2R150TB-8

Gas Discharge Tube Diodes 2R075~2R800(T,S)B/D-8 Series GDTs (Gas Discharge Tubes) are placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment switching operations.These devices do not influence the signal in normal operation. However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment. unit:(mm) 0.8±0.05 82 -*: 6±0.3 66±4 6±0.3 GDTs offer a high level of surge protection, a broad voltage range, low capacitance, and many form factors including new surface mount devices, which makes them suitable for applications such as MDF (Main Distribution Frame) modules, high data-rate telecom applications (e.g. ADSL, VDSL), and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PTC devices, TSS thyristor surge protection devices, and MOV (Metal Oxide Varistor) devices, they can help equipment manufacturers meet Dimension 4±0.5 4±0.5 8±0.3 8±0.3 (T)Series 82 -*: (S)Series Features • RoHS compliant and Lead-free • GHz working frequency • Excellent stability on multiple pulse duty cycle • Excellent response to fast rising transients. • Ultra Low Insertion Loss • 5KA/10KA surge capability tested with 8/20μS pulse as defined by IEC 6100-4-5 • Ultra small devices offered in a variety of mounting lead forms • Non-Radioactive • Low capacitance (1 DC 50V >1 DC 100V >1 DC 250V >1 500 times Notes: 1.Insulation resistance measure at: DC 50V for the 2R075,2R090,and 2R150 DC 200V for other. 2. Terms in accordance with ITU-T K.12 and GB/T 9043-2008 3. At delivery AQL 0.65 level 2 DIN ISO 2859 GDT 02 Minimum Insulation resistance DC 25V >1 1.5 pF DC 50V >1 DC 100V >1 DC 250V >1 Pb – Free assembly Pre Heat s(min) ) - Temperature Max (T s(max) - Time (Min to Max) (t s 150°C ) ) 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max - Temperature (T L) (Liquidus) 217°C - Temperature (t L) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (t p ) 10 – 30 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T ) tL Ramp-down Preheat TS(min) 25 Peak Temperature (T P) Critical Zone TL to T P Ramp-up TL TS(max) 200°C Tem p er at u r e - Temperature Min (T tP TP tS time to peak temperature (t 25ºC to peak) Time 8 minutes Max. P Do not exceed 260°C Soldering Parameters - Wave Soldering (Thru-Hole Devices) Recommended Process Parameters: 280 Wave Parameter 260 Preheat: 240 220 (Depends on Flux Activation Temperature) 200 180 160 140 120 100 80 60 Lead-Free Recommendation (Typical Industry Recommendation) Temperature Minimum: 100° C Temperature Maximum: Preheat Time: 150° C 60-180 seconds Solder Pot Temperature: 280° C Maximum Solder Dwell Time: 2-5 seconds 40 240 230 220 210 200 190 180 170 160 150 140 130 120 110 90 100 80 70 60 50 40 20 30 0 0 20 10 Temperature (°C) - Measured on bottom side of board 300 Time (Seconds) Cooling Time Preheat Time Dwell Time Soldering Parameters - Hand Soldering Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. GDT 03 Packaging Dimensions For 'T' Type Axial Lead Items