HL-AM-2835H421W-S1-08-HR6

Under Development ● Mass production RoHS Specification 规 格 书 Customer Name： 客户名称： Customer P/N： 客户品号： Factory P/N： HL-AM-2835H421W-S1-08-HR6 公司品号： Sending Date： Client approval Hongli approval 客户审核 鸿利智汇审核 Approval Audit Approval Audit Confirmation 核准 确认 核准 确认 制作 黄巍 李卫 陈少霞 □ Qualified DATE: 日期： □ Disqualified 接受 不接受 Adr：No.1,Xianke Yi Road,Huadong Town,Huadu District,Guangzhou,China 地址：中国广州市花都区花东镇先科一路1号 Tel/电话：020-37705135 Fax/传真：020-37705136 Web/网址：www.honglitronic.com 注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本. 2.此规格书的最终解释权归鸿利智汇集团股份有限公司 3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式 SPEC NO：B-18-A-1091 REV NO: A/0 DATE: Aug/08/2018 PAGE: 1 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 Features( 特征） PLCC-2 Package.(PLCC-2 封装） Extremely wide viewing angle.（宽的发光角度） Suitable for all SMT assembly and solder process.（适用于所有的SMT组装和焊接工艺） Available on tape and reel.（适用于载带及卷轴） Moisture sensitivity level: Level 4.（防潮等级 Level 4） Package:4000pcs/reel..(包装每卷4000PCS） RoHS compliant. (RoHS 认证） ATTENTION Description（描述） OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES The White LED which was fabricated using a blue chip and the phosphor 白光LED由蓝光芯片与荧光粉激发而成 注意：操作时应注意静电敏感 释放设备装置 Applications（应用） ■ General use（一般应用） Package Dimensions（封装尺寸） Recommended Soldering Pattern （建议焊盘尺寸图） Notes:（备注） 1. All dimension units are millimeters.（所有标注尺寸单位为毫米） 2.All dimension tolerance is ±0.15mm unless otherwise noted.（除特别标注外，所有尺寸允许公差±0.15mm ） SPEC NO：B-18-A-1091 REV NO: A/0 DATE: Aug/08/2018 PAGE: 2 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 Selection Guide（选择指南） Part No. 型号 Chip Materials 芯片材料 Lens Type 胶体类型 HL-AM-2835H421W-S1-08-HR6 InGaN Yellow Diffused Mass Production list（批量生产目录） Part No. 型号 HL-AM-2835H421WS1-08-HR6 CCT（K） Min CCT（K） Typ CCT（K） Max Φ（lm） Min Φ（lm） Typ Test Conditions 测试条件 6000 6500 7000 20 22 IF=60mA 5700 6000 6500 20 22 IF=60mA 4750 5000 5300 20 22 IF=60mA 3800 4000 4250 20 22 IF=60mA 3250 3400 3650 18 20 IF=60mA 2800 3000 3100 18 20 IF=60mA 2600 2700 2800 16 18 IF=60mA 电性与光学特性 Electrical / Optical Characteristics at Ta=25°C Parameter（参数） Symbol （符号） Min. （最小） Typ. （平均） Max. （最大） Units （单位） Test Conditions 测试条件 Forward Voltage 正向电压 VF 2.8 -- 3.4 V IF=60mA Viewing Angle 角度 2θ1/2 -- 120 -- deg IF=60mA Color Rendering Index 显色性指数 Ra 95 -- -- IF=60mA Note:(备注） 21/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 21/2 是半值角,指光强是光学中心线光强的1/2处到光学中心线的角度 2. The above luminous flux measurement allowance tolerance ±10%. 上述发光通量的测试允许公差为±10% 3. The above Color Rendering Index measurement allowance tolerance is ±2 以上显色性指数的测试允许公差为±2 4. The above forward voltage measurement allowance tolerance is ±0.1V. 以上所示电压测量误差±0.1V SPEC NO：B-18-A-1091 REV NO: A/0 DATE: Aug/08/2018 PAGE: 3 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 Absolute Maximum Ratings at Ta=25°C 绝对最大额定值 Parameter（参数） Symbol（符号） Rating（值） Units（单位） Power Dissipation（功耗） Pd 306 mW Forward Current（正向电流） IF 90 mA Peak Forward Current [1]（峰值正向电流） IFP 150 mA Reverse Voltage（反向电压） VR 5 V Reverse Current 反向电流 IR 10 μA Electrostatic Discharge (HBM)（静电） ESD 1000 V Operating Temperature（操作温度） Topr -40 ~ +85 ℃ Storage Temperature（保存温度） Tstg -40 ~ +100 ℃ Junction Temperature结温 Tj 110 ℃ Note:（备注） 1. 1/10 Duty cycle, 0.1ms pulse width.（脉宽0.1ms,周期1/10） SPEC NO：B-18-A-1091 REV NO: A/0 DATE: Aug/08/2018 PAGE: 4 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 Typical optical characteristics curves 典型光学特性曲线 Forward Current VS. Relative Intensity Ambient Temperature VS Allowable Forward Current 环境温度与允许温度电流特性 2.0 25, 90 85, 45 Relative Luminous Intensity Forward Current（mA） 100 90 80 70 60 50 40 30 20 10 0 正向电流与相对光强特性曲线 1.5 1.0 0.5 0.0 0 10 20 30 40 50 60 70 80 90 Ambient Temperature （℃） Forward Voltage VS. Forward Current 正向电压与正向电流特性曲线 SPEC NO：B-18-A-1091 REV NO: A/0 0 10 20 30 40 50 60 70 80 90 Forward Current(mA) Ambient Temperature VS. Relative Intensity 环境温度与相对光强特性曲线 DATE: Aug/08/2018 PAGE: 5 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 Typical optical characteristics curves 典型光学特性曲线 Relative spectral emission Radiation diagram SPEC NO：B-18-A-1091 REV NO: A/0 相对光谱分布特性曲线 辐射图特性曲线 DATE: Aug/08/2018 PAGE: 6 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 0.46 0.44 2700K 6OS 0.42 3000K 3500K 0.40 6NS2 6WS 4000K 0.38 6NS1 5000K 0.36 6CS2 6000K 6500K 0.34 6CS1 60-6 0.32 0.30 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 Bin Range of Chromaticity Coordinate Bin区分类及色坐标范围 Nominal CCT Bin Code Target Center Point (cx,cy) Major Axis, a Major Axis, b Ellipse Rotation 6500K 6CS1 0.313,0.337 0.01338 0.00570 58.23° Sing 6-step 6000K 60-6 0.3220,0.3365 0.01415 0.006 59.21 Sing 6-step 5000K 6CS2 0.346,0.359 0.01644 0.00708 59.37° Sing 6-step 4040K 6NS1 0.380,0.380 0.01878 0.00804 54.00° Sing 6-step 3450K 6NS2 0.409,0.394 0.01902 0.00834 52.58° Sing 6-step 2940K 6WS 0.440,0.403 0.01668 0.00816 53.10° Sing 6-step 2720K 6OS 0.463,0.420 0.01548 0.00822 53.17° Sing 6-step SPEC NO：B-18-A-1091 REV NO: A/0 DATE: Aug/08/2018 Angle,θ Color Space PAGE: 7 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 Reliability Test Items And Conditions 信赖性测试项目及条件 Test Items 项目 Ref. Standard 参考标准 Test Condition 测试条件 Time 时间 Quantity 数量 Ac/Re 接收/拒收 Reflow 回流焊 JESD22-B106 Temp:260℃max T=10 sec 3 times. 22Pcs. 0/1 Temperature Cycle 温度循环 JESD22-A104 100℃±5℃ 30 min. ↑↓5 min -40℃±5℃ 30 min. 100 Cycles 22Pcs. 0/1 High Temperature Storage 高温保存 JESD22-A103 Temp:100℃±5℃ 1000Hrs. 11Pcs. 0/1 Low Temperature Storage 低温保存 JESD22-A119 Temp:-40℃±5℃ 1000Hrs. 11Pcs. 0/1 Life Test 常温通电 JESD22-A108 Ta=25℃±5℃ IF=60mA 1000Hrs. 11Pcs. 0/1 High Temperature High Humidity Life Test 高温高湿通电 JESD22-A101 60℃±5℃/ 90%RH IF=30mA 1000Hrs. 11Pcs. 0/1 Failure Criteria 失效判定标准 Test Items 项目 Symbol 符号 Failure Criteria 判定标准 Test Condition 测试条件 Min. 最小 Max. 最大 Forward Voltage 正向电压 VF IF=60mA -- U.S.L*)x1.1 Reverse Current 反向电流 IR VR = 5V -- U.S.L*)x2.0 Luminous Flux 光通量 Lm IF=60mA L.S.L*)x0.7 -- U.S.L: Upper Specification Limit 规格上限 L.S.L: Lower Specification Limit 规格下限 *The technical information shown in the data sheets is limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许可的 授权. SPEC NO：B-18-A-1091 REV NO: A/0 DATE: Aug/08/2018 PAGE: 8 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 SMT Reflow Soldering Instructions SMT回流焊说明 1.Reflow soldering should not be done more than two times. 回流焊不可以做两次以上 2.When soldering , do not put stress on the LEDs during heating 当焊接时，不要在材料受热时用力压胶体表面 Soldering iron 烙铁焊接 1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds 当手工焊接时，烙铁的温度必须小于300℃，时间不可超过3秒 2.The hand solder should be done only one times 手工焊接只可焊接一次 Repairing 修补 Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or will not be damaged by repairing. LED回流焊后不应该修复，当修复是不可避免时，必须使用双头烙铁（如下图），但必须事先确认此种方式会或不会 损坏LED本身的特性。 Cautions 注意事项 The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED封装为硅胶，故LED胶体表面较软，用力按压胶体表面会影响LED可靠性，因此应有预防措施避免在封装的零件上的 强大压力，当使用吸嘴时，胶体表面的压力应是恰当的。 SPEC NO：B-18-A-1091 REV NO: A/0 DATE: Aug/08/2018 PAGE: 9 OF 13 Under Development ● Mass production HL-AM-2835H421W-S1-08-HR6 Handling Precautions 处理防备措施 Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force . As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED products, Failure to comply might leads to damage and premature failure of the LED. 相对环氧树脂较脆较硬而言，硅胶封装较柔软且有弹性，虽然它的特性大大减少了热应力，但易受机械外力损坏，因此 在手工处理方面须要对硅胶封装材料做预防措施，若未按要求操作，可能会导致LED损坏和光衰 1.Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry. 通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路 2.The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 为防止气压泄漏，SMD吸咀外径不可以超过LED尺寸，吸咀内径尺寸应尽可能大，吸咀顶端材 质建议采用柔软材料以防在吸取期间刮伤或损坏LED胶体表面，元件的尺寸必须在取放机里准 确的编程好，以确保精确的吸取和避免生产过程中的损害 3.Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry 4.Not suitable to operate in acidic environment, PH