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EHS5-US REL.4

EHS5-US REL.4

  • 厂商:

    THALES(泰雷兹)

  • 封装:

    BLGA-106

  • 描述:

  • 数据手册
  • 价格&库存
EHS5-US REL.4 数据手册
3G Cinterion® EHS5 Wireless Module Highly Efficient 3G in a 2G Footprint Cinterion® EHS5 Wireless Module Highly Efficient 3G in a 2G Footprint EHS5 Dual Band HSPA Java embedded Multi Design Capability (LGA) RLS Monitoring (Jamming Detection) USB 2.0 High Speed compatible Advanced Temperature Management Embedded TCP/IP Stack eCall / ERA GLONASS Compliant FOTA configurable & free of charge Bearer Independent Protocol The Cinterion EHS5 module represents a milestone in embedded Java machine-to-machine (M2M) communication, offering smart connectivity for industrial applications. mobile network operator approvals from application code development, allowing simultaneous progress of both phases for a shorter time to market. EHS5 delivers highly efficient 3G communication in an ultra-compact footprint. EHS5 is an ideal solution for M2M applications moving to 3G technology with a focus on longlasting, futureproof and cost efficient M2M applications. Offering a backward and forward compatible footprint, its multi design capability offers seamless migration and unmatched flexibility to choose frequency bands and global roaming whenever needed. Powered by Intel’s latest HSPA baseband, the next generation of the award-winning Industrial platform features high speed data communication with 7.2 Mbps (max) in the downlink and 5.76 Mbps (max) in the uplink. The platform incorporates an improved Java concept using Multi MIDlet Java execution to simultaneously host and run multiple applications and protocols. An extended security concept with the latest TLS/DTLS engine provides secure and reliable TCP/IP connectivity while an enriched internal flash file system enables free of charge firmware updates over-the-air (FOTA) when required. Sophisticated sandbox modeling and layered architectures simplify device management (DM) and separate The tiny EHS5 comes in Thales M2M’s unique LGA (Land Grid Array) package perfectly suited to the manufacturing needs of small, high-volume M2M devices with a focus on reliable and efficient processes. EHS5 supports voice and data communication and best in class low power consumption incorporated with common industrial interfaces such as USB and serial interfaces. EHS5 is available in two variants: EHS5-US (850/1900 MHz) for North America, and EHS5-E (900/2100 MHz) for the rest of the world. Perfect M2M at Minimal Footprint 27.6 mm BIP (Bearer Independent Protocol) BIP secures broadband speed to eUICC (MIM / classic) to enable On-Demand Provision Service (OPS) and Remote Application Management by direct communication between eUICC and network based on internal TCP/IP stack. As a result it enables instant data connectivity on 1st use of a device, as well as a flexible mobile subscription throughout the lifecycle and a reduced number of customer device variants. 18.8 mm eCall/ ERA glonass Equipped with high performance e-call/GLONASS, the EHS5 platform is already prepared to meet the comprehensive requirements of the European eCall and ERA-GLONASS initiatives to bring rapid assistance to motorists involved in a collision. JavaTM Java offers easy and fast application development, a broad choice of tools, high code reusability, easy maintenance, a proven security concept, on-device debugging as well as multithreading programming and program execution. Thales M2M Support includes:  Personal design-in consulting for hardware and software Local engineers, a competent helpdesk, a dedicated team of R&D specialists and an advanced development center are the hallmarks of our leading support offer.  Extensive RF test capabilities  GCF/PTCRB conform pretests to validate approval readiness  Regular training workshops Cinterion® EHS5 Features General Features  3GPP Rel.7 Compliant Protocol Stack  Dual-Band UMTS (WCDMA/FDD) EHS5-E: 900 and 2100 MHz EHS5-US: 850 and 1900 MHz  Dual-Band GSM EHS5-E: 900 and 1800 MHz EHS5-US: 850 and 1900 MHz  SIM Application Toolkit, Class 3, with BIP and RunAT support  3GPP & Russian eCall support  Embedded IP stack  Control via standardized and extended AT commands (Hayes, TS 27.007 and 27.005)  TCP/IP stack access via AT command and transparent TCP/UDP services  Secure Connection with TLS/DTLS  Internet Services TCP/UDP server/client, DNS, Ping, HTTP client  Supply voltage range 3.1 - 4.5 V, highly optimized for minimal power consumption  LGA66 soldering mount, MSL4  Dimension: 27.6 x 18.8 x 2.2 mm  Weight: 2.7 g  Operating Temperature: -40 °C to +90 °C Specifications  HSDPA Cat.8 / HSUPA Cat.6 data rates DL: max. 7.2 Mbps, UL: max. 5.76 Mbps  EDGE Class 12 data rates DL: max. 237 kbps, UL: max. 237 kbps  GPRS Class 12 data rates DL: max. 85.6 kbps, UL: max. 85.6 kbps  CSD data transmission up to 9.6 kbps, V.110, nontransparent  SMS text and PDU mode, cell broadcast  High quality voice support for handset, headset and hands-free operation  Integrated TTY modem  Speech codec: FR, HR, EFR and AMR Special Features  USB interface supports multiple composite mode and a Linux-/Mac- compliant mode  Firmware update via USB and serial interface  Real time clock with alarm functionality  Multiplexer according 3GPP TS 27.010  RLS Monitoring (Jamming detection) in 2G and 3G  Informal Network Scan  Customer IMEI/SIM-Lock as variant  Integrated FOTA, configurable and free of charge  Cell ID based Location Support  LwM2M support Java Open Platform  Java™ ME 3.2  Secure data transmission with HTTPS/SSL  Multi-Threading programming and Multi-Application execution  10 MB RAM and 13 MB Flash File System Interfaces (LGA Pads)  HSIC HS interface up to 480 Mbps  16 GPIO lines shared with DSR, DTR, DCD (all ASC0), ASC1 (RXD, TXD, RTS, CTS), SPI, Fast-Shutdown, Network-Status-Indication, PWM and Pulse-Counter lines  ADC and I2C interface  4-wire high speed serial interface ASC1  Digital audio interface  UICC and U/SIM card interface 1.8 V / 3 V  Lines for Module-On and Reset Drivers  USB, MUX driver for Microsoft® Windows XP™, Vista™ and 7™, 8™ and 10™  RIL driver for Android, USB driver for Microsoft® Windows Embedded-Handheld™ >= 6.x  USB, MUX driver for Microsoft® Windows Embedded- Compact™ >= 5.x Approvals  EHS5-E: CE, R&TTE  EHS5-US: FCC, PTRCB, UL, IC  GCF Listing  Pad for GSM/WCDMA Antenna  AT&T and other local approvals and provider certifica­tions  USB 2.0 HS interface up to 480 Mbps  EuP, RoHS and REACH compliant Thales in IoT: Driving digital transformation with the power of the IoT Thales delivers innovative IoT technology that simplifies and speeds enterprise digital transformation. For more than 20 years, our customers – in a wide range of industries - trust our IoT solutions to seamlessly connect and secure their IoT devices, maximise field insights, and accelerate their global business success. Thales solutions:  Connect assets to wireless networks and cloud platforms  Manage the long lifecycle of IoT solutions  Secure devices and their data  Analyse real-time data transforming it into business intelligence that improves decision making Our 360° approach provides the essential building blocks needed to simplify design, streamline development and accelerate time-to-market. For more information, please visit www.thalesgroup.com/IoT or follow @ThalesIoT on Twitter thalesgroup.com/iot  Thales has a policy of continuous development and improvement and consequently the equipment may vary from the description and specification in this document. This document may not be considered as a contract specification. Graphics do not indicate use or endorsement of the featured equipment or services. © Thales 2017. All rights reserved. Thales , the Thales logo, are trademarks and service marks of Thales and are registered in certain countries. 1 Jun 2020  High speed serial modem interface ASC0
EHS5-US REL.4 价格&库存

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