HYG045P03LQ1C2
Single P-Channel Enhancement Mode MOSFET
Feature Description
Pin Description
-30V/-80A
D D D D
RDS(ON)= 3.8 mΩ (typ.) @VGS = -10V
D D D D
RDS(ON)= 6.2 mΩ (typ.) @VGS = -4.5V
100% Avalanche Tested
Reliable and Rugged
Halogen- Free Devices Available
S S S G
G S S S
Pin1
PPAK5*6-8L
Applications
Switching Application
Power Management for DC/DC
Battery Protection
Single P-Channel MOSFET
Ordering and Marking Information
Package Code
C2
C2: PPAK5*6-8L
G045P03
Date Code
XYMXXXXXX
XYMXXXXXX
Note: HUAYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate TermiNation finish;which are fully compliant with RoHS. HUAYI lead-free products meet or exceed the lead-Free requirements of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HUAYI defines “Green”
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous
material and total of Br and Cl does not exceed 1500ppm by weight).
HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to this pr
-oduct and/or to this document at any time without notice.
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V1.0
1
HYG045P03LQ1C2
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (Tc=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
-30
V
VGSS
Gate-Source Voltage
±20
V
Maximum Junction Temperature
-55 to 175
°C
Storage Temperature Range
-55 to 175
°C
Tc=25°C
-80
A
Tc=25°C
-320
A
Tc=25°C
-80
A
Tc=100°C
-56
A
Tc=25°C
62.5
W
Tc=100°C
31.2
W
TJ
TSTG
IS
Source Current-Continuous(Body Diode)
Mounted on Large Heat Sink
Note:
IDM
Pulsed Drain Current *
ID
Continuous Drain Current
PD
Maximum Power Dissipation
RJC
Thermal Resistance, Junction-to-Case
2.4
°C/W
RJA
Thermal Resistance, Junction-to-Ambient **
45
°C/W
EAS
SinglePulsed-Avalanche Energy ***
378.5
mJ
L=0.1mH
* Repetitive rating;pulse width limited by max.junction temperature.
** Surface mounted on FR-4 board.
*** Limited by TJmax , starting TJ=25°C, L = 0.1mH, RG= 25Ω, VGS =10V.
Electrical Characteristics(Tc =25°C Unless Otherwise Noted)
Symbol
Parameter
Test Conditions
HYG045P03LQ1
Unit
Min
Typ.
Max
-30
-
-
V
-
-
-1
μA
-
-
-50
μA
-3
V
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Drain-to-Source Leakage Current
VGS(th)
IGSS
RDS(ON)*
VGS=0V,IDS=-250μA
VDS=-30V,VGS=0V
TJ=125°C
Gate Threshold Voltage
VDS=VGS, IDS=-250μA
-1
-1.6
Gate-Source Leakage Current
VGS=±20V,VDS=0V
-
-
VGS=-10V,IDS=-20A
-
3.8
5.0
VGS=-4.5V,IDS=-20A
-
6.2
8.5
ISD=-20A,VGS=0V
-
-0.82
-1.2
V
-
22
-
ns
-
13.5
-
nC
Drain-Source On-State Resistance
±100
nA
mΩ
Diode Characteristics
VSD*
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD=-20A,dISD/dt=100A/μs
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V1.0
2
HYG045P03LQ1C2
Electrical Characteristics (Cont.) (Tc =25°C Unless Otherwise Noted)
Symbol
Parameter
Test Conditions
HYG045P03LQ1
Min
Typ.
Max
-
5.2
-
-
7660
-
Unit
Dynamic Characteristics
RG
Gate Resistance
Ciss
Input Capacitance
VGS=0V,VDS=0V,
Frequency=1.0MHz
VGS=0V,
Coss
Output Capacitance
VDS=-25V,
-
649
-
Crss
Reverse Transfer Capacitance
Frequency=1.0MHz
-
575
-
td(ON)
Turn-on Delay Time
-
14.6
-
Tr
Turn-on Rise Time
VDD=-15V,RG=4Ω,
-
68.8
-
td(OFF)
Turn-off Delay Time
IDS=-20A,VGS=-10V
-
162.9
-
-
95
-
-
131.3
-
Tf
Turn-off Fall Time
Gate Charge
Ω
pF
ns
Characteristics
Qg
Total Gate Charge (Vgs=-10V)
Qg
Total Gate Charge (Vgs=-4.5V)
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS =-15V,ID=-10A
63.6
-
29.5
-
-
19.1
-
nC
Note: *Pulse test,pulse width ≤ 300us,duty cycle ≤ 2%
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V1.0
3
HYG045P03LQ1C2
Typical Operating Characteristics
ID-Drain Current(A)
Voltage
Figure 2: Drain Current
Power Dissipation (w)
Figure 1: Power Dissipation
Tc-Case Temperature(℃)
Tc-Case Temperature(℃)
-VDS-Drain-Source Voltage(V)
Impedance (℃/W)
RDS(ON)-ON-Resistance(mΩ)
Voltage
-VDS-Drain-Source Voltage (V)
Voltage
Maximum Effective Transient Thermal
Impedance, Junction-to-Case
Figure 6: Drain-Source On Resistance
Figure 5: Output Characteristics
-ID-Drain Current(A)
Thermal
Normalized Transient
Figure 4: Thermal Transient Impedance
Z jc
Voltage
-ID-Drain Current(A)
Figure 3: Safe Operation Area
-ID-Drain Current(A)
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V1.0
4
HYG045P03LQ1C2
Typical Operating Characteristics(Cont.)
Voltage
-IS-Source Current (A)
Figure 8: Source-Drain Diode Forward
Voltage
Normalized On-Resistance(A)
Figure 7: On-Resistance vs. Temperature
-VDS-Drain-Source Voltage (V)
Voltage
Figure 10: Gate Charge Characteristics
Voltage
Figure 9: Capacitance Characteristics
-VGS-Gate-Source Voltage (V)
-VSD-Source-Drain Voltage(V)
C-Capacitance(pF)
Tj-Junction Temperature (℃)
Q G-Gate Charge (nC)
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V1.0
5
HYG045P03LQ1C2
Avalanche Test Circuit
Switching Time Test Circuit
Gate Charge Test Circuit
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V1.0
6
HYG045P03LQ1C2
Device Per Unit
Package Type
Unit
Quantity
PPAK5*6-8L
Reel
5000
Package Information
PPAK5*6-8L
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V1.0
7
HYG045P03LQ1C2
Classification Profile
Classification Reflow Profiles
Profile Feature
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmaxto TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to peak temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
150 °C
200 °C
60-120 seconds
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
217 °C
60-150 seconds
60-150 seconds
See Classification Temp in table 1
SeeClassification Tempin table 2
20** seconds
30** seconds
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
*Tolerance for peak profile Temperature (T p) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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V1.0
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HYG045P03LQ1C2
Table 1.SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Volume mm³
Volume mm³
Thickness
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