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HDDB20NSS-B11

HDDB20NSS-B11

  • 厂商:

    HD(高清数字)

  • 封装:

    SMD,1.4x1.8mm

  • 描述:

  • 数据手册
  • 价格&库存
HDDB20NSS-B11 数据手册
规格书编号 SPEC NO : HDDB20NSSB11SP00 产品 规 格书 SPECIFICATION CUSTOMER 客 户: PRODUCT 产 品: SAW DUPLEXER MODEL NO 型 号: HDDB20NSS-B11 MARKING 印 字: B177 PREPARED 编 制: CHECKED 审 核: APPROVED 批 准: DAT E 日 期: 2016-10-15 客户确认 CUSTOMER RECEIVED: 审核 CHECKED 批准 APPROVED 日期 DATE 无锡市好达电子有限公司 Shoulder Electronics Limited Factory Address: NO. 115, Gaoyun Road, Binhu Economic & Technology Development Area, Wuxi, Jiangsu, China. Tel:86-510-85629111 Country of origin: China www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 1 of 8 SAW DUPLEXER HDDB20NSS-B11 更改历史记录 History Record 更改日期 Date 2016-10-15 www.shoulder.cn 规格书编号 Spec. No. SP00 产品型号 Part No. 客户产品型号 Customer No. HDDB20NSS -B11 Tel:0755-82916880 Fax:0755-82916881 更改内容描述 Modify Content 备注 Remark The new specification E-mail:info@shoulder.cn Page 2 of 8 SAW DUPLEXER HDDB20NSS-B11 1. Application ● Low-loss Saw duplexer for LTE Band 20 systems ● Low insertion attenuation and low passband ripple. ● Usable passband 30MHz ● High isolation between Tx and Rx. ● RoHS compatible 2. DIMENSION (PKG SIZE 1.8 x 1.4 x 0.6mm) 3. Maximum Rating Items Operation temperature rang Storage temperature rang ESD voltage Sensitive discharge device DC Voltage VDC Moisture Sensitivity Level Conditions -30℃ ~ +85℃ -40℃ ~ +85℃ ESD(MM) : 50VDC ESD(HBM) : 175VDC 3V (25+/-2 deg.C) MSL 2 4.TEST CIRCUIT www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 3 of 8 SAW DUPLEXER HDDB20NSS-B11 5. ELECTRICAL SPECIFICATION Table1. Electrical Specification Item TX Center frequency to Insertion loss ANT Amplitude ripple VSWR Input Power 832.25~861.75 832~862 ANT 832~862 Tx 832~862 Absolute attenuation ANT Center frequency to Insertion loss RX Pass band ripple Condition (MHz) 1.7 1.6 2.0 2.0 +29dBm Ta=+50℃5000h,CW MHz dB - 35 40 45 38 40 25 30 30 45 40 30 20 20 - 38 45 50 41 46 45 45 45 55 48 50 46 40 806 - dB dB dB dB dB dB dB dB dB dB dB dB dB MHz 791.25~820.75 - 2.7 3.8 dB 791~821 - 1.5 3.0 dB 35 45 40 40 40 40 40 1.7 1.7 42 55 50 55 55 55 45 2.0 2.0 - dB dB dB dB dB dB dB ANT 791~821 Rx 10~760 Absolute attenuation 832.25~861.75 880~915 1710~1785 2400~2500 2500~2570 4900~5950 Tel:0755-82916880 - Unit 10~771 771~791 791.25~820.75 925~960 1559~1605 1664~1724 1805~1880 2110~2170 2400~2500 2496~2586 2620~2690 3328~3448 4000~6000 VSWR www.shoulder.cn Specification Min Typ Max 847 2.1 2.8 0.8 1.8 Fax:0755-82916881 E-mail:info@shoulder.cn Page 4 of 8 SAW DUPLEXER HDDB20NSS-B11 Table2. Electrical Specification Item TX to RX Isolation Terminating Impedance Condition (MHz) 832.25~861.75 791.25~820.75 Tx port Rx port Ant port Operating Temperature Specification Min Typ Max 52 56 52 56 50Ω+2nH 50Ω+4nH 50//6.8nH -20 to +85 - Unit Remarks dB dB Ohm Ohm Ohm oC Single-ended Differential Single-ended 6. Typical frequency response www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 5 of 8 SAW DUPLEXER HDDB20NSS-B11 7. ENVIRONMENTAL CHARACTERISTICS 7.1 High temperature exposure Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 5. 7.2 Low temperature exposure Subject the device to -40℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 5. 7.3 Temperature cycling Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high temperature of +85℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in 5. 7.4 Resistance to solder heat 1、immerge the solder bath at 260℃ for 10 sec. 2、the iron at 370℃ for 3 sec 7.5 Solderability Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the soldering pad must be covered with new solder. It shall meet the specifications in 5. 7.6 Reflow soldering The specimen shall be passed through the reflow furnace with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1h, after which the measurement shall be made. Test board shall be 1.6 mm thick. Base material shall be glass fabric base epoxy resin. 7.7 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 5. 7.8 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 5. 8. REMARK 8.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 6 of 8 SAW DUPLEXER HDDB20NSS-B11 8.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 8.3 Soldering Only pad component may be solded. Please avoid soldering another part of component. 9. Packing 9.1 Dimensions (1) Carrier Tape: Figure 1 (2) Reel: Figure 2 (3) The product shall be packed properly not to be damaged during transportation and storage. 9.2 Reeling Quantity 10000 pcs/reel φ 259mm 9.3 Taping Structure (1) The tape shall be wound around the reel in the direction shown below. (2) Label Device Name Marking User Product Name Quantity Lot No. (3) Leader part and vacant position specifications. 10. TAPE SPECIFICATIONS www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:info@shoulder.cn Page 7 of 8 SAW DUPLEXER HDDB20NSS-B11 10.1 Tensile Strength of Carrier Tape: 4.4N/mm width 10.2 Top Cover Tape Adhesion (See the below figure) (1) pull off angle: 0~15º (2) speed: 300mm/min. (3) force: 20~70g [Figure 1] Carrier Tape Dimensions [Figure 2] 10000 pcs/reel www.shoulder.cn Tel:0755-82916880 φ 257.5mm Fax:0755-82916881 E-mail:info@shoulder.cn Page 8 of 8
HDDB20NSS-B11 价格&库存

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