MXD8636

MXD8636 SP3T Switch for 0.1～3G Application VED APPRO This document contains information that is confidential and proprietary to Maxscend Technologies Inc. (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8636 – SP3T Switch for 0.1～3G Application General Description The MXD8636 is manufactured in a compact, 12- The MXD8636 is a Single Pole, Triple-Throw pin 2.0 x 2.0 mm, Quad Flat No-Lead (QFN) (SP3T) antenna switch. The low insertion loss package. A functional block diagram is shown in achieved by the MXD8636 make it an ideal choice Figure 1. The pin configuration and package are for main/diversity receiving commonly used in shown in Figure 2. Signal pin assignments and LTE-based handsets, data cards, and tablets that functional pin descriptions are provided in Table 1. use antenna diversity solutions. Switching is controlled by two CMOS/TTL- Applications compatible control voltage inputs (V1 and V2).  WCDMA band and mode switching Depending on the logic voltage level applied to the  Antenna switch for multimode systems control pins, the ANT pin is connected to one of  802.11 b/g/n WLANs three switched RF outputs (RF1 to RF2) using a Features low insertion loss path, while the paths between  Broadband frequency range: 0.1 to 3.0 GHz the ANT pin and the other RF pins are in a high  Low insertion loss: 0.5 dB typical @ 2.5 GHz isolation state. No external blocking capacitors are  High isolation: >27 dB @ 2.5 GHz required on the RF paths unless VDC is externally  No external DC blocking capacitors requires applied.  Small QFN (12-pin, 2.0 x 2.0 mm) package Functional Block Diagram and Pin Function Figure 1. Functional Block Diagram Figure 2. Pin Diagram Page 2 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8636 – SP3T Switch for 0.1～3G Application Application Circuit GND RFC GND V1 V2 VDD Figure 3. MXD8636 Evaluation Board Schematic Table 1. Pin Description Pin No. Name Description 1 RF1 RF I/O path 1 2 GND Ground 3 RF3 RF I/O path 3 4 V1 DC control voltage 1 5 V2 DC control voltage 2 6 VDD DC supply Note: Bottom ground paddles must be connected to ground. Pin No. Name Description 7 8 9 10 11 12 GND GND RF2 GND RFC GND Ground Ground RF I/O path 2 Ground RF common port Ground Table 2. Truth Table Control pins V1 0 0 1 1 Note: V2 0 1 0 1 RF1 Insertion Loss Isolation Isolation Switched RF Outputs RF2 Isolation Isolation Insertion Loss Isolation RF3 Isolation Isolation Insertion Loss “1” = 1.0 V to 3.0 V. “0” = 0 V to +0.3 V. Page 3 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8636 – SP3T Switch for 0.1～3G Application Recommended Operation Range Table 3. Parameters Operation Frequency Power supply Switch Control Voltage (H) Switch Control Voltage (L) Symbol Min Typ Max Units f1 VDD VH VL 0.1 2.0 1.0 0 2.8 1.8 0 3.0 3.0 3.0 0.3 GHz V V V Units Test Condition (Note 2) Specifications Table 4. Electrical Specifications Parameter Symbol Min. Specification Typical Max. DC Specifications Supply voltage VDD Supply current Control current 2.0 2.8 3.0 V IDD 22 35 μA ICTL 2 μA VCTL = 1.8 V 50% of final control Turn-on switching time Ton 2 μs voltage to 90% of final RF power, switching between RF1/2/3 RF Specifications Insertion loss (RFC pin to RF1/2/3 pins) IL Input return loss (RFC pin to RF1/2/3 pins) 0.1 dB Compression Point (ANT pin to RF1/2/3 pins) 0.45 dB 0.8 to 1.0 GHz 0.45 0.55 dB 1.0 to 2.2 GHz 0.5 0.60 dB 2.2 to 3.0 GHz 32 35 dB 0.8 to 1.0 GHz 28 30 dB 1.0 to 2.2 GHz 23 25 dB 2.2 to 3.0 GHz RL -20 dB 0.8 to 3.0 GHz P0.1dB +28 dBm Isolation (RFC pin to RF1/2/3 pins) 0.40 ISO 0.1 GHz to 3 GHz Page 4 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8636 – SP3T Switch for 0.1～3G Application Absolute Maximum Ratings Table 5 Maximum ratings Parameters Symbol Minimum Maximum Units Supply voltage VDD +2.5 +3.0 V Control voltage (V1 and V2) VCTL -0.5 +3.0 V RF input power (RF1 to RF3) PIN +28 dBm Operating temperature -40 +85 ℃ TOP Storage temperature -55 +150 ℃ TSTG Human Body Mode HBM 1000 V Machine Mode MM 100 V Charged Device Mode CDM 500 V Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device Package Outline Dimension Figure 4. package outline dimension Page 5 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8636 – SP3T Switch for 0.1～3G Application Reflow Chart Figure 5. Recommended Lead-Free Reflow Profile Table 6 Reflow condition Profile Parameter Lead-Free Assembly, Convection, IR/Convection Ramp-up rate（TSmax to Tp） 3℃/second max. Preheat temperature（TSmin to TSmax） 150℃ to 200℃ Preheat time（ts） 60 - 180 seconds Time above TL , 217℃（tL） 60 - 150 seconds Peak temperature（Tp） 260℃ Time within 5℃ of peak temperature(tp) 20 - 40 seconds Ramp-down rate 6℃/second max. Time 25℃ to peak temperature 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. Page 6 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential