FKN0107
FETek Technology Corp.
P-Ch 100V Fast Switching MOSFETs
Super Low Gate Charge
Excellent Cdv/dt effect decline
Green Device Available
Advanced high cell density Trench
technology
Product Summary
BVDSS
RDSON
ID
-100V
0.65Ω
-0.9A
SOT23 Pin Configuration
Description
The FKN0107 is the high cell density trenched
P-ch MOSFETs, which provides excellent
RDSON and efficiency for most of the small
power switching and load switch applications.
The FKN0107 meets the RoHS and Green
Product requirement with full function reliability
approved.
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
-100
V
VGS
Gate-Source Voltage
ID@TA=25℃
ID@TA=70℃
IDM
PD@TA=25℃
±20
V
Continuous Drain Current, VGS @
-10V1
-0.9
A
Continuous Drain Current, VGS @
-10V1
-0.7
A
Current2
-1.8
A
Dissipation3
1
W
Pulsed Drain
Total Power
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
RθJA
Thermal Resistance Junction-ambient
RθJC
Thermal Resistance Junction-Case1
Data and specifications subject to change without notice.
www.fetek.com.tw Ver : A
1
Typ.
Max.
Unit
---
125
℃/W
---
80
℃/W
1
FKN0107
FETek Technology Corp.
P-Ch 100V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
Conditions
Min.
Typ.
Max.
Unit
-100
---
---
V
Reference to 25℃ , ID=-1mA
---
-0.0624
---
V/℃
VGS=-10V , ID=-0.8A
---
0.52
0.65
VGS=-4.5V , ID=-0.4A
---
0.56
0.7
-1.0
-1.5
-2.5
V
---
4.5
---
mV/℃
VDS=-80V , VGS=0V , TJ=25℃
---
---
10
VDS=-80V , VGS=0V , TJ=55℃
---
---
100
VGS=0V , ID=-250uA
VGS=VDS , ID =-250uA
uA
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=-5V , ID=-0.8A
---
3
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
16
32
Qg
Total Gate Charge (-4.5V)
---
4.5
---
---
1.14
---
VDS=-15V , VGS=-4.5V , ID=-0.5A
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
---
1.5
---
Td(on)
Turn-On Delay Time
---
13.6
---
nC
Rise Time
VDD=-50V , VGS=-10V , RG=3.3
---
6.8
---
Turn-Off Delay Time
ID=-0.5A
---
34
---
Fall Time
---
3
---
Ciss
Input Capacitance
---
553
---
Coss
Output Capacitance
---
29
---
Crss
Reverse Transfer Capacitance
---
20
---
Min.
Typ.
Max.
Unit
---
---
-0.9
A
---
---
-1.8
A
---
---
-1.2
V
Tr
Td(off)
Tf
VDS=-15V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
Parameter
Current1,4
IS
Continuous Source
ISM
Pulsed Source Current2,4
VSD
Diode Forward
Voltage2
Conditions
VG=VD=0V , Force Current
VGS=0V , IS=-1A , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
Data and specifications subject to change without notice.
www.fetek.com.tw Ver : A
2
FKN0107
FETek Technology Corp.
P-Ch 100V Fast Switching MOSFETs
Typical Characteristics
550
1.2
ID= 0 . 5 A
540
RD S O N( m Ω )
-ID Drain Current (A)
VGS=-10V
0.9
VGS=-7V
530
VGS=-5V
0.6
520
VGS=-4.5V
VGS=-3V
0.3
510
500
0.0
0
0.25
0.5
0.75
2
1
-VDS ,Drain-to-Source Voltage (V)
8
10
Fig.2 On-Resistance vs. Gate-Source
Voltage
1.5
-VGS Gate to Source Voltage (V)
10
VDS=-20V
ID=-0.5A
7.5
1
TJ=150℃
TJ=25℃
0.5
5
2.5
0
0.00
0
0.25
0.50
0.75
1.00
0
-VSD , Source-to-Drain Voltage (V)
5
7.5
10
Fig.4 Gate-Charge Characteristics
diode
2.0
Normalized On Resistance
1.8
2.5
QG , Total Gate Charge (nC)
Fig.3 Forward Characteristics Of Reverse
Normalized VGS(th) (V)
6
-VGS (V)
Fig.1 Typical Output Characteristics
-IS Source Current(A)
4
1.4
1.5
1
1.0
0.6
0.2
0.5
-50
0
50
100
TJ ,Junction Temperature (℃ )
Fig.5 Normalized VGS(th) vs. TJ
Data and specifications subject to change without notice.
www.fetek.com.tw Ver : A
150
-50
0
50
100
150
TJ , Junction Temperature (℃)
Fig.6 Normalized RDSON vs. TJ
3
FKN0107
FETek Technology Corp.
P-Ch 100V Fast Switching MOSFETs
1000
10.00
F=1.0MHz
Ciss
1ms
Capacitance (pF)
1.00
100ms
100
Coss
-ID (A)
0.10
1s
0.01
DC
10S
TA=25℃
Single Pulse
Crss
10
1
5
9
13
17
21
25
-VDS ,Drain to Source Voltage (V)
0.00
0.1
1
Fig.7 Capacitance
10
100
-VDS (V)
1000
Fig.8 Safe Operating Area
Normalized Thermal Response (R θJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
PDM
0.001
TON
SINGLE PULSE
T
D = TON/T
TJpeak = TC + PDM x RθJC
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
VDS
90%
10%
VGS
Td(on)
Tr
Ton
Td(off)
Tf
Toff
Fig.10 Switching Time Waveform
Data and specifications subject to change without notice.
www.fetek.com.tw Ver : A
Fig.11 Gate Charge Waveform
4
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