SiC Schottky Barrier Diode
CI06S65C3
Features
•
•
•
•
•
•
•
Package
650-Volt Schottky Rectifier
Zero Reverse Recovery Current
Zero Forward Recovery Voltage
High-Frequency Operation
Temperature-Independent Switching Behavior
Extremely Fast Switching
Positive Temperature Coefficient on VF
Benefits
•
•
•
•
•
TO-220-2
Replace Bipolar with Unipolar Rectifiers
Essentially No Switching Losses
Higher Efficiency
Reduction of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
1
2
PIN 1
CASE
PIN 2
Applications
•
•
•
Switch Mode Power Supplies
Power Factor Correction
Motor Drives
Maximum Ratings (TC = 25 ˚C unless otherwise specified)
Symbol
Parameter
Value
Unit
Test Conditions
Note
VRRM
Repetitive Peak Reverse Voltage
650
V
VRSM
Surge Peak Reverse Voltage
650
V
VDC
DC Blocking Voltage
650
V
Continuous Forward Current
19
9
6
A
TC=25˚C
TC=135˚C
TC=154˚C
IFRM
Repetitive Peak Forward Surge Current
30
20
A
TC=25˚C, tP = 10 ms, Half Sine Wave
TC=110˚C, tP = 10 ms, Half Sine Wave
IFSM
Non-Repetitive Peak Forward Surge Current
63
49
A
TC=25˚C, tp = 10 ms, Half Sine Wave
TC=110˚C, tp = 10 ms, Half Sine Wave
Fig. 8
IF,Max
Non-Repetitive Peak Forward Surge Current
540
460
A
TC=25˚C, tP = 10 µs, Pulse
TC=110˚C, tP = 10 µs, Pulse
Fig. 8
Ptot
Power Dissipation
88
38
W
TC=25˚C
TC=110˚C
Fig. 4
-55 to
+175
˚C
1
8.8
Nm
lbf-in
IF
TJ , Tstg
Operating Junction and Storage Temperature
TO-220 Mounting Torque
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M3 Screw
6-32 Screw
Fig. 3
SiC Schottky Barrier Diode
CI06S65C3
Electrical Characteristics
Symbol
Parameter
Typ.
Max.
Unit
Test Conditions
Note
VF
Forward Voltage
1.5
2.0
1.7
2.4
V
IF = 6 A TJ=25°C
IF = 6 A TJ=175°C
Fig. 1
IR
Reverse Current
8
15.5
40
160
μA
VR = 650 V TJ=25°C
VR = 650 V TJ=175°C
Fig. 2
QC
Total Capacitive Charge
15
nC
VR = 400 V, IF = 6 A
di/dt = 500 A/μs
TJ = 25°C
Fig. 5
C
Total Capacitance
295
28.5
25.5
pF
VR = 0 V, TJ = 25°C, f = 1 MHz
VR = 200 V, TJ = 25˚C, f = 1 MHz
VR = 400 V, TJ = 25˚C, f = 1 MHz
Fig. 6
EC
Capacitance Stored Energy
2.3
μJ
VR = 400 V
Fig. 7
Note: This is a majority carrier diode, so there is no reverse recovery charge.
Thermal Characteristics
Symbol
RθJC
Parameter
Thermal Resistance from Junction to Case
Typ.
Unit
Note
1.7
°C/W
Fig. 9
Typical Performance
20
14
8
6
TJ = 25 °C
TJ = 75 °C
TJ = 125 °C
IR (mA)
10
TJ = -55 °C
Reverse Leakage Current, IRR (mA)
F
Foward I
Current,
(A) IF (A)
12
TJ = 175 °C
4
2
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
0 200 400 600 800 1000 1200
3.5
4.0
FowardVVoltage,
(V) VF (V)
F
16
TJ = 175 °C
12
TJ = 125 °C
TJ = 75 °C
8
TJ = 25 °C
TJ = -55 °C
4
0
0
100 200 300 400 500 600 700 800 900 1000
ReverseVVoltage,
(V) VR (V)
R
Figure 1. Forward Characteristics
Figure 2. Reverse Characteristics
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SiC Schottky Barrier Diode
CI06S65C3
Typical Performance
70
100
10% Duty
20% Duty
30% Duty
50% Duty
70% Duty
DC
60
80
70
40
(W)
PP
Tot(W)
TOT
IF(peak)
(A)
IF (A)
50
90
30
60
50
40
30
20
20
10
10
0
25
50
75
100
125
150
0
175
25
50
75
T
˚C
TCC(°C)
150
175
C
Figure 4. Power Derating
350
Conditions:
TJ = 25 °C
Conditions:
TJ = 25 °C
Ftest = 1 MHz
Vtest = 25 mV
300
20
250
Capacitance
C (pF) (pF)
CapacitiveQCharge,
(nC) QC (nC)
C
125
˚C
TTC (°C)
Figure 3. Current Derating
25
100
15
10
200
150
100
5
50
0
0
100
200
300
400
500
600
700
ReverseVVoltage,
(V) VR (V)
R
0
0
1
10
100
(V) VR (V)
ReverseVVoltage,
R
Figure 5. Total Capacitance Charge vs. Reverse Voltage
Figure 6. Capacitance vs. Reverse Voltage
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1000
SiC Schottky Barrier Diode
CI06S65C3
Typical Performance
1,000
6
IIFSM (A)
(A)
4
FSM
3
C
Capacitance StoredE Energy,
µJ)
(mJ) EC (µ
5
100
TJ_initial = 25 °C
TJ_initial = 110 °C
2
1
0
100
200
300
400
500
600
700
ReverseVVoltage,
(V) VR (V)
1E-3
Figure 8. Non-repetitive peak forward surge current
versus pulse duration (sinusoidal waveform)
Figure 7. Capacitance Stored Energy
1
100E-6
tp (s)
Time,
tp (s)
R
Thermal Resistance
(oC/W)
Thermal Resistance
(˚C/W)
0
10
10E-6
0.5
0.3
0.1
100E-3
0.05
0.02
SinglePulse
10E-3
0.01
1E-3
1E-6
10E-6
100E-6
1E-3
Time,
tp (s)
T (Sec)
10E-3
Figure 9. Transient Thermal Impedance
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100E-3
1
10E-3
SiC Schottky Barrier Diode
CI06S65C3
Package Dimensions
Package TO-220-2
POS
PIN 1
PIN 2
CASE
Inches
Millimeters
Min
Max
Min
Max
A
.381
.410
9.677
10.414
B
.235
.255
5.969
6.477
C
.100
.120
2.540
3.048
D
.223
.337
5.664
8.560
D1
.457-.490
11.60-12.45 typ
D2
.277-.303 typ
7.04-7.70 typ
D3
.244-.252 typ
6.22-6.4 typ
E
.590
.615
14.986
15.621
E1
.302
.326
7.68
8.28
E2
.227
251
5.77
6.37
F
.143
.153
3.632
3.886
G
1.105
1.147
28.067
29.134
H
.500
.550
12.700
13.970
L
.025
.036
.635
.914
M
.045
.055
1.143
1.550
N
.195
.205
4.953
5.207
P
.165
.185
4.191
4.699
Q
.048
.054
1.219
1.372
S
3°
6°
3°
6°
T
3°
6°
3°
6°
U
3°
6°
3°
6°
V
.094
.110
2.388
2.794
W
.014
.025
.356
.635
X
3°
5.5°
3°
5.5°
Y
.385
.410
9.779
10.414
z
.130
.150
3.302
3.810
NOTE:
1. Dimension L, M, W apply for Solder Dip Finish
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