MXD8621EC

MXD8621EC SPDT Switch for 0.1~6.0GHz Application VED APPRO This document contains information that is confidential and proprietary to Maxscend Microelectronics Company Limited (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8621EC -- SPDT Switch for 0.1~6.0GHz Application General Description Applications The MXD8621EC is a Single-Pole, Double-Throw  GSM/WCDMA/LTE Receive (SPDT) for 0.1~6.0GHz application. Switching is  WLAN TRX controlled by an integrated GPIO interface with a Features single control pin. No external DC blocking capacitors are required as  Broadband frequency range: 0.1 to 6.0 GHz  Low insertion loss: 0.33 dB @ 2.7 GHz long as no DC voltage is applied on any RF path. 0.55 dB @ 6.0 GHz  High isolation: 38dB @ 2.7 GHz The MXD8621EC is provided in a compact 1.1mm x 0.7mm x 0.377mm 6-lead DFN package that meets requirements for board-level assembly. A functional block diagram and the 30dB @ 6.0 GHz  P0.1dB 29dBm  No external DC blocking capacitors required  Single GPIO control line with VDD voltage pin regulator: configuration are shown in Figure 1. VDD= 1.62 to 3.60 V  Small, 6-Lead DFN, 400 um pitch (1.1mm x 0.7mmx 0.377 mm) package ，MSL1 Functional Block Diagram and Pin Function RF1 ANT RF2 Logic and Supply VDD 4 VDD 3 RF1 5 ANT 2 GND 6 VC 1 RF2 VC Figure 1 Functional Block Diagram and Pin-out (Top View) Page 2 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8621EC -- SPDT Switch for 0.1~6.0GHz Application Application Circuit VDD 4 VDD C1 100pF V1 3 RF1 RF1 RFIN 5 ANT 2 GND 6 VC 1 RF2 RF2 C2 100pF Figure 2 MXD8621EC Application Circuit Table 1. Pin Description Pin No. Name 1 2 3 Description RF2 GND RF1 RF I/O. Throw 1 of the switch. Ground RF I/O. Throw 2 of the switch. Pin No. 6 5 4 Name VC ANT VDD Description Logic Control Antenna Supply Truth Table Table 2. State 0 1 Active Path ANT to RF1 ANT to RF2 VC 0 1 Note: “1” = 1.2 V to VDD V. “0” = 0 V to +0.3 V. Recommended Operation Range Table 3. Parameters Symbol Min Typ Max Units Operation Frequency Power supply Switch Control Voltage High Switch Control Voltage Low f1 VDD VCTL_H VCTL_L 0.1 1.62 1.2 0 1.8 1.8 0 6.0 3.60 VDD 0.3 GHz V V V Page 3 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8621EC -- SPDT Switch for 0.1~6.0GHz Application Specifications Table 4.Electrical Specifications Parameter Symbol Specification Min. Typical Max. Units Test Condition DC Specifications Supply voltage Control voltage: Low High Current on VC pin Supply current DC supply on/turn-off time RF path time turn- switching Supply ripple Insertion loss (RF1 or RF2 to ANT pin) VDD 1.62 1.8 3.60 V VCTL_L VCTL_H ICTL IDD 0 1.2 0 1.8 0.3 VDD 5 140 V V μA μA 10 μs 200 ns 50 mVpp ton tsw 130 VPP IL Isolation (ANT to RF1 or RF2) ISO Isolation (RF1 to RF2) ISO Input return loss (ANT to RF1 or RF2) Voltage Standing Wave Ratio, all ports 0.1dB compression point （from antenna 100 RL 50 42 35 31 27 49 41 34 30 26 13 VSWR RF Specifications 0.28 0.35 0.30 0.40 0.33 0.45 0.40 0.50 0.55 0.65 56 45 38 34 30 55 44 37 33 29 20 1.25:1 1.5:1 29 dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB 700 to 960 MHz 1710 to 2170 MHz 2170 to 2690 MHz 3600 to 3800 MHz 4800 to 6000 MHz 700 to 960 MHz 1710 to 2170 MHz 2170 to 2690 MHz 3600 to 3800 MHz 4800 to 6000 MHz 700 to 960 MHz 1710 to 2170 MHz 2170 to 2690 MHz 3600 to 3800 MHz 4800 to 6000 MHz dB 700 to 6000 MHz - Referenced to 50 Ω, 700 to 6000 MHz dBm 700M to 6000MHz 25% duty pulse to RF1 and RF2） 2nd Harmonic (ANT to RF1 or RF2) 3rd Harmonic (ANT to RF1 or RF2) 2nd Intermodulation Distortion 3rd Intermodulation Distortion VDD= 1.8 V Measured from 50% of final VDD supply voltage to 90% of final RF power From one active state to another active state transition, measured from 50% of final control voltage to 90% of final RF power 2fo -62 -55 dBm 3fo -62 -55 dBm IMD2 -103 -100 dBm IMD3 -103 -100 dBm fo = 950 MHz, PIN = +26 dBm Two-tone test：f0=24dBm and f1= 15dBm at f0+1MHz Page 4 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8621EC -- SPDT Switch for 0.1~6.0GHz Application Absolute Maximum Ratings Table 5. Maximum ratings Symbol Minimum Maximum Units Supply voltage Digital control voltage RF input power Operating temperature Parameters VDD VCTL PIN TOP +1.62 0 V V dBm –40 +3.7 +3.7 +30 +85 Storage temperature TSTG –55 +150 ℃ Humidity Grade ℃ MSL1 Storage Cycle(package) Electrostatic Discharge Human body model (HBM), Class 1C years 2 ESD_HBM 1000 Machine Model (MM), Class A ESD_MM 100 Charged device model (CDM), Class III ESD_CDM 500 V Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Page 5 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8621EC -- SPDT Switch for 0.1~6.0GHz Application Package Outline Dimension Figure 3. Package outline dimension Page 6 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8621EC -- SPDT Switch for 0.1~6.0GHz Application Marking Specification PIN1 1st letter (Fixed): Product Code B,C,D CA Last letter(Variable): Lot code From 1~9 and A ~Z excluding letter "I" and "O" Figure 4 Marking specification (Top View) Tape and Reel Dimensions Figure 5 Tape and reel dimensions Minimum packing Quantity The minimum packing quantity of this device is 10000. Page 7 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8621EC -- SPDT Switch for 0.1~6.0GHz Application Reflow Chart tP TP Critical Zone TL to TP Ramp-up Temperature TL TSmax tL TSmin Ramp-down tS Preheat t 25 ℃ to Peak Time Figure 6. Recommended Lead-Free Reflow Profile Table 6. Profile Parameter Lead-Free Assembly, Convection, IR/Convection Ramp-up rate（TSmax to Tp） 3℃/second max. Preheat temperature（TSmin to TSmax） 150℃ to 200℃ Preheat time（ts） 60 - 180 seconds Time above TL , 217℃（tL） 60 - 150 seconds Peak temperature（Tp） 260℃ Time within 5℃ of peak temperature(tp) 20 - 40 seconds Ramp-down rate 6℃/second max. Time 25℃ to peak temperature 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. 1.5.1 Page 8 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential