HL-304PT1C-T
HL-304PT1C-T
Features
•Mechanically and spectrally matchend to
the infrared emitting LED LAMP.
• Color Transparent Lens.
•Rohs compliant.
Description
Package Dimensions
Made with NPN silicon phototransistor chips.
1: ANODE
2: CATHODE
3.85
5.3
29.0
SPEC NO:
1
2
1.5
0.7
1
Tolerance
Grade
2.54
0.5
2.94
1.5MAX
1
2
1
3
2
Dimension Tolerance (UNIT:mm)
0.5~3
3~6
6~30
30~120
±0.1
±0.2
±0.3
±0.5
REV NO:A/2
DATE: Mar/07/2011
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PAGE:1/3
HL-304PT1C-T
Electrical / Optical Characteristics at TA=25°C
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VBR CEO
Collector-Emitter Breakdown Voltage
30
-
100
V
Ic=100uA
Ee=0mW/cm 2
VBR ECO
Emitter-to–Collector Breakdown Voltage
6.5
-
-
V
Ie=100uA
Ee=0mW/cm 2
VCE (SAT)
Collector-to-Emitter Saturation Voltage
-
-
0.2
V
Ic=100uA
Ee=20mW/cm 2
Collector Dark Current
-
-
100
nA
VCE=100uA
Ee=0mW/cm 2
TR
Rise Time (10% to 90%)
-
15
-
us
TF
Fall Time (90% to 10%)
-
15
-
us
0.1
0.5
-
mA
ICEO
I(ON)
On State Collector Current
VCE=5V
IC=1mA
RL=1000Ω
VCE=5V
Ee=1mW/cm 2
λ=940nm
Absolute Maximum ratings at Ta=25℃
Parameter
Max Ratings
Collector-to-Emitter Breakdown Voltage
30V
Emitter-to-Collector Breakdown Voltage
6.5V
Power Dissipation at (or below) 25℃ Free Air Temperature
100mW
Operating Temperature Range
-30℃~80℃
Storage Temperature Range
-30℃~80℃
Lead Soldering Temperature (>3mm for 5sec)
SPEC NO:
REV NO:A/2
260℃
DATE: Mar/07/2011
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HL-304PT1C-T
Soldering:
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃and Soldering within 3 seconds per
solder-land is to be observed.
2. DIP soldering (Wave Soldering):
Preheating:120℃~150℃,within 120~180 sec.
Operation heating:245℃±5℃ within 5 sec.260℃(Max)
Gradual Cooling (Avoid quenching).
SPEC NO:
REV NO:A/2
DATE: Mar/07/2011
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PAGE:3/3
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