC10
PC10
78
I/O
5VT
Alternate: UART3_TX(4), SDIO_D2(4)
Remap: USART2_TX, SPI2_SCK(4), I2S2_CK(4)
Default: PC11
PC11
79
I/O
5VT
Alternate: UART3_RX(4), SDIO_D3(4)
Remap: USART2_RX, SPI2_MISO(4)
Default: PC12
PC12
80
I/O
5VT
Alternate: UART4_TX(4), SDIO_CK(4)
Remap: USART2_CK, SPI2_MOSI(4), I2S2_SD(4)
Default: PD0
PD0
81
I/O
5VT
Alternate: EXMC_D2
Remap: CAN0_RX
Default: PD1
PD1
82
I/O
5VT
Alternate: EXMC_D3
Remap: CAN0_TX
PD2
83
I/O
5VT
Default: PD2
Alternate: TIMER2_ETI, SDIO_CMD(4), UART4_RX(4)
35
GD32F103xx Datasheet
Pin Name
Pins
PD3
84
Pin
I/O
Type(1)
Level(2)
I/O
5VT
Functions description
Default: PD3
Alternate: EXMC_CLK
Remap: USART1_CTS
Default: PD4
PD4
85
I/O
5VT
Alternate: EXMC_NOE
Remap: USART1_RTS
Default: PD5
PD5
86
I/O
5VT
Alternate: EXMC_NWE
Remap: USART1_TX
Default: PD6
PD6
87
I/O
5VT
Alternate: EXMC_NWAIT
Remap: USART1_RX
Default: PD7
PD7
88
I/O
5VT
Alternate: EXMC_NE0, EXMC_NCE1
Remap: USART1_CK
Default: JTDO
PB3
89
I/O
5VT
Alternate:SPI2_SCK(4), I2S2_CK(4)
Remap: PB3, TRACESWO(4), TIMER1_CH1, SPI0_SCK
Default: NJTRST
PB4
90
I/O
5VT
Alternate: SPI2_MISO(4)
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
PB5
91
Alternate: I2C0_SMBA, SPI2_MOSI(4), I2S2_SD(4)
I/O
Remap: TIMER2_CH1, SPI0_MOSI
Default: PB6
PB6
92
I/O
5VT
Alternate: I2C0_SCL, TIMER3_CH0
Remap: USART0_TX
Default: PB7
PB7
93
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1, EXMC_NADV
Remap: USART0_RX
BOOT0
94
I
PB8
95
I/O
Default: BOOT0
Default: PB8
5VT
Alternate: TIMER3_CH2, SDIO_D4(4), TIMER9_CH0(3)
Remap: I2C0_SCL, CAN0_RX
Default: PB9
PB9
96
I/O
5VT
Alternate: TIMER3_CH3, SDIO_D5(4), TIMER10_CH0(3)
Remap: I2C0_SDA, CAN0_TX
PE0
97
I/O
5VT
PE1
98
I/O
5VT
VSS_3
99
P
Default: PE0
Alternate: TIMER3_ETI, EXMC_NBL0
Default: PE1
Alternate: EXMC_NBL1
Default: VSS_3
36
GD32F103xx Datasheet
Pin Name
Pins
VDD_3
100
Pin
I/O
Type(1)
Level(2)
P
Functions description
Default: VDD_3
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
(3) Functions are available in GD32F103VF/G/I/K devices.
(4) Functions are available in GD32F103VC/D/E/F/G/I/K devices.
(5) ADC2 functions are available in GD32F103VC/D/E/F/G/I/K devices.
37
GD32F103xx Datasheet
2.6.3.
GD32F103Rx LQFP64 pin definitions
Table 2-7. GD32F103Rx LQFP64 pin definitions
Pin
I/O
Type(1)
Level(2)
Pin Name
Pins
VBAT
1
P
2
I/O
3
I/O
4
I/O
OSCIN
5
I
Default: OSCIN
OSCOUT
6
O
Default: OSCOUT
NRST
7
I/O
Default: NRST
PC0
8
I/O
PC1
9
I/O
PC2
10
I/O
PC3
11
I/O
VSSA
12
P
Default: VSSA
VDDA
13
P
Default: VDDA
PC13TAMPERRTC
PC14OSC32IN
PC15OSC32OUT
Functions description
Default: VBAT
Default: PC13
Alternate: TAMPER-RTC
Default: PC14
Alternate: OSC32IN
Default: PC15
Alternate: OSC32OUT
Default: PC0
Alternate: ADC012_IN10(5)
Default: PC1
Alternate: ADC012_IN11(5)
Default: PC2
Alternate: ADC012_IN12(5)
Default: PC3
Alternate: ADC012_IN13(5)
Default: PA0
PA0-WKUP
14
I/O
Alternate: WKUP, USART1_CTS, ADC012_IN0(5),
TIMER1_CH0, TIMER1_ETI, TIMER4_CH0(4),
TIMER7_ETI(4)
Default: PA1
PA1
15
I/O
Alternate: USART1_RTS, ADC012_IN1(5), TIMER1_CH1,
TIMER4_CH1(4)
Default: PA2
PA2
16
I/O
Alternate: USART1_TX, ADC012_IN2(5), TIMER1_CH2,
TIMER4_CH2(4), TIMER8_CH0(3)
Default: PA3
PA3
17
I/O
Alternate: USART1_RX, ADC012_IN3(5), TIMER1_CH3,
TIMER4_CH3(4), TIMER8_CH1(3)
P
Default: VSS_4
19
P
Default: VDD_4
20
I/O
Default: PA4
VSS_4
18
VDD_4
PA4
38
GD32F103xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1)
Level(2)
Functions description
Alternate: SPI0_NSS, USART1_CK, ADC01_IN4,
DAC_OUT0(4)
Remap:SPI2_NSS(4), I2S2_WS(4)
PA5
21
Default: PA5
I/O
Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1(4)
Default: PA6
PA6
22
Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0,
I/O
TIMER7_BRKIN(4), TIMER12_CH0(3)
Remap: TIMER0_BRKIN
Default: PA7
PA7
23
Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1,
I/O
TIMER7_CH0_ON(4), TIMER13_CH0(3)
Remap: TIMER0_CH0_ON
PC4
24
I/O
PC5
25
I/O
PB0
26
I/O
Default: PC4
Alternate: ADC01_IN14
Default: PC5
Alternate: ADC01_IN15
Default: PB0
Alternate: ADC01_IN8, TIMER2_CH2, TIMER7_CH1_ON(4)
Remap: TIMER0_CH1_ON
Default: PB1
PB1
27
Alternate: ADC01_IN9, TIMER2_CH3, TIMER7_CH2_ON(4)
I/O
Remap: TIMER0_CH2_ON
PB2
28
I/O
5VT
Default: PB2, BOOT1
Default: PB10
PB10
29
I/O
5VT
Alternate: I2C1_SCL(6), USART2_TX(6)
Remap: TIMER1_CH2
Default: PB11
5VT
Alternate: I2C1_SDA(6), USART2_RX(6)
PB11
30
I/O
VSS_1
31
P
Default: VSS_1
VDD_1
32
P
Default: VDD_1
PB12
33
I/O
Remap: TIMER1_CH3
Default: PB12
5VT
Alternate: SPI1_NSS(6), I2C1_SMBA(6), USART2_CK(6),
TIMER0_BRKIN, I2S1_WS(4)
Default: PB13
PB13
34
I/O
5VT
Alternate: SPI1_SCK(6), USART2_CTS(6),
TIMER0_CH0_ON, I2S1_CK(4)
Default: PB14
PB14
35
I/O
5VT
Alternate: SPI1_MISO(6), USART2_RTS(6),
TIMER0_CH1_ON, TIMER11_CH0(3)
PB15
36
I/O
5VT
Default: PB15
39
GD32F103xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1)
Level(2)
Functions description
Alternate: SPI1_MOSI(6), TIMER0_CH2_ON, I2S1_SD(4),
TIMER11_CH1(3)
Default: PC6
PC6
37
I/O
5VT
Alternate: I2S1_MCK(4), TIMER7_CH0(4), SDIO_D6(4)
Remap: TIMER2_CH0
Default: PC7
PC7
38
I/O
5VT
Alternate: I2S2_MCK(4), TIMER7_CH1(4), SDIO_D7(4)
Remap: TIMER2_CH1
Default: PC8
PC8
39
I/O
5VT
Alternate: TIMER7_CH2(4), SDIO_D0(4)
Remap: TIMER2_CH2
Default: PC9
PC9
40
I/O
5VT
Alternate: TIMER7_CH3(4), SDIO_D1(4)
Remap: TIMER2_CH3
PA8
41
I/O
5VT
PA9
42
I/O
5VT
PA10
43
I/O
5VT
PA11
44
I/O
5VT
Default: PA8
Alternate: USART0_CK, TIMER0_CH0, CK_OUT0
Default: PA9
Alternate: USART0_TX, TIMER0_CH1
Default: PA10
Alternate: USART0_RX, TIMER0_CH2
Default: PA11
Alternate: USART0_CTS, CAN0_RX, USBDM,
TIMER0_CH3
Default: PA12
PA12
45
I/O
5VT
Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI,
USBDP
5VT
Default: JTMS, SWDIO
PA13
46
I/O
VSS_2
47
P
Default: VSS_2
VDD_2
48
P
Default: VDD_2
PA14
49
I/O
5VT
PA15
50
I/O
5VT
Remap: PA13
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
Alternate: SPI2_NSS(4), I2S2_WS(4)
Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS
Default: PC10
PC10
51
I/O
5VT
Alternate: UART3_TX(4), SDIO_D2(4)
Remap: USART2_TX(6), SPI2_SCK(4), I2S2_CK(4)
Default: PC11
PC11
52
I/O
5VT
Alternate: UART3_RX(4), SDIO_D3(4)
Remap: USART2_RX(6), SPI2_MISO(4)
PC12
53
I/O
5VT
Default: PC12
40
GD32F103xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1)
Level(2)
Functions description
Alternate: UART4_TX(4), SDIO_CK(4)
Remap: USART2_CK(6), SPI2_MOSI(4), I2S2_SD(4)
PD2
54
I/O
5VT
PB3
55
I/O
5VT
Default: PD2
Alternate: TIMER2_ETI, SDIO_CMD(4), UART4_RX(4)
Default: JTDO
Alternate:SPI2_SCK(4), I2S2_CK(4)
Remap: PB3, TRACESWO(4), TIMER1_CH1, SPI0_SCK
Default: NJTRST
PB4
56
I/O
5VT
Alternate: SPI2_MISO(4)
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
PB5
57
Alternate: I2C0_SMBA, SPI2_MOSI(4), I2S2_SD(4)
I/O
Remap: TIMER2_CH1, SPI0_MOSI
Default: PB6
PB6
58
I/O
5VT
Alternate: I2C0_SCL, TIMER3_CH0(6)
Remap: USART0_TX
Default: PB7
PB7
59
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1(6)
Remap: USART0_RX
BOOT0
60
I
PB8
61
I/O
Default: BOOT0
Default: PB8
5VT
Alternate: TIMER3_CH2(6), SDIO_D4(4), TIMER9_CH0(3)
Remap: I2C0_SCL, CAN0_RX
Default: PB9
PB9
62
I/O
5VT
Alternate: TIMER3_CH3(6), SDIO_D5(4), TIMER10_CH0(3)
Remap: I2C0_SDA, CAN0_TX
VSS_3
63
P
Default: VSS_3
VDD_3
64
P
Default: VDD_3
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
(3) Functions are available in GD32F103RF/G/I/K devices.
(4) Functions are available in GD32F103RC/D/E/F/G/I/K devices.
(5) ADC2 functions are available in GD32F103RC/D/E/F/G/I/K devices.
(6) Functions are available in GD32F103R8/B/C/D/E/F/G/I/K devices.
41
GD32F103xx Datasheet
2.6.4.
GD32F103Cx LQFP48 pin definitions
Table 2-8. GD32F103Cx LQFP48 pin definitions
Pin
I/O
Type(1)
Level(2)
Pin Name
Pins
VBAT
1
P
2
I/O
3
I/O
4
I/O
OSCIN
5
I
Default: OSCIN
OSCOUT
6
O
Default: OSCOUT
NRST
7
I/O
Default: NRST
VSSA
8
P
Default: VSSA
VDDA
9
P
Default: VDDA
PC13TAMPERRTC
PC14OSC32IN
PC15OSC32OUT
Functions description
Default: VBAT
Default: PC13
Alternate: TAMPER-RTC
Default: PC14
Alternate: OSC32IN
Default: PC15
Alternate: OSC32OUT
Default: PA0
PA0-WKUP
10
I/O
Alternate: WKUP, USART1_CTS, ADC012_IN0(3),
TIMER1_CH0, TIMER1_ETI, TIMER4_CH0
PA1
11
I/O
PA2
12
I/O
PA3
13
I/O
PA4
14
I/O
PA5
15
I/O
Default: PA1
Alternate: USART1_RTS, ADC012_IN1(3), TIMER1_CH1
Default: PA2
Alternate: USART1_TX, ADC012_IN2(3), TIMER1_CH2
Default: PA3
Alternate: USART1_RX, ADC012_IN3(3), TIMER1_CH3
Default: PA4
Alternate: SPI0_NSS, USART1_CK, ADC01_IN4
Default: PA5
Alternate: SPI0_SCK, ADC01_IN5
Default: PA6
PA6
16
I/O
Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0
Remap: TIMER0_BRKIN
Default: PA7
PA7
17
I/O
Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1
Remap: TIMER0_CH0_ON
Default: PB0
PB0
18
I/O
Alternate: ADC01_IN8, TIMER2_CH2
Remap: TIMER0_CH1_ON
Default: PB1
PB1
19
I/O
Alternate: ADC01_IN9, TIMER2_CH3
Remap: TIMER0_CH2_ON
42
GD32F103xx Datasheet
Pin Name
Pins
PB2
20
Pin
I/O
Type(1)
Level(2)
I/O
5VT
Functions description
Default: PB2, BOOT1
Default: PB10
PB10
21
I/O
5VT
Alternate: I2C1_SCL(4), USART2_TX(4)
Remap: TIMER1_CH2
Default: PB11
PB11
22
I/O
5VT
Alternate: I2C1_SDA(4), USART2_RX(4)
Remap: TIMER1_CH3
VSS_1
23
P
Default: VSS_1
VDD_1
24
P
Default: VDD_1
Default: PB12
PB12
25
I/O
5VT
Alternate: SPI1_NSS(4), I2C1_SMBA(4), USART2_CK(4),
TIMER0_BRKIN
Default: PB13
PB13
26
I/O
5VT
Alternate: SPI1_SCK(4), USART2_CTS(4),
TIMER0_CH0_ON
Default: PB14
PB14
27
I/O
5VT
Alternate: SPI1_MISO(4), USART2_RTS(4),
TIMER0_CH1_ON
PB15
28
I/O
5VT
PA8
29
I/O
5VT
PA9
30
I/O
5VT
PA10
31
I/O
5VT
PA11
32
I/O
5VT
Default: PB15
Alternate: SPI1_MOSI(4), TIMER0_CH2_ON
Default: PA8
Alternate: USART0_CK, TIMER0_CH0, CK_OUT0
Default: PA9
Alternate: USART0_TX, TIMER0_CH1
Default: PA10
Alternate: USART0_RX, TIMER0_CH2
Default: PA11
Alternate: USART0_CTS, CAN0_RX, USBDM,
TIMER0_CH3
Default: PA12
PA12
33
I/O
5VT
Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI,
USBDP
5VT
Default: JTMS, SWDIO
PA13
34
I/O
VSS_2
35
P
Default: VSS_2
VDD_2
36
P
Default: VDD_2
PA14
37
I/O
5VT
PA15
38
I/O
5VT
PB3
39
I/O
5VT
Remap: PA13
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS
Default: JTDO
Remap: PB3, TIMER1_CH1, SPI0_SCK
43
GD32F103xx Datasheet
Pin
I/O
Type(1)
Level(2)
40
I/O
5VT
41
I/O
Pin Name
Pins
PB4
PB5
Functions description
Default: NJTRST
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
Alternate: I2C0_SMBA
Remap: TIMER2_CH1, SPI0_MOSI
Default: PB6
PB6
42
I/O
5VT
Alternate: I2C0_SCL, TIMER3_CH0(4)
Remap: USART0_TX
Default: PB7
PB7
43
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1(4)
Remap: USART0_RX
BOOT0
44
Default: BOOT0
I
Default: PB8
PB8
45
I/O
5VT
Alternate: TIMER3_CH2(4)
Remap: I2C0_SCL, CAN0_RX
Default: PB9
PB9
46
I/O
5VT
Alternate: TIMER3_CH3(4)
Remap: I2C0_SDA, CAN0_TX
VSS_3
47
P
Default: VSS_3
VDD_3
48
P
Default: VDD_3
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
(3) ADC2 functions are not available in GD32F103C4/6/8/B devices.
(4) Functions are available in GD32F103C8/B devices.
44
GD32F103xx Datasheet
2.6.5.
GD32F103Tx QFN36 pin definitions
Table 2-9. GD32F103Tx QFN36 pin definitions
Pin
I/O
Type(1)
Level(2)
Pin Name
Pins
Functions description
OSCIN
2
I
Default: OSCIN
OSCOUT
3
O
Default: OSCOUT
NRST
4
I/O
Default: NRST
VSSA
5
P
Default: VSSA
VDDA
6
P
Default: VDDA
PA0-WKUP
7
I/O
Default: PA0
Alternate: WKUP, USART1_CTS, ADC012_IN0(3),
TIMER1_CH0, TIMER1_ETI
PA1
8
I/O
PA2
9
I/O
PA3
10
I/O
PA4
11
I/O
PA5
12
I/O
PA6
13
I/O
Default: PA1
Alternate: USART1_RTS, ADC012_IN1(3), TIMER1_CH1
Default: PA2
Alternate: USART1_TX, ADC012_IN2(3), TIMER1_CH2
Default: PA3
Alternate: USART1_RX, ADC012_IN3(3), TIMER1_CH3
Default: PA4
Alternate: SPI0_NSS, USART1_CK, ADC01_IN4
Default: PA5
Alternate: SPI0_SCK, ADC01_IN5
Default: PA6
Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0
Remap: TIMER0_BRKIN
Default: PA7
PA7
14
Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1
I/O
Remap: TIMER0_CH0_ON
Default: PB0
PB0
15
Alternate: ADC01_IN8, TIMER2_CH2
I/O
Remap: TIMER0_CH1_ON
Default: PB1
Alternate: ADC01_IN9, TIMER2_CH3
PB1
16
I/O
PB2
17
I/O
VSS_1
18
P
Default: VSS_1
VDD_1
19
P
Default: VDD_1
PA8
20
I/O
5VT
PA9
21
I/O
5VT
PA10
22
I/O
5VT
Remap: TIMER0_CH2_ON
5VT
Default: PB2, BOOT1
Default: PA8
Alternate: USART0_CK, TIMER0_CH0, CK_OUT0
Default: PA9
Alternate: USART0_TX, TIMER0_CH1
Default: PA10
45
GD32F103xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1)
Level(2)
Functions description
Alternate: USART0_RX, TIMER0_CH2
Default: PA11
PA11
23
I/O
5VT
PA12
24
I/O
5VT
PA13
25
I/O
5VT
VSS_2
26
P
Default: VSS_2
VDD_2
27
P
Default: VDD_2
PA14
28
I/O
5VT
PA15
29
I/O
5VT
PB3
30
I/O
5VT
PB4
31
I/O
5VT
PB5
32
I/O
Alternate: USART0_CTS, CAN0_RX, USBDM, TIMER0_CH3
Default: PA12
Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI, USBDP
Default: JTMS, SWDIO
Remap: PA13
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS
Default: JTDO
Remap: PB3, TIMER1_CH1, SPI0_SCK
Default: NJTRST
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
Alternate: I2C0_SMBA
Remap: TIMER2_CH1, SPI0_MOSI
Default: PB6
PB6
33
I/O
5VT
Alternate: I2C0_SCL, TIMER3_CH0(4)
Remap: USART0_TX
Default: PB7
PB7
34
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1(4)
Remap: USART0_RX
BOOT0
35
I
Default: BOOT0
VSS_3
36
P
Default: VSS_3
VDD_3
1
P
Default: VDD_3
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
(3) ADC2 functions are not available in GD32F103T4/6/8/B devices.
(4) Functions are available in GD32F103T8/B devices.
46
GD32F103xx Datasheet
3.
Functional description
3.1.
Arm® Cortex®-M3 core
The Cortex®-M3 processor is the latest generation of Arm® processors for embedded systems.
It has been developed to provide a low-cost platform that meets the needs of MCU
implementation, with a reduced pin count and low-power consumption, while delivering
outstanding computational performance and an advanced system response to interrupts.
32-bit Arm® Cortex®-M3 processor core
Up to 108 MHz operation frequency
Single-cycle multiplication and hardware divider
Integrated Nested Vectored Interrupt Controller (NVIC)
24-bit SysTick timer
The Cortex®-M3 processor is based on the ARMv7 architecture and supports both Thumb
and Thumb-2 instruction sets. Some system peripherals listed below are also provided by
Cortex®-M3:
Internal Bus Matrix connected with I-Code bus, D-Code bus, System bus, Private
Peripheral Bus (PPB) and debug accesses.
3.2.
Nested Vectored Interrupt Controller (NVIC).
Flash Patch and Breakpoint (FPB).
Data Watchpoint and Trace (DWT).
Instrumentation Trace Macrocell (ITM).
Embedded Trace Macrocell (ETM).
Serial Wire JTAG Debug Port (SWJ-DP).
Trace Port Interface Unit (TPIU).
Memory Protection Unit (MPU).
On-chip memory
Up to 3072 Kbytes of Flash memory
The region of the MCU executing instructions without waiting time is up to 256K bytes ( in
case that Flash size less than or equal to 256K, all memory is no waiting time). A long
delay when CPU fetches the instructions out of the range.
Up to 96 Kbytes of SRAM
The Arm® Cortex®-M3 processor is structured in Harvard architecture which can use separate
buses to fetch instructions and load/store data. 3072 Kbytes of inner Flash at most, which
includes code Flash and data Flash, is available for storing programs and data, and there is
no waiting time within code Flash area when CPU executes instructions. The Table 2-4.
GD32F103xx memory map shows the memory map of the GD32F103xx series of devices,
including code, SRAM, peripheral, and other pre-defined regions.
47
GD32F103xx Datasheet
3.3.
Clock, reset and supply management
Internal 8 MHz factory-trimmed RC and external 4 to 16 MHz crystal oscillator
Internal 40 KHz RC calibrated oscillator and external 32.768 KHz crystal oscillator
Integrated system clock PLL
2.6 to 3.6 V application supply and I/Os
Supply Supervisor: POR (Power On Reset), PDR (Power Down Reset), and low voltage
detector (LVD)
The Clock Control unit provides a range of frequencies and clock functions. These include an
Internal 8M RC oscillator (IRC8M), a High Speed crystal oscillator (HXTAL), a Low Speed
Internal 40K RC oscillator (IRC40K), a Low Speed crystal oscillator (LXTAL), a Phase Lock
Loop (PLL), a HXTAL clock monitor, clock prescalers, clock multiplexers and clock gating
circuitry. The frequency of AHB, APB2 and the APB1 domains can be configured by each
prescaler. The maximum frequency of the AHB, APB2 and APB1 domains is 108 MHz/108
MHz/54 MHz. See Figure 2-8. GD32F103xx clock tree for details.
GD32F10x Reset Control includes the control of three kinds of reset: power reset, system
reset and backup domain reset. The system reset resets the processor core and peripheral
IP components except for the SW-DP controller and the Backup domain. Power-on reset
(POR) and power-down reset (PDR) are always active, and ensures proper operation starting
from/down to 2.6 V. The device remains in reset mode when V DD is below a specified
threshold. The embedded low voltage detector (LVD) monitors the power supply, compares
it to the voltage threshold and generates an interrupt as a warning message for leading the
MCU into security.
Power supply schemes:
VDD range: 2.6 to 3.6 V, external power supply for I/Os and the internal regulator.
Provided externally through VDD pins.
VSSA, VDDA range: 2.6 to 3.6 V, external analog power supplies for ADC, reset blocks,
RCs and PLL. VDDA and VSSA must be connected to VDD and VSS, respectively.
VBAT range: 1.8 to 3.6 V, power supply for RTC, external clock 32 KHz oscillator and
backup registers (through power switch) when VDD is not present.
3.4.
Boot modes
At startup, boot pins are used to select one of three boot options:
Boot from main flash memory (default)
Boot from system memory
Boot from on-chip SRAM
The boot loader is located in the internal boot ROM memory (system memory). It is used to
reprogram the Flash memory by using USART0 (PA9 and PA10), if devices are
GD32F103xF/G/I/K, USART1 (PA2 and PA3) is also available for boot functions. It also can
48
GD32F103xx Datasheet
be used to transfer and update the Flash memory code, the data and the vector table sections.
In default condition, boot from bank 0 of Flash memory is selected. It also supports to boot
from bank 1 of Flash memory by setting a bit in option bytes.
49
GD32F103xx Datasheet
3.5.
Power saving modes
The MCU supports three kinds of power saving modes to achieve even lower power
consumption. They are sleep mode, deep-sleep mode, and standby mode. These operating
modes reduce the power consumption and allow the application to achieve the best balance
between the CPU operating time, speed and power consumption.
Sleep mode
In sleep mode, only clock of Cortex®-M3 is off. All peripherals continue to operate and
any interrupt/event can wake up the system.
Deep-sleep mode
In deep-sleep mode, all clocks in the 1.2V domain are off, and all of IRC8M, HXTAL and
PLLs are disabled. Only the contents of SRAM and registers are retained. Any interrupt
or wakeup event from EXTI lines can wake up the system from the deep-sleep mode
including the 16 external lines, the RTC alarm, the LVD output, USB Wakeup and Ethernet
Wakeup. When exiting the deep-sleep mode, the IRC8M is selected as the system clock.
Standby mode
In standby mode, the whole 1.2V domain is power off, the LDO is shut down, and all of
IRC8M, HXTAL and PLL are disabled. The contents of SRAM and registers (except
Backup registers) are lost. There are four wakeup sources for the Standby mode,
including the external reset from NRST pin, the RTC alarm, the FWDGT reset, and the
rising edge on WKUP pin.
3.6.
Analog to digital converter (ADC)
12-bit SAR ADC
Up to 1 MSPS for 12-bit resolution
Analog input signal voltage range: VSSA to VDDA (2.6 to 3.6 V)
Temperature sensor
Up to three 12-bit multi-channel ADCs are integrated in the device. Each has a total of up to
21 multiplexed external channels. An analog watchdog block can be used to detect the
channels, which are required to remain within a specific threshold window. A configurable
channel management block of analog inputs also can be used to perform conversions in
single, continuous, scan or discontinuous mode.
The ADCs can be triggered from the events generated by the general level 0 timers (TIMERx)
or the advanced timers (TIMER0 and TIMER7) with internal connection. The temperature
sensor generates a voltage that varies linearly with temperature. The analog supply voltage
VDDA can vary from 2.6 V to 3.6 V. The output voltage of temperature sensor is internally
connected to the ADC_IN16 input channel.
To ensure a high accuracy on ADC and DAC, the ADC/DAC independent external reference
voltage should be connected to VREF+/VREF- pins. According to the different packages, VREF+
50
GD32F103xx Datasheet
pin can be connected to VDDA pin, or external reference voltage, VREF- pin must be connected
to VSSA pin. The VREF+ pin is only available on no less than 100-pin packages. On less than
100-pin packages, the VREF+ pin is not available and it is internally connected to VDDA. The
VREF- pin is internally connected to VSSA.
3.7.
Digital to analog converter (DAC)
Two 12-bit DACs with independent output channels
8-bit or 12-bit mode in conjunction with the DMA controller
The two 12-bit buffered DACs are used to generate variable analog outputs. The DAC
channels can be triggered by the timer or EXTI with DMA support. In dual DAC channel
operation, conversions could be done independently or simultaneously. The maximum output
value of the DAC is VREF+.
3.8.
DMA
7 channel DMA0 controller and 5 channel DMA1 controller
Peripherals supported: Timers, ADC, SPIs, I2Cs, USARTs, DAC, I2S and SDIO
The direct memory access (DMA) controllers provide a hardware method of transferring data
between peripherals and/or memory without intervention from the CPU, thereby freeing up
bandwidth for other system functions. Three types of access method are supported:
peripheral to memory, memory to peripheral, memory to memory.
Each channel is connected to fixed hardware DMA requests. The priorities of DMA channel
requests are determined by software configuration and hardware channel number. Transfer
size of source and destination are independent and configurable.
3.9.
General-purpose inputs/outputs (GPIOs)
Up to 112 fast GPIOs, all mappable on 16 external interrupt lines
Analog input/output configurable
Alternate function input/output configurable
There are up to 112 general purpose I/O pins (GPIO), named PA0 ~ PA15, PB0 ~ PB15, PC0
~ PC15, PD0 ~ PD15, PE0 ~ PE15, PF0 ~ PF15 and PG0 ~ PG15 for the device to implement
logic input/output functions. Each GPIO port has related control and configuration registers to
satisfy the requirements of specific applications. The external interrupt on the GPIO pins of
the device have related control and configuration registers in the Interrupt/event Controller
Unit (EXTI). The GPIO ports are pin-shared with other alternative functions (AFs) to obtain
maximum flexibility on the package pins. The GPIO pins can be used as alternative functional
pins by configuring the corresponding registers regardless of the AF input or output pins. Each
51
GD32F103xx Datasheet
of the GPIO pins can be configured by software as output (push-pull or open-drain), input,
peripheral alternate function or analog mode. Each GPIO pin can be configured as pull-up,
pull-down or no pull-up/pull-down. All GPIOs are high-current capable except for analog mode.
3.10.
Timers and PWM generation
Up to two 16-bit advanced timer (TIMER0 & TIMER7), ten 16-bit general timers, and two
16-bit basic timer (TIMER5 & TIMER6)
Up to 4 independent channels of PWM, output compare or input capture for each and
external trigger input
16-bit, motor control PWM advanced timer with programmable dead-time generation for
output match
Encoder interface controller with two inputs using quadrature decoder
24-bit SysTick timer down counter
2 watchdog timers (Free watchdog timer and window watchdog timer)
The advanced timer (TIMER0 & TIMER7) can be seen as a three-phase PWM multiplexed
on 6 channels. It has complementary PWM outputs with programmable dead-time generation.
It can also be used as a complete general timer. The 6 independent channels can be used
for
Input capture
Output compare
PWM generation (edge-aligned or center-aligned counting modes)
Single pulse mode output
If configured as a general 16-bit timer, it can be synchronized with external signals or to
interconnect with other general timers together which have the same architecture and
features.
The general timer, known as TIMER1 ~ TIMER4, TIMER8 ~ TIMER10, TIMER11 ~ TIMER13
can be used for a variety of purposes including general timer, input signal pulse width
measurement or output waveform generation such as a single pulse generation or PWM
output, up to 4 independent channels for input capture/output compare. The general timer
also supports an encoder interface with two inputs using quadrature decoder.
The basic timer, known as TIMER5 and TIMER6 are mainly used for DAC trigger generation.
They can also be used as a simple 16-bit time base.
The GD32F103xx have two watchdog peripherals, free watchdog timer and window watchdog
timer. They offer a combination of high safety level, flexibility of use and timing accuracy.
The free watchdog timer consists of an 8-stage prescaler and a 12-bit down-counter, it is
clocked from an independent 40 KHz internal RC and as it operates independently of the
main clock, it can operate in deep-sleep and standby modes. It can be used either as a
watchdog to reset the device when a problem occurs, or as a free-running timer for application
52
GD32F103xx Datasheet
timeout management.
The window watchdog timer is based on a 7-bit down counter that can be set as free-running.
It can be used as a watchdog to reset the device when a problem occurs. It is clocked from
the main clock. It has an early wakeup interrupt capability and the counter can be frozen in
debug mode.
The SysTick timer is dedicated for OS, but could also be used as a standard down counter.
The features are shown below:
3.11.
A 24-bit down counter
Auto reload capability
Maskable system interrupt generation when the counter reaches 0
Programmable clock source
Real time clock (RTC)
32-bit up-counter with a programmable 20-bit prescaler
Alarm function
Interrupt and wake-up event
The real time clock is an independent timer which provides a set of continuously running
counters which can be used with suitable software to provide a clock calendar function, and
provides an alarm interrupt and an expected interrupt. The RTC features a 32-bit
programmable counter for long-term measurement using the compare register to generate an
alarm. A 20-bit prescaler is used for the time base clock and is by default configured to
generate a time base of 1 second from a clock at 32.768 KHz from external crystal oscillator.
3.12.
Inter-integrated circuit (I2C)
Up to two I2C bus interfaces can support both master and slave mode with a frequency
up to 400 KHz
Provide arbitration function, optional PEC (packet error checking) generation and
checking
Supports 7-bit and 10-bit addressing mode and general call addressing mode
The I2C interface is an internal circuit allowing communication with an external I2C interface
which is an industry standard two line serial interface used for connection to external
hardware. These two serial lines are known as a serial data line (SDA) and a serial clock line
(SCL). The I2C module provides transfer rate of up to 100 KHz in standard mode and up to
400 KHz in fast mode. The I2C module also has an arbitration detect function to prevent the
situation where more than one master attempts to transmit data to the I2C bus at the same
time. A CRC-8 calculator is also provided in I2C interface to perform packet error checking for
I2C data.
53
GD32F103xx Datasheet
3.13.
Serial peripheral interface (SPI)
Up to three SPI interfaces with a frequency of up to 18 MHz
Support both master and slave mode
Hardware CRC calculation and transmit automatic CRC error checking
The SPI interface uses 4 pins, among which are the serial data input and output lines (MISO
& MOSI), the clock line (SCK) and the slave select line (NSS). Both SPIs can be served by
the DMA controller. The SPI interface may be used for a variety of purposes, including simplex
synchronous transfers on two lines with a possible bidirectional data line or reliable
communication using CRC checking.
3.14.
Universal synchronous asynchronous receiver transmitter
(USART)
Up to three USARTs and two UARTs with operating frequency up to 6.75 MHz
Supports both asynchronous and clocked synchronous serial communication modes
IrDA SIR encoder and decoder support
LIN break generation and detection
USARTs support ISO 7816-3 compliant smart card interface
The USART (USART0, USART1 and USART2) and UART (UART3 & UART4) are used to
translate data between parallel and serial interfaces, provides a flexible full duplex data
exchange using synchronous or asynchronous transfer. It is also commonly used for RS-232
standard communication. The USART includes a programmable baud rate generator which
is capable of dividing the system clock to produce a dedicated clock for the USART transmitter
and receiver. The USART also supports DMA function for high speed data communication
except UART4.
3.15.
Inter-IC sound (I2S)
Two I2S bus Interfaces with sampling frequency from 8 KHz to 192 KHz
Support either master or slave mode
The Inter-IC sound (I2S) bus provides a standard communication interface for digital audio
applications by 3-wire serial lines. GD32F103xx contain two I2S-bus interfaces that can be
operated with 16/32 bit resolution in master or slave mode, pin multiplexed with SPI1 and
SPI2. The audio sampling frequency from 8 KHz to 192 KHz is supported with less than 0.5%
accuracy error.
54
GD32F103xx Datasheet
3.16.
Secure digital input and output card interface (SDIO)
Support SD2.0/SDIO2.0/MMC4.2 host interface
The Secure Digital Input and Output Card Interface (SDIO) provides access to external SD
memory cards specifications version 2.0, SDIO card specification version 2.0 and multi-media
card system specification version 4.2 with DMA supported. In addition, this interface is also
compliant with CE-ATA digital protocol rev1.1.
3.17.
Universal serial bus full-speed device (USBD)
One full-speed USB Interface with frequency up to 12 Mbit/s
Internal main PLL for USB CLK compliantly
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between one or
more devices. Full-speed peripheral is compliant with the USB 2.0 specification. The device
controller enables 12 Mbit/s data exchange with a USB Host controller. Transaction formatting
is performed by the hardware, including CRC generation and checking. The status of a
completed USB transfer or error condition is indicated by status registers. An interrupt is also
generated if enabled. The dedicated 48 MHz clock is generated from the internal main PLL
(the clock source must use a HSE crystal oscillator) and the operating frequency divided from
APB1 should be 12 MHz above.
3.18.
Controller area network (CAN)
One CAN2.0B interface with communication frequency up to 1 Mbit/s
Internal main PLL for USB CLK compliantly
Controller area network (CAN) is a method for enabling serial communication in field bus. The
CAN protocol has been used extensively in industrial automation and automotive applications.
It can receive and transmit standard frames with 11-bit identifiers as well as extended frames
with 29-bit identifiers. It has three mailboxes for transmission and two FIFOs of three message
deep for reception. It also provides 14 scalable/configurable identifier filter banks for selecting
the incoming messages needed and discarding the others.
3.19.
External memory controller (EXMC)
Supported external memory: SRAM, PSRAM, ROM and NOR-Flash, NAND Flash and
CF card
Up to 16-bit data bus
Support interface with Motorola 6800 and Intel 8080 type LCD directly
55
GD32F103xx Datasheet
External memory controller (EXMC) is an abbreviation of external memory controller. It is
divided in to several sub-banks for external device support, each sub-bank has its own chip
selection signal but at one time, only one bank can be accessed. The EXMC support code
execution from external memory except NAND Flash and CF card. The EXMC also can be
configured to interface with the most common LCD module of Motorola 6800 and Intel 8080
series and reduce the system cost and complexity.
3.20.
Debug mode
Serial wire JTAG debug port (SWJ-DP)
The Arm® SWJ-DP Interface is embedded and is a combined JTAG and serial wire debug
port that enables either a serial wire debug or a JTAG probe to be connected to the target.
3.21.
Package and operation temperature
LQFP144 (GD32F103Zx), LQFP100 (GD32F103Vx), LQFP64 (GD32F103Rx), LQFP48
(GD32F103Cx) and QFN36 (GD32F103Tx)
Operation temperature range: -40°C to +85°C (industrial level)
56
GD32F103xx Datasheet
4.
Electrical characteristics
4.1.
Absolute maximum ratings
The maximum ratings are the limits to which the device can be subjected without permanently
damaging the device. Note that the device is not guaranteed to operate properly at the
maximum ratings. Exposure to the absolute maximum rating conditions for extended periods
may affect device reliability.
Table 4-1. Absolute maximum ratings (1)(4)
Symbol
VDD
External voltage
range(2)
Min
Max
Unit
VSS - 0.3
VSS + 3.6
V
VDDA
External analog supply voltage
VSSA - 0.3
VSSA + 3.6
V
VBAT
External battery supply voltage
VSS - 0.3
VSS + 3.6
V
VSS - 0.3
VDD + 3.6
V
Input voltage on other I/O
VSS - 0.3
3.6
V
|ΔVDDX|
Variations between different VDD power pins
—
50
mV
|VSSX −VSS|
Variations between different ground pins
—
50
mV
IIO
Maximum current for GPIO pins
—
±25
mA
TA
Operating temperature range
-40
+85
°C
Power dissipation at TA = 85°C of LQFP144
—
820
Power dissipation at TA = 85°C of LQFP100
—
697
Power dissipation at TA = 85°C of LQFP64
—
647
Power dissipation at TA = 85°C of LQFP48
—
621
Power dissipation at TA = 85°C of QFN36
—
926
TSTG
Storage temperature range
-65
+150
°C
TJ
Maximum junction temperature
—
125
°C
VIN
PD
(1)
(2)
(3)
(4)
4.2.
Parameter
Input voltage on 5V tolerant
pin(3)
mW
Guaranteed by design, not tested in production.
All main power and ground pins should be connected to an external power source within the allowable range.
VIN maximum value cannot exceed 5.5 V.
It is recommended that VDD and VDDA are powered by the same source. The maximum difference between VDD
and VDDA does not exceed 300 mV during power-up and operation.
Operating conditions characteristics
Table 4-2. DC operating conditions
Min(1) Typ Max(1) Unit
Symbol
Parameter
Conditions
VDD
Supply voltage
—
2.6
3.3
3.6
V
VDDA
Analog supply voltage
Same as VDD
2.6
3.3
3.6
V
VBAT
Battery supply voltage
—
1.8
—
3.6
V
(1)
Based on characterization, not tested in production.
57
GD32F103xx Datasheet
Figure 4-1. Recommended power supply decoupling capacitors(1) (2)
VBAT
100 nF
VSS
N * VDD
4.7 μF + N * 100 nF
VSS
VDDA
1 μF
VSSA
10 nF
VREF+
1 μF
(1)
(2)
VREF-
10 nF
The VREF+ and VREF- pins are only available on no less than 100-pin packages, or else the VREF+ and VREF- pins
are not available and internally connected to VDDA and VSSA pins.
All decoupling capacitors need to be as close as possible to the pins on the PCB board.
Table 4-3. Clock frequency(1)
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
AHB clock frequency
—
—
108
MHz
fAPB1
APB1 clock frequency
—
—
54
MHz
fAPB2
APB2 clock frequency
—
—
108
MHz
Min
Max
Unit
0
∞
20
∞
(1)
Guaranteed by design, not tested in production.
Table 4-4. Operating conditions at Power up/ Power down (1)
Symbol
tVDD
(1)
Parameter
Conditions
VDD rise time rate
—
VDD fall time rate
μs/V
Guaranteed by design, not tested in production.
Table 4-5. Start-up timings of Operating conditions (For GD32F103x4/6/8/B
devices)(1)(2)(3)
Symbol
Parameter
tstart-up
Start-up time
(1)
(2)
(3)
Conditions
Typ
Clock source from HXTAL
60
Clock source from IRC8M
60
Unit
ms
Based on characterization, not tested in production.
After power-up, the start-up time is the time between the rising edge of NRST high and the main function.
PLL is off.
Table 4-6. Start-up timings of Operating conditions (For GD32F103xC/D/E/F/G/I/K
58
GD32F103xx Datasheet
devices)
(1)(2)(3)
Symbol
Parameter
tstart-up
Start-up time
(1)
(2)
(3)
Conditions
Typ
Clock source from HXTAL
132
Clock source from IRC8M
132
Unit
ms
Based on characterization, not tested in production.
After power-up, the start-up time is the time between the rising edge of NRST high and the main function.
PLL is off.
Table 4-7. Power saving mode wakeup timings characteristics (for GD32F103x4/6/8/B
devices)(1)(2)
Symbol
Parameter
Typ
tSleep
Wakeup from Sleep mode
4.5
Wakeup from Deep-sleep mode(LDO On)
6.5
Wakeup from Deep-sleep mode(LDO in low power mode)
6.5
Wakeup from Standby mode
60
tDeep-sleep
tStandby
(1)
(2)
4-8.
Power
saving
GD32F103xC/D/E/F/G/I/K devices)
ms
mode
wakeup
timings
characteristics
Parameter
Typ
tSleep
Wakeup from Sleep mode
4.5
Wakeup from Deep-sleep mode(LDO On)
6
Wakeup from Deep-sleep mode(LDO in low power mode)
6
Wakeup from Standby mode
119
tStandby
(for
(1)(2)
Symbol
tDeep-sleep
4.3.
μs
Based on characterization, not tested in production.
The wakeup time is measured from the wakeup event to the point at which the application code reads the first
instruction under the below conditions: VDD = VDDA = 3.3 V, IRC8M = System clock = 8 MHz.
Table
(1)
(2)
Unit
Unit
μs
ms
Based on characterization, not tested in production.
The wakeup time is measured from the wakeup event to the point at which the application code reads the first
instruction under the below conditions: VDD = VDDA = 3.3 V, IRC8M = System clock = 8 MHz.
Power consumption
The power measurements specified in the tables represent that code with data executing from
on-chip Flash with the following specifications.
Table 4-9. Power consumption characteristics (for GD32F103x4/6/8/B devices)(2)(3)(4)(5)
Symbol
Parameter
Conditions
Min
Typ(1) Max Unit
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 108 MHz, All peripherals
IDD+IDDA
Supply current
enabled
(Run mode)
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 108 MHz, All peripherals
—
45.6
—
mA
—
33.4
—
mA
disabled
59
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ(1) Max Unit
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 96 MHz, All peripherals
—
40.7
—
mA
—
29.9
—
mA
—
31
—
mA
—
22.9
—
mA
—
21.3
—
mA
—
15.8
—
mA
—
16.4
—
mA
—
12.3
—
mA
—
11.5
—
mA
—
8.7
—
mA
—
8.3
—
mA
—
6.4
—
mA
—
5.1
—
mA
—
4.1
—
mA
enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 96 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 72 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 72 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 48 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 48 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 36 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 36 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 24 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 24 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 16 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 16 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 8 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System clock = 8 MHz, All peripherals
disabled
60
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ(1) Max Unit
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 108 MHz, CPU clock off,
—
19.6
—
mA
—
6.2
—
mA
—
17.6
—
mA
—
5.6
—
mA
—
13.7
—
mA
—
4.7
—
mA
—
9.7
—
mA
—
3.7
—
mA
—
7.7
—
mA
—
3.2
—
mA
—
5.7
—
mA
—
2.7
—
mA
—
4.4
—
mA
—
2.4
—
mA
All peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 108 MHz, CPU clock off,
All peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 96 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 96 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 72 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 72 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 48 MHz, CPU clock off, All
Supply current
peripherals enabled
(Sleep mode)
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 48 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 36 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 36 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 24 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 24 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 16 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 16 MHz, CPU clock off, All
peripherals disabled
61
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ(1) Max Unit
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 8 MHz, CPU clock off, All
—
3.1
—
mA
—
2.1
—
mA
—
259
—
μA
—
247
—
μA
—
7.8
—
μA
—
7.3
—
μA
—
6.1
—
μA
—
17.00
—
μA
—
12.65
—
μA
—
5.95
—
μA
—
2.02
—
μA
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 8 MHz,
System Clock = 8 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, LDO in normal power
Supply current
(Deep-Sleep
mode)
mode, IRC40K off, RTC off, All GPIOs
analog mode
VDD = VDDA = 3.3 V, LDO in low power
mode, IRC40K off, RTC off, All GPIOs
analog mode
VDD = VDDA = 3.3 V, LXTAL off, IRC40K on,
RTC on
Supply current VDD = VDDA = 3.3 V, LXTAL off, IRC40K on,
(Standby mode)
RTC off
VDD = VDDA = 3.3 V, LXTAL off, IRC40K off,
RTC off
VDD off, VDDA off, VBAT = 3.6 V, LXTAL on
with external crystal, RTC on
Battery supply
IBAT
current (Backup
mode)
VDD off, VDDA off, VBAT = 3.3 V, LXTAL on
with external crystal, RTC on
VDD off, VDDA off, VBAT = 2.6 V, LXTAL on
with external crystal, RTC on
VDD off, VDDA off, VBAT = 1.8 V, LXTAL on
with external crystal, RTC on
(1)
(2)
(3)
(4)
(5)
Based on characterization, not tested in production.
Unless otherwise specified, all values given for TA = 25 ℃ and test result is mean value.
When System Clock is less than 4 MHz, an external source is used, and the HXTAL bypass function is needed,
no PLL.
When System Clock is greater than 8 MHz, a crystal 8 MHz is used, and the HXTAL bypass function is closed,
using PLL.
When analog peripheral blocks such as ADCs, DACs, HXTAL, LXTAL, IRC8M, or IRC40K are ON, an
additional power consumption should be considered.
62
GD32F103xx Datasheet
Table
4-10.
devices)
Power
consumption
characteristics
(for
GD32F103xC/D/E/F/G/I/K
(2)(3)(4)(5)
Symbol
Parameter
Conditions
Min
Typ(1) Max Unit
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 108 MHz, All peripherals
—
59.4
—
mA
—
37.5
—
mA
—
53.1
—
mA
—
33.7
—
mA
—
40.3
—
mA
—
25.7
—
mA
—
27.5
—
mA
—
17.9
—
mA
—
21.1
—
mA
—
13.9
—
mA
—
14.8
—
mA
—
10
—
mA
—
10.6
—
mA
enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 108 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 96 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 96 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 72 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 72 MHz, All peripherals
disabled
IDD+IDDA
Supply current
(Run mode)
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 48 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 2 MHz,
System clock = 48 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 36 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 36 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 24 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 24 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 16 MHz, All peripherals
enabled
63
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ(1) Max Unit
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 16 MHz, All peripherals
—
7.4
—
mA
—
6.5
—
mA
—
4.9
—
mA
—
33.3
—
mA
—
8.1
—
mA
—
29.8
—
mA
—
7.4
—
mA
—
22.9
—
mA
—
6.1
—
mA
—
16
—
mA
—
4.7
—
mA
—
12.6
—
mA
—
4.1
—
mA
—
9.1
—
mA
disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 8 MHz, All peripherals
enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System clock = 8 MHz, All peripherals
disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 108 MHz, CPU clock off,
All peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 108 MHz, CPU clock off,
All peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 96 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 96 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 72 MHz, CPU clock off, All
peripherals enabled
Supply current
(Sleep mode)
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 72 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 48 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 48 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 36 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 36 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 24 MHz, CPU clock off, All
peripherals enabled
64
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ(1) Max Unit
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 24 MHz, CPU clock off, All
—
3.4
—
mA
—
6.8
—
mA
—
3
—
mA
—
4.4
—
mA
—
2.3
—
mA
—
585
—
μA
—
573
—
μA
—
7.8
—
μA
—
7.4
—
μA
—
6.2
—
μA
—
16.6
—
μA
—
12.6
—
μA
—
5.9
—
μA
—
2
—
μA
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 16 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 16 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 8 MHz, CPU clock off, All
peripherals enabled
VDD = VDDA = 3.3 V, HXTAL = 25 MHz,
System Clock = 8 MHz, CPU clock off, All
peripherals disabled
VDD = VDDA = 3.3 V, LDO in normal power
Supply current
(Deep-Sleep
mode)
mode, IRC40K off, RTC off, All GPIOs
analog mode
VDD = VDDA = 3.3 V, LDO in low power
mode, IRC40K off, RTC off, All GPIOs
analog mode
VDD = VDDA = 3.3 V, LXTAL off, IRC40K on,
RTC on
Supply current VDD = VDDA = 3.3 V, LXTAL off, IRC40K on,
(Standby mode)
RTC off
VDD = VDDA = 3.3 V, LXTAL off, IRC40K off,
RTC off
VDD off, VDDA off, VBAT = 3.6 V, LXTAL on
with external crystal, RTC on
Battery supply
IBAT
current (Backup
mode)
VDD off, VDDA off, VBAT = 3.3 V, LXTAL on
with external crystal, RTC on
VDD off, VDDA off, VBAT = 2.6 V, LXTAL on
with external crystal, RTC on
VDD off, VDDA off, VBAT = 1.8 V, LXTAL on
with external crystal, RTC on
(1)
(2)
(3)
(4)
(5)
Based on characterization, not tested in production.
Unless otherwise specified, all values given for TA = 25 ℃ and test result is mean value.
When System Clock is less than 4 MHz, an external source is used, and the HXTAL bypass function is needed,
no PLL.
When System Clock is greater than 8 MHz, a crystal 8 MHz is used, and the HXTAL bypass function is closed,
using PLL.
When analog peripheral blocks such as ADCs, DACs, HXTAL, LXTAL, IRC8M, or IRC40K are ON, an
additional power consumption should be considered.
65
GD32F103xx Datasheet
Figure 4-2. Typical supply current consumption in Run mode (For GD32F103x4/6/8/B
devices)
50
45.6
IDD+IDDA (mA)
45
40.7
40
All perlpherals enabled
35
All perlpherals disabled
31
30
33.4
25
29.9
21.3
16.4
20
22.9
11.5
15
15.8
8.3
10
5.1
5
4.1
0
0
12.3
6.4
8.7
20
40
60
80
100
120
System clock (MHz)
Figure
4-3.
Typical
supply
current
consumption
in
Run
mode
(For
GD32F103xC/D/E/F/G/I/K devices)
70
59.4
60
53.1
IDD+IDDA (mA)
All perlpherals enabled
50
All perlpherals disabled
40.3
40
27.5
30
37.5
33.7
21.1
20
25.7
14.8
10.6
10
6.5
0
4.9
0
17.9
13.9
7.4
10
20
40
60
80
100
120
System clock (MHz)
Figure 4-4. Typical supply current consumption in Sleep mode (For GD32F103x4/6/8/B
66
GD32F103xx Datasheet
devices)
25
19.6
All perlpherals enabled
IDD+IDDA (mA)
20
17.6
All perlpherals disabled
13.7
15
9.7
10
7.7
5.7
4.4
5
3.1
0
0
2.1 2.4 2.7
20
3.7
3.2
40
6.2
5.6
4.7
60
80
100
120
System clock (MHz)
Figure
4-5.
Typical
supply
current
consumption
in
Sleep
mode
(For
GD32F103xC/D/E/F/G/I/K devices)
33.3
35
29.8
30
IDD+IDDA (mA)
All perlpherals enabled
25
22.9
All perlpherals disabled
20
16
12.6
15
9.1
10
6.8
4.4
5
0
2.3
0
3
3.4
20
4.7
4.1
40
7.4
6.1
60
80
8.1
100
120
System clock (MHz)
4.4.
EMC characteristics
EMS (electromagnetic susceptibility) includes ESD (Electrostatic discharge, positive and
negative) and FTB (Burst of Fast Transient voltage, positive and negative) testing result is
given in the Table 4-11. EMS characteristics
(1)
, based on the EMS levels and classes
compliant with IEC 61000 series standard.
Table 4-11. EMS characteristics (1)
Symbol
Parameter
Conditions
Level/Class
VESD
Voltage applied to all device pins to
VDD = 3.3 V, TA = + 25 °C
3B
67
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Level/Class
induce a functional disturbance
LQFP144, fHCLK = 108 MHz
conforms to IEC 61000-4-2
VFTB
(1)
4.5.
Fast transient voltage burst applied to
VDD = 3.3 V, TA = +25 °C
induce a functional disturbance through
LQFP144, fHCLK = 108 MHz
100 pF on VDD and VSS pins
conforms to IEC 61000-4-4
4A
Based on characterization, not tested in production.
Power supply supervisor characteristics
Table 4-12. Power supply supervisor characteristics (For GD32F103x4/6/8/B devices)
Symbol
VLVD(1)
Parameter
Conditions
Min
Typ
Max
LVDT = 100(rising edge)
—
2.55
—
LVDT = 100(falling edge)
—
2.48
—
LVDT = 101(rising edge)
—
2.66
—
Low voltage
LVDT = 101(falling edge)
—
2.58
—
Detector level selection
LVDT = 110(rising edge)
—
2.75
—
LVDT = 110(falling edge)
—
2.69
—
LVDT = 111(rising edge)
—
2.86
—
LVDT = 111(falling edge)
—
2.78
—
—
—
100
—
mV
—
2.40
—
V
—
2.35
—
V
VLVDhyst(2)
LVD hystersis
VPOR(1)
Power on reset threshold
VPDR(1)
Unit
V
Power down reset
—
threshold
VPDRhyst(2)
PDR hysteresis
—
50
—
mV
tRSTTEMPO(2)
Reset temporization
—
2
—
ms
(1)
(2)
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Table 4-13. Power supply supervisor characteristics (For GD32F103xC/D/E/F/G/I/K
devices)
Symbol
VLVD(1)
Parameter
Conditions
Min
Typ
Max
LVDT = 000(rising edge)
—
2.19
—
Low voltage
LVDT = 000(falling edge)
—
2.08
—
Detector level selection
LVDT = 001(rising edge)
—
2.29
—
LVDT = 001(falling edge)
—
2.19
—
Unit
V
68
GD32F103xx Datasheet
Symbol
VLVDhyst(2)
LVD hystersis
VPOR(1)
Power on reset threshold
VPDR(1)
Conditions
Min
Typ
Max
LVDT = 010(rising edge)
—
2.39
—
LVDT = 010(falling edge)
—
2.29
—
LVDT = 011(rising edge)
—
2.5
—
LVDT = 011(falling edge)
—
2.39
—
LVDT = 100(rising edge)
—
2.6
—
LVDT = 100(falling edge)
—
2.48
—
LVDT = 101(rising edge)
—
2.68
—
LVDT = 101(falling edge)
—
2.58
—
LVDT = 110(rising edge)
—
2.79
—
LVDT = 110(falling edge)
—
2.68
—
LVDT = 111(rising edge)
—
2.89
—
LVDT = 111(falling edge)
—
2.78
—
—
—
100
—
mV
—
2.40
—
V
—
1.85
—
V
Power down reset
threshold
—
Unit
VPDRhyst(2)
PDR hysteresis
—
550
—
mV
tRSTTEMPO(2)
Reset temporization
—
2
—
ms
(1)
(2)
4.6.
Parameter
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Electrical sensitivity
The device is strained in order to determine its performance in terms of electrical sensitivity.
Electrostatic discharges (ESD) are applied directly to the pins of the sample. Static latch-up
(LU) test is based on the two measurement methods.
Table 4-14. ESD characteristics (1)
Symbol
VESD(HBM)
VESD(CDM)
(1)
Parameter
Conditions
Electrostatic discharge
TA = 25 °C;
voltage (human body model)
JS-001-2014
Electrostatic discharge
TA = 25 °C;
voltage (charge device model)
JS-002-2014
Min
Typ
Max
Unit
—
—
3000
V
—
—
500
V
Based on characterization, not tested in production.
69
GD32F103xx Datasheet
Table 4-15. Static latch-up characteristics
Symbol
(1)
Parameter
Conditions
Min
Typ
Max
Unit
—
—
±100
mA
—
—
5.4
V
I-test
LU
TA = 25 °C; JESD78
Vsupply over voltage
(1)
4.7.
Based on characterization, not tested in production.
External clock characteristics
Table 4-16. High speed external clock (HXTAL) generated from a crystal/ceramic
characteristics(For GD32F103x4/6/8/B devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fHXTAL(1)
Crystal or ceramic frequency
2.6 V ≤ VDD ≤ 3.6 V
4
8
16
MHz
RF(2)
Feedback resistor
VDD = 3.3 V
—
400
—
kΩ
—
—
20
30
pF
Crystal or ceramic duty cycle
—
30
50
70
%
Oscillator transconductance
Startup
—
35
—
mA/V
Crystal or ceramic operating
VDD = 3.3 V,
current
TA = 25 °C
—
1.3
—
mA
—
3.9
—
ms
Recommended matching
CHXTAL(2) (3)
capacitance on OSCIN and
OSCOUT
Ducy(HXTAL)
(2)
gm(2)
IDDHXTAL(1)
tSUHXTAL(1)
(1)
(2)
(3)
Crystal or ceramic startup time
VDD = 3.3 V,
TA = 25 °C
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
CHXTAL1 = CHXTAL2 = 2*(CLOAD - CS), For CHXTAL1 and CHXTAL2, it is recommended matching capacitance on OSCIN
and OSCOUT. For CLOAD, it is crystal/ceramic load capacitance, provided by the crystal or ceramic
manufacturer. For CS, it is PCB and MCU pin stray capacitance.
Table 4-17. High speed external clock (HXTAL) generated from a crystal/ceramic
characteristics(For GD32F103xC/D/E/F/G/I/K devices)
Symbol
fHXTAL
RF
(1)
(2)
Parameter
Conditions
Min
Typ
Max
Unit
Crystal or ceramic frequency
2.6 V ≤ VDD ≤ 3.6 V
4
8
16
MHz
Feedback resistor
VDD = 3.3 V
—
400
—
kΩ
—
—
20
30
pF
Crystal or ceramic duty cycle
—
30
50
70
%
Oscillator transconductance
Startup
—
35
—
mA/V
Crystal or ceramic operating
VDD = 3.3 V,
current
TA = 25 °C
—
1.6
—
mA
—
0.68
—
ms
Recommended matching
CHXTAL
(2) (3)
capacitance on OSCIN and
OSCOUT
Ducy(HXTAL)
(2)
gm(2)
IDDHXTAL(1)
tSUHXTAL(1)
Crystal or ceramic startup time
VDD = 3.3 V,
TA = 25 °C
70
GD32F103xx Datasheet
(1) Based on characterization, not tested in production.
(2) Guaranteed by design, not tested in production.
(3) CHXTAL1 = CHXTAL2 = 2*(CLOAD - CS), For CHXTAL1 and CHXTAL2, it is recommended matching capacitance on OSCIN
and OSCOUT. For CLOAD, it is crystal/ceramic load capacitance, provided by the crystal or ceramic
manufacturer. For CS, it is PCB and MCU pin stray capacitance.
Table 4-18. High speed external clock characteristics (HXTAL in bypass mode)
Symbol
Parameter
fHXTAL_ext(1)
voltage
OSCIN input pin low level
(2)
(2)
CIN(2)
Ducy(HXTAL)
(1)
(2)
Typ
Max
Unit
2.6 V ≤ VDD ≤ 3.6 V
1
—
50
MHz
0.7 VDD
—
VDD
V
VSS
—
0.3 VDD
V
VDD = 3.3 V
voltage
tH/L(HXTAL) (2)
tR/F(HXTAL)
oscillator frequency
Min
OSCIN input pin high level
VHXTALH(2)
VHXTALL
External clock source or
Conditions
(2)
OSCIN high or low time
—
5
—
—
ns
OSCIN rise or fall time
—
—
—
10
ns
OSCIN input capacitance
—
—
5
—
pF
Duty cycle
—
40
—
60
%
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Table 4-19. Low speed external clock (LXTAL) generated from a crystal/ceramic
characteristics(For GD32F103x4/6/8/B devices)
Symbol
fLXTAL(1)
Parameter
Crystal or ceramic
frequency
Conditions
Min
Typ
Max
Unit
VDD = 3.3 V
—
32.768
—
kHz
—
—
10
—
pF
—
30
—
70
%
—
—
11
—
μA/V
—
—
12
—
μA
—
—
0.28
—
s
Recommended matching
CLXTAL(2) (3)
capacitance on OSC32IN
and OSC32OUT
Ducy(LXTAL)(2)
gm(2)
IDDLXTAL
tSULXTAL(1) (4)
(1)
(2)
(3)
(4)
Crystal or ceramic duty
cycle
Oscillator transconductance
Crystal or ceramic operating
current
Crystal or ceramic startup
time
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
CLXTAL1 = CLXTAL2 = 2*(CLOAD - CS), For CLXTAL1 and CLXTAL2, it is recommended matching capacitance on OSC32IN
and OSC32OUT. For CLOAD, it is crystal/ceramic load capacitance, provided by the crystal or ceramic
manufacturer. For CS, it is PCB and MCU pin stray capacitance.
tSULXTAL is the startup time measured from the moment it is enabled (by software) to the 32.768 kHz oscillator
stabilization flags is SET. This value varies significantly with the crystal manufacturer.
Table 4-20. Low speed external clock (LXTAL) generated from a crystal/ceramic
71
GD32F103xx Datasheet
characteristics(For GD32F103xC/D/E/F/G/I/K devices)
Symbol
Parameter
Crystal or ceramic
fLXTAL(1)
frequency
Conditions
Min
Typ
Max
Unit
VDD = 3.3 V
—
32.768
—
kHz
—
—
10
—
pF
—
30
—
70
%
—
—
11
—
μA/V
—
—
11.6
—
μA
—
—
0.39
—
s
Recommended matching
CLXTAL
(2) (3)
capacitance on OSC32IN
and OSC32OUT
Ducy(LXTAL)(2)
gm(2)
Crystal or ceramic duty
cycle
Oscillator transconductance
Crystal or ceramic operating
IDDLXTAL
current
tSULXTAL(1) (4)
Crystal or ceramic startup
time
(1) Based on characterization, not tested in production.
(2) Guaranteed by design, not tested in production.
(3) CLXTAL1 = CLXTAL2 = 2*(CLOAD - CS), For CLXTAL1 and CLXTAL2, it is recommended matching capacitance on OSC32IN
and OSC32OUT. For CLOAD, it is crystal/ceramic load capacitance, provided by the crystal or ceramic
manufacturer. For CS, it is PCB and MCU pin stray capacitance.
(4) tSULXTAL is the startup time measured from the moment it is enabled (by software) to the 32.768 kHz oscillator
stabilization flags is SET. This value varies significantly with the crystal manufacturer.
Table 4-21. Low speed external user clock characteristics (LXTAL in bypass mode)
Symbol
Parameter
fLXTAL_ext(1)
Unit
VDD = 3.3 V
—
32.768
1000
kHz
—
0.7 VDD
—
VDD
(2)
(2)
V
—
VSS
—
0.3 VDD
OSC32IN high or low time
—
450
—
—
OSC32IN rise or fall time
—
—
—
50
OSC32IN input capacitance
—
—
5
—
pF
Duty cycle
—
30
50
70
%
voltage
CIN(2)
4.8.
Max
OSC32IN input pin low level
tH/L(LXTAL) (2)
(1)
(2)
Typ
voltage
VLXTALL(2)
Ducy(LXTAL)
frequency
Min
OSC32IN input pin high level
VLXTALH(2)
tR/F(LXTAL)
External clock source or oscillator
Conditions
ns
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Internal clock characteristics
Table 4-22. High speed internal clock (IRC8M) characteristics (For GD32F103x4/6/8/B
72
GD32F103xx Datasheet
devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD = VDDA = 3.3 V
—
8
—
MHz
-2.5
—
+2.5
%
VDD = VDDA = 3.3 V, TA = 25 °C
-1.0
—
+1.0
%
—
—
0.5
—
%
DucyIRC8M(2) IRC8M oscillator duty cycle
VDD = VDDA = 3.3 V
45
50
55
%
IRC8M oscillator operating
VDD = VDDA = 3.3 V,
current
TA = 25 °C
—
87
—
μA
IRC8M oscillator startup
VDD = VDDA = 3.3 V,
time
TA = 25 °C
—
2.5
—
μs
High Speed Internal
fIRC8M
Oscillator (IRC8M)
frequency
VDD = VDDA = 3.3 V,
IRC8M oscillator Frequency
accuracy, Factory-trimmed
ACCIRC8M
TA = -40 °C ~ +85 °C
IRC8M oscillator Frequency
accuracy, User trimming
step(1)
IDDAIRC8M(1)
tSUIRC8M(1)
(1)
(2)
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Table 4-23. High speed internal clock (IRC8M) characteristics (For GD32F103
xC/D/E/F/G/I/K devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD = VDDA = 3.3 V
—
8
—
MHz
-2.5
—
+2.5
%
VDD = VDDA = 3.3 V, TA = 25 °C
-1.0
—
+1.0
%
—
—
0.5
—
%
DucyIRC8M(2) IRC8M oscillator duty cycle
VDD = VDDA = 3.3 V
45
50
55
%
IRC8M oscillator operating
VDD = VDDA = 3.3 V,
current
TA = 25 °C
—
62
—
μA
IRC8M oscillator startup
VDD = VDDA = 3.3 V,
time
TA = 25 °C
—
0.64
—
μs
High Speed Internal
fIRC8M
Oscillator (IRC8M)
frequency
VDD = VDDA = 3.3 V,
IRC8M oscillator Frequency
accuracy, Factory-trimmed
ACCIRC8M
TA = -40 °C ~ +85 °C(1)
IRC8M oscillator Frequency
accuracy, User trimming
step(1)
IDDAIRC8M(1)
tSUIRC8M(1)
(1)
(2)
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Table 4-24. Low speed internal clock (IRC40K) characteristics (For GD32F103x4/6/8/B
devices)
Symbol
fIRC40K(1)
Parameter
Conditions
Low Speed Internal oscillator
VDD = VDDA = 3.3 V,
(IRC40K) frequency
TA = -40°C ~ +85 °C
Min
Typ
—
40
Max Unit
—
kHz
73
GD32F103xx Datasheet
Symbol
IDDAIRC40K(2)
tSUIRC40K(2)
(1)
(2)
Parameter
Conditions
IRC40K oscillator operating
VDD = VDDA = 3.3 V,
current
TA = 25 °C
IRC40K oscillator startup
VDD = VDDA = 3.3 V,
time
TA = 25 °C
Min
Typ
Max Unit
—
1.3
—
μA
—
113
—
μs
Guaranteed by design, not tested in production.
Based on characterization, not tested in production.
Table 4-25. Low speed internal clock (IRC40K) characteristics(For GD32F103
xC/D/E/F/G/I/K devices)
Symbol
fIRC40K(1)
IDDAIRC40K(2)
tSUIRC40K(2)
Parameter
Conditions
Low Speed Internal oscillator
VDD = VDDA = 3.3 V,
(IRC40K) frequency
TA = -40°C ~ +85 °C
IRC40K oscillator operating
VDD = VDDA = 3.3 V,
current
TA = 25 °C
IRC40K oscillator startup
VDD = VDDA = 3.3 V,
time
TA = 25 °C
Min
Typ
Max Unit
—
40
—
kHz
—
1.2
—
μA
—
124
—
μs
(1) Guaranteed by design, not tested in production.
(2) Based on characterization, not tested in production.
4.9.
PLL characteristics
Table 4-26. PLL characteristics
Symbol
fPLLIN
(1)
fPLLOUT
(2)
fVCO(2)
tLOCK(2)
(1)
(2)
Parameter
Conditions
Min
Typ
Max
Unit
PLL input clock frequency
—
1
—
25
MHz
PLL output clock frequency
—
16
—
108
MHz
—
32
—
216
MHz
—
—
—
300
μs
PLL VCO output clock
frequency
PLL lock time
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
74
GD32F103xx Datasheet
4.10.
Memory characteristics
Table 4-27. Flash memory characteristics (For GD32F103x4/6/8/B devices)
Symbol
Parameter
Conditions
Min(1) Typ(1)
Max(2)
Unit
Number of guaranteed
PECYC
program /erase cycles
TA = -40 °C ~ +85 °C
100
—
—
kcycle
s
before failure (Endurance)
tRET
Data retention time
—
—
20
—
years
tPROG
Word programming time
TA = -40°C ~ +85 °C
—
37.5
105
μs
tERASE
Page erase time
TA = -40°C ~ +85 °C
—
50
400
ms
tMERASE(16K)
Mass erase time
TA = -40°C ~ +85 °C
—
0.3
3
s
tMERASE(32K)
Mass erase time
TA = -40°C ~ +85 °C
—
0.6
6
s
tMERASE(64K)
Mass erase time
TA = -40°C ~ +85 °C
—
1.2
12
s
tMERASE(128K)
Mass erase time
TA = -40°C ~ +85 °C
—
2.4
24
s
(1)
(2)
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Table 4-28. Flash memory characteristics (For GD32F103xC/D/E/F/G/I/K devices)
Symbol
Parameter
Conditions
Min(1) Typ(1)
Max(2)
Unit
Number of guaranteed
PECYC
program /erase cycles
before failure
TA = -40 °C ~ +85 °C
100
—
—
20
—
kcycle
s
(Endurance)
tRET
Data retention time
—
—
tPROG
Word programming time
TA = -40°C ~ +85 °C
—
tERASE
Page erase time
TA = -40°C ~ +85 °C
—
tMERASE(256K)
Mass erase time
TA = -40°C ~ +85 °C
—
37.5 105/170
years
(3)
μs
50
400/500 (4)
ms
2.4
24
s
tMERASE(512K)
Mass erase time
TA = -40°C ~ +85 °C
—
8
64
s
tMERASE(1024K)
Mass erase time
TA = -40°C ~ +85 °C
—
16
128
s
tMERASE(3072K)
Mass erase time
TA = -40°C ~ +85 °C
—
64
512
s
(1)
(2)
(3)
(4)
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Flash memory with 256K is 105 us and flash memory >256K is 170 us.
Flash memory with 256K is 400 ms and flash memory >256K is 500 ms.
75
GD32F103xx Datasheet
4.11.
NRST pin characteristics
Table 4-29. NRST pin characteristics
Symbol
Parameter
VIL(NRST)(1)
NRST Input low level voltage
VIH(NRST)(1)
NRST Input high level voltage
Vhyst(1)
VIL(NRST)
Typ
Max
-0.3
—
0.3 VDD
VDD = VDDA = 2.6 V 0.7 VDD —
—
350
—
NRST Input low level voltage
-0.3
—
0.3 VDD
(1)
NRST Input high level voltage
VDD = VDDA = 3.3 V 0.7 VDD —
Schmidt trigger Voltage hysteresis
—
360
—
NRST Input low level voltage
-0.3
—
0.3 VDD
(1)
NRST Input high level voltage
VDD = VDDA = 3.6 V 0.7 VDD —
Vhyst(1)
Schmidt trigger Voltage hysteresis
Rpu(2)
Pull-up equivalent resistor
—
V
mV
V
VDD + 0.3
(1)
VIH(NRST)
Unit
VDD + 0.3
Schmidt trigger Voltage hysteresis
Vhyst(1)
(1)
(2)
Min
(1)
VIH(NRST)
VIL(NRST)
Conditions
mV
V
VDD + 0.3
—
370
—
mV
—
40
—
kΩ
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Figure 4-6. Recommended external NRST pin circuit(1)
VDD
VDD
External reset circuit
10 kΩ
RPU
NRST
K
100 nF
GND
(1)
4.12.
Unless the voltage on NRST pin go below VIL(NRST) level, the device would not generate a reliable reset.
GPIO characteristics
Table 4-30. I/O port DC characteristics(For GD32F103x4/6/8/B devices)(1) (3)
Symbol
Parameter
Standard IO Low level input
VIL
voltage
5V-tolerant IO Low level
input voltage
Standard IO Low level input
VIH
voltage
5V-tolerant IO Low level
Conditions
Min
Typ
Max
Unit
2.6 V ≤ VDD = VDDA ≤ 3.6 V
—
—
0.3 VDD
V
2.6 V ≤ VDD = VDDA ≤ 3.6 V
—
—
0.3 VDD
V
2.6 V ≤ VDD = VDDA ≤ 3.6 V 0.7 VDD
—
—
V
2.6 V ≤ VDD = VDDA ≤ 3.6 V 0.7 VDD
—
—
V
76
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
input voltage
RPU(2)
RPD(2)
Internal pull-
All pins
VIN = VSS
—
40
—
up resistor
PA10
—
—
10
—
Internal pull-
All pins
VIN = VDD
—
40
—
down resistor
PA10
—
—
10
—
kΩ
kΩ
IO_Speed=50MHz
Low level output voltage
VDD = 2.6V
—
0.12
—
for an IO Pin
VDD = 3.3 V
—
0.1
—
(IIO = +4 mA)
VDD = 3.6V
—
0.1
—
Low level output voltage
VDD = 2.6V
—
0.38
—
for an IO Pin
VDD = 3.3 V
—
0.32
—
(IIO = +12 mA)
VDD = 3.6V
—
0.3
—
High level output voltage
VDD = 2.6V
—
2.32
—
for an IO Pin
VDD = 3.3 V
—
3.06
—
(IIO = +8 mA)
VDD = 3.6V
—
3.37
—
VDD = 2.6V
—
2.03
—
VDD = 3.3 V
—
2.76
—
VDD = 3.6V
—
3.09
—
VOL
V
High level output voltage
VOH
for an IO Pin
V
(IIO = +15 mA)
High level output voltage
for an IO Pin
(IIO = +18 mA)
IO_Speed=10MHz
VOL
Low level output voltage for
VDD = 2.6V
—
0.29
—
an IO Pin
VDD = 3.3 V
—
0.26
—
(IIO = +4 mA)
VDD = 3.6V
—
0.25
—
Low level output voltage for
VDD = 2.6V
—
0.65
—
VDD = 3.3 V
—
0.51
—
VDD = 3.6V
—
0.62
—
High level output voltage
VDD = 2.6V
—
1.94
—
for an IO Pin
VDD = 3.3 V
—
2.78
—
(IIO = +8 mA)
VDD = 3.6V
—
3.11
—
VDD = 2.6V
—
1.71
—
VDD = 3.3 V
—
2.18
—
VDD = 3.6V
—
2.85
—
an IO Pin
(IIO = +8 mA)
V
Low level output voltage for
an IO Pin
(IIO = +10 mA)
High level output voltage
VOH
for an IO Pin
V
(IIO = +10mA)
High level output voltage
for an IO Pin
(IIO = +15mA)
IO_Speed=2MHz
77
GD32F103xx Datasheet
Symbol
VOL
Parameter
Conditions
Min
Typ
Max
Low level output voltage for
VDD = 2.6V
—
0.59
—
an IO Pin
VDD = 3.3 V
—
0.54
—
(IIO = +4 mA)
VDD = 3.6V
—
0.51
—
VDD = 2.6V
—
2.14
—
VDD = 3.3 V
—
2.53
—
VDD = 3.6V
—
2.89
—
Unit
V
High level output voltage
for an IO Pin
VOH
(IIO = +2mA)
High level output voltage
for an IO Pin
(IIO = +4mA)
(1)
(2)
(3)
V
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
All pins except PC13 / PC14 / PC15. Since PC13 to PC15 are supplied through the Power Switch, which can
only be obtained by a small current, the speed of GPIOs PC13 to PC15 should not exceed 2 MHz when they
are in output mode (maximum load: 30 pF).
Table 4-31. I/O port DC characteristics(For GD32F103xC/D/E/F/G/I/K devices)(1) (3)
Symbol
Parameter
Standard IO Low level input
VIL
voltage
5V-tolerant IO Low level
input voltage
Standard IO Low level input
VIH
voltage
5V-tolerant IO Low level
input voltage
RPU(2)
RPD(2)
Conditions
Min
Typ
Max
Unit
2.6 V ≤ VDD = VDDA ≤ 3.6 V
—
—
0.3 VDD
V
2.6 V ≤ VDD = VDDA ≤ 3.6 V
—
—
0.3 VDD
V
2.6 V ≤ VDD = VDDA ≤ 3.6 V 0.7 VDD
—
—
V
2.6 V ≤ VDD = VDDA ≤ 3.6 V 0.7 VDD
—
—
V
Internal pull-
All pins
VIN = VSS
—
40
—
up resistor
PA10
—
—
10
—
Internal pull-
All pins
VIN = VDD
—
40
—
down resistor
PA10
—
—
10
—
kΩ
kΩ
IO_Speed=50MHz
Low level output voltage for
VDD = 2.6V
—
0.27
—
an IO Pin
VDD = 3.3 V
—
0.23
—
(IIO = +8 mA)
VDD = 3.6V
—
0.22
—
VDD = 2.6V
—
0.43
—
VDD = 3.3 V
—
0.66
—
(IIO = +20 mA)
VDD = 3.6V
—
0.61
—
High level output voltage
VDD = 2.6V
—
2.3
—
Low level output voltage for
VOL
an IO Pin
V
(IIO = +12mA)
Low level output voltage for
an IO Pin
VOH
for an IO Pin
VDD = 3.3 V
—
3.05
—
(IIO = +8 mA)
VDD = 3.6V
—
3.36
—
High level output voltage
VDD = 2.6V
—
2.21
—
V
78
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ
Max
VDD = 3.3 V
—
2.59
—
VDD = 3.6V
—
2.95
—
Unit
for an IO Pin
(IIO = +10 mA)
High level output voltage
for an IO Pin
(IIO = +20 mA)
IO_Speed=10MHz
Low level output voltage for
VDD = 2.6V
—
0.43
—
an IO Pin
VDD = 3.3 V
—
0.36
—
(IIO = +8 mA)
VDD = 3.6V
—
0.34
—
Low level output voltage for
VDD = 2.6V
—
—
—
an IO Pin
VDD = 3.3 V
—
0.78
—
(IIO = +15 mA)
VDD = 3.6V
—
0.72
—
High level output voltage
VDD = 2.6V
—
2.06
—
for an IO Pin
VDD = 3.3 V
—
2.87
—
(IIO = +8 mA)
VDD = 3.6V
—
3.2
—
High level output voltage
VDD = 2.6V
—
—
—
for an IO Pin
VDD = 3.3 V
—
2.39
—
(IIO = +15mA)
VDD = 3.6V
—
2.77
—
VOL
VOH
V
V
IO_Speed=2MHz
VOL
VOH
(1)
(2)
(3)
Low level output voltage for
VDD = 2.6V
—
0.44
—
an IO Pin
VDD = 3.3 V
—
0.36
—
(IIO = +4 mA)
VDD = 3.6V
—
0.34
—
High level output voltage
VDD = 2.6V
—
2.22
—
for an IO Pin
VDD = 3.3 V
—
2.99
—
(IIO = +4mA)
VDD = 3.6V
—
3.31
—
V
V
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
All pins except PC13 / PC14 / PC15. Since PC13 to PC15 are supplied through the Power Switch, which can
only be obtained by a small current, the speed of GPIOs PC13 to PC15 should not exceed 2 MHz when they
are in output mode(maximum load: 30 pF).
Table 4-32. I/O port AC characteristics(For GD32F103x4/6/8/B devices) (1)(2)(4)
GPIOx_MDy[1:0] bit value(3)
GPIOx_CTL->MDy[1:0]=10
(IO_Speed = 2MHz)
GPIOx_CTL->MDy[1:0] = 01
(IO_Speed = 10MHz)
GPIOx_CTL->MDy[1:0]=11
(IO_Speed = 50MHz)
(1)
Parameter
TRise/TFall
TRise/TFall
TRise/TFall
Conditions
Typ
2.6 ≤ VDD ≤ 3.6 V, CL = 10 pF
48.6
2.6 ≤ VDD ≤ 3.6 V, CL = 30 pF
59.4
2.6 ≤ VDD ≤ 3.6 V, CL = 50 pF
68.4
2.6 ≤ VDD ≤ 3.6 V, CL = 10 pF
16
2.6 ≤ VDD ≤ 3.6 V, CL = 30 pF
19.4
2.6 ≤ VDD ≤ 3.6 V, CL = 50 pF
25.2
2.6 ≤ VDD ≤ 3.6 V, CL = 10 pF
2.6
2.6 ≤ VDD ≤ 3.6 V, CL = 30 pF
3.2
2.6 ≤ VDD ≤ 3.6 V, CL = 50 pF
4.2
Unit
ns
ns
ns
Based on characterization, not tested in production.
79
GD32F103xx Datasheet
(2)
(3)
(4)
Unless otherwise specified, all test results given for TA = 25 °C.
The I/O speed is configured using the GPIOx_CTL -> MDy[1:0] bits.
Only for reference, Depending on user’s design.
Table 4-33. I/O port AC characteristics(For GD32F103xC/D/E/F/G/I/K devices) (1)(2)(4)
GPIOx_MDy[1:0] bit value(3)
Parameter
GPIOx_CTL->MDy[1:0]=10
(IO_Speed = 2MHz)
GPIOx_CTL->MDy[1:0] = 01
(IO_Speed = 10MHz)
GPIOx_CTL->MDy[1:0]=11
(IO_Speed = 50MHz)
(1)
(2)
(3)
(4)
4.13.
TRise/TFall
TRise/TFall
TRise/TFall
Conditions
Typ
2.6 ≤ VDD ≤ 3.6 V, CL = 10 pF
49.2
2.6 ≤ VDD ≤ 3.6 V, CL = 30 pF
60
2.6 ≤ VDD ≤ 3.6 V, CL = 50 pF
70.4
2.6 ≤ VDD ≤ 3.6 V, CL = 10 pF
23.4
2.6 ≤ VDD ≤ 3.6 V, CL = 30 pF
27
2.6 ≤ VDD ≤ 3.6 V, CL = 50 pF
32
2.6 ≤ VDD ≤ 3.6 V, CL = 10 pF
3.3
2.6 ≤ VDD ≤ 3.6 V, CL = 30 pF
3.5
2.6 ≤ VDD ≤ 3.6 V, CL = 50 pF
3.6
Unit
ns
ns
ns
Based on characterization, not tested in production.
Unless otherwise specified, all test results given for TA = 25 °C.
The I/O speed is configured using the GPIOx_CTL -> MDy[1:0] bits.
Only for reference, Depending on user’s design.
ADC characteristics
Table 4-34. ADC characteristics(For GD32F103x4/6/8/B devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDA(1)
Operating voltage
—
2.6
3.3
3.6
V
VIN(1)
ADC input voltage range
16 external; 2 internal
0
—
VREF+
V
VREF+(2)
Positive Reference Voltage
—
2.6
—
VDDA
V
—
—
VSSA
—
V
MHz
VREF-(2)
Negative Reference
Voltage
fADC(1)
ADC clock
—
0.6
—
14
fS(1)
Sampling rate
12-bit
0.04
—
1
External input impedance
See Equation 1
—
—
54.8
kΩ
—
—
—
0.2
kΩ
—
—
32
pF
fADC = 14 MHz
0.11
—
17.11
μs
12-bit
—
14
—
—
—
—
1
(2)
RAIN
RADC(2)
Input sampling switch
resistance
CADC(2)
Input sampling capacitance
ts(2)
Sampling time
No pin/pad capacitance
included
Total conversion
tCONV(2)
time(including sampling
time)
tSU(2)
(1)
(2)
Startup time
MSP
S
1/
fADC
μs
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
80
GD32F103xx Datasheet
Table 4-35. ADC characteristics(For GD32F103xC/D/E/F/G/I/K devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDA(1)
Operating voltage
—
2.6
3.3
3.6
V
VIN(1)
ADC input voltage range
—
0
—
VREF+
V
VREF+(2)
Positive Reference Voltage
—
2.6
—
VDDA
V
—
—
VSSA
—
V
MHz
VREF-(2)
Negative Reference
Voltage
fADC(1)
ADC clock
—
0.6
—
14
fS(1)
Sampling rate
12-bit
0.04
—
1
External input impedance
See Equation 1
—
—
219.8
kΩ
—
—
—
0.5
kΩ
—
—
8
pF
(2)
RAIN
RADC(2)
Input sampling switch
resistance
No pin/pad capacitance
S
CADC(2)
Input sampling capacitance
tCAL(2)
Calibration time
fADC = 14 MHz
—
7.28
—
μs
Sampling time
fADC = 14 MHz
0.11
—
17.11
μs
12-bit
—
14
—
—
—
—
1
(2)
ts
included
Total conversion
tCONV(2)
time(including sampling
time)
tSU(2)
(1)
(2)
MSP
Startup time
1/
fADC
μs
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
Equation 1: RAIN max formula R AIN <
Ts
fADC ∗CADC ∗ln(2N+2 )
− R ADC
The formula above (Equation 1) is used to determine the maximum external impedance allowed for
an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).
Table 4-36. ADC RAIN max for fADC = 14 MHz (For GD32F103x4/6/8/B devices)
Ts (cycles)
ts (μs)
RAIN max (kΩ)
1.5
0.11
0.1
7.5
0.54
1.5
13.5
0.96
2.9
28.5
2.04
6.3
41.5
2.96
9.3
55.5
3.96
12.5
71.5
5.11
16.2
239.5
17.11
54.8
Table 4-37. ADC RAIN max for fADC = 14 MHz (For GD32F103xC/D/E/F/G/I/K devices)
Ts (cycles)
ts (μs)
RAIN max (kΩ)
1.5
0.11
0.8
7.5
0.54
6.4
13.5
0.96
11.9
81
GD32F103xx Datasheet
4.14.
Ts (cycles)
ts (μs)
RAIN max (kΩ)
28.5
2.04
25.7
41.5
2.96
37.6
55.5
3.96
50.5
71.5
5.11
65.2
239.5
17.11
219.8
Temperature sensor characteristics
Table 4-38. Temperature sensor characteristics (1)
Symbol
Parameter
Min
Typ
Max
Unit
TL
VSENSE linearity with temperature
—
±1.5
—
℃
Avg_Slope
Average slope
—
4.1
—
mV/℃
V25
Voltage at 25 °C
—
1.45
—
V
ADC sampling time when reading the temperature
—
17.1
—
μs
tS_temp
(1)
(2)
4.15.
(2)
Based on characterization, not tested in production.
Shortest sampling time can be determined in the application by multiple iterations.
DAC characteristics
Table 4-39. DAC characteristics(For GD32F103xC/D/E/F/G/I/K devices)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDA(1)
Operating voltage
—
2.6
3.3
3.6
V
VREF+(2)
Positive Reference Voltage
—
2.6
—
VDDA
V
—
—
VSSA
—
V
5
—
—
kΩ
—
—
15
kΩ
—
—
50
pF
—
0.2
—
—
V
—
—
—
—
—
0.5
—
—
—
With no load, middle
—
550
VREF-(2)
RLOAD(2)
Ro(2)
CLOAD(2)
Negative Reference
Voltage
Load resistance
Impedance output with
buffer OFF
Load capacitance
DAC_OUT Lower DAC_OUT voltage
min(2)
with buffer ON
DAC_OUT Higher DAC_OUT voltage
max(2)
with buffer ON
DAC_OUT Lower DAC_OUT voltage
min(2)
with buffer OFF
DAC_OUT Higher DAC_OUT voltage
max(2)
with buffer OFF
IDDA(1)
DAC current consumption
Resistive load with
buffer ON
—
No pin/pad capacitance
included
VDDA0.2
—
VDDA1LSB
—
V
mV
V
μA
82
GD32F103xx Datasheet
Symbol
Parameter
Conditions
in quiescent mode
code(0x800) on the input, VREF+
Min
Typ
Max
Unit
—
600
—
μA
—
86
—
μA
—
298
—
μA
= 3.6 V
With no load, worst
code(0xF1C) on the input, VREF+
= 3.6 V
With no load, middle
code(0x800) on the input, VREF+
IDDVREF+(1)
DAC current consumption
= 3.6 V
in quiescent mode
With no load, worst
code(0xF1C) on the input, VREF+
= 3.6 V
Tsetting
(1)
Twakeup
(2)
Update
rate(2)
Settling time
CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
—
0.3
1
μs
Wakeup from off state
—
—
5
10
μs
CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ
—
—
4
MS/s
—
55
80
—
dB
Max frequency for a correct
DAC_OUT change from
code i to i±1LSBs
Power supply rejection
PSRR(2)
ratio
(to VDDA)
(1)
(2)
4.16.
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
I2C characteristics
Table 4-40. I2C characteristics(1) (2)
Symbol
Parameter
Conditions
tSCL(H)
SCL clock high time
tSCL(L)
tsu(SDA)
Standard mode
Fast mode
Unit
Min
Max
Min
Max
—
4.0
—
0.6
—
μs
SCL clock low time
—
4.7
—
1.3
—
μs
SDA setup time
—
250
—
100
—
ns
3450
0
900
ns
th(SDA)
SDA data hold time
—
0(3)
tr(SDA/SCL)
SDA and SCL rise time
—
—
1000
—
300
ns
tf(SDA/SCL)
SDA and SCL fall time
—
—
300
—
300
ns
th(STA)
Start condition hold time
—
4.0
—
0.6
—
μs
—
4.7
—
0.6
—
μs
—
4.0
—
0.6
—
μs
—
4.7
—
1.3
—
μs
ts(STA)
ts(STO)
tbuff
(1)
Repeated Start condition setup
time
Stop condition setup time
Stop to Start condition time (bus
free)
Guaranteed by design, not tested in production.
83
GD32F103xx Datasheet
To ensure the standard mode I2C frequency, f PCLK1 must be at least 2 MHz. To ensure the fast mode I2C
frequency, fPCLK1 must be at least 4 MHz.
The device should provide a data hold time of 300 ns at least in order to bridge the undefined region of the
falling edge of SCL.
(2)
(3)
Figure 4-7. I2C bus timing diagram
tsu(STA)
SDA
70%
30%
tf(SDA)
tr(SDA)
tSCL(H)
th(STA)
SCL
tbuff
th(SDA)
tsu(SDA)
70%
30%
tSCL(L)
4.17.
tr(SCL)
tf(SCL)
tsu(STO)
SPI characteristics
Table 4-41. Standard SPI characteristics(1)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSCK
SCK clock frequency
—
—
—
27
MHz
tSCK(H)
SCK clock high time
tSCK(L)
SCK clock low time
Master mode, fPCLKx = 108 MHz,
presc = 4
Master mode, fPCLKx = 108 MHz,
presc = 4
35.13 37.13 39.13
ns
35.13 37.13 39.13
ns
SPI master mode
tV(MO)
Data output valid time
—
—
—
8
ns
tSU(MI)
Data input setup time
—
1
—
—
ns
tH(MI)
Data input hold time
—
0
—
—
ns
SPI slave mode
tSU(NSS)
NSS enable setup time
—
0
—
—
ns
tH(NSS)
NSS enable hold time
—
1
—
—
ns
tA(SO)
Data output access time
—
—
9
—
ns
tDIS(SO)
Data output disable time
—
—
11
—
ns
tV(SO)
Data output valid time
—
—
11
—
ns
tSU(SI)
Data input setup time
—
0
—
—
ns
tH(SI)
Data input hold time
—
1
—
—
ns
(1)
Based on characterization, not tested in production.
84
GD32F103xx Datasheet
Figure 4-8. SPI timing diagram - master mode
tSCK
SCK (CKPH=0 CKPL=0)
SCK (CKPH=0 CKPL=1)
SCK (CKPH=1 CKPL=0)
tSCK(H)
tSCK(L)
SCK (CKPH=1 CKPL=1)
tSU(MI)
MISO
D[0]
LF=1,FF16=0
D[7]
tH(MI)
D[0]
MOSI
D[7]
tH(MO)
tV(MO)
Figure 4-9. SPI timing diagram - slave mode
NSS
tSCK
tSU(NSS)
SCK (CKPH=0 CKPL=0)
tSCK(H)
SCK (CKPH=0 CKPL=1)
tSCK(L)
tH(NSS)
tH(SO)
tDIS(SO)
tV(SO)
tA(SO)
MISO
D[0]
D[7]
tSU(SI)
D[0]
MOSI
D[7]
tH(SI)
4.18.
I2S characteristics
Table 4-42. I2S characteristics (For GD32F103xC/D/E/F/G/I/K devices) (1) (2)
Symbol
Parameter
fCK
Clock frequency
Conditions
Master mode (data: 32 bits,
Audio frequency = 96 kHz)
Min
Typ
Max
Unit
—
6.25
—
MHz
85
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Slave mode
0
—
12.5
—
80
—
ns
—
80
—
ns
tH
Clock high time
tL
Clock low time
tV(WS)
WS valid time
Master mode
—
3
—
ns
tH(WS)
WS hold time
Master mode
—
3
—
ns
tSU(WS)
WS setup time
Slave mode
0
—
—
ns
tH(WS)
WS hold time
Slave mode
2
—
—
ns
Slave mode
—
50
—
%
Ducy(SCK)
—
I2S slave input clock duty
cycle
tSU(SD_MR)
Data input setup time
Master mode
1
—
—
ns
tsu(SD_SR)
Data input setup time
Slave mode
0
—
—
ns
Master receiver
0
—
—
ns
Slave receiver
1
—
—
ns
—
—
5
ns
6
—
—
ns
—
—
5
ns
0
—
—
ns
tH(SD_MR)
Data input hold time
tH(SD_SR)
(1)
(2)
tv(SD_ST)
Data output valid time
th(SD_ST)
Data output hold time
tv(SD_MT)
Data output valid time
th(SD_MT)
Data output hold time
Slave transmitter
(after enable edge)
Slave transmitter
(after enable edge)
Master transmitter
(after enable edge)
Master transmitter
(after enable edge)
Guaranteed by design, not tested in production.
Based on characterization, not tested in production.
Figure 4-10. I2S timing diagram - master mode
tCK
CPOL=0
tL
CPOL=1
tV(WS)
tH
tH(WS)
WS output
tV(SD_MT)
SD transmit
SD receive
tH(SD_MT)
D[0]
D[0]
tSU(SD_MR)
tH(SD_MR)
86
GD32F103xx Datasheet
Figure 4-11. I2S timing diagram - slave mode
tCK
CPOL=0
tL
CPOL=1
tH
tH(WS)
WS input
tSU(WS)
tH(SD_ST)
tV(SD_ST)
SD transmit
D[0]
SD receive
D[0]
tSU(SD_SR)
tH(SD_SR)
4.19.
USART characteristics
Table 4-43. USART characteristics(1)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSCK
SCK clock frequency
fPCLKx = 108 MHz
—
—
13.5
MHz
tSCK(H)
SCK clock high time
fPCLKx = 108 MHz
37.0
—
—
ns
tSCK(L)
SCK clock low time
fPCLKx = 108 MHz
37.0
—
—
ns
(1)
4.20.
Guaranteed by design, not tested in production.
SDIO characteristics
Table 4-44. SDIO characteristics (For GD32F103xC/D/E/F/G/I/K devices)(1)(2)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Clock frequency in data transfer mode
—
0
—
48
MHz
tW(CKL)
(3)
Clock low time
fpp = 48 MHz
10.5
11
—
ns
tW(CKH)
(3)
Clock high time
fpp = 48 MHz
9.5
10
—
ns
fPP(3)
CMD, D inputs (referenced to CK) in MMC and SD HS mode
tISU(4)
Input setup time HS
fpp = 48 MHz
4
—
—
ns
tIH(4)
Input hold time HS
fpp = 48 MHz
3
—
—
ns
13.8
ns
CMD, D outputs (referenced to CK) in MMC and SD HS mode
tOV(3)
Output valid time HS
fpp = 48 MHz
—
—
87
GD32F103xx Datasheet
Symbol
Parameter
tOH(3)
Conditions
Output hold time HS
Min
Typ
Max
12
—
—
ns
fpp = 48 MHz
Unit
CMD, D inputs (referenced to CK) in SD default mode
tISUD(4)
Input setup time SD
fpp = 24 MHz
3
—
—
ns
tIHD(4)
Input hold time SD
fpp = 24 MHz
3
—
—
ns
CMD, D outputs (referenced to CK) in SD default mode
tOVD(3)
Output valid default time SD
fpp = 24 MHz
—
2.4
2.8
ns
tOHD(3)
Output hold default time SD
fpp = 24 MHz
0.8
—
—
ns
(1)
(2)
(3)
(4)
4.21.
CLK timing is measured at 50% of VDD.
Capacitive load CL = 30 pF.
Based on characterization, not tested in production.
Guaranteed by design, not tested in production.
CAN characteristics
Refer to Table 4-30. I/O port DC characteristics for more details on the input/output
alternate function characteristics (CANTX and CANRX).
4.22.
USBD characteristics
Table 4-45. USBD start up time (For GD32F103x4/6/8/B devices)
Symbol
(1)
tSTARTUP
(1)
Parameter
Max
Unit
USBD startup time
1
μs
Guaranteed by design, not tested in production.
Table 4-46. USBD start up time (For GD32F103xC/D/E/F/G/I/K devices)
Symbol
(1)
tSTARTUP
(1)
Parameter
Max
Unit
USBD startup time
1
μs
Guaranteed by design, not tested in production.
Table 4-47. USBD DC electrical characteristics (For GD32F103x4/6/8/B devices)
Symbol
Input
levels(1)
Parameter
Conditions
Min
Typ
Max
Unit
VDD
USBD operating voltage
—
3
—
3.6
V
VDI
Differential input sensitivity
I(USBDP, USBDM)
0.2
—
—
VCM Differential common mode range
Includes VDI range
0.8
—
2.5
VSE Single ended receiver threshold
—
0.8
—
2.0
Output
VOL
Static output level low
RL of 1.5 kΩ to 3.6 V
—
0.064
0.3
levels(2)
VOH
Static output level high
RL of 15 kΩ to VSS
2.8
3.3
3.6
(1)
(2)
V
V
Guaranteed by design, not tested in production.
Based on characterization, not tested in production.
Table 4-48. USBD DC electrical characteristics (For GD32F103xC/D/E/F/G/I/K devices)
Symbol
Input
VDD
Parameter
Conditions
Min
Typ
Max
Unit
USBD operating voltage
—
3
—
3.6
V
88
GD32F103xx Datasheet
Symbol
Parameter
Conditions
Min
Typ
Max
Differential input sensitivity
I(USBDP, USBDM)
0.2
—
—
VCM Differential common mode range
Includes VDI range
0.8
—
2.5
VSE Single ended receiver threshold
—
0.8
—
2.0
levels(1)
VDI
Output
VOL
Static output level low
RL of 1.5 kΩ to 3.6 V
—
0.064
0.3
levels(2)
VOH
Static output level high
RL of 15 kΩ to VSS
2.8
3.3
3.6
(1)
(2)
Unit
V
V
Guaranteed by design, not tested in production.
Based on characterization, not tested in production.
Table 4-49. USBD full speed-electrical characteristics (For GD32F103x4/6/8/B devices)
(1)
(1)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tR
Rise time
CL = 50 pF
4
—
20
ns
tF
Fall time
CL = 50 pF
4
—
20
ns
tRFM
Rise / fall time matching
tR / tF
90
—
110
%
vCRS
Output signal crossover voltage
—
1.3
—
2.0
V
Guaranteed by design, not tested in production.
Table 4-50. USBD full speed-electrical characteristics (For GD32F103xC/D/E/F/G/I/K
devices)(1)
(1)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tR
Rise time
CL = 50 pF
4
—
20
ns
tF
Fall time
CL = 50 pF
4
—
20
ns
tRFM
Rise / fall time matching
tR / tF
90
—
110
%
vCRS
Output signal crossover voltage
—
1.3
—
2.0
V
Guaranteed by design, not tested in production.
Figure 4-12. USBD timings: definition of data signal rise and fall time
Crossover
points
Differential
data lines
VCRS
VSS
tf
4.23.
tr
EXMC characteristics
Table 4-51. Synchronous multiplexed PSRAM/NOR read timings(1)(2)(3)
Symbol
Parameter
Min
Max
Unit
tw(CLK)
EXMC_CLK period
36.8
—
ns
td(CLKL-NExL)
EXMC_CLK low to EXMC_NEx low
0
—
ns
td(CLKH-NExH)
EXMC_CLK high to EXMC_NEx high
18.4
—
ns
89
GD32F103xx Datasheet
Symbol
Parameter
Min
Max
Unit
td(CLKL-NADVL)
EXMC_CLK low to EXMC_NADV low
0
—
ns
td(CLKL-NADVH)
EXMC_CLK low to EXMC_NADV high
0
—
ns
td(CLKL-AV)
EXMC_CLK low to EXMC_Ax valid
0
—
ns
td(CLKH-AIV)
EXMC_CLK high to EXMC_Ax invalid
18.4
—
ns
td(CLKL-NOEL)
EXMC_CLK low to EXMC_NOE low
0
—
ns
td(CLKH-NOEH)
EXMC_CLK high to EXMC_NOE high
18.4
—
ns
td(CLKL-ADV)
EXMC_CLK low to EXMC_AD valid
0
—
ns
td(CLKL-ADIV)
EXMC_CLK low to EXMC_AD invalid
0
—
ns
(1)
(2)
(3)
CL = 30 pF.
Guaranteed by design, not tested in production.
Based on configure: fHCLK = 108 MHz, BurstAccessMode = Enable; Memory Type = PSRAM; WriteBurst =
Enable; CLKDivision = 3(EXMC_CLK is 4 divided by HCLK); Data Latency = 1.
Table 4-52. Synchronous multiplexed PSRAM write timings(1)(2)(3)
Symbol
Parameter
Min
Max
Unit
tw(CLK)
EXMC_CLK period
36.8
—
ns
td(CLKL-NExL)
EXMC_CLK low to EXMC_NEx low
0
—
ns
td(CLKH-NExH)
EXMC_CLK high to EXMC_NEx high
18.4
—
ns
td(CLKL-NADVL)
EXMC_CLK low to EXMC_NADV low
0
—
ns
td(CLKL-NADVH)
EXMC_CLK low to EXMC_NADV high
0
—
ns
td(CLKL-AV)
EXMC_CLK low to EXMC_Ax valid
0
—
ns
td(CLKH-AIV)
EXMC_CLK high to EXMC_Ax invalid
18.4
—
ns
td(CLKL-NWEL)
EXMC_CLK low to EXMC_NWE low
0
—
ns
td(CLKH-NWEH)
EXMC_CLK high to EXMC_NWE high
18.4
—
ns
td(CLKL-ADIV)
EXMC_CLK low to EXMC_AD invalid
0
—
ns
td(CLKL-DATA)
EXMC_A/D valid data after EXMC_CLK low
0
—
ns
th(CLKL-NBLH)
EXMC_CLK low to EXMC_NBL high
0
—
ns
(1)
(2)
(3)
CL = 30 pF.
Guaranteed by design, not tested in production.
Based on configure: fHCLK = 108 MHz, BurstAccessMode = Enable; MemoryType = PSRAM; WriteBurst =
Enable; CLKDivision = 3 (EXMC_CLK is 4 divided by HCLK); DataLatency = 1.
Table 4-53. Synchronous non-multiplexed PSRAM/NOR read timings(1)(2)(3)
Symbol
Parameter
Min
Max
Unit
tw(CLK)
EXMC_CLK period
36.8
—
ns
td(CLKL-NExL)
EXMC_CLK low to EXMC_NEx low
0
—
ns
td(CLKH-NExH)
EXMC_CLK high to EXMC_NEx high
18.4
—
ns
td(CLKL-NADVL)
EXMC_CLK low to EXMC_NADV low
0
—
ns
td(CLKL-NADVH)
EXMC_CLK low to EXMC_NADV high
0
—
ns
td(CLKL-AV)
EXMC_CLK low to EXMC_Ax valid
0
—
ns
td(CLKH-AIV)
EXMC_CLK high to EXMC_Ax invalid
18.4
—
ns
td(CLKL-NOEL)
EXMC_CLK low to EXMC_NOE low
0
—
ns
td(CLKH-NOEH)
EXMC_CLK high to EXMC_NOE high
18.4
—
ns
(1)
CL = 30 pF.
90
GD32F103xx Datasheet
(2)
(3)
Guaranteed by design, not tested in production.
Based on configure: HCLK = 108 MHz, BurstAccessMode = Enable; MemoryType = PSRAM; WriteBurst =
Enable; CLKDivision = 3 (EXMC_CLK is 4 divided by HCLK); DataLatency = 1.
Table 4-54. Synchronous non-multiplexed PSRAM write timings(1)(2)(3)
Symbol
Parameter
Min
Max
Unit
tw(CLK)
EXMC_CLK period
36.8
—
ns
td(CLKL-NExL)
EXMC_CLK low to EXMC_NEx low
0
—
ns
td(CLKH-NExH)
EXMC_CLK high to EXMC_NEx high
18.4
—
ns
td(CLKL-NADVL)
EXMC_CLK low to EXMC_NADV low
0
—
ns
td(CLKL-NADVH)
EXMC_CLK low to EXMC_NADV high
0
—
ns
td(CLKL-AV)
EXMC_CLK low to EXMC_Ax valid
0
—
ns
td(CLKH-AIV)
EXMC_CLK high to EXMC_Ax invalid
18.4
—
ns
td(CLKL-NWEL)
EXMC_CLK low to EXMC_NWE low
0
—
ns
td(CLKH-NWEH)
EXMC_CLK high to EXMC_NWE high
18.4
—
ns
td(CLKL-DATA)
EXMC_A/D valid data after EXMC_CLK low
0
—
ns
th(CLKL-NBLH)
EXMC_CLK low to EXMC_NBL high
0
—
ns
(1)
(2)
(3)
4.24.
CL = 30 pF.
Guaranteed by design, not tested in production.
Based on configure: HCLK = 108 MHz, BurstAccessMode = Enable; MemoryType = PSRAM; WriteBurst =
Enable; CLKDivision = 3(EXMC_CLK is 4 divided by HCLK); DataLatency = 1.
TIMER characteristics
Table 4-55. TIMER characteristics(1)
Symbol
Parameter
tres
Timer resolution time
fEXT
Timer external clock frequency
RES
Timer resolution
tCOUNTER
4.25.
Min
Max
Unit
—
1
—
tTIMERxCLK
fTIMERxCLK = 108 MHz
9.3
—
ns
—
0
fTIMERxCLK/2
MHz
fTIMERxCLK = 108 MHz
0
54
MHz
—
—
16
bit
—
1
65536
tTIMERxCLK
607
μs
16-bit counter clock period
when internal clock is selected
tMAX_COUNT
(1)
Conditions
Maximum possible count
fTIMERxCLK = 108 MHz 0.0093
—
—
fTIMERxCLK = 108 MHz
—
65536x65536 tTIMERxCLK
39.8
s
Guaranteed by design, not tested in production.
WDGT characteristics
Table 4-56. FWDGT min/max timeout period at 40 kHz (IRC40K)(1)
Prescaler divider
PR[2:0] bits
1/4
000
Min timeout RLD[11:0] = Max timeout RLD[11:0]
0x000
= 0xFFF
0.025
409.525
Unit
ms
91
GD32F103xx Datasheet
Prescaler divider
PR[2:0] bits
1/8
(1)
Min timeout RLD[11:0] = Max timeout RLD[11:0]
0x000
= 0xFFF
001
0.025
819.025
1/16
010
0.025
1638.025
1/32
011
0.025
3276.025
1/64
100
0.025
6552.025
1/128
101
0.025
13104.025
1/256
110 or 111
0.025
26208.025
Unit
Guaranteed by design, not tested in production.
Table 4-57. WWDGT min-max timeout value at 54 MHz (fPCLK1)(1)
PSC[2:0]
1/1
00
75.8
1/2
01
151.7
1/4
10
303.4
1/8
11
606.8
(1)
4.26.
Min timeout value
Prescaler divider
CNT[6:0] = 0x40
Unit
Max timeout value
CNT[6:0] = 0x7F
Unit
4.8
μs
9.7
19.4
ms
38.8
Guaranteed by design, not tested in production.
Parameter conditions
Unless otherwise specified, all values given for VDD = VDDA = 3.3 V, TA = 25 ℃.
92
GD32F103xx Datasheet
5.
Package information
5.1
LQFP144 package outline dimensions
Figure 5-1. LQFP144 package outline
A3
c
F
θ
A2A
A1
D
D1
108
73
109
72
0.25
L
L1
DETAIL: F
E1 E
b
b1
c1 c
37
144
BASE METAL
WITH PLATING
1
e
b
BB
SECTION B-B
36
Table 5-1. LQFP144 package dimensions
Symbol
Min
Typ
Max
A
—
—
1.60
A1
0.05
—
0.15
A2
1.35
1.40
1.45
A3
0.59
0.64
0.69
b
0.18
—
0.26
b1
0.17
0.20
0.23
c
0.13
—
0.17
c1
0.12
0.13
0.14
D
21.80
22.00
22.20
D1
19.90
20.00
20.10
E
21.80
22.00
22.20
E1
19.90
20.00
20.10
e
—
0.50
—
L
0.45
—
0.75
L1
—
1.00
—
θ
0°
—
7°
(Original dimensions are in millimeters)
93
GD32F103xx Datasheet
Figure 5-2. LQFP144 recommended footprint
22.70
109
144
20.30
108
36
73
72
37
17.80
22.70
0.30
1
1.20
0.50
(Original dimensions are in millimeters)
94
GD32F103xx Datasheet
5.2
LQFP100 package outline dimensions
Figure 5-3. LQFP100 package outline
A3
A2 A
c
θ
A1
F
eB
D
D1
51
75
0.25
50
76
L
L1
DETAIL: F
E1
E
b
b1
100
c1 c
26
BASE METAL
1
25
b
e
WITH PLATING
B B
SECTION B-B
Table 5-2. LQFP100 package dimensions
Symbol
Min
Typ
Max
A
—
—
1.60
A1
0.05
—
0.15
A2
1.35
1.40
1.45
A3
0.59
0.64
0.69
b
0.18
—
0.26
b1
0.17
0.20
0.23
c
0.13
—
0.17
c1
0.12
0.13
0.14
D
15.80
16.00
16.20
D1
13.90
14.00
14.10
E
15.80
16.00
16.20
E1
13.90
14.00
14.10
e
—
0.50
—
eB
15.05
—
15.35
L
0.45
—
0.75
L1
—
1.00
—
θ
0°
—
7°
(Original dimensions are in millimeters)
95
GD32F103xx Datasheet
Figure 5-4. LQFP100 recommended footprint
16.70
76
100
14.30
75
25
51
50
26
12.30
16.70
0.30
1
1.20
0.50
(Original dimensions are in millimeters)
96
GD32F103xx Datasheet
5.3
LQFP64 package outline dimensions
Figure 5-5. LQFP64 package outline
A3
A2 A
θ
c
A1
F
eB
D
D1
33
48
0.25
32
49
L
L1
DETAIL: F
E1
E
b
b1
c1 c
BASE METAL
64
17
WITH PLATING
1
e
b
SECTION B-B
16
B B
Table 5-3. LQFP64 package dimensions
Symbol
Min
Typ
Max
A
—
—
1.60
A1
0.05
—
0.15
A2
1.35
1.40
1.45
A3
0.59
0.64
0.69
b
0.18
—
0.26
b1
0.17
0.20
0.23
c
0.13
—
0.17
c1
0.12
0.13
0.14
D
11.80
12.00
12.20
D1
9.90
10.00
10.10
E
11.80
12.00
12.20
E1
9.90
10.00
10.10
e
—
0.50
—
eB
11.25
—
11.45
L
0.45
—
0.75
L1
—
1.00
—
θ
0°
—
7°
(Original dimensions are in millimeters)
97
GD32F103xx Datasheet
Figure 5-6. LQFP64 recommended footprint
12.70
64
49
10.30
48
16
33
17
32
7.80
12.70
0.30
1
1.20
0.50
(Original dimensions are in millimeters)
98
GD32F103xx Datasheet
LQFP48 package outline dimensions
Figure 5-7. LQFP48 package outline
A3
A2 A
θ
A1
c
5.4
F
eB
D
D1
36
0.25
25
L
24
37
L1
DETAIL: F
E1 E
b
b1
13
48
c1c
BASE METAL
WITH PLATING
1
12
b
e
SECTION B-B
BB
Table 5-4. LQFP48 package dimensions
Symbol
Min
Typ
Max
A
—
—
1.60
A1
0.05
—
0.15
A2
1.35
1.40
1.45
A3
0.59
0.64
0.69
b
0.18
—
0.26
b1
0.17
0.20
0.23
c
0.13
—
0.17
c1
0.12
0.13
0.14
D
8.80
9.00
9.20
D1
6.90
7.00
7.10
E
8.80
9.00
9.20
E1
6.90
7.00
7.10
e
—
0.50
—
eB
8.10
—
8.25
L
0.45
—
0.75
L1
—
1.00
—
θ
0°
—
7°
(Original dimensions are in millimeters)
99
GD32F103xx Datasheet
Figure 5-8. LQFP48 recommended footprint
9.70
37
48
7.30
36
12
25
24
13
5.80
9.70
0.30
1
1.20
0.50
(Original dimensions are in millimeters)
100
GD32F103xx Datasheet
QFN36 package outline dimensions
Figure 5-9. QFN36 package outline
Nd
D2
D
36
36
1
1
h
PIN 1#
Laser Mark
2
e
b1
b
L1
L
E2
Ne
h
E
2
EXPOSED THERMAL
PAD ZONE
TOP VIEW
BOTTOM VIEW
A1
A
c
5.5
SIDE VIEW
Table 5-5. QFN36 package dimensions
Symbol
Min
Typ
Max
A
0.80
0.85
0.90
A1
0
0.02
0.05
b
0.18
0.23
0.30
b1
—
0.16
—
c
0.18
0.20
0.23
D
5.90
6.00
6.10
D2
3.80
3.90
4.00
E
5.90
6.00
6.10
E2
3.80
3.90
4.00
e
—
0.50
—
h
0.30
0.35
0.40
L
0.50
0.55
0.60
L1
—
0.10
—
Nd
3.95
4.00
4.05
Ne
3.95
4.00
4.05
(Original dimensions are in millimeters)
101
GD32F103xx Datasheet
Figure 5-10. QFN36 recommended footprint
6.70
36
28
4.80
1
4.28
6.70
3.85
0.28
27
3.85
9
10
18
19
0.95
0.50
(Original dimensions are in millimeters)
102
GD32F103xx Datasheet
5.6
Thermal characteristics
Thermal resistance is used to characterize the thermal performance of the package device,
which is represented by the Greek letter “θ”. For semiconductor devices, thermal resistance
represents the steady-state temperature rise of the chip junction due to the heat dissipated
on the chip surface.
θJA: Thermal resistance, junction-to-ambient.
θJB: Thermal resistance, junction-to-board.
θJC: Thermal resistance, junction-to-case.
ᴪJB: Thermal characterization parameter, junction-to-board.
ᴪJT: Thermal characterization parameter, junction-to-top center.
θJA =(TJ -TA )/PD
(5-1)
θJB =(TJ -TB )/PD
(5-2)
θJC =(TJ -TC )/PD
(5-3)
Where, TJ = Junction temperature.
TA = Ambient temperature
TB = Board temperature
TC = Case temperature which is monitoring on package surface
PD = Total power dissipation
θJA represents the resistance of the heat flows from the heating junction to ambient air. It is
an indicator of package heat dissipation capability. Lower θJA can be considerate as better
overall thermal performance. θJA is generally used to estimate junction temperature.
θJB is used to measure the heat flow resistance between the chip surface and the PCB board.
θJC represents the thermal resistance between the chip surface and the package top case.
θJC is mainly used to estimate the heat dissipation of the system (using heat sink or other heat
dissipation methods outside the device package).
Table 5-6. Package thermal characteristics(1)
Symbol
θJA
θJB
Condition
Natural convection, 2S2P PCB
Cold plate, 2S2P PCB
Package
Value
LQFP144
48.76
LQFP100
57.42
LQFP64
61.80
LQFP48
64.40
QFN36
43.20
LQFP144
35.00
Unit
°C/W
°C/W
103
GD32F103xx Datasheet
Symbol
θJC
ᴪJB
ᴪJT
(1)
Condition
Cold plate, 2S2P PCB
Natural convection, 2S2P PCB
Natural convection, 2S2P PCB
Package
Value
LQFP100
31.68
LQFP64
42.83
LQFP48
42.32
QFN36
16.51
LQFP144
12.03
LQFP100
13.85
LQFP64
21.98
LQFP48
22.47
QFN36
16.18
LQFP144
35.32
LQFP100
41.28
LQFP64
43.05
LQFP48
42.42
QFN36
16.64
LQFP144
1.86
LQFP100
0.75
LQFP64
1.58
LQFP48
1.74
QFN36
1.07
Unit
°C/W
°C/W
°C/W
Thermal characteristics are based on simulation, and meet JEDEC specification.
104
GD32F103xx Datasheet
6.
Ordering Information
Table 6-1. Part ordering code for GD32F103xx devices
Ordering code
Flash (KB)
Package
Package type
GD32F103ZKT6
3072
LQFP144
Green
GD32F103ZIT6
2048
LQFP144
Green
GD32F103ZGT6
1024
LQFP144
Green
GD32F103ZFT6
768
LQFP144
Green
GD32F103ZET6
512
LQFP144
Green
GD32F103ZDT6
384
LQFP144
Green
GD32F103ZCT6
256
LQFP144
Green
GD32F103VKT6
3072
LQFP100
Green
GD32F103VIT6
2048
LQFP100
Green
GD32F103VGT6
1024
LQFP100
Green
GD32F103VFT6
768
LQFP100
Green
GD32F103VET6
512
LQFP100
Green
GD32F103VDT6
384
LQFP100
Green
GD32F103VCT6
256
LQFP100
Green
GD32F103VBT6
128
LQFP100
Green
GD32F103V8T6
64
LQFP100
Green
GD32F103RKT6
3072
LQFP64
Green
GD32F103RIT6
2048
LQFP64
Green
GD32F103RGT6
1024
LQFP64
Green
GD32F103RFT6
768
LQFP64
Green
GD32F103RET6
512
LQFP64
Green
GD32F103RDT6
384
LQFP64
Green
GD32F103RCT6
256
LQFP64
Green
GD32F103RBT6
128
LQFP64
Green
Temperature
operating range
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
105
GD32F103xx Datasheet
Ordering code
Flash (KB)
Package
Package type
GD32F103R8T6
64
LQFP64
Green
GD32F103R6T6
32
LQFP64
Green
GD32F103R4T6
16
LQFP64
Green
GD32F103CBT6
128
LQFP48
Green
GD32F103C8T6
64
LQFP48
Green
GD32F103C6T6
32
LQFP48
Green
GD32F103C4T6
16
LQFP48
Green
GD32F103TBU6
128
QFN36
Green
GD32F103T8U6
64
QFN36
Green
GD32F103T6U6
32
QFN36
Green
GD32F103T4U6
16
QFN36
Green
Temperature
operating range
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
Industrial
-40°C to +85°C
106
GD32F103xx Datasheet
7.
Revision History
Table 7-1. Revision history
Revision No.
Description
Date
1.0
Initial Release
Mar.8, 2013
1.
2.2
Characteristics values modified and package data
updated, refers to Electrical characteristics and
Oct.10, 2013
Package information.
1.
2.3
Maximum HXTAL frequency value corrected in Table 413. High speed external clock (HXTAL) generated from
Oct.20, 2014
a crystal/ceramic characteristics.
2.4
1.
Repair history accumulation error.
1.
Add missing pin definitions for GD32F103Rx, 8 to 11,18
2.5
and 19 pins in Table 2-7. GD32F103Rx LQFP64 pin
Jan.24, 2018
Dec.10, 2018
definitions.
2.6
2.7
1.
Delete EXMC_NADV in PB7 of Table 2-7. GD32F103Rx
LQFP64 pin definitions.
1.
Delete the PD0,PD1 remap to OSC pins information in
July 22, 2019
Feb.15, 2020
packages no less than100 pins, refers to Pin definitions.
1.
Integrate the boot loader address in chapter Memory
map together.
2.8
2.
Add description of VREF+ and VREF- connection in chapter
Sep.18, 2020
Analog to digital converter (ADC).
3.
Arm® Cortex® written format modification.
1.
Table 4-3 update, refers to Table 4-3. Power
consumption characteristics (for GD32F103x4/6/8/B
2.9
devices) and Table 4-4. Power consumption
Apr.12, 2021
characteristics (for GD32F103xC/D/E/F/G/I/K devices) .
2.10
1.
Table 5-2 update, refers to Package information.
1.
Delete PD0 / PD1 from OSCIN / OSCOUT remap
June 22, 2021
information in chapter 2.6.3 to 2.6.5, ETM related
functions modification in chapter 2.6.2 to 2.6.5, refers to
Pin definitions.
2.11
2.
Modify pinouts, refers to Pinouts and pin assignment.
3.
Characteristics values modified, and add new tables,
refers to Electrical characteristics.
4.
May.23, 2022
Package information and Ordering information update,
refer to Package information and Ordering information.
5.
Modify Vesd (HBM) and Vesd (CDM) standards, refers to
Electrical characteristics.
6.
Modify SPI/I2S diagrams, refer to SPI characteristics
107
GD32F103xx Datasheet
and I2S characteristics.
7.
Modify I2C characteristics, refer to I2C characteristics.
8.
Power consumption characteristics update, refer to Power
consumption.
1.
Modify LQFP64 package information, refer to LQFP64
package outline dimensions.
2.12
2.
Update NRST external pin circuit, refer to Figure 4-6.
Jun.30, 2022
Recommended external NRST pin circuit(1).
3.
EXMC related pin update, refer to Pin definitions.
108
GD32F103xx Datasheet
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