PremierWave 2050
Enterprise Wi-Fi® IoT Module
Integration Guide
Part Number 900-731-R
Revision C February 2017
Intellectual Property
© 2017 Lantronix, Inc. All rights reserved. No part of the contents of this publication may be
transmitted or reproduced in any form or by any means without the written permission of
Lantronix.
Lantronix and PremierWave are registered trademarks of Lantronix, Inc. in the United States
and other countries.
Patented: http://patents.lantronix.com; additional patents pending.
Wi-Fi is a registered trademark of Wi-Fi Alliance Corporation. Ethertronics is a trademark of
Ethertronics, Inc. Exar is a trademark of Exar Integrated Systems Corporation. SEMTECH is
a trademark of Semtech Corporation. All other trademarks and trade names are the property of
their respective holders.
Contacts
Lantronix, Inc.
7535 Irvine Center Drive, Suite 100
Irvine, CA 92618, USA
Toll Free: 800-526-8766
Phone:
949-453-3990
Fax:
949-453-3995
Technical Support
Online: www.lantronix.com/support
Sales Offices
For a current list of our domestic and international sales offices, go to the Lantronix web site at
www.lantronix.com/about/contact
Disclaimer
All information contained herein is provided “AS IS.” Lantronix undertakes no obligation to
update the information in this publication. Lantronix does not make, and specifically disclaims,
all warranties of any kind (express, implied or otherwise) regarding title, non-infringement,
fitness, quality, accuracy, completeness, usefulness, suitability or performance of the
information provided herein. Lantronix shall have no liability whatsoever to any user for any
damages, losses and causes of action (whether in contract or in tort or otherwise) in
connection with the user’s access or usage of any of the information or content contained
herein. The information and specifications contained in this document are subject to change
without notice.
This equipment has to be tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
2
If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
1. Reorient or relocate the receiving antenna.
2. Increase the separation between the equipment and receiver.
3. Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
4. Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
This device is intended only for OEM Integrators. The OEM integrator should be aware of the
following important considerations.
Labeling of the End Product
The label on the end product incorporating the PremierWave 2050 module must clearly state
that it contains an FCC-approved RF module. Canada and Japan also require a similar
statement.
For example, “This product contains RF transmitter ID # (put FCC, IC, CMIIT, and/or Japan
module grant numbers here).” The label must include the ID numbers for the regions where
the end product is installed. The grant numbers are below.
♦
PremierWave 2050 FCC ID number: R68PW2050
♦
PremierWave 2050 IC ID number: 3867A-PW2050
♦
PremierWave 2050 Japan ID numbers: 201-152843
♦
PremierWave 2050 China SRRC CMIIT ID: 2015AJ6847 (M)
RSS-GEN Sections 7.1.4 and 7.1.5 Statement for Devices with
Detachable Antennas
This device has been designed to operate with the antennas listed in the Certificate, and
having a maximum gain of 5.5 dBi. Antennas not included in this list or having a gain greater
than 5.5 dBi are strictly prohibited for use with this device, unless system level approval is
gained. The required antenna impedance is 50 ohms.
To reduce potential radio interference to other users, the antenna type and its gain should be
so chosen that the equivalent isotropically radiated power (EIRP) is not more than that
required for successful communication.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
3
Integration Notes
This module is authorized under limited module approval specific to mobile host equipment.
The antenna must be installed with a 20 cm space maintained between the antenna and users.
The transmitter module may not be co-located with any other transmitter or antenna.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end product for any additional
compliance requirements required with this module installed (for example, digital device
emission, PC peripheral requirements, etc.)
In the event that these conditions cannot be met (for example certain laptop configurations,
general purpose PCMCIA or similar cards, or co-location with another transmitter) and
obtaining a separate FCC authorization will be required, then the FCC authorization is no
longer considered valid and the FCC ID cannot be used on the final product (including the
transmitter).
Changes or modifications to this device not explicitly approved by Lantronix will void the user's
authority to operate this device.
Note: With the purchase of any PremierWave 2050 family product, the OEM agrees to an
OEM firmware license agreement that grants the OEM a non-exclusive, royalty-free
firmware license to use and distribute the binary firmware image provided, only to the
extent necessary to use the PremierWave 2050 hardware. For further details, please see
the PremierWave 2050 OEM firmware license agreement.
Note: Please refer to the PremierWave 2050 Enterprise Wi-Fi IoT Module Datasheet,
available at www.lantronix.com/support/documentation, for the full compliance
specification and requirements.
Warranty
For details on the Lantronix warranty policy, please go to our Web site at
www.lantronix.com/support/warranty.
Revision History
Date
Rev.
Comments
February 2016
A
Initial document.
May 2016
B
Added the “Sample Solder Process Using 5 Mil Stencil” section.
February 2017
C
Updated the DEFAULT#, WAKE and SHDN signal descriptions.
For the latest revision of this product document, please check our online documentation at
www.lantronix.com/support/documentation.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
4
Table of Contents
Intellectual Property _________________________________________________________
Contacts __________________________________________________________________
Disclaimer ________________________________________________________________
Labeling of the End Product __________________________________________________
RSS-GEN Sections 7.1.4 and 7.1.5 Statement for Devices with Detachable Antennas ____
Integration Notes ___________________________________________________________
Warranty _________________________________________________________________
Revision History ____________________________________________________________
Table of Contents __________________________________________________________
List of Figures _____________________________________________________________
List of Tables ______________________________________________________________
1: Introduction
2
2
2
3
3
4
4
4
5
6
7
8
About the Integration Guide___________________________________________________ 8
Additional Documentation ____________________________________________________ 9
2: Functional Description
PremierWave 2050 Features_________________________________________________
PremierWave 2050 Block Diagram ____________________________________________
Signal Descriptions ________________________________________________________
Antenna Interface _________________________________________________________
Antenna Placement ________________________________________________________
Serial Interface ___________________________________________________________
Ethernet Interface _________________________________________________________
USB Device Port __________________________________________________________
USB Host Port ____________________________________________________________
LEDs ___________________________________________________________________
General Purpose I/O Pins ___________________________________________________
Reset Pins _______________________________________________________________
3: PCB Footprint and Module Dimensions
Access CAD Files _________________________________________________________
Reflow Profile Guideline ____________________________________________________
Sample Solder Process Using 5 Mil Stencil _____________________________________
1. Introduction _________________________________________________________
2. Scope _____________________________________________________________
3. Assembly Process____________________________________________________
4. Solder Paste and Stencil Design ________________________________________
5. Solder Paste Printing _________________________________________________
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
10
10
12
13
17
19
20
22
24
25
26
26
27
28
28
30
32
32
32
32
32
32
5
6. Component placement ________________________________________________
7. Pre-Reflow Inspection _________________________________________________
8. Reflow _____________________________________________________________
9. Post Reflow Inspection ________________________________________________
MSD (Moisture Sensitive Device) Control for the Module ___________________________
Product Information Label ___________________________________________________
Evaluation Board Schematic _________________________________________________
34
34
37
37
39
40
41
List of Figures
Figure 2-1 PremierWave 2050 Dimensions and Views ____________________________
Figure 2-2 PremierWave 2050 Block Diagram ___________________________________
Figure 2-3 PremierWave 2050 Pin Locations ____________________________________
Figure 2-4 Reverse-SMA to U.FL (Long) (Lantronix Part Number 500-180-R-ACC)______
Figure 2-5 U.FL to U.FL Cable (Lantronix Part Number 500-181-R-ACC) _____________
Figure 2-6 Reverse-SMA to U.FL (short) (Lantronix Part Number 500-182-R-ACC)______
Figure 2-7 Module with Chip Antenna Board Edge Mounting _______________________
Figure 2-8 Serial Port Example ______________________________________________
Figure 2-9 Ethernet Connections to an External 10/100 RJ45 Magnetic Jack (J5) _______
Figure 2-10 USB Device Interface Example (PremierWave 2050 Wi-Fi only) ___________
Figure 2-11 USB Host Interface Connections ___________________________________
Figure 2-12 Recommended Use of SHDN Signal to Shut Off External Power Rail _______
Figure 3-1 PremierWave 2050 Module Dimensions_______________________________
Figure 3-2 PremierWave 2050 Recommended Footprint __________________________
Figure 3-3 Recommended Reflow Profile ______________________________________
Figure 3-4 SMT Process Flow ________________________________________________
Figure 3-5 SPI Rectangle Pad 2876.5 mm Inspection Result ________________________
Figure 3-6 SPI Square Pad 3850.7 mm Inspection Result __________________________
Figure 3-7 X-Ray Machine Pre-Reflow Inspection ________________________________
Figure 3-8 X-Ray Machine Post Reflow Inspection ________________________________
Figure 3-9 PremierWave 2050 Product Label ____________________________________
Figure 3-10 Evaluation Board Schematic (1 of 7) ________________________________
Figure 3-11 Evaluation Board Schematic (2 of 7) ________________________________
Figure 3-12 Evaluation Board Schematic (3 of 7) ________________________________
Figure 3-13 Evaluation Board Schematic (4 of 7) ________________________________
Figure 3-14 Evaluation Board Schematic (5 of 7) ________________________________
Figure 3-15 Evaluation Board Schematic (6 of 7) ________________________________
Figure 3-16 Evaluation Board Schematic (7 of 7) ________________________________
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
11
12
16
18
18
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23
24
25
27
28
29
31
32
33
34
35
37
40
41
42
43
44
45
46
47
6
List of Tables
Table 1-1 PremierWave 2050 Integration Guide Sections ___________________________ 8
Table 2-1 PremierWave 2050 Part Numbers ____________________________________ 10
Table 2-2 PremierWave 2050 PCB Interface Signals _____________________________ 13
Table 2-3 PremierWave 2050 Wi-Fi On Module Antenna __________________________ 17
Table 2-4 PremierWave 2050 Wi-Fi External Antenna Options via On Module U.FL _____ 17
Table 2-5 PremierWave 2050 Serial Port Signals ________________________________ 20
Table 2-6 Example RS232 Connections (Serial Transceiver Required) _______________ 21
Table 2-7 Example RS422/485 Connections (Serial Transceiver Required) ____________ 22
Table 2-8 Ethernet Port Signals ______________________________________________ 23
Table 2-9 USB Device Port Signals ___________________________________________ 24
Table 2-10 USB Host Port Signals ____________________________________________ 25
Table 2-11 PremierWave 2050 Wi-Fi Status LED Output Signals ____________________ 26
Table 2-12 Ethernet Interface PremierWave 2050 Serial Port Signals ________________ 26
Table 2-13 PremierWave 2050 Reset Signals ___________________________________ 27
Table 3-1 Oven Setting _____________________________________________________ 37
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
7
1: Introduction
About the Integration Guide
This user guide provides the information needed to integrate the Lantronix® PremierWave®
2050 family of products into customer-printed circuit boards. This manual is intended for
engineers responsible for integrating the PremierWave 2050 enterprise Wi-Fi® IoT module into
their product. This document provides instruction for connecting to the various module pin
function groups as well as general module placement and mounting. For detailed technical
and compliance specifications please refer to the PremierWave 2050 Enterprise Wi-Fi IoT
Module Datasheet available at www.lantronix.com/support/documentation.
The table below describes the integration guide sections.
Table 1-1 PremierWave 2050 Integration Guide Sections
Section
Description
PremierWave 2050 Features
PremierWave 2050 Block
Diagram
Signal Descriptions
Antenna Interface
Antenna Placement
Using the RF1 Signal Pin
Provides an overview of the module functions and mechanical drawing
Shows the module functional blocks
Serial Interface
Ethernet Interface
USB Device Port
USB Host Port
LEDs
General Purpose IO Pins
Reset Pins
Mounting Instructions and
PCB Footprint
Product Information Label
Evaluation Board Schematic
Provides signal descriptions and pinout information
Lists the antennas pre-certified for use with the module
Provides a general recommendation for antenna placement
This section is reserved for a future off module antenna connection
option
Provides an example on how to connect the unit to external
RS232/485/422 networks
Gives an example on how to connect the module Ethernet
Provides an example on how to connect the unit up as a USB device
port
Provides an example on how to connect the module USB host ports
Describes the module LED connections
Describes the module GPIO connections
Describes the module RESET, DEFAULT, and WAKE pins
Provides the module PCB footprint and solder profile
Provides an image and description of the unit label contents
Provides the PremierWave 2050 evaluation board schematic.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
8
1: Introduction
Additional Documentation
Visit the Lantronix web site at www.lantronix.com/support/documentation for the latest
documentation and the following additional documentation.
Document
Description
PremierWave 2050 Enterprise
Wi-Fi IoT Module Datasheet
PremierWave 2050 Enterprise
Wi-Fi IoT Module User Guide
PremierWave 2050 Enterprise
Wi-Fi IoT Module Evaluation
Kit Quick Start Guide
PremierWave 2050 Enterprise
Wi-Fi IoT Module Evaluation
Kit User Guide
Notification Soldering Profile
and Washing
Provides a unit description and all technical and compliance
specifications for the module
Provides information needed to configure, use, and update the
PremierWave 2050 firmware.
Provides the steps for getting the PremierWave 2050 and
PremierWave 2050 evaluation kit up and running.
Provides a detailed description of the PremierWave 2050 evaluation kit
hardware
Provides guidance in developing a manufacturing assembly process
for various Lantronix embedded products.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
9
2: Functional Description
Designed for quick integration with minimal engineering effort, the chip-sized PremierWave
2050 module provides simplicity and flexibility making it the easiest and fastest networkingenabling module on the market.
PremierWave 2050 modules are extremely compact networking solutions that enable Ethernet
or wireless connectivity on virtually any device with a serial interface. The included industryproven Lantronix module application and full IP stack allow seamless remote access to device
data simplifying design integration while providing robust connectivity.
The PremierWave 2050 modules can be utilized in designs typically intended for chip
solutions. A key difference with the PremierWave 2050 module is that there is virtually no need
to write a single line of code, translating to a much lower development cost and faster time-tomarket.
Table 2-1 PremierWave 2050 Part Numbers
Part Number
Description
PW205010001B
PremierWave 2050, 802.11ac enterprise Wi-Fi module, dual U.FL, ind. temp,
Bulk
PW205020001B
PremierWave 2050, 802.11ac enterprise Wi-Fi module, chip ant +U.FL, ind.
temp, Bulk
PW205010001S
PremierWave 2050, 802.11ac enterprise Wi-Fi module, dual U.FL, ind. temp,
Sample
PW205020001S
PremierWave 2050, 802.11ac enterprise Wi-Fi module, chip ant + U.FL, ind.
temp, Sample
PWGG2051000K
PremierWave 2050 evaluation Kit, 802.11ac enterprise Wi-Fi module, dual U.FL
PWGG2052000K
PremierWave 2050 evaluation kit, 802.11ac enterprise Wi-Fi module, chip ant
PremierWave 2050 Features
The PremierWave 2050 module is built around a 400 Mhz ARM9 processor with 32 MB of
DDR2 DRAM and 128 MB of embedded flash memory. Network connections are provided by
a dual band 802.11 ac/b/g/n WLAN radio and 10/100Mbps Ethernet MAC and PHY.
The PremierWave 2050 module also supports the following:
♦
400 Mhz ARM9 CPU
♦
32 MB DDR2 DRAM
♦
128 MB NAND Flash
♦
802.11 ac/bgn wireless with option for on module antenna or on module U.FL
♦
On module 10/100 Mbps Ethernet MAC/PHY. External magnetic and RJ45 required.
♦
One USB 2.0 high speed host/device interface.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
10
2: Functional Description
♦
One USB 2.0 high speed host only port
♦
One USB 2.0 full speed host only port
♦
Two 3.3V serial interface
♦
13 configurable I/O pins
♦
Power supply filters
♦
Reset circuit
♦
Integrated wake up and shutdown for sleep and standby states
♦
Interface for connection to an external JTAG software debugger.
♦
Dedicated two wire serial port for debug
The PremierWave 2050 module requires +5V DC power and is designed to operate in an
extended temperature range. (See the PremierWave 2050 Enterprise Wi-Fi IoT Module
Datasheet available at www.lantronix.com/support/documentation for all technical
specifications.)
Figure 2-1 PremierWave 2050 Dimensions and Views
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
11
2: Functional Description
PremierWave 2050 Block Diagram
The following drawing is a block diagram of the PremierWave 2050 module showing the
relationships of the components.
Figure 2-2 PremierWave 2050 Block Diagram
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
12
2: Functional Description
Signal Descriptions
The PremierWave 2050 module has a serial interface compatible with data rates up to 921,600
bps. All of the logic IO pins are 3.3V tolerant. The serial signals usually connect to an internal
device, such as a UART. For applications requiring an external cable running with RS-232 or
RS422/485 voltage levels, the PremierWave 2050 must interface to a serial transceiver chip.
An on-module 10/100 Mbps Ethernet MAC and PHY are included on the module. For
connection to an external Ethernet network, external magnetics and an RJ45 are required.
The module has options for an on-module chip antenna and an external antenna via an onmodule U.FL connection.
Table 2-2 PremierWave 2050 PCB Interface Signals
Signal
Name
PremierWave
2050 Pin #
Primary Function
RF1
2
Reserved for future use. Do not
connect
RF2
4
Reserved for future use. Do not
connect
CP3/MISO
12
Configurable GPIO / SPI master
serial data input, SPI slave serial
data output
CP4/MOSI
13
Configurable GPIO / SPI master
serial data output, SPI slave serial
data input
CP7/SCK
14
Configurable GPIO / SPI clock
CP8/CS
15
Configurable GPIO, multiplexed
with SPI interface chip select
CP5
16
Configurable GPIO / I2C data
10K PU
CP6
17
Configurable GPIO / I2C clock
10K PU
USB1+/DDP
18
USB (Positive)
USB high speed host/device port
USB1-/DDM
19
USB (Negative)
USB high speed host/device port
USB2+
21
USB (Positive)
USB high speed host port
USB2-
22
USB (Negative)
USB high speed host port
RTS2
24
UART2 serial ready to send output
CTS2
25
UART2 clear to send input
CP9
26
Configurable GPIO
DBTX
27
Debug UART serial transmit data
output
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
Reset
State
Internal
Pull-up
/Pulldown
Driver
Strength
13
2: Functional Description
Signal
Name
PremierWave
2050 Pin #
Primary Function
DBRX
28
Debug UART serial receive data
input
ETXP
(ETH1+)
34
Ethernet TX (Positive)
Future Gbit pair 1 (pos)
ETXM
(ETH1-)
35
Ethernet TX (Negative)
Future Gbit pair 1 (net)
TXCT
(ECT1)_
37
Center tap connection for Ethernet
TX pair
RXCT
(ECT2)
38
Center tap connection for Ethernet
RX pair
ERXP
(ETH2+)
40
Ethernet RX (Positive)
Future Gbit pair 2 (pos)
ERXM
(ETH2-)
41
Ethernet RX (Negative)
Future Gbit pair 2 (neg)
ETH3+
43
Reserved for future Gbit Ethernet
pair 3 (Positive)
ETH3-
44
Reserved for future Gbit Ethernet
pair 3 (Negative)
ETH4+
46
Reserved for future Gbit Ethernet
pair 4 (Positive)
ETH4-
47
Reserved for future Gbit Ethernet
pair 4 (Negative)
ECT3
49
Reserved for future Gbit center tap
3 connection
ECT4
50
Reserved for future Gbit center tap
4 connection
USB3+
52
USB (Positive)
USB full speed host port
USB3-
53
USB (Negative)
USB full speed host port
SPEED_LED
56
Ethernet speed LED, active low for
100 Mbps
CP13
57
Configurable GPIO
CP12
58
Configurable GPIO
CP11
59
Configurable GPIO
CP10
60
Configurable GPIO
WAKE
65
CPU wake up input. Module wakes
from low power state on a rising
edge
DEFAULT#
66
Unit reset to default, active low.
Drive low for xx seconds to reset
unit to default settings.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
Reset
State
Internal
Pull-up
/Pulldown
Driver
Strength
10K PU
100K
PU
14
2: Functional Description
Signal
Name
PremierWave
2050 Pin #
Primary Function
SYS_LED
67
System status LED, active high
CP2/INT
68
Configurable GPIO / SPI interrupt
external interrupt input
CP1
71
Configurable GPIO
LINK_ACT
72
Ethernet link/activity LED
active low for link.
toggle for activity.
WLAN LED
73
LED function for WLAN link
indication, active low
RESET#
77
Unit hardware reset, active low.
Drive low to reboot unit
RXD2
78
UART2 serial receive data input
TXD2
79
UART2 serial transmit data output
CTS1
80
UART1 clear to send input
RTS1
81
UART1 serial ready to send output
RXD1
82
UART1 Serial receive data input
TXD1
83
UART1 serial transmit data output
SHDN
88
Indicates when module is in
standby state. Use to power off
external devices
RF1_CTL
97
Reserved for future use. Do not
connect
TRST
100
TRST signal for external debugger
TDO
101
TDO signal for external debugger
TDI
104
TDI signal for external debugger
TCK
105
TCK signal for external debugger
TMS
106
TMS signal for external debugger
VCC
29,30,31
5V power input
GND
1,3,5,20,23,32,
33,36,39,42,45,
48,51,54,55,61,
64,84,86,87,94,
95,96,98,99,102,
103,107,108,109,
Signal ground
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
Reset
State
Internal
Pull-up
/Pulldown
Driver
Strength
35K PU
15
2: Functional Description
Signal
Name
PremierWave
2050 Pin #
Primary Function
Reset
State
Internal
Pull-up
/Pulldown
Driver
Strength
110,111,112,113,
114,115,116,117,
118,119,120,121,
122,123,124
RSVD
2,4,6,7,8,9,10,11,
43,44,46,47,49,50,
62,63,69,70,74,
75,76,85,89,90,
91,92,93,
Reserved for future use. Leave
disconnected.
Note1: The current module supports 10/100 Mbps Ethernet. Additional pins have been called out for a
future Gigabit Ethernet module.
Note2: The logic IO pins are 3.3V tolerant.
Note3: Pins 109 to 124 are the large ground pads under the module. These pads should be connected to
ground. These pads also provide thermal relief for the module. It is recommended that multiple vias for
each pad be used to connect the ground pads to the ground plane.
Figure 2-3 PremierWave 2050 Pin Locations
Note: Pins 109 to 124 are the large pads under the module. Pins 109 to 124 should be
connected to GND. The pads in yellow are for future module revisions and should be left
disconnected.
PCB Strip Antenna Area
108
1 GND
GND
2 RF1
3 GND
4 RF2
5 GND
6 SDCK
7 SDCMD
8 SDIO0
9 SDIO1
10 SDIO2
11 SDIO3
12 CP3/MISO
13 CP4/MOSI
14 CP7/SCK
15 CP8/CS
16 CP5/I2CDATA
17 CP6/I2CCLK
18 USB+
19 USB20 GND
21 USB2+
22 USB223 GND
24 RTS2
25 CTS2
26 CP9
27 DBTX
28 DBRX
29 VCC3
30 VCC3
31 VCC3
32 GND
GND
33
107
GND
106
TMS
105
TCK
104
TDI
103
GND
102
GND
101
TDO
100
TRST GND
99
98
GND
97
RF1_CTL
96
GND
95
GND
GND
94
93
VCC2
92
VCC2
91
VCC2
90
VCC2
89
VCC2
88
SHDN
GND
87
ETH447
GND
48
ECT3
49
ECT4
50
GND
51
USB3+
52
USB353
GND
54
Golden2050
GateModule
PremierWave
ETX+
34
ETX35
GND
36
TXCT
37
RXCT
38
GND
39
ERX+
40
ERX41
GND
42
ETH3+
43
ETH344
GND
45
ETH4+
46
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
GND 86
RF3/GPS 85
GND 84
TXD1 83
RXD1 82
RTS1 81
CTS1 80
TXD2 79
RXD2 78
RESET# 77
VCC 76
VCC 75
VCC 74
LED0/LNK 73
LED1/ACT 72
CP1 71
SPARE1 70
SPARE2 69
CP2/INT 68
SYS_LED 67
DEFAULT# 66
WAKE 65
GND 64
ADC1 63
ADC2 62
GND 61
CP10/TXD3 60
CP11/RXD3 59
CP12/RTS3 58
CP13/CTS3 57
SPEED LED 56
GND 55
16
2: Functional Description
Antenna Interface
The PremierWave 2050 module has been certified using the external antennas listed below. Per
FCC guidelines, the PremierWave 2050 Wi-Fi certification remains valid if using an antenna of
similar type to the antennas below. If using an antenna of similar type to one of the antennas
below, but from a different manufacturer part number the antenna gain must be equal to or less
than specified in the table. Refer to the PremierWave 2050 Enterprise Wi-Fi IoT Module
Datasheet, available at www.lantronix.com/support/documentation, for full compliance
instructions and information. Consult with your certification lab for more details.
Table 2-3 PremierWave 2050 Wi-Fi On Module Antenna
Antenna
Type
Peak Gain
Typical
Lantronix
Part Number
Vendor
Vendor Part
Number
Approved
Region
Ceramic
Antenna
2.17dBi, 2.4 GHz to
2.5 GHz
2.74 dBi, 4.9 GHz
to 5.8 GHz
N/A
N/A
N/A
FCC, IC, EU,
AUS/NZS,
JPN, China,
Mexico
Table 2-4 PremierWave 2050 Wi-Fi External Antenna Options via On Module U.FL
Antenna Type
Peak Gain
Typical
Lantronix
Part
Number
Vendor
Vendor
Part
Number
Approved
Region
PCB Strip Antenna
with 50 mm cable
to U.FL connector
With tape backing
PCB Strip Antenna
with 50 mm cable
to U.FL connector
Without tape
backing
Swivel type
antenna, with RPSMA(M) connector
2.5dBi, 2.39 GHz
to 2.49 GHz
5 dBi, 4.9 GHz to
5.9 GHz
2.5dBi, 2.39 GHz
to 2.49 GHz
5dBi, 4.9Ghz to
5.9Ghz
XPW100A003
-01-B
50 piece bulk
pack
Ethertronics®
1001077
Ethertronics
1000668
FCC, IC, EU,
AUS/NZS,
JPN, China,
Mexico
FCC, IC, EU,
AUS/NZS,
JPN, China,
Mexico
2 dBi, 2.4 GHz to
2.5 GHz, 2 dBi,
5.15 GHz to 5.85
GHz
3.8 dBi, 2.4Ghz
to 2.5Ghz,
5.5 dBi, 4.9 GHz
to 5.8Ghz
930-033-RACC
50 piece bulk
pack
Wanshih
WSS002
Taoglas
GW.71.5153
(Not for EU
use)
Swivel type
antenna, with RPSMA(M) connector
FCC, IC, EU,
AUS/NZS,
JPN, China,
Mexico
FCC, IC,
AUS/NZS,
JPN, China,
Mexico
Note: The PCB strip antenna is available from Ethertronics with or without adhesive tape backing
for mounting to a plastic case. The antennas Lantronix supplies include an adhesive backing. For
the component without tape backing a non-conductive double sided adhesive tape can be used to
fix the antenna in place. The Ethertronics part numbers listed above come with a 50 mm U.FL
cable attached to the PCB strip antenna. The 50 mm cable length is the minimum allowed cable
length for use with the PremierWave 2050 module. For similar PCB strip antennas with longer
cables consult with Ethertronics (www.ethertronics.com).
Lantronix provides a U.FL to Reverse SMA antenna cable in with the evaluation board and
sample kits for development work. These cables can be purchased from Lantronix for production
or supplied by an RF cable manufacturer. External antennas can be purchased from an antenna
vendor. Components for cable design should be selected for low loss over the entire 2.4 GHz to
5.9 GHz signal range. The cable target impedance should be 50 ohms.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
17
2: Functional Description
Figure 2-4 Reverse-SMA to U.FL (Long) (Lantronix Part Number 500-180-R-ACC)
Figure 2-5 U.FL to U.FL Cable (Lantronix Part Number 500-181-R-ACC)
Figure 2-6 Reverse-SMA to U.FL (short) (Lantronix Part Number 500-182-R-ACC)
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
18
2: Functional Description
Antenna Placement
When designing the PremierWave 2050 module to a mating board, it is important to consider
the final installation of the module and its location with respect to connecting access points.
The antenna should be placed so that it has as clear as possible path to the connecting access
point for maximum range. Avoid placing the antenna such that it is blocked by metal walls or
ground planes of adjacent circuit boards.
When using the on board chip antenna it is recommended to place the module such that the
antenna region is along the edge of the board or extending outward from the edge of the
board. The area under the chip antenna region should be voided of all signals and planes
See the figure images below showing recommended placement with the module chip antenna.
Figure 2-7 Module with Chip Antenna Board Edge Mounting
Void region in red
6mmx23mm
Edge of PCB
Example PCB Placement
Note: The chip antenna region of the module shown in red above is at the top edge of
the PCB. The area in red should be voided to optimize antenna performance.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
19
2: Functional Description
Serial Interface
The PremierWave 2050 modules has two external serial interfaces. The signal levels on the
serial interface are 3.3V tolerant. The serial interfaces require an external transceiver in order
to connect to external RS232, RS485, or RS422 networks. The signals of the Serial Ports may
be connected as shown in the reference schematic below. The transceiver shown in the
reference schematic is of type Exar, part number SP336. This transceiver is a multiprotocol
RS232, RS485, RS422 transceiver. Single protocol transceivers may be used as required.
The PremierWave 2050 interface may also be directly connected to the UART interface of an
external CPU.
Table 2-5 PremierWave 2050 Serial Port Signals
Signal
Module Pin
Description
TXD1
83
Serial transmit data output
RTS1
81
Serial ready-to-send / serial transmit enable output
RXD1
82
Serial receive data input
CTS1
80
Serial clear-to-send input
TXD2
79
Serial transmit data output 2
RTS2
24
Serial ready-to-send / serial transmit enable output
RXD2
78
Serial receive data input 2
CTS2
25
Serial clear-to-send input
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
20
2: Functional Description
Figure 2-8 Serial Port Example
Table 2-6 Example RS232 Connections (Serial Transceiver Required)
PremierWave 2050 Signal
DTE Connector
DCE Connector
Signal (Logic)
RXDx
TXDx
RTSx
CTSx
CPx
CPy
DB9
2
3
7
8
1
4
DB9
3
2
8
7
4
1
Description
Data In
Data Out
H/W Flow Control Output
H/W Flow Control Input
Modem Control Input
Modem Control Output
DB25
3
2
4
5
8
20
Signal
RXDx
TXDx
RTSx
CTSx
DCDx
DTRx
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
DB25
2
3
5
4
20
8
Signal
TXDx
RXDx
CTSx
RTSx
DTRx
DCDx
21
2: Functional Description
Table 2-7 Example RS422/485 Connections (Serial Transceiver Required)
PremierWave
2050 Signal
(logic)
Description
RS485
Signal
DB25 4
Wire
DB25 2
Wire
DB9 4
wire
DB9 2
wire
TXDx
TXDx
RXDx
RXDx
RTSx
CPx
CPy
Data Out
Data Out
Data In
Data In
TX Enable
RS485 Select
RS485 2-wire
TX+485
TX-485
RX+485
RX-485
14
15
21
22
14
15
14
15
7
3
2
8
7
3
7
3
Note: The IO pins for PremierWave 2050 module are set to floating input on power up until
configured by unit firmware. An external 100K ohm pull-up may be required on the serial transmit
signal to prevent downstream UART devices from detecting false characters on initial power up.
Ethernet Interface
The unit provides a 10/100 Mbps Ethernet interface for connection to an external network
through external magnetics and an external RJ45. The figure below shows the Ethernet
connections to a 10/100 Ethernet RJ45 Jack with Magnetics, J5 in the figure. The RJ45
Magnetic Jack is Belfuse part number 08B0-1D1T-06-F.
The Ethernet differential pair signals, ERXM/ERXP and ETXM/ETXP should be routed as 100ohm differential pairs on a layer next to the signal ground plane. The use of vias on these
signals should be minimized. Center tap signals RXCT and TXCT should be routed with at
least 20 mil trace thickness. The area underneath the RJ45 magnetic jack should be void of all
signals and planes. The connector shield should be connected to chassis. It is recommended
that 1206 resistor pads from chassis ground to signal ground be placed next to each of the
shield tabs. The resistor pads allow for 0 ohm jumper, ferrite beads, or decoupling caps to be
installed as needed for EMI/EMC improvement.
The Ethernet LED signals should be routed to discrete LEDs or to the LED pins on the RJ45
through 220 ohm or larger resistors. The LED signals are active low.
Also shown in the figure is an optional active choke that can be used to improve ESD, EFT,
and EMI/EMC performance in harsh environments. The device is shown as U22 in the figure
and is Akros part number AS1602. This device features route through pin assignments
allowing for the Ethernet differential signal pairs to be routed without altering the trace
impedance or adding vias. Due to this routing the device could be installed or depopulated as
needed. Lantronix has performed all certification to FCC Class B without U22 populated.
The Ethernet signals may be left disconnected if unused.
See the Lantronix app note, How to Connect a Lantronix Embedded Module to a Wired
Ethernet Port for more details on Ethernet connection and routing,
http://www.lantronix.com/pdf/appnotes/Connect-LTRX-Embed-Module-to-WiredEthernet_AN.pdf.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
22
2: Functional Description
Table 2-8 Ethernet Port Signals
Pin Name
Description
PremierWave
2050 Pins
Signal Requirement
RJ45
MagJack
Belfuse,
08B0-1D1T06-F Pin
assignment
ERXM
Ethernet Receive Negative signal.
41
5
EXRP
Ethernet Receive Positive signal.
40
ETXM
Ethernet Transmit Negative
signal.
Ethernet Transmit Positive signal.
35
RXCT
TXCT
Chassis
E_LNKACT
Center tap for receive pair.
Center tap for transmit pair
Unit chassis
Link / activity LED. Active low.
Solid for link, blink for activity.
38
37
72
E_SPEED
Link Speed Active low for
100Mbps, Off (high) for 10Mbps.
56
3V3
3.3 V power
3V3
100 ohm differential
pair with ERXP
100 ohm differential
pair with ERXM
100 ohm differential
pair with ETXP
100 ohm differential
pair with ETXM
Route > 20 mil width
Route > 20 mil width
RJ45 connector shield
Route to LED cathode
through 220 ohm or
greater.
Route to LED cathode
through 220 ohm or
greater.
3.3V power, connect to
LED anodes.
ETXP
34
4
3
2
6
1
Shield tabs
9
7
8, 10
Figure 2-9 Ethernet Connections to an External 10/100 RJ45 Magnetic Jack (J5)
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
23
2: Functional Description
USB Device Port
The PremierWave 2050 module has one USB 2.0 device port interface for connection to an
upstream USB device. The port consists of a differential pair, signals DDP and DDM. These
signals should be routed as a 90 ohm differential pair on a signal layer next to the signal
ground plane. The use of vias should be minimized on these signals. The USB signals can be
connected to a USB Mini Type B USB port or directly to an IC with a USB host port. If
connecting to an external port that is user accessible it is recommended to add a TVS diode
array to the signal nets for ESD protection. The ESD array shown in the figure is of type
SEMTECH RCIamp0502A. This device features through pin routing to minimize trace
impedance changes and simplify routing. The footprint for the TVS array can be added to the
PCB and the part can be depopulated if it is not needed. It is recommended that the power
drawn off the USB Mini Type B connector be limited to less than 500 mA per USB
requirements. If the USB device port is unused the DDP and DDM pins may be left
disconnected.
Table 2-9 USB Device Port Signals
Pin Name
Description
Module Pins
Signal Requirement
Mini Type B USB
Device Connector
Pin
USB+/DDP
USB Device Port
Positive pin
18
3
USB-/DDM
USB Device Port
Negative pin
19
5V
5V power from
USB cable
Signal Ground
Route as 90 ohm
differential pair with DDM
signal
Route as 90 ohm
differential pair with DDP
signal
Current limit to 500 mA
per port
Ground plane
Ground
Ground
2
1
5
Figure 2-10 USB Device Interface Example (PremierWave 2050 Wi-Fi only)
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
24
2: Functional Description
USB Host Port
The PremierWave 2050 module has two USB 2.0 host port interfaces for connection to
downstream USB devices. Each port consists of a differential pair. Port USB 2 is a high
speed port and port USB 3 is a full speed port. These signals should be routed as 90 ohm
differential pairs on a signal layer next to the signal ground plane. The use of vias should be
minimized on these signals. The USB signals can be connected to a USB type A dual USB
port as shown in the figure below or directly to an IC with a USB device port. If connecting to
an external port that is user accessible it is recommended to add a TVS diode array to the
signal nets for ESD protection. The ESD array shown in the figure is of type NXP, IP4234CZ6.
If connecting to an off board device that needs power add a USB power switch to current limit
the 5V power connection at the connector. USB requires that each port be limited to 500 mA
maximum sustained current. If using the USB host ports the end system must take into
account the amount of power consumed by the PremierWave 2050 module and each USB
device connected to the host ports. The schematic below shows how to connect 5V to a USB
host connector using an ST, STMPS2151 power distribution switch. The USB host port 5V
power is not provided by the PremierWave 2050 module. If the USB host ports are unused
their pins may be left disconnected.
Table 2-10 USB Host Port Signals
Pin Name
Description
PremierWave
2050 Pins
Signal
Requirement
Type A USB
Host connector
pin
USB2+/HHSDPB
USB HS Host Port
A Positive pin
USB HS Host Port
A Negative pin
USB FS Host Port
B Positive pin
USB FS Host Port
B Negative pin
5V power for USB
connector
Signal Ground
21
Route as 90 ohm
differential pair
Route as 90 ohm
differential pair
Route as 90 ohm
differential pair
Route as 90 ohm
differential pair
Current limit to 500
mA per port
Ground plane
B3
USB2-/HHSDPM
USB3+/HFSDPC
USB3-/HFSDMC
5V(User
supplied)
Ground
22
52
53
Ground
B2
A3
A2
A1, B1
A4, B4
Figure 2-11 USB Host Interface Connections
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
25
2: Functional Description
LEDs
The PremierWave 2050 module contains several external signals that are intended to drive
external status LEDs. The LEDs are listed below. The signals may be connected as shown in
the reference schematic figure below.
Note: The System LED usually remains on. When the Default button is pressed for 5-6
seconds, the System LED starts blinking every second to indicate the default button can
be released to complete resetting the unit to factory default. The unit reboots after
release of the Default button. A lit WLAN LED indicates the STA interface is associated
with an access point.
Table 2-11 PremierWave 2050 Wi-Fi Status LED Output Signals
Signal
Pin
Description
WI-FI LED
73
Wi-Fi Status LED, active low
SYS_LED
67
System status LED, active high
ETH SPEED
56
Ethernet 100Mbps ON (Active low), 10Mbps OFF
ETH LINK/ACT
72
Ethernet link ON (Active low)
Ethernet activity Blink (toggle)
General Purpose I/O Pins
PremierWave 2050 module contains 13 pins which may be used as configurable inputs or
outputs. Listed below are the configurable I/O pins. These pins are 3.3V tolerant.
Table 2-12 Ethernet Interface PremierWave 2050 Serial Port Signals
Signal
Pin
Description
PremierWave 2050
Reset
State
CP1
71
Configurable I/O
Input
CP2/INT
68
Configurable I/O-SPI interrupt input
Input
CP3
12
Configurable I/O- SPI MISO
Input
CP4
13
Configurable I/O-SPI MOSI
Input
CP5
16
Configurable I/O
Input
CP6
17
Configurable I/O
Input
CP7
14
Configurable I/O-SPI Clock
Input
CP8
15
Configurable I/O-SPI Chip Select
Input
CP9
26
Configurable I/O
Input
CP10
60
Configurable I/O
Input
CP11
59
Configurable I/O
Input
CP12
58
Configurable I/O
Input
CP13
57
Configurable I/O
Input
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
26
2: Functional Description
Reset Pins
PremierWave 2050 modules have two signals for use as reset signals. Signal EXT_RESET#
is a hardware controlled input signal that will reboot the PremierWave 2050 processor when
asserted low. Signal DEFAULT# is polled by the PremierWave 2050 software. When
DEFAULT# is asserted low for six seconds, the unit will reset the system to the default
manufacturing settings and reboot the unit. PremierWave 2050 has an additional signal that
can be used to wake up the unit processor when the unit is in a sleep or power down state.
The SHDN signal is active when the module is in the shutdown state. Use the SHDN signal to
gate off external logic when the module is in the shutdown state to minimize power
Table 2-13 PremierWave 2050 Reset Signals
Signal
Pin
Description
Reset
State
EXT_RESET#
77
Unit hardware reset, active low. Drive low for 50ms to reboot unit.
Signal should be driven high or left floating after reset.
Input
DEFAULT#
66
Unit reset to default, active low.
Drive low for 6 seconds or longer to reset unit to default settings.
Input
WAKE
65
CPU wake up input. Module wakes from low power state on a
rising edge. Refer to user guide for WAKE pin configuration
options.
Input
SHDN
88
Indicates when module is in Standby state. Use to power off
external devices. See evaluation board schematic for
recommended connections.
Figure 2-12 Recommended Use of SHDN Signal to Shut Off External Power Rail
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
27
3: PCB Footprint and Module Dimensions
The module recommended footprint is shown below. The antenna region should ideally be
placed on the edge of the board. The area under the antenna region should be void of all
signals and planes. The antenna location inside of the end unit and installation should be
chosen such that the antenna has as clear as possible line of site to the connecting WLAN
devices. The antenna path should be as clear as possible from metal, ground and power
planes from adjacent PCBs and other objects that can interfere with the signal path to the
connecting WLAN devices.
Access CAD Files
1. Go to http://www.lantronix.com/products/cad-visio.html.
2. Click Download CAD files here to access the Registration Form.
Figure 3-1 PremierWave 2050 Module Dimensions
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
28
3: PCB Footprint and Module Dimensions
Figure 3-2 PremierWave 2050 Recommended Footprint
The pads on the PremierWave 2050 module are pre-bumped with solder. Lantronix
recommends using non-solder-mask defined pads (NSMD). Lantronix recommends using
ENIG finish for the PremierWave 2050 module pads.
The internal ground pads are used for module signal ground and thermal relief. The outer
layers should be flooded with ground and the ground pads should have many vias to the
internal ground layers.
Soldering coverage should be maximized and checked via x-ray for proper design. There is a
trade-off between providing enough soldering for conductivity and applying too much, which
allows the module to “float” on the pads creating reliability issues. Lantronix recommends 80%
or more full contact solder coverage on each of the internal ground pads after reflow.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
29
3: PCB Footprint and Module Dimensions
Note: The recommended stencil thickness is 4-5 mil. The stencil aperture should not
exceed the size of the pad. Solder volume must be controlled. It is recommended that
the aperture be set to 1:0.8 of the pad size. For example, the 0.8x0.6 mm pad would use
a 0.64x0.48 mm stencil. Thicker stencils will require further reduction in stencil aperture.
First article and routine inspection of the printing quality is necessary to ensure high yield.
At a minimum, visually inspect the unit utilizing a magnifier with 10x magnification;
otherwise inspection with a solder paste inspection (SPI) machine is preferred. Lantronix
recommends a final standoff height after reflow of 75 to 100 um.
Reflow Profile Guideline
The reflow profile is dependent on many factors including flux selection, solder composition,
and the capability of the user's reflow equipment.
Lantronix does not recommend a specific reflow profile but provides the following general
guidelines:
♦
The solder composition typically sets the peak temperatures of the profile.
♦
Lantronix recommends lead free solder pastes SAC305: Type 4. Water soluble or noclean solder pastes are acceptable.
♦
Reflow equipment is needed at nine heater zones at minimum. Lantronix recommends a
forced air type reflow oven with nitrogen.
♦
Lantronix recommends that the peak temperature at the solder joint be within 235°C ~
245°C, and the maximum component temperature should not exceed 260°C.
♦
Lantronix recommends that the solder joint heating time above 217°C last between 40-90
seconds, and at a minimum of 40 seconds.
♦
Excessive ramp/cooling rates (>3°C/s) should be avoided.
♦
To develop the reflow profile, Lantronix recommends that the user place thermocouples
at various locations on the assembly to confirm that all locations meet the profile
requirements. The critical locations are the module solder joints.
♦
When developing the reflow profile, Lantronix recommends that a fully loaded assembly
be used to assure that the total thermal mass is accounted for.
PremierWave® 2050 Enterprise Wi-Fi® IoT Module Integration Guide
30
3: PCB Footprint and Module Dimensions
Figure 3-3 Recommended Reflow Profile
(1) Solder paste alloy: SAC305(Sn96.5/Ag3.0/Cu0.5)(Lead free solder
paste is recommended by Lantronix.)
(2) A-B. Temp.(Pre-heat): 150~200 °C; soak time:60~120 seconds.
(3) C. Peak temp:
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