BPF1608LM10R5000A

  Nov. 29, 2019 V01 www.yageo.com   Nov. 29, 2019 V01 www.yageo.com   Nov. 29, 2019 V01 www.yageo.com   Nov. 29, 2019 V01 www.yageo.com      WIRELESS COMPONENTS Ceramic Chip Antenna 2.PACKING SPEC  Nov. 29, 2019 V01 www.yageo.com   ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ      WIRELESS COMPONENTS  Ceramic Chip Antenna 7DSHZLGWK 6SURFNHWKROH 'LVWDQFHVSURFNHWKROHWRVSURFNHWKROH 'LVWDQFHSRFNHWWRSRFNHW 'LVWDQFHVSURFNHWKROHWRSRFNHW 'LVWDQFHVSURFNHWKROHWRRXWVLGH 'LVWDQFHVSURFNHWKROHWRSRFNHW ,QWHUQDOGLDPHWHURIUHHO ([WHUQDOGLDPHWHURIUHHO         &KHFNLQJQRWH  6HULDOQR $ & ) ( 3 3 3R ' : ,QGH[    s  s  s  s  s  s s  s   s         6SHFPP      WIRELESS COMPONENTS Ceramic Chip Antenna  3.Reliability Test   Nov. 29, 2019 V01 www.yageo.com      WIRELESS COMPONENTS  Nov. 29, 2019 V01 Ceramic Chip Antenna www.yageo.com      WIRELESS COMPONENTS Ceramic Chip Antenna V  Nov. 29, 2019 V01 www.yageo.com      WIRELESS COMPONENTS Ceramic Chip Antenna \  Nov. 29, 2019 V01 www.yageo.com      WIRELESS COMPONENTS Ceramic Chip Antenna 4.Reflow Profile  Nov. 29, 2019 V01 www.yageo.com      WIRELESS COMPONENTS Ceramic Chip Antenna Soldering Profile for Lead-free Process  Nov. 29, 2019 V01 www.yageo.com