HL-C3535F77W1GA(Ra2)-FC(5310K-6020K)

Under Development Mass production RoHS Specification Client Name： 客户名称： Client P/N： 客户品号： Product P/N： 产品型号: HL-C3535F77W1GA(Ra2)-FC Sending Date： 送样日期： Client approval 客户审核 Approval 核准 Hongli approval 鸿利智汇审核 Audit 确认 Confirmation 制作 Audit 确认 Sales department Quality department 营销中心 品质部 □ Qualified 接受 □ Disqualified 不接受 Engineering technology centre 工程技术中心 伍学海 DATE: 日期：2021.10.20 Adr：NO.1,Xianke Yi Road,Huadong Town,,Huadu District,Guangzhou,China 地址：中国广州市花都区花东镇先科一路1号 Tel/电话：020-86733333 Fax/传真：020-86733883 86733938 86733265 Web/网址：www.honglitronic.com 注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本. 2.此规格书的最终解释权归鸿利智汇集团股份有限公司 3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 1 OF 15 ● Under Development Mass production Catalog目录 1. Product naming rules 产品命名规则···························3 2. Features 特点·······························3 3. Application range 应用范围·····························4 4. Radiation Pattern 辐射模式·····························4 5. Specifications 规范······························5-6 6. Product bins 产品分级·····························7 7.Typical Optical/Electrical Characteristics Curves 典型光学/电性特征曲线·······················8 8. Package Dimensions 封装尺寸·····························9 9. Welded plate and steel mesh Dimensions 焊盘及钢网尺寸··························9 10.Label 标签·······························10 11.Tape Specifications 包装规格·····························11 12.Reflow soldering instructions 回流焊说明····························12 13.Use the matters needing attention 使用注意事项·························13-14 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 2 OF 15 ● Under Development Mass production Product naming rules 产品命名规则 HL-C 3535 F77 W 1 G A (Ra2) -FC 1 2 3 4 5 6 7 8 9 10 1：鸿利光电代码 2：产品系列代码 3：尺寸代码 4：芯片代码 5：表示发光颜色为白光 6：表示使用350mA分光 7：模具代码 8：基板材质代码 9：表示Ra≥80 10:倒装芯片 Features 特点 ● ● ● ● ● ● ● ● ● Long operating life 寿命长 High flux 光通量高 More energy efficient 节能 Low voltage DC operated 低电压直流工作 Cool beam, safe to the touch 冷光源，接触安全 Instant light (less than 100ns ) 瞬间点亮（小于100ns） No UV 无紫外线 Flip Chip Technology 倒装芯片工艺 RoHS compliant 符合RoHS标准 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 3 OF 15 ● Under Development Mass production Application range 应用范围 ● ● ● ● ● Portable lightings /(flash lightings, bicycle)便携式照明 Street light 路灯 Working light 工作灯 General lighting通用照明 Industrial lighting 工业照明 Relative Luminous Flux (%) Radiation Pattern辐射模式 100 50 -90° SPEC NO: B-21-C-0081 -60° -30° REV NO: A/1 0° 30° 60° DATE: Oct/2021 90° PAGE: 4 OF 15 ● Under Development Mass production Specifications规范 (1) Absolute Maximum Ratings at Ta=25°C 在25°C时绝对极限条件 Parameter参数 Symbol符号 Rating 值 Units单位 Pi 3 W Peak Forward Current 正向电流 IFP 1000 mA Reverse Current 反向漏电流 I 3@5V uA Junction Temperature 结温 Tj 145 ° C — 120~140 degrees Input power 输入功率 View Angle (FWHM)-White 发光角度 R Operating Temperature Range 工作温度 Topr -20° C To +85° C Storage Temperature Range Tstg -40°C To +100°C ESD Sensitivity（HBM） 抗静电能力 ESD Class 1 Reverse voltage （反向电压） Vr not designed for reverse bias 不允许反向工作 储藏温度 Notes注: 1.* All high power emitter LED products mounted on aluminum metal-core printed circuit board, can be lighted directly, but we do not recommend lighting the high power products for more than 5 seconds without a appropriate heat dissipation equipment. When using at 700mA, TS (cathode point) temperature should be controlled below 85°C . 所有高功率的发光LED产品安装在铝金属为核心印刷电路板，可直接点亮，但我们不建议在没有一个 适当的散热设备时,照明高功率LED点亮超过5秒，当产品为700mA使用，TS点（负极焊盘）温度控制 在85℃以下。 2.wave peak and soak-stannum soldering etc.is not suitable for this products. 波峰焊、浸锡焊接不适合这个产品。 3.Reflow soldering should not be done more than two times.The reflow temperature we recommend is 260℃,When the temperature exceeds 260 ℃, the product failure of LED can be caused 回流焊不能超过两次,回流焊最高温度建议260℃，当温度超过260℃极大可能引起LED产品失效。 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 5 OF 15 ● Under Development Mass production ● (2) Optical Characteristics at Ta=25°C 在Ta=25°C 时的典型光学特性 IF=700mA HL-C3535F77W1GA(Ra2)-FC（IF=350mA） Main push Center Tc （K) Tc（K) Ra 2725 2580-2870 80(min) 110 120 135 220 240 260 3045 2870-3220 80(min) 130 140 155 230 250 270 3465 3220-3710 80(min) 130 140 155 230 250 270 3985 3710-4260 80(min) 140 150 165 240 260 280 4503 4260-4745 80(min) 140 150 165 240 260 280 5028 4745-5310 80(min) 140 150 165 240 260 280 5665 5310-6020 80(min) 145 155 170 245 265 285 6020 5665-6530 80(min) 145 155 170 245 265 285 6530 6020-7040 80(min) 145 155 170 245 265 285 ★ ★ ★ Min（lm） Typ（lm） Max（lm） Min（lm） Typ（lm） Max（lm） Notes注: *1.the products after this specification refer to the parameters prevail, before the release of specification without refer to the above parameters. 此规格书发布日后生产的产品以上述参数为准，发布前生产的库存品不参考上述参数。 2.Tolerance of measurement of forward voltage±3%、Color-rendering index±2、luminous flux±5% 不同标准源测试存在仪器公差：正向电压公差为±3%、显指公差为±2、光通量公差为±5%。 3.The CCT at IF=700mA value will be raised 3%. IF=700mA时色温会上升约3%。 4. With“★”for the product the main push color segment. 带“★”为产品主推色温段。 (3) Optical Electrical /Thermal Characteristics at Ta=25° 在Ta=25°C 时典型的电学/热学特性 VF (V) IF (mA) R（j-s）(°C/W) Po（W） 3.2 4.3 1.01 3.4 5 2.2 min typ max 350 2.6 2.85 700 2.8 3.15 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 6 OF 15 Under Development Mass production Product bins 产品分级 (1) Forward Voltage bins 电压分级 Min (V) Max (V) 2.6 2.8 2.8 3.0 3.0 3.2 3.2 3.4 (2) Chromaticity bins 色温分级 色温中心 2200K 2725K 3045K 3710K 3985K 4503K X,Y 0.507,0.4148 0.4582,0.4098 0.4338,0.403 0.3945,0.386 0.3818,0.3797 0.3615,0.3659 色温中心 4745K 5028K 5665K 6020K 6530K 7040K X,Y 0.3531,0.3607 0.3447,0.3553 0.329,0.3417 0.3214,0.3359 0.3129,0.329 0.3053,0.3813 Notes 注： 1.Products are tested and binned at a transient forward current(IF) with 350mA. With the use of different IF, it may probably cause differences in CCT & forward voltage. Generally, with the increase of IF, the CCT will be raised as well. 该产品通过瞬态350mA 点亮，分光分色.若使用不同电流，可能会引起色温及电压的变化,一般情况下， 使用电流增加，色温会上升。 2.Tolerence of ±0.005 on x,y coordinates. 色坐标的测量误差允许在±0.005 3.The chromaticity center refers to ANSI C78.377-2008 . 色温分bin参考ANSI C78.377-2008. SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 7 OF 15 ● Under Development Mass production ● Typical Optical/Electrical Characteristics Curves (Ta=25℃ Unless Otherwise Noted )典型光学/电性特征曲线（Ta=25℃ 除非另有注释） IF - Ts(based on Tj max 135℃） 焊点温度与正向电流曲线图（基于最大结温135℃） Ta=25° TC=5700K 1000 Forward Current IF(mA) TRelative Luminous Flux(LM) Relative Luminous Flux-IF 正向电流与相对光通量曲线图 1.4 1.0 0.6 0.2 600 400 200 0 0 200 400 600 800 0 1000 Relative Luminous Flux [a.u.] 3.2 3.0 2.8 2.6 2.4 2.2 0 200 400 600 800 1000 Forward Current IF(mA) SPEC NO: B-21-C-0081 40 60 80 100 Solder Temperature vs.Relative L uminous Flux 焊点温度与相对流明曲线图 IF=350mA VF - IF 正向电压与正向电流曲线图 Ta=25° TC=5700K 20 Solder Temperature(℃） IF(mA) Forward Voltage VF(V) 800 110% 100% 90% 80% 70% 60% 0 25 50 75 100 125 TS (°C) REV NO: A/1 DATE: Oct/2021 PAGE: 8 OF 15 Under Development Mass production ● Package Dimensions封装尺寸 晶片位置 - 侧面 + + 正面 背面 Notes注: 1. All dimension units are millimeters. 所有尺寸单位均为毫米. 2. All dimension tolerance is ±0.15mm unless otherwise noted. 所有尺寸误差是±0.15毫米除非另有说明 Welded plate and steel mesh Dimensions 焊盘及钢网尺寸 中间焊盘增加 覆铜面积方向 1.3 0.39 1.15 0.40 3.32 0.51 建议使用的焊盘尺寸 3.17 0.40 3.32 0.51 0.63 3.21 建议使用的钢网尺寸 Notes注: When the circuit configuration is not affected, suggested the increase in the middle of the copper area, or the connection between the middle and the pad and the negative electrode can improve the cooling performance of the product. 在不影响电路配置时，建议增加中间焊盘覆铜区域，或中间焊盘和负极焊盘连接，能提高产品散热性能。 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 9 OF 15 Under Development Mass production Label 标签 TYPE: XXXXXXXXX 产品型号 QTY: XXXXX 包装数量 VF: Forward voltage rank 正向电压档次范围 ФV: Luminous Flux rank 光通量档次范围 IF: XXXX 分选电流 TC: Color temperature 色温 DATE: XXXX 生产日期 LOT.NO:Lot Number 生产批号 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 10 OF 15 ● Under Development Mass production ● Tape Specifications(Units:mm)包装规格 (单位:mm) We provide tape as below 我们提供以下包装方式 Reel package ( 1000 pcs/reel) 卷轴包装（1000 pcs/卷） 178.00±0.20 60.00±0.40 末端 .30 ±0 .50 13 12.00±0.50 Moisture resistant packaging 防潮包装 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 11 OF 15 Under Development Mass production Reflow soldering instructions 回流焊说明 Profile Feature Lead-Based solder Lead-Free Solder Average Ramp-Rate (Tsmax to Tp) 3℃/second max 3℃/second max Preheat: Temperature Min (Tsmin) 100℃ 150℃ Preheat:Temperature Max (Tsmax) 150℃ 200℃ 60-120 seconds 60-180 seconds 183℃ 217℃ 60-150 seconds 60-150 seconds 215℃ 260℃ 10-15 seconds 20-40 seconds 6℃/second max 6℃/second max 6 minutes max 8 minutes max Preheat:Time(tsmin to tsmax) Time Maintained Above: Temperature(T L) Time Maintained Above: Time(tL) Peak/Classification Temperature(Tp) Time Within 5℃ of Actual Peak Temperature(tp) Ramp-Down Rate Time 25℃ to Peak Temperature Note: 1.recommend to use a convection type reflow machine with 8 zones. 建议使用八温区回流焊机。 2.recommend to use Lead-Free Paste with a melting point between 230℃-240℃. 建议使用熔点为230℃-240℃的无铅锡膏。 3.the reflow soldering time should not be more than 400s. 总的回流焊时间不要超过400s。 4.all temperature means the temperature measured on the surface of the package body. 所有温度均指在封装本体表面上测得的温度。 5.When using hot plate, the temperature is no more than 260 ℃, the time is not more than 10seconds. 当使用热板作业时，温度不超过260℃，时间不超过10秒。 SPEC NO: B-21-C-0081 REV NO: A/1 DATE: Oct/2021 PAGE: 12 OF 15 ● Under Development Mass production ● Use the matters needing attention(使用注意事项 ) 一、储存(storage)： 为避免受潮的影响，我司建议产品在未开包装前储存条件为 5-30°C，相对湿度小于 60%；已开包装的 LED 光源请在 24H 内使用安装完毕，如未用完之产品，请进行除湿并抽真空后密封保存。开封超过一周 或湿度卡发生变化时，请务必进行除湿，除湿条件：60°C±5°C，12H；产品密封保存有效使用期为一 年。 To avoid moisture, we recommend storage conditions for the unopened LED +5 ~ +30 °C, relative humidity