SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
General Description
FSMOS® MOSFET is based on Oriental Semiconductor’s unique device design to achieve low
RDS(ON), low gate charge, fast switching and excellent avalanche characteristics. The high Vth series
is specially designed to use in power supply systems with driving voltage of more than 10V.
Features
Low RDS(ON) & FOM
Extremely low switching loss
Excellent reliability and uniformity
Fast switching and soft recovery
Applications
Switched mode power supply
Motor driver
Battery protection
DC-DC convertor
Inverters
UPS
Key Performance Parameters
Parameter
Value
Unit
VDS
150
V
ID, pulse
240
A
RDS(ON), max @ VGS=10V
10
mΩ
Qg
70
nC
Product Name
Package
Marking
SFS15R10GNF
PDFN5*6
SFS15R10GN
Marking Information
Package & Pin information
Oriental Semiconductor © Copyright Reserved V1.0
Page.1
SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
Parameter
Symbol
Value
Unit
Drain-source voltage
VDS
150
V
Gate-source voltage
VGS
±20
V
ID
80
A
ID, pulse
240
A
IS
80
A
IS, pulse
240
A
Power dissipation3), TC=25 °C
PD
160
W
Single pulsed avalanche energy5)
EAS
80
mJ
Tstg, Tj
-55 to 150
°C
Symbol
Value
Unit
Thermal resistance, junction-case
RθJC
0.78
°C/W
Thermal resistance, junction-ambient4)
RθJA
62
°C/W
Continuous drain current1), TC=25 °C
Pulsed drain current2), TC=25 °C
Continuous diode forward current1), TC=25 °C
Diode pulsed current2), TC=25 °C
Operation and storage temperature
Thermal Characteristics
Parameter
Electrical Characteristics at Tj=25°C unless otherwise specified
Parameter
Drain-source
breakdown voltage
Gate threshold
voltage
Drain-source
on-state resistance
Symbol
Min.
BVDSS
150
VGS(th)
3.0
RDS(ON)
Typ.
9
Max.
Unit
V
VGS=0 V, ID=250 μA
4.5
V
VDS=VGS, ID=250 μA
10
mΩ
100
Gate-source
leakage current
IGSS
Drain-source
leakage current
IDSS
Gate resistance
RG
VGS=10 V, ID=20 A
VGS=20 V
nA
-100
Oriental Semiconductor © Copyright Reserved V1.0
Test condition
1
2.4
VGS=-20 V
μA
VDS=135 V, VGS=0 V
Ω
ƒ=1 MHz, Open drain
Page.2
SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
Dynamic Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Input capacitance
Ciss
5132
pF
Output capacitance
Coss
1674
pF
Reverse transfer capacitance
Crss
175
pF
Turn-on delay time
td(on)
22
ns
tr
22
ns
td(off)
38
ns
tf
8.8
ns
Rise time
Turn-off delay time
Fall time
Test condition
VGS=0 V,
VDS=25 V,
ƒ=100 kHz
VGS=10 V,
VDS=75 V,
RG=2 Ω,
ID=44 A
Gate Charge Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Total gate charge
Qg
70
nC
Gate-source charge
Qgs
27
nC
Gate-drain charge
Qgd
18
nC
Vplateau
6.2
V
Gate plateau voltage
Test condition
VGS=10 V,
VDS=75 V,
ID=44 A
Body Diode Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
1.3
V
Diode forward voltage
VSD
Reverse recovery time
trr
76
ns
Reverse recovery charge
Qrr
285
nC
Peak reverse recovery current
Irrm
5.9
A
Test condition
IS=20 A,
VGS=0 V
VR=80 V,
IS=40 A,
di/dt=100 A/μs
Note
1) Calculated continuous current based on maximum allowable junction temperature.
2) Repetitive rating; pulse width limited by max. junction temperature.
3) Pd is based on max. junction temperature, using junction-case thermal resistance.
4) The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper,
in a still air environment with Ta=25 °C.
5) VDD=50 V,VGS=10 V, L=0.3 mH, starting Tj=25 °C.
Oriental Semiconductor © Copyright Reserved V1.0
Page.3
SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
Electrical Characteristics Diagrams
1000
280
Tj = 25 °C
Tj = 25 °C
ID, Drain current(A)
100
200
ID, Drain current (A)
VDS = 10 V
VGS= 10 V
240
VGS= 7.5 V
160
VGS= 7 V
120
VGS= 6.5 V
80
10
1
VGS= 6 V
40
0.1
0
0
2
4
6
8
VDS, Drain-source voltage (V)
2
10
Figure 1. Typ. output characteristics
6
8
10
Figure 2. Typ. transfer characteristics
104
10
ID = 44 A
VDS = 75 V
VGS, Gate-source voltage(V)
Ciss
8
3
10
C, Capacitance (pF)
4
VGS, Gate-source voltage(V)
Coss
6
102
4
Crss
101
2
f = 100 kHz
VGS = 0 V
100
0
30
60
90
120
150
0
0
10
20
VDS, Drain-source voltage (V)
40
50
60
70
Figure 4. Typ. gate charge
Figure 3. Typ. capacitances
16m
170
ID = 20 A
ID = 250 μA
VGS = 0 V
RDS(ON), On-resistance(Ω)
BVDSS, Drain-source breakdown voltage (V)
30
Qg, Gate charge(nC)
165
160
155
150
-50
0
50
100
150
Tj, Junction temperature (℃)
Figure 5. Drain-source breakdown voltage
Oriental Semiconductor © Copyright Reserved V1.0
14m
VGS = 10 V
12m
10m
8m
6m
-50
0
50
100
Tj, Junction temperature (°C)
150
Figure 6. Drain-source on-state resistance
Page.4
SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
4.6
1000
ID = 250 μA
Tj = 25 ℃
100
4.2
IS, Source current (A)
Vth, Threshold voltage (V)
4.4
4.0
3.8
3.6
3.4
10
1
3.2
0.1
3.0
-50
0
50
100
0.4
150
0.8
1.2
1.6
2.0
VSD, Source-drain voltage (V)
Tj, Junction temperature (°C)
Figure 7. Threshold voltage
Figure 8. Forward characteristic of body diode
60m
90
80
VGS=6 V
6.5 V
7.5 V
7V
10 V
70
ID, Drain current (A)
RDS(ON), On-resistance(Ω)
50m
40m
30m
20m
60
50
40
30
20
10m
10
0
40
80
120
160
200
240
0
280
0
ID, Drain current(A)
25
Figure 9. Drain-source on-state resistance
ID, Drain current(A)
10
100 μs
RDS(ON) Limited
1 ms
10 ms
DC
1
100
125
150
D= tp/T
zthjc, Thermal Response(K/W)
100
10 μs
75
Figure 10. Drain current
1000
100
50
TC, Case temperature (°C)
D= 1
0.5
0.2
0.1
10-1
0.05
0.02
0.01
Single Pulse
10-2
0.1
0.1
1
10
100
VDS, Drain-source voltage(V)
Figure 11. Safe operation area TC=25℃
Oriental Semiconductor © Copyright Reserved V1.0
10-5
10-4
10-3
10-2
10-1
100
tp, Pulse width(s)
Figure 12. Max. transient thermal impedance
Page.5
SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
Test circuits and waveforms
Figure 1. Gate charge test circuit & waveform
Figure 2. Switching time test circuit & waveforms
Figure 3. Unclamped inductive switching (UIS) test circuit & waveforms
Figure 4. Diode reverse recovery test circuit & waveforms
Oriental Semiconductor © Copyright Reserved V1.0
Page.6
SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
Package Information
mm
Symbol
Min
Nom
Max
A
1.00
1.10
1.20
b
0.30
0.40
0.50
c
0.154
0.254
0.354
D1
5.00
5.20
5.40
D2
3.80
4.10
4.25
e
1.17
1.27
1.37
E1
5.95
6.15
6.35
E2
5.66
5.86
6.06
E4
3.52
3.72
3.92
H
0.40
0.50
0.60
L
0.30
0.60
0.70
L1
K
0.12 REF
1.15
1.30
1.45
Version 1: PDFN5*6-P package outline dimension
Oriental Semiconductor © Copyright Reserved V1.0
Page.7
SFS15R10GNF
Enhancement Mode N-Channel Power MOSFET
Ordering Information
Package
Type
Units/
Reel
Reels/
Inner Box
Units/
Inner Box
Inner Boxes/
Carton Box
Units/
Carton Box
PDFN5*6-P
5000
2
10000
5
50000
Product Information
Product
Package
Pb Free
RoHS
Halogen Free
SFS15R10GNF
PDFN5*6
yes
yes
yes
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any
typical values stated herein and/or any information regarding the application of the device,
Oriental Semiconductor hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of
any third party.
For further information on technology, delivery terms and conditions and prices, please
contact the Oriental Semiconductor sales representatives (www.orientalsemi.com).
© Oriental Semiconductor Co.,Ltd. All Rights Reserved
Oriental Semiconductor © Copyright Reserved V1.0
Page.8