HL-503H3GD

HL-503H3GD HL-503H3GD ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSIT IVE DEVICES Features •φ5 LAMP LED •LOW POWER CONSUMPTION. •CABINED VIEW ING ANGLE. •IDEAL FOR BACKLIGHT AND INDICATOR. •PACKAGE: 1000PCS / BAG. Description Package Dimensions This devices are made with TS InGaN. 5 5.8 1.0 8.7 4.9 1.5MAX 2 1 28.0 2.0～1.0mm 0.5 1：ANODE 2：CATHODE 2.54 2 Dimension Tolerance (UNIT:mm) Tolerance Grade 0.5~3 3~6 6~30 30~120 ±0.1 ±0.2 ±0.3 ±0.5 Chip SPEC NO.: 1 Lens Color Material Emitting Color InGaN Greenish Yellow REV NO.:A/2 Color Diffused DATE:Sep/06/2010 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn PAGE:1/4 HL-503H3GD ■Absolute Maximum Rating Item Symbol Value Unit Forward Current IF 20 mA Peak Forward Current* IFP 100 mA Reverse Voltage VR 5 V Power Dissipation PD 80 mW Electrostatic discharge ESD 2000 V Operation Temperature Topr -30∽+80 ℃ Storage Temperature Tstg -30∽+80 ℃ Lead Soldering Temperature* Tsol Max. 260℃ for 5sec Max. *IFP Conditions：Pulse Width≤10msec *Tsol Conditions：3mm from the base of the epoxy bulb ■ Typical Optical/ Electrical Characteristics Item Luminous Intensity Forward Voltage Viewing Angle DominateWavelength Recommend Forward Current Reverse Current Notes: Ta=25℃ Symbol Condition Rank Iv VF IF=20mA Min. Typ. Max. Unit E 22 30 mcd F 30 40 mcd G 40 55 mcd 1.8 2.2 2.6 V 2θ 1/2 -- 45 -- deg λD 565 -- 575 nm IF(rec) -- -- -- 20 mA IR Vr=5V -- -- 20 uA Tolerance ：VF±0.1V，λd±2 nm，IV(φV) ±15%，2θ 1/2±15% SPEC NO.: REV NO.:A/2 DATE:Sep/06/2010 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn PAGE:2/4 HL-503H3GD ■ Reliability Performance Test Items And Result Test Duration Sample Size AC/RE 1000 hrs 22pcs 0/1 100 cycles 22 pcs 0/1 100 cycles 22 pcs 0/1 1000 hrs 22 pcs 0/1 Ta=100℃±5℃ 1000 hrs 22 pcs 0/1 Ta=-40℃±5℃ 1000 hrs 22 pcs 0/1 1times 22 pcs 0/1 3times 22 pcs 0/1 Test Classification Test Item Test Conditions Life Test Room Temperature DC Operating Life Test Ta=25℃±5℃，IF =20mA 100℃±5℃ 5min ↑↓ -40℃±5℃ 5min. 100℃±5℃ 30min ↑↓5min -40℃±5℃ 30min. 85℃±5℃/85% RH IF=5mA Thermal Shock Test Temperature Cycle Test Environment Test High Temperature ＆ High Humidity Test High Temperature Storage Low Temperature Storage Resistance to Soldering Heat Mechanical Test Lead Integrity 60 50 40 30 20 10 0 20 40 60 80 100 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -25 120 Forward Current vs.Forward Voltage 50 75 100 125 Luminous Spertrum(Ta=25℃) 2.8 40 Forward Voltage VF(V) Forward Current If(mA) 25 Forward Voltage vs. Ambient Temperature 50 30 20 10 0 0 Ambient Temperature Ta(℃) Ambient Temperature Ta(℃) 1.0 1.5 2.0 2.5 3.0 3.5 Forward Voltage VF(V) SPEC NO.: 4.0 SPECTRAL RADIANCE 100 2.6 RELATIVE RESPONSE 100%=1.642e-G01 Forward Current If(mA) Relative Intensity vs. Ambient Temperature Relative Intensity IV%(mcd) Forward Current vs. Ambient Temperature 0 Temp=260℃max T=5sec max Load 2.5N(0.25kgf) 0° ~ 90° ~0° 2.4 2.2 2.0 1.8 1.6 -25 0 25 50 75 100 Ambient Temperature Ta(℃) REV NO.:A/2 125 80 60 40 20 0 400 DATE:Sep/06/2010 PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn 500 600 700 800 PAGE:3/4 nm HL-503H3GD Soldering: 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃and Soldering within 3 seconds per solder-land is to be observed. 2. DIP soldering (Wave Soldering): Preheating:120℃~150℃,within 120~180 sec. Operation heating:245℃±5℃ within 5 sec.260℃(Max) Gradual Cooling (Avoid quenching). SPEC NO.: REV NO.:A/2 DATE:Sep/06/2010 PDF 文件使用 "pdfFactory Pro" 试用版本创建 ÿwww.fineprint.com.cn PAGE:4/4