GigaDevice Semiconductor Inc.
GD32F107xx
Arm® Cortex®-M3 32-bit MCU
Datasheet
GD32F107xx Datasheet
Table of Contents
Table of Contents ........................................................................................................... 1
List of Figures ................................................................................................................ 3
List of Tables .................................................................................................................. 4
1. General description ................................................................................................. 5
2. Device overview ....................................................................................................... 6
2.1.
Device information ...................................................................................................... 6
2.2.
Block diagram .............................................................................................................. 8
2.3.
Pinouts and pin assignment ....................................................................................... 9
2.4.
Memory map .............................................................................................................. 12
2.5.
Clock tree ................................................................................................................... 16
2.6.
Pin definitions ............................................................................................................ 17
2.6.1.
GD32F107Zx LQFP144 pin definitions ................................................................................. 17
2.6.2.
GD32F107Vx LQFP100 pin definitions ................................................................................ 26
2.6.3.
GD32F107Rx LQFP64 pin definitions .................................................................................. 33
3. Functional description .......................................................................................... 38
3.1.
Arm® Cortex®-M3 core ............................................................................................... 38
3.2.
On-chip memory ........................................................................................................ 38
3.3.
Clock, reset and supply management ...................................................................... 39
3.4.
Boot modes ................................................................................................................ 39
3.5.
Power saving modes ................................................................................................. 40
3.6.
Analog to digital converter (ADC) ............................................................................ 40
3.7.
Digital to analog converter (DAC) ............................................................................. 41
3.8.
DMA ............................................................................................................................ 41
3.9.
General-purpose inputs/outputs (GPIOs) ................................................................ 41
3.10.
Timers and PWM generation ................................................................................. 42
3.11.
Real time clock (RTC) ............................................................................................ 43
3.12.
Inter-integrated circuit (I2C) .................................................................................. 43
3.13.
Serial peripheral interface (SPI) ............................................................................ 44
3.14.
Universal synchronous asynchronous receiver transmitter (USART) ............... 44
3.15.
Inter-IC sound (I2S) ................................................................................................ 44
1
GD32F107xx Datasheet
3.16.
Universal serial bus full-speed (USBFS) .............................................................. 45
3.17.
Controller area network (CAN) .............................................................................. 45
3.18.
Ethernet MAC interface .......................................................................................... 45
3.19.
External memory controller (EXMC) ..................................................................... 45
3.20.
Debug mode ........................................................................................................... 46
3.21.
Package and operation temperature ..................................................................... 46
4. Electrical characteristics ....................................................................................... 47
4.1.
Absolute maximum ratings ....................................................................................... 47
4.2.
Recommended DC characteristics ........................................................................... 47
4.3.
Power consumption .................................................................................................. 48
4.4.
EMC characteristics .................................................................................................. 49
4.5.
Power supply supervisor characteristics ................................................................ 49
4.6.
Electrical sensitivity .................................................................................................. 50
4.7.
External clock characteristics .................................................................................. 51
4.8.
Internal clock characteristics ................................................................................... 52
4.9.
PLL characteristics.................................................................................................... 53
4.10.
Memory characteristics ......................................................................................... 53
4.11.
GPIO characteristics .............................................................................................. 53
4.12.
ADC characteristics ............................................................................................... 54
4.13.
DAC characteristics ............................................................................................... 54
4.14.
I2C characteristics ................................................................................................. 54
4.15.
SPI characteristics ................................................................................................. 55
5. Package information.............................................................................................. 56
6. Ordering information ............................................................................................. 58
7. Revision history ..................................................................................................... 59
2
GD32F107xx Datasheet
List of Figures
Figure 2-1. GD32F107xx block diagram .................................................................................................... 8
Figure 2-2. GD32F107Zx LQFP144 pinouts ............................................................................................... 9
Figure 2-3. GD32F107Vx LQFP100 pinouts ............................................................................................. 10
Figure 2-4. GD32F107Rx LQFP64 pinouts ............................................................................................... 11
Figure 2-5. GD32F107xx clock tree .......................................................................................................... 16
Figure 5-1. LQFP package outline............................................................................................................ 56
3
GD32F107xx Datasheet
List of Tables
Table 2-1. GD32F107xx devices features and peripheral list .................................................................. 6
Table 2-2. GD32F107xx devices features and peripheral list (continued) ............................................. 7
Table 2-3. GD32F107xx memory map ...................................................................................................... 12
Table 2-4. GD32F107Zx LQFP144 pin definitions ................................................................................... 17
Table 2-5. GD32F107Vx LQFP100 pin definitions ................................................................................... 26
Table 2-6. GD32F107Rx LQFP64 pin definitions .................................................................................... 33
Table 4-1. Absolute maximum ratings ..................................................................................................... 47
Table 4-2. DC operating conditions ......................................................................................................... 47
Table 4-3. Power consumption characteristics ...................................................................................... 48
Table 4-4. EMS characteristics ................................................................................................................. 49
Table 4-5. EMI characteristics .................................................................................................................. 49
Table 4-6.Power supply supervisor characteristics............................................................................... 49
Table 4-7. ESD characteristics ................................................................................................................. 50
Table 4-8. Static latch-up characteristics ................................................................................................ 50
Table 4-9. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics ... 51
Table 4-10. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics .. 51
Table 4-11. High speed internal clock (IRC8M) characteristics ............................................................ 52
Table 4-12. Low speed internal clock (IRC40K) characteristics ........................................................... 52
Table 4-13. PLL characteristics ................................................................................................................ 53
Table 4-14. Flash memory characteristics .............................................................................................. 53
Table 4-15. I/O port characteristics .......................................................................................................... 53
Table 4-16. ADC characteristics ............................................................................................................... 54
Table 4-17. DAC characteristics ............................................................................................................... 54
Table 4-18. I2C characteristics ................................................................................................................. 54
Table 4-19. SPI characteristics ................................................................................................................. 55
Table 5-1. LQFP package dimensions ..................................................................................................... 57
Table 6-1. Part ordering code for GD32F107xx devices ........................................................................ 58
Table 7-1. Revision history ....................................................................................................................... 59
4
GD32F107xx Datasheet
1.
General description
The GD32F107xx device belongs to the connectivity line of GD32 MCU Family. It is a 32-bit
general-purpose microcontroller based on the Arm® Cortex®-M3 RISC core with enhanced
connectivity performance and best ratio in terms of processing power, reduced power
consumption and peripheral set. The Cortex®-M3 is a next generation processor core which
is tightly coupled with a Nested Vectored Interrupt Controller (NVIC), SysTick timer and
advanced debug support.
The GD32F107xx device incorporates the Arm® Cortex®-M3 32-bit processor core operating
at 108 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It
provides up to 1 MB on-chip Flash memory and 96 KB SRAM memory. An extensive range
of enhanced I/Os and peripherals connected to two APB buses. The devices offer up to two
12-bit ADCs, up to two 12-bit DACs, up to four general-purpose 16-bit timers, two basic timers
plus one PWM advanced-control timer, as well as standard and advanced communication
interfaces: up to three SPIs, two I2Cs, three USARTs, two UARTs, two I2Ss, two CANs, an
USBFS and an Ethernet MAC.
The device operates from a 2.6 to 3.6 V power supply and available in –40 to +85 °C
temperature range. Several power saving modes provide the flexibility for maximum
optimization between wakeup latency and power consumption, an especially important
consideration in low power applications.
The above features make the GD32F107xx devices suitable for a wide range of
interconnection applications, especially in areas such as industrial control, motor drives,
power monitor and alarm systems, consumer and handheld equipment, POS, vehicle GPS,
LED display and so on.
5
GD32F107xx Datasheet
2.
Device overview
2.1.
Device information
Table 2-1. GD32F107xx devices features and peripheral list
GD32F107xx
Part Number
RC
RD
RE
RF
RG
VB
VC
Flash (KB)
128
256
384
512
768
1024
128
256
SRAM (KB)
96
96
96
96
96
96
96
96
Timers
RB
GPTM(16
4
4
4
4
4
4
4
4
bit)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
Advanced
1
1
1
1
1
1
1
1
TM(16 bit)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
SysTick
1
1
1
1
1
1
1
1
Basic TM(16
2
2
2
2
2
2
2
2
bit)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
Watchdog
2
2
2
2
2
2
2
2
RTC
1
1
1
1
1
1
1
1
U(S)ART
5
5
5
5
5
5
5
5
1
1
2
2
2
2
1
1
(0)
(0)
(0-1)
(0-1)
(0-1)
(0-1)
(0)
(0)
3
3
3
3
3
3
3
3
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
2
2
2
2
2
2
2
2
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
CAN 2.0B
2
2
2
2
2
2
2
2
USBFS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
GPIO
51
51
51
51
51
51
80
80
EXMC
0
0
0
0
0
0
1
1
EXTI
16
16
16
16
16
16
16
16
Units
2
2
2
2
2
2
2
2
Channels
16
16
16
16
16
16
16
16
2
2
2
2
2
2
2
2
Connectivity
I2C
SPI
I2S
Ethernet
ADC
MAC
DAC
6
GD32F107xx Datasheet
LQFP64
Package
LQFP100
Table 2-2. GD32F107xx devices features and peripheral list (continued)
GD32F107xx
Part Number
VE
VF
VG
ZC
ZD
ZE
ZF
ZG
Flash (KB)
384
512
768
1024
256
384
512
768
1024
SRAM (KB)
96
96
96
96
96
96
96
96
96
Connectivity
Timers
VD
GPTM(16
4
4
4
4
4
4
4
4
4
bit)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
(1-4)
Advanced
1
1
1
1
1
1
1
1
1
TM(16 bit)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
(0)
SysTick
1
1
1
1
1
1
1
1
1
Basic TM(16
2
2
2
2
2
2
2
2
2
bit)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
(5-6)
Watchdog
2
2
2
2
2
2
2
2
2
RTC
1
1
1
1
1
1
1
1
1
U(S)ART
5
5
5
5
5
5
5
5
5
I2C
2
2
2
2
2
2
2
2
2
SPI
3
3
3
3
3
3
3
3
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
(0-2)
2
2
2
2
2
2
2
2
2
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
(1-2)
CAN 2.0B
2
2
2
2
2
2
2
2
2
USBFS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
GPIO
80
80
80
80
112
112
112
112
112
EXMC
1
1
1
1
1
1
1
1
1
EXTI
16
16
16
16
16
16
16
16
16
Units
2
2
2
2
2
2
2
2
2
Channels
16
16
16
16
16
16
16
16
16
DAC
2
2
2
2
2
2
2
2
2
I2S
Ethernet
MAC
ADC
3
(0-2)
Package
LQFP100
LQFP144
7
GD32F107xx Datasheet
2.2.
Block diagram
Figure 2-1. GD32F107xx block diagram
SW/JTAG
TPIU
NVIC
ICode DCode System
Arm Cortex-M3
Processor
Fmax:108MHz
POR/ PDR
Flash
Memory
Controller
Ibus
Flash
Memory
PLL
F max : 108MHz
Dbus
FMC
Master
Master
ENET
Slave
Master
Slave
EXMC
CRC
LDO
1.2V
RCU
AHB Peripherals
Slave
AHB Matrix
GP DMA 12 chs
USBFS
SRAM
Controller
AHB to APB
Bridge2
IRC
8MHz
SRAM
HXTAL
3-25MHz
AHB to APB
Bridge1
Slave
LVD
Interrput request
CAN0
USART0
Slave
12-bit
SAR ADC
Slave
SPI0
WWDGT
ADC0~1
TIMER1~3
EXTI
SPI1~2
GPIOA
USART1~2
GPIOB
I2C0
Powered By V DDA
GPIOE
APB1: Fmax = 54MHZ
GPIOD
APB2: Fmax = 108MHz
GPIOC
Powered By VDDA
I2C1
FWDGT
RTC
GPIOF
DAC
GPIOG
TIMER4~6
TIMER0
UART3~4
CAN1
8
GD32F107xx Datasheet
2.3.
Pinouts and pin assignment
Figure 2-2. GD32F107Zx LQFP144 pinouts
PA14
PA15
PC10
PC11
PC12
PD0
PD1
PD2
PD3
PD4
PD5
VSS_10
VDD_10
PD6
PD7
PG9
PG10
PG11
PG12
PG13
PG14
VSS_11
VDD_11
PG15
PB4
PB3
PB5
PB6
PB7
BOOT0
PB8
PB9
PE0
PE1
VSS_3
VDD_3
144143142141140139138137136135134133 132131130129128127126125124123122121120 119118117116115114113112111110109
PE2
1
108
PE3
PE4
2
107
VSS_2
3
106
NC
PE5
PE6
4
105
PA13
5
104
PA12
VBAT
6
103
PA11
PC13-TAMPER-RTC
PC14-OSC32IN
7
102
PA10
8
101
PA9
PC15-OSC32OUT
9
100
PA8
PF0
10
99
PC9
PF1
11
98
PC8
PF2
12
97
PC7
PF3
PF4
13
96
PC6
14
95
VDD_9
PF5
15
94
VSS_9
VSS_5
16
93
PG8
92
PG7
91
PG6
90
PG5
89
PG4
88
PG3
VDD_2
VDD_5
17
PF6
18
PF7
19
PF8
20
PF9
21
PF10
22
87
PG2
OSCIN
23
86
PD15
OSCOUT
GigaDevice GD32F107Zx
LQFP144
24
85
PD14
NRST
25
84
VDD_8
PC0
26
83
VSS_8
PC1
27
82
PD13
PC2
28
81
PD12
PC3
VSSA
29
80
PD11
30
79
PD10
VREFVREF+
31
78
PD9
32
77
PD8
VDDA
33
76
PB15
PA0_WKUP
34
75
PB14
PA1
35
74
PB13
PA2
36
73
PB12
37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72
VDD_1
VSS_1
PB11
PB10
PE15
PE13
PE14
PE12
PE11
VDD_7
PE10
VSS_7
PE8
PE9
PE7
PG1
PG0
PF15
PF14
VDD_6
PF13
VSS_6
PF12
PB2
PF11
PB1
PC5
PB0
PA7
PC4
PA6
PA5
VDD_4
PA4
VSS_4
PA3
9
GD32F107xx Datasheet
Figure 2-3. GD32F107Vx LQFP100 pinouts
PA14
PA15
PC10
PC11
PC12
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PB4
PB3
PB5
PB6
PB7
BOOT0
PB8
PB9
PE0
PE1
VSS_3
VDD_3
PE2
1
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
75
PE3
PE4
2
74
VSS_2
3
73
NC
PE5
PE6
4
72
PA13
5
71
PA12
VBAT
6
PC13-TAMPER-RTC
PC14-OSC32IN
7
70
69
PA10
8
68
PA9
PC15-OSC32OUT
9
67
PA8
VSS_5
10
66
PC9
VDD_5
11
65
PC8
64
PC7
63
PC6
14
62
PD15
OSCIN
12
GigaDevice GD32F107Vx
LQFP100
VDD_2
PA11
OSCOUT
NRST
PC0
13
15
61
PD14
PC1
16
60
PD13
PC2
PC3
17
59
PD12
18
58
PD11
VSSA
19
57
PD10
VREFVREF+
20
56
PD9
21
55
PD8
VDDA
22
54
PB15
PA0-WKUP
23
53
PB14
PA1
24
52
PB13
PA2
25
51
PB12
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
VSS_1
VDD_1
PB11
PB10
PE15
PE14
PE13
PE11
PE12
PE10
PE9
PE8
PE7
PB2
PB1
PC5
PB0
PA7
PC4
PA6
PA5
PA4
VDD_4
PA3
VSS_4
10
GD32F107xx Datasheet
Figure 2-4. GD32F107Rx LQFP64 pinouts
PA14
PA15
PC10
PC11
PD2
PC12
PB3
PB4
PB5
PB6
PB7
BOOT0
PB8
PB9
VSS_3
VDD_3
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
VBAT
1
48
VDD_2
PC13-TAMPER-RTC
2
47
VSS_2
PC14-OSC32IN
3
46
PA13
PC15-OSC32OUT
PD0-OSCIN
4
45
PA12
5
44
PA11
PD1 OSCOUT
6
43
PA10
42
PA9
NRST
PC0
7
PC1
9
PC2
PC3
VSSA
GigaDevice GD32F107Rx
LQFP64
41
PA8
40
PC9
10
39
PC8
11
38
PC7
12
37
PC6
VDDA
13
36
PB15
PA0-WKUP
14
35
PB14
PA1
15
34
PB13
PA2
16
33
PB12
8
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
VDD_1
VSS_1
PB11
PB10
PB2
PB1
PC5
PB0
PC4
PA7
PA6
PA5
PA4
VDD_4
VSS_4
PA3
11
GD32F107xx Datasheet
2.4.
Memory map
Table 2-3. GD32F107xx memory map
Pre-defined
Regions
Bus
External
device
AHB
Address
Peripherals
0xA000 0000 - 0xA000 0FFF
EXMC - SWREG
0x9000 0000 - 0x9FFF FFFF
EXMC - PC CARD
0x7000 0000 - 0x8FFF FFFF
EXMC - NAND
External RAM
EXMC 0x6000 0000 - 0x6FFF FFFF
NOR/PSRAM/SRA
M
Peripheral
AHB
0x5000 0000 - 0x5003 FFFF
USBFS
0x4008 0000 - 0x4FFF FFFF
Reserved
0x4004 0000 - 0x4007 FFFF
Reserved
0x4002 BC00 - 0x4003 FFFF
Reserved
0x4002 B000 - 0x4002 BBFF
Reserved
0x4002 A000 - 0x4002 AFFF
Reserved
0x4002 8000 - 0x4002 9FFF
ENET
0x4002 6800 - 0x4002 7FFF
Reserved
0x4002 6400 - 0x4002 67FF
Reserved
0x4002 6000 - 0x4002 63FF
Reserved
0x4002 5000 - 0x4002 5FFF
Reserved
0x4002 4000 - 0x4002 4FFF
Reserved
0x4002 3C00 - 0x4002 3FFF
Reserved
0x4002 3800 - 0x4002 3BFF
Reserved
0x4002 3400 - 0x4002 37FF
Reserved
0x4002 3000 - 0x4002 33FF
CRC
0x4002 2C00 - 0x4002 2FFF
Reserved
0x4002 2800 - 0x4002 2BFF
Reserved
0x4002 2400 - 0x4002 27FF
Reserved
0x4002 2000 - 0x4002 23FF
FMC
0x4002 1C00 - 0x4002 1FFF
Reserved
0x4002 1800 - 0x4002 1BFF
Reserved
0x4002 1400 - 0x4002 17FF
Reserved
0x4002 1000 - 0x4002 13FF
RCU
0x4002 0C00 - 0x4002 0FFF
Reserved
0x4002 0800 - 0x4002 0BFF
Reserved
0x4002 0400 - 0x4002 07FF
DMA1
0x4002 0000 - 0x4002 03FF
DMA0
0x4001 8400 - 0x4001 FFFF
Reserved
12
GD32F107xx Datasheet
Pre-defined
Regions
Bus
APB2
APB1
Address
Peripherals
0x4001 8000 - 0x4001 83FF
Reserved
0x4001 7C00 - 0x4001 7FFF
Reserved
0x4001 7800 - 0x4001 7BFF
Reserved
0x4001 7400 - 0x4001 77FF
Reserved
0x4001 7000 - 0x4001 73FF
Reserved
0x4001 6C00 - 0x4001 6FFF
Reserved
0x4001 6800 - 0x4001 6BFF
Reserved
0x4001 5C00 - 0x4001 67FF
Reserved
0x4001 5800 - 0x4001 5BFF
Reserved
0x4001 5400 - 0x4001 57FF
Reserved
0x4001 5000 - 0x4001 53FF
Reserved
0x4001 4C00 - 0x4001 4FFF
Reserved
0x4001 4800 - 0x4001 4BFF
Reserved
0x4001 4400 - 0x4001 47FF
Reserved
0x4001 4000 - 0x4001 43FF
Reserved
0x4001 3C00 - 0x4001 3FFF
Reserved
0x4001 3800 - 0x4001 3BFF
USART0
0x4001 3400 - 0x4001 37FF
Reserved
0x4001 3000 - 0x4001 33FF
SPI0
0x4001 2C00 - 0x4001 2FFF
TIMER0
0x4001 2800 - 0x4001 2BFF
ADC1
0x4001 2400 - 0x4001 27FF
ADC0
0x4001 2000 - 0x4001 23FF
GPIOG
0x4001 1C00 - 0x4001 1FFF
GPIOF
0x4001 1800 - 0x4001 1BFF
GPIOE
0x4001 1400 - 0x4001 17FF
GPIOD
0x4001 1000 - 0x4001 13FF
GPIOC
0x4001 0C00 - 0x4001 0FFF
GPIOB
0x4001 0800 - 0x4001 0BFF
GPIOA
0x4001 0400 - 0x4001 07FF
EXTI
0x4001 0000 - 0x4001 03FF
AFIO
0x4000 CC00 - 0x4000 FFFF
Reserved
0x4000 C800 - 0x4000 CBFF
Reserved
0x4000 C400 - 0x4000 C7FF
Reserved
0x4000 C000 - 0x4000 C3FF
Reserved
0x4000 8000 - 0x4000 BFFF
Reserved
0x4000 7C00 - 0x4000 7FFF
Reserved
0x4000 7800 - 0x4000 7BFF
Reserved
0x4000 7400 - 0x4000 77FF
DAC
0x4000 7000 - 0x4000 73FF
PMU
13
GD32F107xx Datasheet
Pre-defined
Regions
Bus
Address
Peripherals
0x4000 6C00 - 0x4000 6FFF
BKP
0x4000 6800 - 0x4000 6BFF
CAN1
0x4000 6400 - 0x4000 67FF
CAN0
0x4000 6000 - 0x4000 63FF
SRAM
AHB
Reserved
0x4000 5800 - 0x4000 5BFF
I2C1
0x4000 5400 - 0x4000 57FF
I2C0
0x4000 5000 - 0x4000 53FF
UART4
0x4000 4C00 - 0x4000 4FFF
UART3
0x4000 4800 - 0x4000 4BFF
USART2
0x4000 4400 - 0x4000 47FF
USART1
0x4000 4000 - 0x4000 43FF
Reserved
0x4000 3C00 - 0x4000 3FFF
SPI2/I2S2
0x4000 3800 - 0x4000 3BFF
SPI1/I2S1
0x4000 3400 - 0x4000 37FF
Reserved
0x4000 3000 - 0x4000 33FF
FWDGT
0x4000 2C00 - 0x4000 2FFF
WWDGT
0x4000 2800 - 0x4000 2BFF
RTC
0x4000 2400 - 0x4000 27FF
Reserved
0x4000 2000 - 0x4000 23FF
Reserved
0x4000 1C00 - 0x4000 1FFF
Reserved
0x4000 1800 - 0x4000 1BFF
Reserved
0x4000 1400 - 0x4000 17FF
TIMER6
0x4000 1000 - 0x4000 13FF
TIMER5
0x4000 0C00 - 0x4000 0FFF
TIMER4
0x4000 0800 - 0x4000 0BFF
TIMER3
0x4000 0400 - 0x4000 07FF
TIMER2
0x4000 0000 - 0x4000 03FF
TIMER1
0x2007 0000 - 0x3FFF FFFF
Reserved
0x2006 0000 - 0x2006 FFFF
Reserved
0x2003 0000 - 0x2005 FFFF
Reserved
0x2002 0000 - 0x2002 FFFF
Reserved
0x2001 C000 - 0x2001 FFFF
Reserved
0x2001 8000 - 0x2001 BFFF
Reserved
0x2000 0000 - 0x2000 4FFF
AHB
512 bytes
0x4000 5C00 - 0x4000 5FFF
0x2000 5000 - 0x2001 7FFF
Code
Shared CAN SRAM
SRAM
0x1FFF F810 - 0x1FFF FFFF
Reserved
0x1FFF F800 - 0x1FFF F80F
Option Bytes
0x1FFF B000 - 0x1FFF F7FF
Boot loader
14
GD32F107xx Datasheet
Pre-defined
Regions
Bus
Address
Peripherals
0x1FFF 7A10 - 0x1FFF AFFF
Reserved
0x1FFF 7800 - 0x1FFF 7A0F
Reserved
0x1FFF 0000 - 0x1FFF 77FF
Reserved
0x1FFE C010 - 0x1FFE FFFF
Reserved
0x1FFE C000 - 0x1FFE C00F
Reserved
0x1001 0000 - 0x1FFE BFFF
Reserved
0x1000 0000 - 0x1000 FFFF
Reserved
0x083C 0000 - 0x0FFF FFFF
Reserved
0x0830 0000 - 0x083B FFFF
Reserved
0x0810 0000 - 0x082F FFFF
0x0802 0000 - 0x080F FFFF
Main Flash
0x0800 0000 - 0x0801 FFFF
0x0030 0000 - 0x07FF FFFF
0x0010 0000 - 0x002F FFFF
0x0002 0000 - 0x000F FFFF
0x0000 0000 - 0x0001 FFFF
Reserved
Aliased to Main
Flash or Boot loader
15
GD32F107xx Datasheet
2.5.
Clock tree
Figure 2-5. GD32F107xx clock tree
(to FMC)
USB OTG
Prescaler
1,1.5,2,2.5
1
SCS[1:0]
CK_FMC
CK_IRC8M
8 MHz
IRC8M
0
1
PLLSEL
PREDV0
0
1
CK_USBFS
(to USBFS)
00
/2
3-25 MHz
HXTAL
48 MHz
×2,3,4
…,32
PLL
CK_PLL
10
AHB
Prescaler
÷1,2...512
CK_SYS
108 MHz max
CK_AHB
108 MHz max
CK_EXMC
EXMC enable
(to EXMC)
HCLK
01
PLLMF
AHB enable
/1,2,3…
15,16
(to AHB bus,Cortex-M3,SRAM,DMA)
CK_CST
Clock
Monitor
÷8
(to Cortex-M3 SysTick)
FCLK
PREDV0SEL
EXT1 to
CK_OUT
(free running clock)
CK_HXTAL
APB1
Prescaler
÷1,2,4,8,16
CK_APB1
PCLK1
to APB1 peripherals
54 MHz max
Peripheral enable
×8..14,16,
20
PLL1
TIMER1,2,3,4,5,6
if(APB1 prescale
=1)x1
else x 2
CK_PLL1
×8..14,16,
20
PLL2
0
CK_PLL2
x2
CK_I2S
1
APB2
Prescaler
÷1,2,4,8,16
CK_RTC
01
(to RTC)
10
RTCSRC[1:0]
40 KHz
IRC40K
CK_OUT0
CK_APB2
PCLK2
to APB2 peripherals
108 MHz max
Peripheral enable
I2S1/2SEL
PLL2MF
11
32.768 KHz
LXTAL
to TIMER1,2,3,4,
5,6
PLL1MF
/1,2,3…
15,16
PREDV1
/128
CK_TIMERx
TIMERx
enable
TIMER0,7
if(APB2 prescale
=1)x1
else x 2
ADC
Prescaler
÷2,4,6,8,12,1
6
CK_TIMERx
TIMERx
enable
to TIMER0,7
CK_ADCx to ADC0,1
14 MHz max
CK_FWDGT
(to FWDGT)
NO CLK
CK_SYS
CK_IRC8M
CK_HXTAL
/2
CK_PLL
CK_PLL1
/2
CK_PLL2
00xx
0100
0101
0110
0111
1000
1001
1010
1011
EXT1
CK_PLL2
CKOUT0SEL[3:0]
0 CK_MACTX
1
Et hernet
PHY
MII_RMII_SEL
/2,20
1 CK_MACRX
0
CK_MACRMII
Legend:
HXTAL: High speed external clock
LXTAL: Low speed external clock
IRC8M: High speed internal clock
IRC40K: Low speed internal clock
16
GD32F107xx Datasheet
2.6.
Pin definitions
2.6.1.
GD32F107Zx LQFP144 pin definitions
Table 2-4. GD32F107Zx LQFP144 pin definitions
Pin
I/O
Pin Name
Pins
PE2
1
I/O
5VT
PE3
2
I/O
5VT
PE4
3
I/O
5VT
PE5
4
I/O
5VT
PE6
5
I/O
5VT
VBAT
6
P
7
I/O
8
I/O
9
I/O
PF0
10
I/O
5VT
PF1
11
I/O
5VT
PF2
12
I/O
5VT
PF3
13
I/O
5VT
PF4
14
I/O
5VT
PF5
15
I/O
5VT
VSS_5
16
P
Default: VSS_5
VDD_5
17
P
Default: VDD_5
PF6
18
I/O
Default: PF6
Type
(1)
PC14PC15OSC32OUT
Alternate: TRACECK, EXMC_A23
Default: PE3
Alternate: TRACED0, EXMC_A19
Default: PE4
Alternate:TRACED1, EXMC_A20
Default: PE5
Alternate:TRACED2, EXMC_A21
Default: PE6
Alternate:TRACED3, EXMC_A22
Default: PC13
Alternate: TAMPER-RTC
RTC
OSC32IN
Default: PE2
Default: VBAT
PC13TAMPER-
Functions description
Level(2)
Default: PC14
Alternate: OSC32IN
Default: PC15
Alternate: OSC32OUT
Default: PF0
Alternate: EXMC_A0
Default: PF1
Alternate: EXMC_A1
Default: PF2
Alternate: EXMC_A2
Default: PF3
Alternate: EXMC_A3
Default: PF4
Alternate: EXMC_A4
Default: PF5
Alternate: EXMC_A5
17
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Alternate: EXMC_NIORD
PF7
19
I/O
PF8
20
I/O
PF9
21
I/O
PF10
22
I/O
OSCIN
23
I
OSCOUT
24
O
NRST
25
I/O
PC0
26
I/O
Default: PF7
Alternate: EXMC_NREG
Default: PF8
Alternate: EXMC_NIOWR
Default: PF9
Alternate: EXMC_CD
Default: PF10
Alternate: EXMC_INTR
Default: OSCIN
Remap: PD0
Default: OSCOUT
Remap: PD1
Default: NRST
Default: PC0
Alternate: ADC01_IN10
Default: PC1
PC1
27
I/O
Alternate: ADC01_IN11, ETH_MII_MDC,
ETH_RMII_MDC
Default: PC2
PC2
28
I/O
PC3
29
I/O
VSSA
30
P
Default: VSSA
VREF-
31
P
Default: VREF-
VREF+
32
P
Default: VREF+
VDDA
33
P
Default: VDDA
Alternate: ADC01_IN12, ETH_MII_TXD2
Default: PC3
Alternate: ADC01_IN13, ETH_MII_TX_CLK
Default: PA0
PA0-WKUP
34
I/O
Alternate: WKUP, USART1_CTS, ADC01_IN0,
TIMER1_CH0, TIMER1_ETI, TIMER4_CH0,
ETH_MII_CRS
Default: PA1
PA1
35
I/O
Alternate: USART1_RTS, ADC01_IN1,
TIMER1_CH1, TIMER4_CH1,
ETH_MII_RX_CLK, ETH_RMII_REF_CLK
Default: PA2
PA2
36
I/O
Alternate: USART1_TX, ADC01_IN2,
TIMER1_CH2, TIMER4_CH2, ETH_MII_MDIO,
ETH_RMII_MDIO
18
GD32F107xx Datasheet
Pin Name
Pins
PA3
37
Pin
I/O
Functions description
Type(1) Level(2)
Default: PA3
I/O
Alternate: USART1_RX, ADC01_IN3,
TIMER1_CH3, TIMER4_CH3, ETH_MII_COL
VSS_4
38
P
Default: VSS_4
VDD_4
39
P
Default: VDD_4
Default: PA4
PA4
40
Alternate: SPI0_NSS, USART1_CK,
I/O
ADC01_IN4, DAC_OUT0
Remap:SPI2_NSS, I2S2_WS
PA5
41
Default: PA5
I/O
Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1
Default: PA6
PA6
42
Alternate: SPI0_MISO, ADC01_IN6,
I/O
TIMER2_CH0
Remap: TIMER0_BKIN
Default: PA7
Alternate: SPI0_MOSI, ADC01_IN7,
PA7
43
I/O
TIMER2_CH1, ETH_MII_RX_DV,
ETH_RMII_CRS_DV
Remap: TIMER0_CH0_ON
Default: PC4
PC4
44
I/O
Alternate: ADC01_IN14, ETH_MII_RXD0,
ETH_RMII_RXD0
Default: PC5
PC5
45
I/O
Alternate: ADC01_IN15, ETH_MII_RXD1,
ETH_RMII_RXD1
Default: PB0
PB0
46
Alternate: ADC01_IN8, TIMER2_CH2,
I/O
ETH_MII_RXD2
Remap: TIMER0_CH1_ON
Default: PB1
PB1
47
Alternate: ADC01_IN9, TIMER2_CH3,
I/O
ETH_MII_RXD3
Remap: TIMER0_CH2_ON
PB2
48
I/O
5VT
PF11
49
I/O
5VT
PF12
50
I/O
5VT
Default: PB2, BOOT1
Default: PF11
Alternate: EXMC_NIOS16
Default: PF12
Alternate: EXMC_A6
19
GD32F107xx Datasheet
Pin
I/O
Pin Name
Pins
Functions description
VSS_6
51
P
Default: VSS_6
VDD_6
52
P
Default: VDD_6
PF13
53
I/O
5VT
PF14
54
I/O
5VT
PF15
55
I/O
5VT
PG0
56
I/O
5VT
PG1
57
I/O
5VT
PE7
58
I/O
5VT
Type(1) Level(2)
Default: PF13
Alternate: EXMC_A7
Default: PF14
Alternate: EXMC_A8
Default: PF15
Alternate: EXMC_A9
Default: PG0
Alternate: EXMC_A10
Default: PG1
Alternate: EXMC_A11
Default: PE7
Alternate: EXMC_D4
Remap: TIMER0_ETI
Default: PE8
PE8
59
I/O
5VT
Alternate: EXMC_D5
Remap: TIMER0_CH0_ON
Default: PE9
PE9
60
I/O
5VT
Alternate: EXMC_D6
Remap: TIMER0_CH0
VSS_7
61
P
Default: VSS_7
VDD_7
62
P
Default: VDD_7
Default: PE10
PE10
63
I/O
5VT
Alternate: EXMC_D7
Remap: TIMER0_CH1_ON
Default: PE11
PE11
64
I/O
5VT
Alternate: EXMC_D8
Remap: TIMER0_CH1
Default: PE12
PE12
65
I/O
5VT
Alternate: EXMC_D9
Remap: TIMER0_CH2_ON
Default: PE13
PE13
66
I/O
5VT
Alternate: EXMC_D10
Remap: TIMER0_CH2
Default: PE14
PE14
67
I/O
5VT
PE15
68
I/O
5VT
Alternate: EXMC_D11
Remap: TIMER0_CH3
Default: PE15
20
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Alternate: EXMC_D12
Remap: TIMER0_BKIN
Default: PB10
PB10
69
I/O
5VT
Alternate: I2C1_SCL, USART2_TX,
ETH_MII_RX_ER
Remap: TIMER1_CH2
Default: PB11
PB11
70
I/O
5VT
Alternate: I2C1_SDA, USART2_RX,
ETH_MII_TX_EN, ETH_RMII_TX_EN
Remap: TIMER1_CH3
VSS_1
71
P
Default: VSS_1
VDD_1
72
P
Default: VDD_1
Default: PB12
PB12
73
I/O
5VT
Alternate: SPI1_NSS, I2C1_SMBA,
USART2_CK, TIMER0_BKIN, I2S1_WS,
CAN1_RX, ETH_MII_TXD0, ETH_RMII_TXD0
Default: PB13
PB13
74
I/O
5VT
Alternate: SPI1_SCK, USART2_CTS,
TIMER0_CH0_ON, I2S1_CK, CAN1_TX,
ETH_MII_TXD1, ETH_RMII_TXD1
Default: PB14
PB14
75
I/O
5VT
Alternate: SPI1_MISO, USART2_RTS,
TIMER0_CH1_ON
Default: PB15
PB15
76
I/O
5VT
Alternate: SPI1_MOSI, TIMER0_CH2_ON,
I2S1_SD
Default: PD8
PD8
77
I/O
5VT
Alternate: EXMC_D13
Remap: USART2_TX, ETH_MII_RX_DV,
ETH_RMII_CRS_DV
Default: PD9
PD9
78
I/O
5VT
Alternate: EXMC_D14
Remap: USART2_RX, ETH_MII_RXD0,
ETH_RMII_RXD0
Default: PD10
PD10
79
I/O
5VT
Alternate: EXMC_D15
Remap: USART2_CK, ETH_MII_RXD1,
ETH_RMII_RXD1
PD11
80
I/O
5VT
Default: PD11
21
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1) Level(2)
Functions description
Alternate: EXMC_A16
Remap: USART2_CTS, ETH_MII_RXD2
Default: PD12
PD12
81
I/O
5VT
Alternate: EXMC_A17
Remap: TIMER3_CH0, USART2_RTS,
ETH_MII_RXD3
Default: PD13
PD13
82
I/O
5VT
Alternate: EXMC_A18
Remap: TIMER3_CH1
VSS_8
83
P
Default: VSS_8
VDD_8
84
P
Default: VDD_8
PD14
85
I/O
Default: PD14
5VT
Alternate: EXMC_D0
Remap: TIMER3_CH2
Default: PD15
PD15
86
I/O
5VT
Alternate: EXMC_D1
Remap: TIMER3_CH3
Default: PG2
PG2
87
I/O
5VT
PG3
88
I/O
5VT
PG4
89
I/O
5VT
PG5
90
I/O
5VT
PG6
91
I/O
5VT
PG7
92
I/O
5VT
PG8
93
I/O
5VT
VSS_9
94
P
Default: VSS_9
VDD_9
95
P
Default: VDD_9
Alternate: EXMC_A12
Default: PG3
Alternate: EXMC_A13
Default: PG4
Alternate: EXMC_A14
Default: PG5
Alternate: EXMC_A15
Default: PG6
Alternate: EXMC_INT1
Default: PG7
Alternate: EXMC_INT2
Default: PG8
Default: PC6
PC6
96
I/O
5VT
Alternate: I2S1_MCK
Remap: TIMER2_CH0
Default: PC7
PC7
97
I/O
5VT
PC8
98
I/O
5VT
Alternate: I2S2_MCK
Remap: TIMER2_CH1
Default: PC8
22
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Remap: TIMER2_CH2
PC9
99
I/O
5VT
Default: PC9
Remap: TIMER2_CH3
Default: PA8
PA8
100
I/O
5VT
Alternate: USART0_CK, TIMER0_CH0,
CK_OUT0, USBFS_SOF
Default: PA9
PA9
101
I/O
5VT
Alternate: USART0_TX, TIMER0_CH1,
USBFS_VBUS
Default: PA10
PA10
102
I/O
5VT
Alternate: USART0_RX, TIMER0_CH2,
USBFS_ID
Default: PA11
PA11
103
I/O
5VT
Alternate: USART0_CTS, CAN0_RX,
USBFS_DM, TIMER0_CH3
Default: PA12
PA12
104
I/O
5VT
Alternate: USART0_RTS, USBFS_DP,
CAN0_TX, TIMER0_ETI
PA13
105
NC
106
I/O
5VT
Default: JTMS, SWDIO
Remap: PA13
-
VSS_2
107
P
Default: VSS_2
VDD_2
108
P
Default: VDD_2
PA14
109
I/O
5VT
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
PA15
110
I/O
5VT
Alternate: SPI2_NSS, I2S2_WS
Remap: TIMER1_CH0, TIMER1_ETI, PA15,
SPI0_NSS
Default: PC10
PC10
111
I/O
5VT
Alternate: UART3_TX
Remap: USART2_TX, SPI2_SCK, I2S2_CK
Default: PC11
PC11
112
I/O
5VT
Alternate: UART3_RX
Remap: USART2_RX, SPI2_MISO
Default: PC12
PC12
113
I/O
5VT
Alternate: UART4_TX
Remap: USART2_CK, SPI2_MOSI, I2S2_SD
PD0
114
I/O
5VT
Default: PD0
23
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Type(1) Level(2)
Functions description
Alternate: EXMC_D2
Remap: CAN0_RX
Default: PD1
PD1
115
I/O
5VT
Alternate: EXMC_D3
Remap: CAN0_TX
PD2
116
I/O
5VT
Default: PD2
Alternate: TIMER2_ETI, UART4_RX
Default: PD3
PD3
117
I/O
5VT
Alternate: EXMC_CLK
Remap: USART1_CTS
Default: PD4
PD4
118
I/O
5VT
Alternate: EXMC_NOE
Remap: USART1_RTS
Default: PD5
PD5
119
I/O
5VT
Alternate: EXMC_NWE
VSS_10
120
Default: VSS_10
VDD_10
121
Default: VDD_10
Remap: USART1_TX
Default: PD6
PD6
122
I/O
5VT
Alternate: EXMC_NWAIT
Remap: USART1_RX
Default: PD7
PD7
123
I/O
5VT
Alternate: EXMC_NE0, EXMC_NCE1
Remap: USART1_CK
PG9
124
I/O
5VT
PG10
125
I/O
5VT
PG11
126
I/O
5VT
PG12
127
I/O
5VT
PG13
128
I/O
5VT
PG14
129
I/O
5VT
VSS_11
130
P
VDD_11
131
P
PG15
132
I/O
Default: PG9
Alternate: EXMC_NE1, EXMC_NCE2
Default: PG10
Alternate: EXMC_NCE3_0, EXMC_NE2
Default: PG11
Alternate: EXMC_NCE3_1
Default: PG12
Alternate: EXMC_NE3
Default: PG13
Alternate: EXMC_A24
Default: PG14
Alternate: EXMC_A25
Default: VSS_11
Default: VDD_11
5VT
Default: PG15
24
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Default: JTDO
PB3
133
I/O
5VT
Alternate:SPI2_SCK, I2S2_CK
Remap: PB3, TRACESWO, TIMER1_CH1,
SPI0_SCK
Default: NJTRST
PB4
134
I/O
5VT
Alternate: SPI2_MISO
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
PB5
135
Alternate: I2C0_SMBA, SPI2_MOSI, I2S2_SD,
I/O
ETH_PPS_OUT
Remap: TIMER2_CH1, SPI0_MOSI, CAN1_RX
Default: PB6
PB6
136
I/O
5VT
Alternate: I2C0_SCL, TIMER3_CH0
Remap: USART0_TX, CAN1_TX
Default: PB7
PB7
137
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1,
EXMC_NADV
Remap: USART0_RX
BOOT0
138
I
PB8
139
I/O
Default: BOOT0
Default: PB8
5VT
Alternate: TIMER3_CH2, ETH_MII_TXD3
Remap: I2C0_SCL, CAN0_RX
Default: PB9
PB9
140
I/O
5VT
Alternate: TIMER3_CH3
Remap: I2C0_SDA, CAN0_TX
Default: PE0
PE0
141
I/O
5VT
PE1
142
I/O
5VT
VSS_3
143
P
Default: VSS_3
VDD_3
144
P
Default: VDD_3
Alternate: TIMER3_ETI, EXMC_NBL0
Default: PE1
Alternate: EXMC_NBL1
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
25
GD32F107xx Datasheet
2.6.2.
GD32F107Vx LQFP100 pin definitions
Table 2-5. GD32F107Vx LQFP100 pin definitions
Pin
I/O
Pin Name
Pins
PE2
1
I/O
5VT
PE3
2
I/O
5VT
PE4
3
I/O
5VT
PE5
4
I/O
5VT
PE6
5
I/O
5VT
VBAT
6
P
7
I/O
8
I/O
9
I/O
VSS_5
10
P
Default: VSS_5
VDD_5
11
P
Default: VDD_5
OSCIN
12
I
OSCOUT
13
O
NRST
14
I/O
PC0
15
I/O
Type
PC13TAMPERRTC
PC14OSC32IN
PC15OSC32OUT
(1)
Functions description
Level(2)
Default: PE2
Alternate: TRACECK, EXMC_A23
Default: PE3
Alternate: TRACED0, EXMC_A19
Default: PE4
Alternate: TRACED1, EXMC_A20
Default: PE5
Alternate: TRACED2, EXMC_A21
Default: PE6
Alternate: TRACED3, EXMC_A22
Default: VBAT
Default: PC13
Alternate: TAMPER-RTC
Default: PC14
Alternate: OSC32IN
Default: PC15
Alternate: OSC32OUT
Default: OSCIN
Remap: PD0
Default: OSCOUT
Remap: PD1
Default: NRST
Default: PC0
Alternate: ADC01_IN10
Default: PC1
PC1
16
I/O
Alternate: ADC01_IN11, ETH_MII_MDC,
ETH_RMII_MDC
Default: PC2
PC2
17
I/O
PC3
18
I/O
VSSA
19
P
Default: VSSA
VREF-
20
P
Default: VREF-
Alternate: ADC01_IN12, ETH_MII_TXD2
Default: PC3
Alternate: ADC01_IN13, ETH_MII_TX_CLK
26
GD32F107xx Datasheet
Pin
I/O
Pin Name
Pins
Functions description
VREF+
21
P
Default: VREF+
VDDA
22
P
Default: VDDA
Type(1) Level(2)
Default: PA0
PA0-WKUP
23
I/O
Alternate: WKUP, USART1_CTS, ADC01_IN0,
TIMER1_CH0, TIMER1_ETI, TIMER4_CH0,
ETH_MII_CRS
Default: PA1
PA1
24
I/O
Alternate: USART1_RTS, ADC01_IN1,
TIMER1_CH1, TIMER4_CH1,
ETH_MII_RX_CLK, ETH_RMII_REF_CLK
Default: PA2
PA2
25
I/O
Alternate: USART1_TX, ADC01_IN2,
TIMER1_CH2, TIMER4_CH2, ETH_MII_MDIO,
ETH_RMII_MDIO
Default: PA3
PA3
26
I/O
Alternate: USART1_RX, ADC01_IN3,
TIMER1_CH3, TIMER4_CH3, ETH_MII_COL
VSS_4
27
P
Default: VSS_4
VDD_4
28
P
Default: VDD_4
Default: PA4
PA4
29
I/O
Alternate: SPI0_NSS, USART1_CK,
ADC01_IN4, DAC_OUT0
Remap:SPI2_NSS, I2S2_WS
PA5
30
I/O
Default: PA5
Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1
Default: PA6
PA6
31
I/O
Alternate: SPI0_MISO, ADC01_IN6,
TIMER2_CH0
Remap: TIMER0_BKIN
Default: PA7
Alternate: SPI0_MOSI, ADC01_IN7,
PA7
32
I/O
TIMER2_CH1, ETH_MII_RX_DV,
ETH_RMII_CRS_DV
Remap: TIMER0_CH0_ON
Default: PC4
PC4
33
I/O
Alternate: ADC01_IN14, ETH_MII_RXD0,
ETH_RMII_RXD0
PC5
34
I/O
Default: PC5
Alternate: ADC01_IN15, ETH_MII_RXD1,
27
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
ETH_RMII_RXD1
Default: PB0
PB0
35
Alternate: ADC01_IN8, TIMER2_CH2,
I/O
ETH_MII_RXD2
Remap: TIMER0_CH1_ON
Default: PB1
PB1
36
Alternate: ADC01_IN9, TIMER2_CH3,
I/O
ETH_MII_RXD3
Remap: TIMER0_CH2_ON
PB2
37
I/O
5VT
PE7
38
I/O
5VT
Default: PB2, BOOT1
Default: PE7
Alternate: EXMC_D4
Remap: TIMER0_ETI
Default: PE8
PE8
39
I/O
5VT
Alternate: EXMC_D5
Remap: TIMER0_CH0_ON
Default: PE9
PE9
40
I/O
5VT
Alternate: EXMC_D6
Remap: TIMER0_CH0
Default: PE10
PE10
41
I/O
5VT
Alternate: EXMC_D7
Remap: TIMER0_CH1_ON
Default: PE11
PE11
42
I/O
5VT
Alternate: EXMC_D8
Remap: TIMER0_CH1
Default: PE12
PE12
43
I/O
5VT
Alternate: EXMC_D9
Remap: TIMER0_CH2_ON
Default: PE13
PE13
44
I/O
5VT
Alternate: EXMC_D10
Remap: TIMER0_CH2
Default: PE14
PE14
45
I/O
5VT
Alternate: EXMC_D11
Remap: TIMER0_CH3
Default: PE15
PE15
46
I/O
5VT
Alternate: EXMC_D12
Remap: TIMER0_BKIN
PB10
47
I/O
5VT
Default: PB10
Alternate: I2C1_SCL(3), USART2_TX,
28
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
ETH_MII_RX_ER
Remap: TIMER1_CH2
Default: PB11
PB11
48
I/O
5VT
Alternate: I2C1_SDA(3), USART2_RX,
ETH_MII_TX_EN, ETH_RMII_TX_EN
Remap: TIMER1_CH3
VSS_1
49
P
Default: VSS_1
VDD_1
50
P
Default: VDD_1
Default: PB12
PB12
51
I/O
5VT
Alternate: SPI1_NSS, I2C1_SMBA(3),
USART2_CK, TIMER0_BKIN, I2S1_WS,
CAN1_RX, ETH_MII_TXD0, ETH_RMII_TXD0
Default: PB13
PB13
52
I/O
5VT
Alternate: SPI1_SCK, USART2_CTS,
TIMER0_CH0_ON, I2S1_CK, CAN1_TX,
ETH_MII_TXD1, ETH_RMII_TXD1
Default: PB14
PB14
53
I/O
5VT
Alternate: SPI1_MISO, USART2_RTS,
TIMER0_CH1_ON
Default: PB15
PB15
54
I/O
5VT
Alternate: SPI1_MOSI, TIMER0_CH2_ON,
I2S1_SD
Default: PD8
PD8
55
I/O
5VT
Alternate: EXMC_D13
Remap: USART2_TX, ETH_MII_RX_DV,
ETH_RMII_CRS_DV
Default: PD9
PD9
56
I/O
5VT
Alternate: EXMC_D14
Remap: USART2_RX, ETH_MII_RXD0,
ETH_RMII_RXD0
Default: PD10
PD10
57
I/O
5VT
Alternate: EXMC_D15
Remap: USART2_CK, ETH_MII_RXD1,
ETH_RMII_RXD1
Default: PD11
PD11
58
I/O
5VT
Alternate: EXMC_A16
Remap: USART2_CTS, ETH_MII_RXD2
PD12
59
I/O
5VT
Default: PD12
Alternate: EXMC_A17
29
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Remap: TIMER3_CH0, USART2_RTS,
ETH_MII_RXD3
Default: PD13
PD13
60
I/O
5VT
Alternate: EXMC_A18
Remap: TIMER3_CH1
Default: PD14
PD14
61
I/O
5VT
Alternate: EXMC_D0
Remap: TIMER3_CH2
Default: PD15
PD15
62
I/O
5VT
Alternate: EXMC_D1
Remap: TIMER3_CH3
Default: PC6
PC6
63
I/O
5VT
Alternate: I2S1_MCK
Remap: TIMER2_CH0
Default: PC7
PC7
64
I/O
5VT
Alternate: I2S2_MCK
Remap: TIMER2_CH1
PC8
65
I/O
5VT
PC9
66
I/O
5VT
PA8
67
I/O
5VT
Default: PC8
Remap: TIMER2_CH2
Default: PC9
Remap: TIMER2_CH3
Default: PA8
Alternate: USART0_CK, TIMER0_CH0,
CK_OUT0, USBFS_SOF
Default: PA9
PA9
68
I/O
5VT
Alternate: USART0_TX, TIMER0_CH1,
USBFS_VBUS
Default: PA10
PA10
69
I/O
5VT
Alternate: USART0_RX, TIMER0_CH2,
USBFS_ID
Default: PA11
PA11
70
I/O
5VT
Alternate: USART0_CTS, CAN0_RX,
USBFS_DM, TIMER0_CH3
Default: PA12
PA12
71
I/O
5VT
Alternate: USART0_RTS, USBFS_DP,
CAN0_TX, TIMER0_ETI
PA13
72
NC
73
I/O
5VT
Default: JTMS, SWDIO
Remap: PA13
30
GD32F107xx Datasheet
Pin
I/O
Pin Name
Pins
Functions description
VSS_2
74
P
Default: VSS_2
VDD_2
75
P
Default: VDD_2
PA14
76
I/O
Type(1) Level(2)
5VT
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
PA15
77
I/O
5VT
Alternate: SPI2_NSS, I2S2_WS
Remap: TIMER1_CH0, TIMER1_ETI, PA15,
SPI0_NSS
Default: PC10
PC10
78
I/O
5VT
Alternate: UART3_TX
Remap: USART2_TX, SPI2_SCK, I2S2_CK
Default: PC11
PC11
79
I/O
5VT
Alternate: UART3_RX
Remap: USART2_RX, SPI2_MISO
Default: PC12
PC12
80
I/O
5VT
Alternate: UART4_TX
Remap: USART2_CK, SPI2_MOSI, I2S2_SD
Default: PD0
PD0
81
I/O
5VT
Alternate: EXMC_D2
Remap: CAN0_RX
Default: PD1
PD1
82
I/O
5VT
Alternate: EXMC_D3
Remap: CAN0_TX
PD2
83
I/O
5VT
PD3
84
I/O
5VT
Default: PD2
Alternate: TIMER2_ETI, UART4_RX
Default: PD3
Alternate: EXMC_CLK
Remap: USART1_CTS
Default: PD4
PD4
85
I/O
5VT
Alternate: EXMC_NOE
Remap: USART1_RTS
Default: PD5
PD5
86
I/O
5VT
Alternate: EXMC_NWE
Remap: USART1_TX
Default: PD6
PD6
87
I/O
5VT
Alternate: EXMC_NWAIT
Remap: USART1_RX
PD7
88
I/O
5VT
Default: PD7
Alternate: EXMC_NE0, EXMC_NCE1
31
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Remap: USART1_CK
Default: JTDO
PB3
89
I/O
5VT
Alternate:SPI2_SCK, I2S2_CK
Remap: PB3, TRACESWO, TIMER1_CH1,
SPI0_SCK
Default: NJTRST
PB4
90
I/O
5VT
Alternate: SPI2_MISO
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
PB5
91
Alternate: I2C0_SMBA, SPI2_MOSI, I2S2_SD,
I/O
ETH_PPS_OUT
Remap: TIMER2_CH1, SPI0_MOSI, CAN1_RX
Default: PB6
PB6
92
I/O
5VT
Alternate: I2C0_SCL, TIMER3_CH0
Remap: USART0_TX, CAN1_TX
Default: PB7
PB7
93
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1,
EXMC_NADV
Remap: USART0_RX
BOOT0
94
I
PB8
95
I/O
Default: BOOT0
Default: PB8
5VT
Alternate: TIMER3_CH2, ETH_MII_TXD3
Remap: I2C0_SCL, CAN0_RX
Default: PB9
PB9
96
I/O
5VT
Alternate: TIMER3_CH3
Remap: I2C0_SDA, CAN0_TX
Default: PE0
PE0
97
I/O
5VT
PE1
98
I/O
5VT
VSS_3
99
P
Default: VSS_3
VDD_3
100
P
Default: VDD_3
Alternate: TIMER3_ETI, EXMC_NBL0
Default: PE1
Alternate: EXMC_NBL1
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
(3) Functions are available in GD32F107VD/E/F/G devices.
32
GD32F107xx Datasheet
2.6.3.
GD32F107Rx LQFP64 pin definitions
Table 2-6. GD32F107Rx LQFP64 pin definitions
Pin
Pin Name
Pins
VBAT
1
P
2
I/O
3
I/O
4
I/O
OSCIN
5
I
OSCOUT
6
O
NRST
7
I/O
PC0
8
I/O
Type
PC13TAMPERRTC
PC14OSC32IN
PC15OSC32OUT
(1)
I/O
Functions description
Level(2)
Default: VBAT
Default: PC13
Alternate: TAMPER-RTC
Default: PC14
Alternate: OSC32IN
Default: PC15
Alternate: OSC32OUT
Default: OSCIN
Remap: PD0
Default: OSCOUT
Remap: PD1
Default: NRST
Default: PC0
Alternate: ADC01_IN10
Default: PC1
PC1
9
I/O
Alternate: ADC01_IN11, ETH_MII_MDC,
ETH_RMII_MDC
Default: PC2
PC2
10
I/O
PC3
11
I/O
VSSA
12
P
Default: VSSA
VDDA
13
P
Default: VDDA
Alternate: ADC01_IN12, ETH_MII_TXD2
Default: PC3
Alternate: ADC01_IN13, ETH_MII_TX_CLK
Default: PA0
PA0-WKUP
14
I/O
Alternate: WKUP, USART1_CTS, ADC01_IN0,
TIMER1_CH0, TIMER1_ETI, TIMER4_CH0,
ETH_MII_CRS
Default: PA1
PA1
15
I/O
Alternate: USART1_RTS, ADC01_IN1,
TIMER1_CH1, TIMER4_CH1,
ETH_MII_RX_CLK, ETH_RMII_REF_CLK
Default: PA2
PA2
16
I/O
Alternate: USART1_TX, ADC01_IN2,
TIMER1_CH2, TIMER4_CH2, ETH_MII_MDIO,
ETH_RMII_MDIO
33
GD32F107xx Datasheet
Pin Name
Pins
PA3
17
Pin
I/O
Functions description
Type(1) Level(2)
Default: PA3
I/O
Alternate: USART1_RX, ADC01_IN3,
TIMER1_CH3, TIMER4_CH3, ETH_MII_COL
VSS_4
18
P
Default: VSS_4
VDD_4
19
P
Default: VDD_4
Default: PA4
PA4
20
Alternate: SPI0_NSS, USART1_CK,
I/O
ADC01_IN4, DAC_OUT0
Remap:SPI2_NSS, I2S2_WS
PA5
21
Default: PA5
I/O
Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1
Default: PA6
PA6
22
Alternate: SPI0_MISO, ADC01_IN6,
I/O
TIMER2_CH0
Remap: TIMER0_BKIN
Default: PA7
Alternate: SPI0_MOSI, ADC01_IN7,
PA7
23
I/O
TIMER2_CH1, ETH_MII_RX_DV,
ETH_RMII_CRS_DV
Remap: TIMER0_CH0_ON
Default: PC4
PC4
24
I/O
Alternate: ADC01_IN14, ETH_MII_RXD0,
ETH_RMII_RXD0
Default: PC5
PC5
25
I/O
Alternate: ADC01_IN15, ETH_MII_RXD1,
ETH_RMII_RXD1
Default: PB0
PB0
26
Alternate: ADC01_IN8, TIMER2_CH2,
I/O
ETH_MII_RXD2
Remap: TIMER0_CH1_ON
Default: PB1
PB1
27
Alternate: ADC01_IN9, TIMER2_CH3,
I/O
ETH_MII_RXD3
Remap: TIMER0_CH2_ON
PB2
28
I/O
5VT
Default: PB2, BOOT1
Default: PB10
PB10
29
I/O
5VT
Alternate: I2C1_SCL(3), USART2_TX,
ETH_MII_RX_ER
Remap: TIMER1_CH2
34
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Default: PB11
PB11
30
I/O
5VT
Alternate: I2C1_SDA(3), USART2_RX,
ETH_MII_TX_EN, ETH_RMII_TX_EN
Remap: TIMER1_CH3
VSS_1
31
P
Default: VSS_1
VDD_1
32
P
Default: VDD_1
Default: PB12
PB12
33
I/O
5VT
Alternate: SPI1_NSS, I2C1_SMBA(3),
USART2_CK, TIMER0_BKIN, I2S1_WS,
CAN1_RX, ETH_MII_TXD0, ETH_RMII_TXD0
Default: PB13
PB13
34
I/O
5VT
Alternate: SPI1_SCK, USART2_CTS,
TIMER0_CH0_ON, I2S1_CK, CAN1_TX,
ETH_MII_TXD1, ETH_RMII_TXD1
Default: PB14
PB14
35
I/O
5VT
Alternate: SPI1_MISO, USART2_RTS,
TIMER0_CH1_ON
Default: PB15
PB15
36
I/O
5VT
Alternate: SPI1_MOSI, TIMER0_CH2_ON,
I2S1_SD
Default: PC6
PC6
37
I/O
5VT
Alternate: I2S1_MCK
Remap: TIMER2_CH0
Default: PC7
PC7
38
I/O
5VT
Alternate: I2S2_MCK
Remap: TIMER2_CH1
PC8
39
I/O
5VT
PC9
40
I/O
5VT
PA8
41
I/O
5VT
Default: PC8
Remap: TIMER2_CH2
Default: PC9
Remap: TIMER2_CH3
Default: PA8
Alternate: USART0_CK, TIMER0_CH0,
CK_OUT0, USBFS_SOF
Default: PA9
PA9
42
I/O
5VT
Alternate: USART0_TX, TIMER0_CH1,
USBFS_VBUS
Default: PA10
PA10
43
I/O
5VT
Alternate: USART0_RX, TIMER0_CH2,
USBFS_ID
35
GD32F107xx Datasheet
Pin Name
Pins
PA11
44
Pin
I/O
Functions description
Type(1) Level(2)
Default: PA11
I/O
5VT
Alternate: USART0_CTS, CAN0_RX,
USBFS_DM, TIMER0_CH3
Default: PA12
PA12
45
I/O
5VT
Alternate: USART0_RTS, USBFS_DP,
CAN0_TX, TIMER0_ETI
5VT
Default: JTMS, SWDIO
PA13
46
I/O
VSS_2
47
P
Default: VSS_2
VDD_2
48
P
Default: VDD_2
PA14
49
I/O
5VT
Remap: PA13
Default: JTCK, SWCLK
Remap: PA14
Default: JTDI
PA15
50
I/O
5VT
Alternate: SPI2_NSS, I2S2_WS
Remap: TIMER1_CH0, TIMER1_ETI, PA15,
SPI0_NSS
Default: PC10
PC10
51
I/O
5VT
Alternate: UART3_TX
Remap: USART2_TX, SPI2_SCK, I2S2_CK
Default: PC11
PC11
52
I/O
5VT
Alternate: UART3_RX
Remap: USART2_RX, SPI2_MISO
Default: PC12
PC12
53
I/O
5VT
Alternate: UART4_TX
Remap: USART2_CK, SPI2_MOSI, I2S2_SD
PD2
54
I/O
5VT
Default: PD2
Alternate: TIMER2_ETI, UART4_RX
Default: JTDO
PB3
55
I/O
5VT
Alternate:SPI2_SCK, I2S2_CK
Remap: PB3, TRACESWO, TIMER1_CH1,
SPI0_SCK
Default: NJTRST
PB4
56
I/O
5VT
Alternate: SPI2_MISO
Remap: TIMER2_CH0, PB4, SPI0_MISO
Default: PB5
PB5
57
Alternate: I2C0_SMBA, SPI2_MOSI, I2S2_SD,
I/O
ETH_PPS_OUT
Remap: TIMER2_CH1, SPI0_MOSI, CAN1_RX
PB6
58
I/O
5VT
Default: PB6
36
GD32F107xx Datasheet
Pin Name
Pins
Pin
I/O
Functions description
Type(1) Level(2)
Alternate: I2C0_SCL, TIMER3_CH0
Remap: USART0_TX, CAN1_TX
Default: PB7
PB7
59
I/O
5VT
Alternate: I2C0_SDA , TIMER3_CH1
Remap: USART0_RX
BOOT0
60
I
PB8
61
I/O
Default: BOOT0
Default: PB8
5VT
Alternate: TIMER3_CH2, ETH_MII_TXD3
Remap: I2C0_SCL, CAN0_RX
Default: PB9
PB9
62
I/O
5VT
Alternate: TIMER3_CH3
Remap: I2C0_SDA, CAN0_TX
VSS_3
63
P
Default: VSS_3
VDD_3
64
P
Default: VDD_3
Notes:
(1) Type: I = input, O = output, P = power.
(2) I/O Level: 5VT = 5 V tolerant.
(3) Functions are available in GD32F107RD/E/F/G devices.
37
GD32F107xx Datasheet
3.
Functional description
3.1.
Arm® Cortex®-M3 core
The Cortex®-M3 processor is the latest generation of Arm® processors for embedded systems.
It has been developed to provide a low-cost platform that meets the needs of MCU
implementation, with a reduced pin count and low-power consumption, while delivering
outstanding computational performance and an advanced system response to interrupts.
32-bit Arm® Cortex®-M3 processor core
Up to 108 MHz operation frequency
Single-cycle multiplication and hardware divider
Integrated Nested Vectored Interrupt Controller (NVIC)
24-bit SysTick timer
The Cortex®-M3 processor is based on the ARMv7 architecture and supports both Thumb
and Thumb-2 instruction sets. Some system peripherals listed below are also provided by
Cortex®-M3:
Internal Bus Matrix connected with ICode bus, DCode bus, system bus, Private
Peripheral Bus (PPB) and debug accesses (AHB-AP)
3.2.
Nested Vectored Interrupt Controller (NVIC)
Flash Patch and Breakpoint (FPB)
Data Watchpoint and Trace (DWT)
Instrument Trace Macrocell (ITM)
Memory Protection Unit (MPU)
Serial Wire JTAG Debug Port (SWJ-DP)
Trace Port Interface Unit (TPIU)
On-chip memory
Up to 1024 Kbytes of Flash memory
96 Kbytes of SRAM
The Arm® Cortex®-M3 processor is structured in Harvard architecture which can use separate
buses to fetch instructions and load/store data. 1024 Kbytes of inner Flash at most and 96
Kbytes of inner SRAM is available for storing programs and data, both accessed (R/W) at
CPU clock speed with zero wait states. The Table 2-3. GD32F107xx memory map shows
the memory map of the GD32F107xx series of devices, including code, SRAM, peripheral,
and other pre-defined regions.
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GD32F107xx Datasheet
3.3.
Clock, reset and supply management
Internal 8 MHz factory-trimmed RC and external 3 to 25 MHz crystal oscillator
Internal 40 KHz RC calibrated oscillator and external 32.768 KHz crystal oscillator
Integrated system clock PLL
2.6 to 3.6 V application supply and I/Os
Supply Supervisor: POR (Power On Reset), PDR (Power Down Reset), and low voltage
detector (LVD)
The Clock Control Unit (CCU) provides a range of oscillator and clock functions. These
include speed internal RC oscillator and external crystal oscillator, high speed and low speed
two types. Several prescalers allow the configuration of the AHB frequency, the high-speed
APB (APB2) and the low-speed APB (APB1) domains. The maximum frequency of the AHB
and the high-speed APB domains is 108 MHz. The maximum allowed frequency of the lowspeed APB domain is 54 MHz. See Figure 2-5. GD32F107xx clock tree for details on the
clock tree.
The Reset Control Unit (RCU) controls three kinds of reset: system reset resets the processor
core and peripheral IP components. Power-on reset (POR) and power-down reset (PDR) are
always active, and ensures proper operation starting from/down to 2.6 V. The device remains
in reset mode when VDD is below a specified threshold. The embedded low voltage detector
(LVD) monitors the power supply, compares it to the voltage threshold and generates an
interrupt as a warning message for leading the MCU into security.
Power supply schemes:
VDD range: 2.6 to 3.6 V, external power supply for I/Os and the internal regulator.
Provided externally through VDD pins.
VSSA, VDDA range: 2.6 to 3.6 V, external analog power supplies for ADC, reset blocks,
RCs and PLL. VDDA and VSSA must be connected to VDD and VSS, respectively.
VBAT range: 1.8 to 3.6 V, power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
3.4.
Boot modes
At startup, boot pins are used to select one of three boot options:
Boot from main flash memory (default)
Boot from system memory
Boot from on-chip SRAM
The boot loader is located in the internal boot ROM memory (system memory). It is used to
reprogram the Flash memory by using USART0 (PA9 and PA10), USART1 (PD5 and PD6),
USBFS in device mode (PA9, PA11 and PA12). It also can be used to transfer and update the
Flash memory code, the data and the vector table sections. In default condition, boot from
bank 0 of Flash memory is selected. It also supports to boot from bank 1 of Flash memory by
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GD32F107xx Datasheet
setting a bit in option bytes.
3.5.
Power saving modes
The MCU supports three kinds of power saving modes to achieve even lower power
consumption. They are sleep mode, deep-sleep mode, and standby mode. These operating
modes reduce the power consumption and allow the application to achieve the best balance
between the CPU operating time, speed and power consumption.
Sleep mode
In sleep mode, only the clock of CPU core is off. All peripherals continue to operate and
any interrupt/event can wake up the system.
Deep-sleep mode
In deep-sleep mode, all clocks in the 1.2V domain are off, and all of the high speed
crystal oscillator (IRC8M, HXTAL) and PLL are disabled. Only the contents of SRAM and
registers are retained. Any interrupt or wakeup event from EXTI lines can wake up the
system from the deep-sleep mode including the 16 external lines, the RTC alarm, the
LVD output, and USB wakeup. When exiting the Deep-sleep mode, the IRC8M is
selected as the system clock.
Standby mode
In standby mode, the whole 1.2V domain is power off, the LDO is shut down, and all of
IRC8M, HXTAL and PLL are disabled. The contents of SRAM and registers (except
Backup registers) are lost. There are four wakeup sources for the standby mode,
including the external reset from NRST pin, the RTC alarm, the FWDGT reset, and the
rising edge on WKUP pin.
3.6.
Analog to digital converter (ADC)
12-bit SAR ADC engine
Up to 1 MSPS conversion rate
Conversion range: VSSA to VDDA (2.6 to 3.6 V)
Temperature sensor
Up to two 12-bit 1 μs multi-channel ADCs are integrated in the device. Each is a total of up to
21 multiplexed external channels. An analog watchdog block can be used to detect the
channels, which are required to remain within a specific threshold window. A configurable
channel management block of analog inputs also can be used to perform conversions in
single, continuous, scan or discontinuous mode to support more advanced usages.
The ADCs can be triggered from the events generated by the general-purpose timers
(TIMERx) and the advanced-control timer (TIMER0) with internal connection. The
temperature sensor has to generate a voltage that varies linearly with temperature. The
conversion range is between 2.6 V < VDDA < 3.6 V. The temperature sensor is internally
connected to the ADC_IN16 input channel which is used to convert the sensor output voltage
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GD32F107xx Datasheet
into a digital value.
To ensure a high accuracy on ADC and DAC, the ADC/DAC independent external reference
voltage should be connected to VREF+/VREF- pins. According to the different packages, VREF+
pin can be connected to VDDA pin, or external reference voltage, VREF- pin must be connected
to VSSA pin. The VREF+ pin is only available on no less than 100-pin packages. On less than
100-pin packages, the VREF+ pin is not available and it is internally connected to V DDA. The
VREF- pin is internally connected to VSSA.
3.7.
Digital to analog converter (DAC)
Two 12-bit DAC converters of independent output channel
8-bit or 12-bit mode in conjunction with the DMA controller
The two 12-bit buffered DAC channels are used to generate variable analog outputs. The
DACs are designed with integrated resistor strings structure. The DAC channels can be
triggered by the timer update outputs or EXTI with DMA support. In dual DAC channel
operation, conversions could be done independently or simultaneously. The maximum output
value of the DAC is VREF+.
3.8.
DMA
7 channel DMA0 controller and 5 channel DMA1 controller
Peripherals supported: Timers, ADC, SPIs, I2Cs, USARTs, DAC, I2S
Dedicated DMA controller with the Ethernet application
The flexible general-purpose DMA controllers provide a hardware method of transferring data
between peripherals and/or memory without intervention from the CPU, thereby freeing up
bandwidth for other system functions. Four types of access method are supported: peripheral
to peripheral, peripheral to memory, memory to peripheral, memory to memory
Each channel is connected to fixed hardware DMA requests. The priorities of DMA channel
requests are determined by software configuration and hardware channel number. Transfer
size of source and destination are independent and configurable.
3.9.
General-purpose inputs/outputs (GPIOs)
Up to 112 fast GPIOs, all mappable on 16 external interrupt vectors (EXTI)
Analog input/output configurable
Alternate function input/output configurable
There are up to 112 general purpose I/O pins (GPIO) in GD32F107xx, named PA0 ~ PA15
and PB0 ~ PB15, PC0 ~ PC15, PD0 ~ PD15, PE0 ~ PE15, PF0-PF15, PG0-PG15 to
implement logic input/output functions. Each of the GPIO ports has related control and
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GD32F107xx Datasheet
configuration registers to satisfy the requirements of specific applications. The external
interrupts on the GPIO pins of the device have related control and configuration registers in
the External Interrupt Control Unit (EXTI). The GPIO ports are pin-shared with other
alternative functions (AFs) to obtain maximum flexibility on the package pins. Each of the
GPIO pins can be configured by software as output (push-pull or open-drain), as input (with
or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are
shared with digital or analog alternate functions. All GPIOs are high-current capable except
for analog inputs.
3.10.
Timers and PWM generation
One 16-bit advanced-control timer (TIMER0), four 16-bit general-purpose timers (GPTM),
and two 16-bit basic timer (TIMER5 & TIMER6)
Up to 4 independent channels of PWM, output compare or input capture for each GPTM
and external trigger input
16-bit, motor control PWM advanced-control timer with programmable dead-time
generation for output match
Encoder interface controller with two inputs using quadrature decoder
24-bit SysTick timer down counter
2 watchdog timers (Free watchdog timer and window watchdog timer)
The advanced-control timer (TIMER0) can be seen as a three-phase PWM multiplexed on 6
channels. It has complementary PWM outputs with programmable dead-time generation. It
can also be used as a complete general-purpose timer. The 4 independent channels can be
used for
Input capture
Output compare
PWM generation (edge- or center-aligned counting modes)
Single pulse mode output
If configured as a general-purpose 16-bit timer, it has the same functions as the TIMER x
timer. It can be synchronized with external signals or to interconnect with other GPTMs
together which have the same architecture and features.
The general-purpose timer (GPTM), known as TIMER1 ~ TIMER4 can be used for a variety
of purposes including general time, input signal pulse width measurement or output waveform
generation such as a single pulse generation or PWM output, up to 4 independent channels
for input capture/output compare. The GPTM also supports an encoder interface with two
inputs using quadrature decoder.
The basic timer, known as TIMER5 and TIMER6 are mainly used for DAC trigger generation.
They can also be used as a simple 16-bit time base.
The GD32F107xx have two watchdog peripherals, free watchdog timer and window watchdog
timer. They offer a combination of high safety level, flexibility of use and timing accuracy.
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GD32F107xx Datasheet
The free watchdog timer includes a 12-bit down-counting counter and an 8-bit prescaler, It is
clocked from an independent 40 kHz internal RC and as it operates independently of the main
clock, it can operate in deep-sleep and standby modes. It can be used either as a watchdog
to reset the device when a problem occurs, or as a free-running timer for application timeout
management.
The window watchdog timer is based on a 7-bit down counter that can be set as free-running.
It can be used as a watchdog to reset the device when a problem occurs. It is clocked from
the main clock. It has an early warning interrupt capability and the counter can be frozen in
debug mode.
The SysTick timer is dedicated for OS, but could also be used as a standard down counter. It
features:
3.11.
A 24-bit down counter
Auto reload capability
Maskable system interrupt generation when the counter reaches 0
Programmable clock source
Real time clock (RTC)
32-bit up-counter with a programmable 20-bit prescaler
Alarm function
Interrupt and wake-up event
The real time clock is an independent timer which provides a set of continuously running
counters which can be used with suitable software to provide a clock calendar function, and
provides an alarm interrupt and an expected interrupt. The RTC features a 32-bit
programmable counter for long-term measurement using the compare register to generate an
alarm. A 20-bit prescaler is used for the time base clock and is by default configured to
generate a time base of 1 second from a clock at 32.768 kHz from external crystal oscillator.
3.12.
Inter-integrated circuit (I2C)
Up to two I2C bus interfaces can support both master and slave mode with a frequency
up to 400 kHz
Provide arbitration function, optional PEC (packet error checking) generation and
checking
Supports 7-bit and 10-bit addressing mode and general call addressing mode
The I2C interface is an internal circuit allowing communication with an external I2C interface
which is an industry standard two line serial interface used for connection to external
hardware. These two serial lines are known as a serial data line (SDA) and a serial clock line
(SCL). The I2C module provides transfer rate of up to 100 KHz in standard mode and up to
400 KHz in fast mode. The I2C module also has an arbitration detect function to prevent the
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GD32F107xx Datasheet
situation where more than one master attempts to transmit data to the I2C bus at the same
time. A CRC-8 calculator is also provided in I2C interface to perform packet error checking
for I2C data.
3.13.
Serial peripheral interface (SPI)
Up to three SPI interfaces with a frequency of up to 18 MHz
Support both master and slave mode
Hardware CRC calculation and transmit automatic CRC error checking
The SPI interface uses 4 pins, among which are the serial data input and output lines (MISO
& MOSI), the clock line (SCK) and the slave select line (NSS). Both SPIs can be served by
the DMA controller. The SPI interface may be used for a variety of purposes, including simplex
synchronous transfers on two lines with a possible bidirectional data line or reliable
communication using CRC checking.
3.14.
Universal synchronous asynchronous receiver transmitter
(USART)
Up to three USARTs and two UARTs with operating frequency up to 6.75 MHz
Supports both asynchronous and clocked synchronous serial communication modes
IrDA SIR encoder and decoder support
LIN break generation and detection
USARTs support ISO 7816-3 compliant smart card interface
The USART (USART0, USART1 and USART2) are used to translate data between parallel
and serial interfaces, provides a flexible full duplex data exchange using synchronous or
asynchronous transfer. It is also commonly used for RS-232 standard communication. The
USART includes a programmable baud rate generator which is capable of dividing the system
clock to produce a dedicated clock for the USART transmitter and receiver. The USART also
supports DMA function for high speed data communication except UART4.
3.15.
Inter-IC sound (I2S)
Two I2S bus Interfaces with sampling frequency from 8 kHz to 192 kHz
Support either master or slave mode
The Inter-IC sound (I2S) bus provides a standard communication interface for digital audio
applications by 3-wire serial lines. GD32F107xx contain two I2S-bus interfaces that can be
operated with 16/32 bit resolution in master or slave mode, pin multiplexed with SPI1 and
SPI2. The audio sampling frequency from 8 kHz to 192 kHz is supported with less than 0.5%
accuracy error.
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GD32F107xx Datasheet
3.16.
Universal serial bus full-speed (USBFS)
One USB device/host/OTG full-speed Interface with frequency up to 12 Mbit/s
Internal main PLL for USB CLK compliantly
The Universal Serial Bus (USB) is a 4-wire bus with 4 bidirectional endpoints. The device
controller enables 12 Mbit/s data exchange with integrated transceivers in device/host/OTG
mode. Full-speed peripheral is compliant with the USB 2.0 specification. Transaction
formatting is performed by the hardware, including CRC generation and checking. The status
of a completed USB transfer or error condition is indicated by status registers. An interrupt is
also generated if enabled. The dedicated 48 MHz clock is generated from the internal main
PLL (the clock source must use a HXTAL crystal oscillator) and the operating frequency
divided from APB1 should be 12 MHz above.
3.17.
Controller area network (CAN)
Two CAN2.0B interface with communication frequency up to 1 Mbit/s
Internal main PLL for USB CLK compliantly
Controller area network (CAN) is a method for enabling serial communication in field bus. The
CAN protocol has been used extensively in industrial automation and automotive applications.
It can receive and transmit standard frames with 11-bit identifiers as well as extended frames
with 29-bit identifiers. Each CAN has three mailboxes for transmission and two FIFOs of three
message deep for reception. It also provides 14 scalable/configurable identifier filter banks
for selecting the incoming messages needed and discarding the others.
3.18.
Ethernet MAC interface
IEEE 802.3 compliant media access controller (MAC) for Ethernet LAN
10/100 Mbit/s rates with dedicated DMA controller and SRAM
Support hardware precision time protocol (PTP) with conformity to IEEE 1588
The Ethernet media access controller (MAC) conforms to IEEE 802.3 specifications and fully
supports IEEE 1588 standards. The embedded MAC provides the interface to the required
external network physical interface (PHY) for LAN bus connection via an internal media
independent interface (MII) or a reduced media independent interface (RMII). The number of
MII signals provided up to 17 with 25 MHz output and RMII up to 9 with 50 MHz output. The
function of 32-bit CRC checking is also available.
3.19.
External memory controller (EXMC)
Supported external memory: SRAM, PSRAM, ROM and NOR-Flash, NAND Flash and
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GD32F107xx Datasheet
CF card
Up to 16-bit data bus
Support to interface with Motorola 6800 and Intel 8080 type LCD directly
External memory controller (EXMC) is an abbreviation of external memory controller. It is
divided in to several sub-banks for external device support, each sub-bank has its own chip
selection signal but at one time, only one bank can be accessed. The EXMC support code
execution from external memory except NAND Flash and CF card. The EXMC also can be
configured to interface with the most common LCD module of Motorola 6800 and Intel 8080
series and reduce the system cost and complexity.
3.20.
Debug mode
Serial wire JTAG debug port (SWJ-DP)
The Arm® SWJ-DP Interface is embedded and is a combined JTAG and serial wire debug
port that enables either a serial wire debug or a JTAG probe to be connected to the target.
3.21.
Package and operation temperature
LQFP144 (GD32F107Zx), LQFP100 (GD32F107Vx), LQFP64 (GD32F107Rx)
Operation temperature range: -40°C to +85°C (industrial level)
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GD32F107xx Datasheet
4.
Electrical characteristics
4.1.
Absolute maximum ratings
The maximum ratings are the limits to which the device can be subjected without permanently
damaging the device. Note that the device is not guaranteed to operate properly at the
maximum ratings. Exposure to the absolute maximum rating conditions for extended periods
may affect device reliability.
Table 4-1. Absolute maximum ratings
Symbol
Parameter
Min
Max
Unit
VDD
External voltage range
VSS - 0.3
VSS + 3.6
V
VDDA
External analog supply voltage
VSSA - 0.3
VSSA + 3.6
V
VBAT
External battery supply voltage
VSS - 0.3
VSS + 3.6
V
Input voltage on 5V tolerant pin
VSS - 0.3
VDD + 4.0
V
Input voltage on other I/O
VSS - 0.3
4.0
V
IIO
Maximum current for GPIO pins
—
25
mA
TA
Operating temperature range
-40
+85
°C
TSTG
Storage temperature range
-55
+150
°C
TJ
Maximum junction temperature
—
125
°C
VIN
4.2.
Recommended DC characteristics
Table 4-2. DC operating conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD
Supply voltage
—
2.6
3.3
3.6
V
VDDA
Analog supply voltage
Same as VDD
2.6
3.3
3.6
V
VBAT
Battery supply voltage
—
1.8
—
3.6
V
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GD32F107xx Datasheet
4.3.
Power consumption
The power measurements specified in the tables represent that code with data executing from
on-chip Flash with the following specifications.
Table 4-3. Power consumption characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD=VDDA=3.3V, HXTAL=25MHz, System
—
63.44
—
mA
—
38.7
—
mA
-—
42.87
—
mA
—
26.49
—
mA
—
38.31
—
mA
—
8.69
—
mA
—
μA
—
μA
clock=108 MHz, All peripherals enabled
VDD=VDDA=3.3V, HXTAL=25MHz, System
Supply current
clock =108 MHz, All peripherals disabled
(Run mode)
VDD=VDDA=3.3V, HXTAL=25MHz, System
clock =72MHz, All peripherals enabled
VDD=VDDA=3.3V, HXTAL=25MHz, System
Clock =72 MHz, All peripherals disabled
VDD=VDDA=3.3V, HXTAL=25MHz, System
clock =108 MHz, CPU clock off, All
Supply current
peripherals enabled
(Sleep mode)
VDD=VDDA=3.3V, HXTAL=25MHz, System
clock =108 MHz, CPU clock off, All
peripherals disabled
IDD+IDDA
VDD=VDDA=3.3V, LDO in normal power
mode, All clock off, IRC40K on, RTC on,
—
727.7
3
All GPIOs analog mode
Supply current
VDD=VDDA=3.3V, LDO in low power mode,
(Deep-Sleep
All clock off, IRC40K on, RTC on, All
mode)
GPIOs analog mode
—
713.3
7
VDD=VDDA=3.3V, LDO in normal power
mode, All clock off, IRC40K off, RTC off,
—
0.73
2.2
mA
—
9.75
—
μA
—
8.16
22
μA
—
12.7
—
μA
—
10.22
—
μA
—
5.6
—
μA
All GPIOs analog mode
VDD=VDDA=3.3V, LDO off, LXTAL off,
Supply current
IRC40K on, RTC on
(Standby mode)
VDD=VDDA=3.3V, LDO off, LXTAL off,
IRC40K off, RTC off
VDD not available, VBAT=3.6V, LDO off,
Battery supply
IBAT
current (Standby
mode)
LXTAL on, IRC40K off, RTC on
VDD not available, VBAT=3.3V, LDO off,
LXTAL on, IRC40K off, RTC on
VDD not available, VBAT=2.6V, LDO off,
LXTAL on, IRC40K off, RTC on
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GD32F107xx Datasheet
4.4.
EMC characteristics
EMS (electromagnetic susceptibility) includes ESD (Electrostatic discharge, positive and
negative) and FTB (Burst of Fast Transient voltage, positive and negative) testing result is
given in the Table 4-4. EMS characteristics, based on the EMS levels and classes
compliant with IEC 61000 series standard.
Table 4-4. EMS characteristics
Symbol
VESD
Parameter
Conditions
Voltage applied to all device pins to
VDD = 3.3 V, TA = +25 °C
induce a functional disturbance
conforms to IEC 61000-4-2
Fast transient voltage burst applied to
VFTB
induce a functional disturbance through
100 pF on VDD and VSS pins
Level/Class
3A
VDD = 3.3 V, TA = +25 °C
4A
conforms to IEC 61000-4-4
EMI (Electromagnetic Interference) emission testing result is given in the Table 4-5. EMI
characteristics, compliant with IEC 61967-2 standard which specifies the test board and
the pin loading.
Table 4-5. EMI characteristics
Symbol
Parameter
Conditions
4.5.
Peak level
frequency band
Unit
56M
72M
108M
0.1 to 2 MHz
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