HY4008P/M/B/PS/PM
N-Channel Enhancement Mode MOSFET
Pin Description
Features
•
80V/200A
RDS(ON) = 2.9 mΩ (typ.) @ VGS=10V
•
100% avalanche tested
•
Reliable and Rugged
•
Lead Free and Green Devices Available
G
G
D
D
S
G
D
S
S
TO-220FB-3M
TO-220FB-3L
TO-263-2L
(RoHS Compliant)
G
Applications
G
D
Switching application
•
Power Management for Inverter Systems.
S
S
TO-3PS-3L
•
D
TO-3PS-3M
D
N-Channel MOSFET
G
S
Ordering and Marking Information
P
HY4008
ÿ
YYXXXJWW
G
ÿ
YYXXXJWW
G
PS
HY4008
PM
HY4008
ÿ
YYXXXJWW
G
Note:
Package Code
M
HY4008
B
HY4008
P : TO-220FB-3L
B: TO-263-2L
PM: TO-3PS-3M
ÿ
YYXXXJWW
G
Date Code
YYXXX WW
ÿ
YYXXXJWW
G
M : TO-220FB-3M
PS: TO-3PS-3L
Assembly Material
G : Lead Free Device
HOOYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate
termination finish; which are fully compliant with RoHS.
HOOYI lead-free products meet or exceed the lead-free
requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature.
HOOYI
defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in
homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
HOOYI reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
1
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141225
HY4008P/M/B/PS/PM
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (TC=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
80
VGSS
Gate-Source Voltage
±25
Maximum Junction Temperature
175
°C
-55 to 175
°C
TC=25°C
200
A
TC=25°C
790**
A
TC=25°C
200
TC=100°C
144
TC=25°C
345
TC=100°C
173
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
V
Mounted on Large Heat Sink
IDM
Pulsed Drain Current *
ID
Continuous Drain Current
PD
Maximum Power Dissipation
RθJC
Thermal Resistance-Junction to Case
0.43
RθJA
Thermal Resistance-Junction to Ambient
62.5
A
W
°C/W
Avalanche Ratings
EAS
Avalanche Energy, Single Pulsed
L=0.5mH
mJ
1496***
Note: * Repetitive rating ; pulse width limiited by junction temperature
** Drain current is limited by junction temperature
*** VD=64V
Electrical Characteristics
Symbol
Parameter
(TC = 25°C Unless Otherwise Noted)
Test Conditions
HY4008
Min.
Typ.
Max.
80
-
-
-
-
1
-
-
10
Unit
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)*
VGS=0V, IDS=250µA
VDS=80V, VGS=0V
TJ=85°C
V
µA
Gate Threshold Voltage
VDS=VGS, IDS=250µA
2.0
3.0
4.0
V
Gate Leakage Current
VGS=±25V, VDS=0V
-
-
±100
nA
Drain-Source On-state Resistance
VGS=10V, IDS=100A
-
2.9
3.5
mΩ
ISD=100A, VGS=0V
-
0.8
1.2
V
-
30
-
ns
-
52
-
nC
Diode Characteristics
VSD *
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD=100A, dlSD/dt=100A/µs
2
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HY4008P/M/B/PS/PM
Electrical Characteristics (Cont.)
Symbol
Parameter
(TC = 25°C Unless Otherwise Noted)
Test Conditions
HY4008
Min.
Typ.
Max.
-
3.2
-
-
8154
-
-
1029
-
-
650
-
-
28
-
-
18
-
-
42
-
-
54
-
-
197
-
-
31
-
-
75
-
Unit
Dynamic Characteristics
RG
Gate Resistance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
Tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
Tf
VGS=0V,VDS=0V,F=1MHz
VGS=0V,
VDS=25V,
Frequency=1.0MHz
VDD=40V, R G=6 Ω,
I DS =100A, VGS=10V,
Turn-off Fall Time
Ω
pF
ns
Gate Charge Characteristics
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=64V, VGS=10V,
IDS=100A
Note * : Pulse test ; pulse width ≤300µs, duty cycle≤2%.
3
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nC
HY4008P/M/B/PS/PM
Typical Operating Characteristics
Power Dissipation
Drain Current
350
225
200
ID - Drain Current (A)
250
200
150
100
limited by package
175
150
125
100
75
50
25
50
o
TC=25 C,VG=10V
o
TC=25 C
0
0
20
40
0
60
80 100 120 140 160 180 200
0
20
Tc - Case Temperature (°C)
40
60 80 100 120 140 160 180 200
Tc - Case Temperature (°C)
Safe Operation Area
im
it
100us
ds
(
on
)L
100
1ms
R
ID - Drain Current (A)
1000
10ms
10
DC
1
o
TC=25 C
0.1
0.01
0.1
1
10
100 300
VDS - Drain - Source Voltage (V)
Thermal Transient Impedance
1
Normalized Effective Transient
Ptot - Power (W)
300
Duty = 0.5
0.1
0.2
0.1
0.05
0.01
0.02
0.01
0.001
Single
Mounted on minimum pad
o
RθJA : 62.5 C/W
0.0001
0.0001
0.001
0.1
0.01
1
10
Square Wave Pulse Duration (sec)
4
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HY4008P/M/B/PS/PM
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
Output Characteristics
5.0
320
VGS= 5.5,6,7,8,9,10V
RDS(ON) - On - Resistance (mW)
280
ID - Drain Current (A)
240
5V
200
160
4.5V
120
4V
80
40
0
0.0
1.0
2.0
3.0
4.0
5.0
4.5
4.0
VGS=10V
3.5
3.0
2.5
2.0
1.5
0
6.0
50
100
150
200
250
ID - Drain Current (A)
VDS - Drain - Source Voltage (V)
Gate-Source On Resistance
Gate Threshold Voltage
14
IDS=100A
1.6
IDS =250µA
Normalized Threshold Voltage
RDS(ON) - On - Resistance (mW)
12
10
8
6
4
2
0
1.4
1.2
1.0
0.8
0.6
0.4
3
4
5
6
7
8
9
0.2
-50 -25
10
VGS - Gate - Source Voltage (V)
0
25
50
75 100 125 150 175
Tj - Junction Temperature (°C)
5
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HY4008P/M/B/PS/PM
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
Source-Drain Diode Forward
2.4
2.2
200
VGS = 10V
100
IDS = 100A
Normalized On Resistance
2.0
1.8
IS - Source Current (A)
o
1.6
1.4
1.2
1.0
0.8
0.6
0.4
o
Tj=25 C
1
RON@Tj=25 C: 2.9mΩ
0
25
50
75 100 125 150 175
0.1
0.0
0.6
0.8
1.0
1.2
Capacitance
Gate Charge
VGS - Gate-source Voltage (V)
10500
9000
1.4
10
VDS= 64V
9
Ciss
7500
6000
4500
3000
Coss
IDS= 100A
8
7
6
5
4
3
2
1
Crss
0
0.4
VSD - Source - Drain Voltage (V)
Frequency=1MHz
1500
0.2
Tj - Junction Temperature (°C)
12000
C - Capacitance (pF)
10
o
0.2
-50 -25
0
Tj=175 C
8
16
24
32
0
40
VDS - Drain - Source Voltage (V)
0
40
80
120
160
QG - Gate Charge (nC)
6
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200
HY4008P/M/B/PS/PM
Avalanche Test Circuit and Waveforms
VDS
L
tp
VDSX(SUS)
DUT
VDS
IAS
RG
VDD
VDD
IL
tp
EAS
0.01Ω
tAV
Avalanche Test Circuit and Waveforms
VDS
RD
V
DS
DUT
RG
90%
VGS
VDD
10%
VGS
tp
td(on) tr
7
td(off) tf
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HY4008P/M/B/PS/PM
Package Information
TO-220FB-3L
SYMBOL
A
A1
A2
b
b2
c
D
D1
DEP
E
NOM
MAX
MIN
NOM
MAX
4.57
1.30
4.70
1.33
0.173
0.050
0.180
0.051
0.185
0.052
2.35
0.77
2.40
0.80
2.50
0.90
0.093
0.030
0.094
0.031
0.098
0.035
1.17
1.27
1.36
0.046
0.050
0.054
0.48
15.40
0.50
15.60
0.56
15.80
0.019
0.606
0.020
0.614
0.022
0.622
9.00
9.10
9.20
0.354
0.358
0.362
0.05
9.80
0.10
10.00
0.20
10.20
0.002
0.386
0.004
0.394
0.008
0.402
8.70
-
0.343
-
E1
-
E2
9.80
e
e1
H1
L
L1
L2
P
P1
Q
θ1
θ2
θ3
8
MIN
4.40
1.27
6.40
12.75
-
10.00 10.20
2.54 BSC
5.08 BSC
6.50 6.60
13.50
13.65
3.10 3.30
2.50 REF
0.386
0.394 0.402
0.100 BSC
0.252
0.200 BSC
0.256 0.260
0.502
0.531
-
0.537
0.122 0.130
0.098 REF
3.50
3.60
3.63
0.138
0.142
0.143
3.50
2.73
3.60
2.80
3.63
2.87
0.138
0.107
0.142
0.110
0.143
0.113
5°
7°
9°
5°
7°
9°
1°
1°
3°
3°
5°
5°
1°
1°
3°
3°
5°
5°
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HY4008P/M/B/PS/PM
TO-220FB-3M
SYMBOL
A
A1
A2
b
b2
c
D
D1
DEP
E
NOM
MAX
MIN
NOM
MAX
4.57
1.30
4.70
1.33
0.173
0.050
0.180
0.051
0.185
0.052
2.35
0.77
2.40
0.80
2.50
0.90
0.093
0.030
0.094
0.031
0.098
0.035
1.17
1.27
1.36
0.046
0.050
0.054
0.48
15.40
0.50
15.60
0.56
15.80
0.019
0.606
0.020
0.614
0.022
0.622
9.00
9.10
9.20
0.354
0.358
0.362
0.05
9.80
0.10
10.00
0.20
10.20
0.002
0.386
0.004
0.394
0.008
0.402
8.70
-
0.343
-
E1
-
E2
9.80
e
e1
H1
L
L1
L2
P
P1
Q
θ1
θ2
9
MIN
4.40
1.27
6.40
7.25
-
10.00 10.20
2.54 BSC
5.08 BSC
6.50 6.60
7.40
7.55
3.10 3.30
2.50 REF
0.386
0.252
0.285
-
0.394 0.402
0.100 BSC
0.200 BSC
0.256 0.260
0.291 0.297
0.122 0.130
0.098 REF
3.50
3.60
3.63
0.138
0.142
0.143
3.50
2.73
3.60
2.80
3.63
2.87
0.138
0.107
0.142
0.110
0.143
0.113
5°
7°
9°
5°
7°
9°
1°
3°
5°
1°
3°
5°
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HY4008P/M/B/PS/PM
TO-263-2L
SYMBOL
MM
MIN
NOM
MAX
MIN
NOM
MAX
A
4.40
4.57
4.70
0.173
0.180
0.185
A1
1.22
1.27
1.32
0.048
0.050
0.052
A2
2.59
2.69
2.79
0.102
0.106
0.110
A3
0.00
0.10
0.20
0.000
0.004
0.008
b
0.77
0.813
0.90
0.030
0.032
0.035
b1
1.20
1.270
1.36
0.047
0.050
0.054
c
0.34
0.381
0.47
0.013
0.015
0.019
D1
8.60
8.70
8.80
0.339
0.343
0.346
E
10.00
10.16
10.26
0.394
0.400
0.404
E2
10.00
10.10
10.20
0.394
0.398
0.402
H
14.70
15.10
15.50
0.579
0.594
0.610
H2
1.17
1.27
1.40
0.046
0.050
0.055
L
2.00
2.30
2.60
0.079
0.091
0.102
L1
1.45
1.55
1.70
0.057
0.061
0.067
2.54 BSC
e
L2
0.100 BSC
2.50 REF
L4
10
INCH
0.098 REF
0.25 BSC
0.010 BSC
0°
5°
8°
0°
5°
8°
1
5°
7°
9°
5°
7°
9°
2
1°
3°
5°
1°
3°
5°
ΦP1
1.40
1.50
1.60
0.055
0.059
0.063
DEP
0.05
0.10
0.20
0.002
0.004
0.008
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HY4008P/M/B/PS/PM
TO-3PS-3L
SYMBOL
A
A1
A2
b
b2
c
D
D1
D2
DEP
E
E1
E2
E3
e
e1
L
L1
P
P1
P2
P3
Q
Q1
Q2
U
θ1
θ2
θ3
11
MIN
NOM
3. 36
3. 56
3. 76
1. 27
1. 49
0. 77
1. 17
1. 30
1. 54
0. 80
1. 27
1. 37
1. 64
0. 90
1. 36
0. 48
1 5. 50
9. 10
0. 05
9. 88
7. 80
6. 90
9. 90
1 3. 25
-
1. 40
3. 93
1. 60
6. 80
4. 00
3°
5°
1°
MAX
0. 50
1 5. 70
0. 56
1 5. 90
9. 20
0. 30
0. 10
1 0. 00
8. 00
7. 10
1 0. 00
2. 54
5. 08
1 3. 40
3 .0 0
6. 00
3. 20
3. 57
1. 50
4. 00
1. 70
7. 00
4. 20
5°
7°
3°
9. 30
RE F
0. 20
1 0. 20
8. 20
7. 30
1 0. 10
BS C
BS C
1 3. 55
3 .3 0
RE F
RE F
RE F
1. 60
4. 07
1. 80
7. 20
4. 40
7°
9°
5°
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HY4008P/M/B/PS/PM
TO-3PS-3M
SYMBOL
A
A1
A2
b
b2
c
D
D1
D2
DEP
E
E1
E2
E3
e
e1
L
L1
P
P1
P2
P3
Q
Q1
Q2
U
θ1
θ2
θ3
12
MIN
NOM
3. 36
3. 56
3. 76
1. 27
1. 49
0. 77
1. 17
1. 30
1. 54
0. 80
1. 27
1. 37
1. 64
0. 90
1. 36
0. 48
1 5. 50
9. 10
0. 05
9. 88
7. 80
6. 90
9. 90
7.25
-
1. 40
3. 93
1. 60
6. 80
4. 00
3°
5°
1°
MAX
0. 50
1 5. 70
0. 56
1 5. 90
9. 20
0. 30
0. 10
1 0. 00
8. 00
7. 10
1 0. 00
2. 54
5. 08
7.40
3 .0 0
6. 00
3. 20
3. 57
1. 50
4. 00
1. 70
7. 00
4. 20
5°
7°
3°
9. 30
RE F
0. 20
1 0. 20
8. 20
7. 30
1 0. 10
BS C
BS C
7.55
3 .3 0
RE F
RE F
RE F
1. 60
4. 07
1. 80
7. 20
4. 40
7°
9°
5°
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HY4008P/M/B/PS/PM
Devices Per Unit
Package Type
Unit
Quantity
TO-220FB-3L
Tube
50
TO-220FB-3M
Tube
50
TO-263-2L
Tube
50
TO-3PS-3L
Tube
50
TO-3PS-3M
Tube
50
Classification Profile
13
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HY4008P/M/B/PS/PM
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak
(Tp)*
package
body
Temperature
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
3
Package
Volume mm
Thickness
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