H1601SR

承 认 书 APPROVAL SHEETS 客户名称 CUSTOMER 客户料号 MODEL NO 产品名称 PART NAME 10/100 BASE-T Single Port Transformer Modules 产品型号 H1601SR PART TYPE 版 本 A01 REV 客户承认 CUSTOMER APPROVAL 承认印： SIGNET 签名： SIGNATURE 深圳市威勤电子技术有限公司 ShenZhen Winchen Electronic Technolgy Co.,Ltd 地址 ：深圳市南山区留仙大道4093号南山云谷创新产业园山水楼B座4楼 Tel：0755-83576361 Fax：0755-83047459 E-mail : alan@winchen.com.cn 10/100BASE-TX TRANSFORMER MODULES Features： Dimension: ● Designed to meet IEEE 802.3 requirements. ● Operating Humidity:90%RH ● Storage temperature range:：-40～+80℃,90%RH ● RoHS compliant Specifications Electrical Specification@25℃ Operating Temperature 0 to +70℃ Part NO Trun Ratio (±3%) TX H1601SR RX OCL primary@ 100KHz,0.1Vrms,8mA Leakage primary@ 100KHz,0.1Vrms Cww (Pri.:Sec.) 350uH Min 0.5uH max 35pF Max 1CT:1CT 1CT:1CT DCR (Ω) Primary Secondary 0.9 Max 1.2 Max Isolation Voltage (Vrms min) 1500 Electrical Specification@25℃ Operating Temperature 0 to +70℃ Part NO Insertion Ioss (dB max) 1-100MHz H1601SR -1.0 DMRR (dB min .) MHz 1-30 40 50 60-100 1-60 60-100 Crosstalk (dB min .) MHz 1-100 -18 -16 -16 -10 -35 -30 -33 Return Ioss(dB min) MHz Dimension Unless otherwise specified, all tolerances are ±0.25mm H1601SR YYWW 1.27(0.05) 9.40(0.37) 6.90(0.27) 0.64(0.025) 10.67(0.42) 5.65(0.22)±0.30 8.89(0.35) 12.7(0.5) 0.25(0.01) 0.76(0.03) 0.25(0.01) Schematic TD+1 16TX+ CT 2 15 CT TD-3 14TX- RD+6 11RX+ CT 7 10 CT RD-8 9 RX- ShenZhen Winchen Electronic Technolgy Co.,Ltd Tel:+86-755-83576361 http://www.winchen.com.cn 5.SUGGEST PROFILE IR reflow graph (4)Peak Tp Temperature Tp TL (3)Ramp up Soldering Zone TL Tb (2)Preheat Ta (1)Ramp up RT t1 t2 Time IR reflow profile Form-1（Reference JEDEC J-STD-020C Table 5-2）） Sn-Pb IR reflow profile Profile Feature step# Pb-free Condition/Duration Condition/Duration step1 Ramp-up rate 1.5-3℃/sec. 1.5-3℃/sec. step2 Preheat : 100~150℃(Ta-Tb) t1-t2 : 60~120 sec. t1-t2 : 60~180 sec. Ramp-up rate(TL to TP) 1.5-3℃/sec. 1.5-3℃/sec. Temperature maintained above 183℃(TL) TL : 60-150sec. TL : 80-150sec. Peak temperature(TP) 230+5/-10℃ 260+0/-5℃ Time within 5℃ of actual peak temperature 30±10 sec. 30±10 sec. Ramp-down rate 6℃/sec.Max step3 step4 step5 6℃/sec.Max Note1 Subject the samples to 3 cycles of the above defind reflow conditions Subject the samples to 3 cycles of the above defind reflow conditions Note2 Time 25℃ to peak temperature : 6 minutes max. Time 25℃ to peak temperature : 8 minutes max. The time between reflows shall be 5 minutes minimum and 60minutes maximum Note3 SnPb Eutectic Process- “Package Peak Reflow Temperature” Form-2 (Reference JEDEC J-STD-020C Table 4-1) 产品厚度 ＜2.5mm ≥2.5mm 产品体积＜350mm3 240 +0/-5℃ 225 +0/-5℃ 产品体积≥350mm3 225 +0/-5℃ 225 +0/-5℃ Pb-free Process - “Package Peak Reflow Temperature” Form-3 (Referencre JEDEC J-STD-020C Table 4-2) 产品厚度 ＜1.6mm 1.6mm-2.5mm ＞2.5mm 产品体积＜350mm3 产品体积350mm3-2000mm3 260 +0/-5℃ 260 +0/-5℃ 260 +0/-5℃ 250 +0/-5℃ 250 +0/-5℃ 245 +0/-5℃ 产品体积＞2000mm3 260 +0/-5℃ 245 +0/-5℃ 245 +0/-5℃ ShenZhen Winchen Electronic Technolgy Co.,Ltd 深圳市威勤电子技术有限公司 REV： 01 Page：3 of 4 6.Reliability No. Test Item Refer To Standard Test Condition Resistance To Soldering Heat-Convection Reflow 1).Peak Temperature: Refer to Specification According to Package Body Thickness And Volume IPC/JEDEC J-STD- 2).Preheat Temperature and Soak Time: 150~200℃,60~120 Seconds 020D 3).Average Ramp-up Rate: 3℃/Second Max 4).Above 217℃: 60~150 Seconds 5).Peak Temperature-5℃: Over 30 S 2 Thermal Shock 1.Low Temperature:-40℃ 2.High Temperature:125 IEC68-2-14 Method 3.Dwell Time:30 Minutes A 4.Transition Time: Less Than 5Minutes 5.Number of Cycles: 10 3 High Temperature IEC68-2-2 Method A 125℃,96Hours 4 Low Temperature IEC68-2-1 Method A -40℃,96Hours 1 5 6 Temperature Humidity Cycle Vibration IEC68-2-38 Temp Humidity 25~65°C 93+/-3%RH 65°C 93+/-3%RH 65~25°C 80~96%RH 25~65°C 93+/-3%RH 65°C 93+/-3%RH 65~25°C 80~96%RH soak time 1.5 hr 4 hr 2.5 hr 1.5hr 4hr 2 IEC68-2-6 1.Sine Wave 2.Amplitude:0.75mm 3.Frequence:5~500~5Hz 4.Direction: X,Y,Z 5.Number of Sweep Cycles Per Direction:10 6.Duration: 2 Hours Each Direction 7 Mechanical Shock MIL-STD-202 1).Half -Sine Wave 2).Peak Acceleration:50G 3).Duration:11mS 4).Direction: X,Y,Z,-X,-Y,-Z 5).Number of Shock Per Direction:3 8 Free Drop ISO4180 1) Height: Refer to Specification According to Production weight 2).1Corner,3Edges,6Faces .Total Are 10 Times JESD22-B102D 1).Precondition:150±5°C,16±0.5Hours 2).Flux Type:ROL1 3).Immersion Flux Time: 5~10 Seconds 4).Solder Temperature:245±5°C 5).Solder Immersion Time:5±0.5 Seconds 6).Solder Immersion/Emersion Speed:25.4±6.4mm/Second 9 Solderability 10 Accelerated Moisture Resistance--JESD22-A102-C Unbiased Autoclave 1.Temperature:121°C 2. Humidity: 100% 3. Vapor Pressure: 29.7 Psia or 205KPa 4.Duration:96 hours ShenZhen Winchen Electronic Technolgy Co.,Ltd 深圳市威勤电子技术有限公司 REV： 01 Page：4 of 4