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MXD8638C

MXD8638C

  • 厂商:

    MAXSCEND(卓胜微电子)

  • 封装:

    QFN9_1.1x1.1mm

  • 描述:

    MXD8638C是一款CMOSSOI(绝缘体上的硅)单刀三掷(SP3T)射频开关,适用于GSM/WCDMA/LTE接收和发射以及802.11b/g/nWLAN应用。其高线性性能和低插入损耗使其成为手机...

  • 数据手册
  • 价格&库存
MXD8638C 数据手册
MXD8638C 0.1-3.0GHz SP3T Switch VED APPRO This document contains information that is confidential and proprietary to Maxscend Microelectronics Company Limited (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 6 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8638C – 0.1-3.0GHz SP3T Switch General Description Applications The MXD8638C is a CMOS silicon-on-insulator (SOI), single-pole, triple-throw (SP3T) transmitting and receiving switch. The high  GSM/WCDMA/LTE receive and transmit  802.11b/g/n WLANs linearity performance and low insertion loss makes the Features device an ideal choice for GSM/WCDMA/LTE  Broadband frequency range: 0.1 to 3.0 GHz handset and data card applications.  Low insertion: 0.45 dB @ 2.7 GHz The MXD8638C SP3T switch is provided in a  High isolation: 25 dB up to 2.7 GHz compact QFN 9-pin 1.15mm x 1.15mm x 0.45mm  P0.1dB of 36dBm package. A functional block diagram is shown in  No external DC blocking capacitors required Figure 1. The pin configuration and package are  Positive low voltage control: VC = 1.6 to 3.00 V, VDD = 2.5 to 3.0 V shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.  Small, QFN (9-pin, 1.15mm x 1.15mm x 0.45mm) package Functional Block Diagram and Pin Function RF1 RF2 1 V1 8 V2 7 VDD 2 RF3 9 GND 6 GND 3 RF1 4 ANT 5 RF2 ANT RF3 Logic and Supply VDD V1 V2 Figure 1 Functional Block Diagram Figure 2 Pin-out (Top View) Page 2 of 6 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8638C – 0.1-3.0GHz SP3T Switch Application Circuit V1 C1 100pF RF3 V2 C2 100pF VDD C3 100pF 1 V1 8 V2 7 VDD 2 RF3 9 GND 6 GND 3 RF1 4 ANT 5 RF2 RF1 ANT RF2 Figure 3 MXD8638C Application Circuit Table 1. Pin Description Pin No. Name Description Pin No. Name Description 1 2 3 4 5 V1 RF3 RF1 ANT RF2 Control Pin 1 RF-Port 3 RF-Port 1 Antenna RF-Port 2 6 7 8 9 GND VDD V2 GND Ground Power Supply Control Pin 2 Ground Truth Table Table 2. V1 V2 Active Path 0 1 0 1 0 0 1 1 OFF ANT to RF1 ANT to RF2 ANT to RF3 Note: “1” = 1.0 V to 3.00 V. “0” = 0 V to +0.3 V. Recommended Operation Range Table 3. Parameters Operation Frequency Power supply Switch Control Voltage High Switch Control Voltage Low Symbol Min Typ Max f1 0.1 2.5 1.6 0 2.8 1.8 0 3.0 3.0 3.0 0.3 VDD VCTL_H VCTL_L Units GHz V V V Page 3 of 6 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8638C – 0.1-3.0GHz SP3T Switch Specifications Table 4.Electrical Specifications Parameter DC Specifications Control voltage: Low High Supply voltage Supply current Symbol VCTL_L VCTL_H VDD IDD Control current Min. Specification Typical Max. 0 1.6 2.5 ICTL 0 +1.8 2.8 35 0.3 3.0 3.0 60 1 Units Test Condition V V V μA VDD = 2.8 V μA VC= 1.8 V dB dB dB dB dB dB dB 0.1 to 1.0 GHz 1.0 to 2.2 GHz 2.2 to 3.0 GHz 0.1 to 1.0 GHz 1.0 to 2.2 GHz 2.2 to 3.0 GHz 0.1 to 3.0 GHz 0.1 to 3.0 GHz, ΔF = 1 MHz, PIN = +20 dBm/tone RF Specifications Insertion loss IL Isolation ISO Return loss |S11| 3rd Order Input Intercept Point IIP3 30 25 20 +60 0.30 0.37 0.45 35 30 25 15 0.35 0.40 0.50 +70 dBm Input 0.1 dB compression point P0.1dB +36 dBm 2nd harmonic 2fo +90 dBc 3rd harmonic 3fo +90 dBc 1 μs 50% VCTL to 10/90% RF 1 μs 50% VCTL to 90/10% RF 5 μs Shutdown state to any RF switch state Switching on time Switching off time Startup time 0.1 to 3.0 GHz, ANT to RF1,RF2 and RF3 0.1~3GHz, PIN = +26 dBm 0.1~3GHz, PIN = +26 dBm Absolute Maximum Ratings Table 5. Maximum ratings Parameters Symbol Minimum Maximum Units Supply voltage Digital control voltage RF input power Operating temperature Storage temperature Electrostatic discharge: Human Body Model (HBM), Class 1C Machine Model (MM), Class A VDD VCTL PIN TOP TSTG +2.5 0 +3.3 +3.3 +36.5 +85 +150 V V dBm ℃ ℃ 1000 V 100 V ESD –30 –55 Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Page 4 of 6 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8638C – 0.1-3.0GHz SP3T Switch Package Outline Dimension M 1 PIN 1 CORNER M TOP VIEW SYMBOL DESCRIPTION PIN 1 I.D. 7 8 1 TOTAL THICKNESS A 0.40 STAND OFF A1 MOLD THICKNESS A2 L/F THICKNESS A3 9 BODY SIZE 2 3 0.50 0.00 --- 0.05 0.25 0.30 0.35 0.150 REF b 0.10 0.20 0.30 1.10 1.15 1.20 Y E 1.10 1.15 1.20 LEAD LENGTH 4 MAX 0.45 D LEAD PITCH 5 MILLIMETER NOM X LEAD WIDTH 6 MIN 0.40 BSC e L 0.10 0.20 PACKAGE EDGE TOLERANCE aaa MOLD FLATNESS bbb 0.1 COPLANARITY ccc 0.08 LEAD OFFSET ddd 0.1 EXPOSED PAD OFFSET eee 0.1 0.30 0.1 BOTTOM VIEW VIEW M-M Figure 4. Package outline dimension Page 5 of 6 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8638C – 0.1-3.0GHz SP3T Switch Reflow Chart tP TP Critical Zone TL to TP Ramp-up Temperature TL TSmax tL TSmin Ramp-down tS Preheat t 25 ℃ to Peak Time Figure 5. Recommended Lead-Free Reflow Profile Table 6 Reflow condition Profile Parameter Lead-Free Assembly, Convection, IR/Convection Ramp-up rate(TSmax to Tp) 3℃/second max. Preheat temperature(TSmin to TSmax) 150℃ to 200℃ Preheat time(ts) 60 - 180 seconds Time above TL , 217℃(tL) 60 - 150 seconds Peak temperature(Tp) 260℃ Time within 5℃ of peak temperature(tp) 20 - 40 seconds Ramp-down rate 6℃/second max. Time 25℃ to peak temperature 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. 1.0.1 Page 6 of 6 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential
MXD8638C 价格&库存

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