HYG120P06LR1C2
P-Channel Enhancement Mode MOSFET
Feature
Pin Description
-60V/-55A
D D D D
RDS(ON)= 11 mΩ(typ.) @VGS = -10V
D D D D
RDS(ON)= 15.5 mΩ(typ.) @VGS = -4.5V
100% avalanche tested
Reliable and Rugged
Halogen Free and Green Devices Available
S S S G
G S S S
(RoHS Compliant)
Pin1
PDFN5*6-8L
Applications
Switching application
Battery management
P-Channel MOSFET
Ordering and Marking Information
Package Code
C2
G120P06
C2 : PDFN5*6-8L
XYMXXXXXX
Date Code
XYMXXXXXX
Note: HUAYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate Termination finish; which are fully compliant with RoHS. HUAYI lead-free products meet or exceed the lead-Free requirements of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HUAYI defines “Green”
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous
material and total of Br and Cl does not exceed 1500ppm by weight).
HUAYI reserves the right to make changes to improve reliability or manufacturability without notice, and Advise
customers to obtain the latest version of relevant information to verify before placing orders.
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V1.0
1
HYG120P06LR1C2
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (Tc=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
-60
V
VGSS
Gate-Source Voltage
±20
V
TJ
Junction Temperature Range
-55 to 175
°C
TSTG
Storage Temperature Range
-55 to 175
°C
Tc=25°C
-55
A
Tc=25°C
-210
A
Tc=25°C
-55
A
Tc=100°C
-38.8
A
Tc=25°C
75
W
Tc=100°C
37.5
W
2
°C/W
110
°C/W
212
mJ
IS
Drain Current-Continuous
Mounted on Large Heat Sink
Note:
IDM
Pulsed Drain Current *
ID
Continuous Drain Current
PD
Maximum Power Dissipation
RJC
Thermal Resistance, Junction-to-Case
RJA
Thermal Resistance, Junction-to-Ambient **
EAS
SinglePulsed-Avalanche Energy ***
*
**
***
L=0.3mH
Repetitive rating; pulse width limited by max junction temperature.
Surface mounted on FR-4 board.
Limited by TJmax , starting TJ=25°C, L = 0.3mH, RG= 25Ω, VGS = -10V.
Electrical Characteristics(Tc =25°C Unless Otherwise Noted)
Symbol
Parameter
Test Conditions
HYG120P06LR1
Unit
Min
Typ
Max
VGS=0V,IDS=-250uA
-60
-
-
V
VDS=-60V, VGS=0V
-
-
-1
uA
-
-
-50
uA
-1.2
-1.7
-2.5
V
±100
nA
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Drain-to-Source Leakage Current
VGS(th)
IGSS
RDS(ON)*
TJ=125°C
Gate Threshold Voltage
VDS=VGS, IDS=-250uA
Gate-Source Leakage Current
VGS=±20V,VDS=0V
-
-
VGS=-10V,ID= -20A
-
11
15
mΩ
15.5
20
mΩ
-
-0.83
-1.2
V
-
19.5
-
ns
-
16
-
nC
Drain-Source On-state Resistance
VGS=-4.5V,ID= -20A
Diode Characteristics
VSD*
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD= -20A,VGS=0V
ISD= -20A,dI/dt=100A/us
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V1.0
2
HYG120P06LR1C2
Electrical Characteristics (Cont.) (Tc =25°C Unless Otherwise Noted)
Symbol
Parameter
Test Conditions
HYG120P06LR1
Min
Typ
Max
Unit
Dynamic Characteristics
RG
Gate Resistance
VGS=0V,VDS=0V ,F=1MHz
-
12
-
Ciss
Input Capacitance
VGS=0V,
-
4660
-
Coss
Output Capacitance
VDS=-25V,
-
290
-
Crss
Reverse Transfer Capacitance
Frequency=1.0MHz
-
198
-
td(ON)
Turn-on Delay Time
-
10
-
Tr
Turn-on Rise Time
VDD= -30V,RG=4Ω,
-
48
-
td(OFF)
Turn-off Delay Time
IDS= -20A,VGS=-10V
-
173
-
-
83
-
-
95
-
Tf
Turn-off Fall Time
Gate Charge
Ω
pF
ns
Characteristics
Qg
Total Gate Charge (VGS= -10V)
Qg
Total Gate Charge (VGS= -4.5V)
VDS = -48V, VGS=-10V
-
47
-
Qgs
Gate-Source Charge
ID= -20A
-
19
-
Qgd
Gate-Drain Charge
-
21
-
nC
Note: *Pulse test; pulse width ≤ 300us,duty cycle ≤ 2%
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V1.0
3
HYG120P06LR1C2
Typical Operating Characteristics
-ID-Drain Current(A)
Voltage
Figure 2: Drain Current
Power Dissipation (w)
Figure 1: Power Dissipation
Tc-Case Temperature(℃)
Impedance
Thermal
Normalized Transient
Figure 4: Thermal Transient Impedance
Zθ jc
Voltage
-ID-Drain Current(A)
Figure 3: Safe Operation Area
Tc-Case Temperature(℃)
Maximum Effective Transient Thermal
Impedance, Junction-to-Case
-VDS-Drain-Source Voltage(V)
-VDS-Drain-Source Voltage (V)
Voltage
RDS(ON)-ON-Resistance(mΩ)
Figure 6: Drain-Source On Resistance
Voltage
-ID-Drain Current(A)
Figure 5: Output Characteristics
- ID-Drain Current(A)
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V1.0
4
HYG120P06LR1C2
Typical Operating Characteristics(Cont.)
Voltage
-IS-Source Current (A)
Figure 8: Source-Drain Diode Forward
Voltage
Normalized On-Resistance
Figure 7: On-Resistance vs. Temperature
Tj-Junction Temperature (℃)
-VDS-Drain-Source Voltage (V)
Voltage
-VGS-Gate-Source Voltage (V)
Figure 10: Gate Charge Characteristics
Voltage
C-Capacitance(pF)
Figure 9: Capacitance Characteristics
-VSD-Source-Drain Voltage(V)
Q G-Gate Charge (nC)
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V1.0
5
HYG120P06LR1C2
Avalanche Test Circuit
Switching Time Test Circuit
Gate Charge Test Circuit
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V1.0
6
HYG120P06LR1C2
Device Per Unit
Package Type
Unit
Quantity
PPAK5*6-8L
Reel
5000
Package Information
PPAK5*6-8L
www.hymexa.com
V1.0
7
HYG120P06LR1C2
Classification Profile
Classification Reflow Profiles
Profile Feature
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to peak temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
150 °C
200 °C
60-120 seconds
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
217 °C
60-150 seconds
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
20** seconds
30** seconds
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
*Tolerance for peak profile Temperature (T p) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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V1.0
8
HYG120P06LR1C2
Table 1.SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Volume mm³
Volume mm³
Thickness
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