103AP-2

SEMITEC Ishizuka Electronics Corporation THERMISTOR SPECIFICATIONS 1. Scope This specification defines rating, dimensions, electrical properties, mechanical properties and climatic properties for the following part. 103AP-2 2. Part No. 3. Rating 3.1 Rated zero-power resistance 3.2 Rated B-value R25 B25/85 10.0 k ohm +/-0.5% (at 25 deg C) 3 435 K +/- 0.5% (The Rated B-value is calculated from the zero-power resistance values measured at 25 deg C and 85 deg C.) 3.3 Dissipation factor Approx. 1.0mW/deg C (in still air at 25 deg C) (Measured according to JIS C 2570 13.7) 3.4 Thermal time constant Approx. 15.0 s (in still air) (A constant that represents the time required for the temperature of a thermistor to change by 63.2% of the difference between the original temperature and the ambient temperature when the load current of the thermistor is abruptly changed from non-zero-power state to zero–power state. Measured according to JIS C 2570 13.8) 3.5 Maximum power 5.0mW (in still air at 25 deg C) (Including self-heat of approx. 5 deg C) 4. Operating temperature ranges Spec.No : S03-0239 -60 deg C ~ +150 deg C Note Revision Date : NOV. 10, 2003 Approved H.ISHIDA Checked M.FUKUMOTO A Drawn B M.MIYAKE C 1/3 SEMITEC Ishizuka Electronics Corporation 5. Dimensions Unit: mm 1.8~2.6 3.0~3.6 17+/-1.5 8.5+/-1 3.0~4.5 (1) 103 3N10 Epoxy resin Marking Tiebar cut (2) (3) (4) (5) (0.7) (0.35) 0.25t Tin plated 42 alloy 2.54+/-0.25 (1) :R25 10 k ohm 103 (2) :year 2003 3 (3) :month 11(NOV.) N (4)(5):day 10 10 Solder:Lead free 6. Electric properties Item Test Conditions 6.1 Voltage proof AC 1 200V x 1 s (Cut-off current: 1mA) 6.2 Insulation Measured at DC 500V between the coated area and lead-wires. Criteria No visible damage Over 100M ohm 7. Mechanical properties Item 7.1 Test Conditions 2N load for 10s as shown below: Robustness of Terminations 2N(10s) 7.2 Free fall From 1 meter high to the maple or the like board. 7.3 Resistance to soldering heat The lead-wires to be dipped into the soldering bath at 260 deg C+/-5 deg C for 10s+/-1s. In case of a soldering iron, the 350 deg C+/-5 deg C of the iron shall be applied to the area of the lead-wires below the tiebar-cut for 3s+/-0.5s. 7.4 Solderability After applying the flux specified in JIS C2570 , the lead-wires are to be dipped in the soldering bath at 245 deg C+/-5 deg C for 2s+/-1s. Spec. NO. S03-0239 2/3 Criteria Variation of Rated zero-power resistance at 25 deg C and Rated B-value after test shall be within +/-0.5% of those of the initial values. No visible damage except the bend of the lead wire due to the 2N load. Variation of Rated zero-power resistance at 25 deg C and Rated B-value after test shall be within +/-0.5% of those of the initial values. Soldered area, more than 90% SEMITEC Ishizuka Electronics Corporation 8. Climatic properties Item Test Conditions 8.1 Dry Heat At 150 deg C+/-3 deg C for 1 000 hours and then stored at room temperature and humidity for 1 hour. 8.2 Cold At –60 deg C+/-3 deg C for 1 000 hours and then stored at room temperature and humidity for 1 hour. 8.3 Damp Heat At 40 deg C+/-3 deg C, 90%RH~95%RH for 1 000 hours and then stored at room temperature and humidity for 1 hour. 8.4 Damp load At 40 deg C+/-3 deg C, 90%RH~95%RH with the DC 1mA load for 1 000 hours and then stored at room temperature and humidity for 1 hour. Temperature Cycling 100 times in the following order and conditions and then stored at room temperature and humidity for 1 hour “Room temperature (Initial value)” “-60 deg C+/-3 deg C for 30min”. “Room temperature for 3min”. ” 150 deg C+/-3 deg C for 30min”. “Room temperature for 3min”. 8.5 Spec. NO. S03-0239 3/3 Criteria Variation of Rated zero-power resistance at 25 deg C and Rated B-value after test shall be within +/-0.5% of those of the initial values. Variation of Rated zero-power resistance at 25 deg C and Rated B-value after test shall be within +/-0.5% of those of the initial values. Variation of Rated zero-power resistance at 25 deg C and Rated B-value after test shall be within +/-0.5% of those of the initial values.