HYCW01-LF02-125B

序号 (NO.) 品名 (Name) 材质 (Material) 1 A型立式胶芯 1.25 Pitch S/T Wire To Board Housing(H=4.9) LCP UL94V-0 本色 2 A型立式WTB端子 1.25 Pitch S/T Wire To Board Terminal(H=4.9) 铜合金/表面镀锡 Copper Alloy/ Tin Plating 3 A型立式WTB焊片 铜合金/表面镀锡 1.25 Pitch S/T Wire To Copper Alloy/ Board Fitting Nail (H=4.9) Tin Plating 4 A型立式WTB吸盖 1.25 Pitch S/T Wire To Board Cover(H=4.9) LCP UL94V-0 本色 2 A 1 4 WITHOUT COVER SECTION A-A A 技术指标(Technical Index) : (Min) 3 适用线路板(PCB LAYOUT) 1.塑件表面应光洁、无毛边、无明显收缩、缺陷、裂纹等现象.(The surface of the plastic parts should be smooth,no rough edges,no obvious shrinkage,defects,cracks and other phenomena) 2.锁扣窗口：2～3PIN为1个，≥4PIN为2个.(Lock Configuration：2 to 3Pin is 1，≥4Pin is 2 ) 3.不同Pin位吸盖加入/取出力有差异，实属正常现象.(It is normal that there are differences between suction cap and suction cap at different Pin positions) 4.温度范围(Temperature range)：-65°C～125°C. 5.额定电压(Rated voltage)：125V，AC/DC(=等效). 6.接触电阻(Contact resistance)：≤0.02 Ω. 7.绝缘电阻(Insulation resistance):≥100M Ω 陈一鸣 2014-02-23 马跃 2014-02-23 邱敏 2014-02-23 1.25PH 立式贴片wafer HYCW01-LFN-125B HYC-2112271007 1 OF 1