MXD8638C
0.1-3.0GHz SP3T Switch
VED
APPRO
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Company Limited (Maxscend) and may not be reproduced in any form without express written consent of
Maxscend. No transfer or licensing of technology is implied by this document.
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MXD8638C – 0.1-3.0GHz SP3T Switch
General Description
Applications
The MXD8638C is a CMOS silicon-on-insulator
(SOI), single-pole, triple-throw (SP3T) transmitting
and
receiving
switch.
The
high
GSM/WCDMA/LTE receive and transmit
802.11b/g/n WLANs
linearity
performance and low insertion loss makes the
Features
device an ideal choice for GSM/WCDMA/LTE
Broadband frequency range: 0.1 to 3.0 GHz
handset and data card applications.
Low insertion: 0.45 dB @ 2.7 GHz
The MXD8638C SP3T switch is provided in a
High isolation: 25 dB up to 2.7 GHz
compact QFN 9-pin 1.15mm x 1.15mm x 0.45mm
P0.1dB of 36dBm
package. A functional block diagram is shown in
No external DC blocking capacitors required
Figure 1. The pin configuration and package are
Positive low voltage control: VC = 1.6 to 3.00
V, VDD = 2.5 to 3.0 V
shown in Figure 2. Signal pin assignments and
functional pin descriptions are provided in Table 1.
Small, QFN (9-pin, 1.15mm x 1.15mm x
0.45mm) package
Functional Block Diagram and Pin Function
RF1
RF2
1
V1
8
V2
7
VDD
2
RF3
9
GND
6
GND
3
RF1
4
ANT
5
RF2
ANT
RF3
Logic and Supply
VDD
V1 V2
Figure 1 Functional Block Diagram
Figure 2 Pin-out (Top View)
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MXD8638C – 0.1-3.0GHz SP3T Switch
Application Circuit
V1
C1
100pF
RF3
V2
C2
100pF
VDD
C3
100pF
1
V1
8
V2
7
VDD
2
RF3
9
GND
6
GND
3
RF1
4
ANT
5
RF2
RF1
ANT
RF2
Figure 3 MXD8638C Application Circuit
Table 1. Pin Description
Pin No.
Name
Description
Pin No.
Name
Description
1
2
3
4
5
V1
RF3
RF1
ANT
RF2
Control Pin 1
RF-Port 3
RF-Port 1
Antenna
RF-Port 2
6
7
8
9
GND
VDD
V2
GND
Ground
Power Supply
Control Pin 2
Ground
Truth Table
Table 2.
V1
V2
Active Path
0
1
0
1
0
0
1
1
OFF
ANT to RF1
ANT to RF2
ANT to RF3
Note: “1” = 1.0 V to 3.00 V. “0” = 0 V to +0.3 V.
Recommended Operation Range
Table 3.
Parameters
Operation Frequency
Power supply
Switch Control Voltage High
Switch Control Voltage Low
Symbol
Min
Typ
Max
f1
0.1
2.5
1.6
0
2.8
1.8
0
3.0
3.0
3.0
0.3
VDD
VCTL_H
VCTL_L
Units
GHz
V
V
V
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MXD8638C – 0.1-3.0GHz SP3T Switch
Specifications
Table 4.Electrical Specifications
Parameter
DC Specifications
Control voltage:
Low
High
Supply voltage
Supply current
Symbol
VCTL_L
VCTL_H
VDD
IDD
Control current
Min.
Specification
Typical
Max.
0
1.6
2.5
ICTL
0
+1.8
2.8
35
0.3
3.0
3.0
60
1
Units
Test Condition
V
V
V
μA
VDD = 2.8 V
μA
VC= 1.8 V
dB
dB
dB
dB
dB
dB
dB
0.1 to 1.0 GHz
1.0 to 2.2 GHz
2.2 to 3.0 GHz
0.1 to 1.0 GHz
1.0 to 2.2 GHz
2.2 to 3.0 GHz
0.1 to 3.0 GHz
0.1 to 3.0 GHz,
ΔF = 1 MHz,
PIN = +20 dBm/tone
RF Specifications
Insertion loss
IL
Isolation
ISO
Return loss
|S11|
3rd Order Input
Intercept Point
IIP3
30
25
20
+60
0.30
0.37
0.45
35
30
25
15
0.35
0.40
0.50
+70
dBm
Input 0.1 dB
compression
point
P0.1dB
+36
dBm
2nd harmonic
2fo
+90
dBc
3rd harmonic
3fo
+90
dBc
1
μs
50% VCTL to 10/90% RF
1
μs
50% VCTL to 90/10% RF
5
μs
Shutdown state to any RF
switch state
Switching on
time
Switching off
time
Startup time
0.1 to 3.0 GHz,
ANT to RF1,RF2 and RF3
0.1~3GHz,
PIN = +26 dBm
0.1~3GHz,
PIN = +26 dBm
Absolute Maximum Ratings
Table 5. Maximum ratings
Parameters
Symbol
Minimum
Maximum
Units
Supply voltage
Digital control voltage
RF input power
Operating temperature
Storage temperature
Electrostatic
discharge:
Human Body Model
(HBM), Class 1C
Machine Model (MM),
Class A
VDD
VCTL
PIN
TOP
TSTG
+2.5
0
+3.3
+3.3
+36.5
+85
+150
V
V
dBm
℃
℃
1000
V
100
V
ESD
–30
–55
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with
only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed
here may result in permanent damage to the device.
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MXD8638C – 0.1-3.0GHz SP3T Switch
Package Outline Dimension
M
1
PIN 1 CORNER
M
TOP VIEW
SYMBOL
DESCRIPTION
PIN 1 I.D.
7
8
1
TOTAL THICKNESS
A
0.40
STAND OFF
A1
MOLD THICKNESS
A2
L/F THICKNESS
A3
9
BODY SIZE
2
3
0.50
0.00
---
0.05
0.25
0.30
0.35
0.150 REF
b
0.10
0.20
0.30
1.10
1.15
1.20
Y
E
1.10
1.15
1.20
LEAD LENGTH
4
MAX
0.45
D
LEAD PITCH
5
MILLIMETER
NOM
X
LEAD WIDTH
6
MIN
0.40 BSC
e
L
0.10
0.20
PACKAGE EDGE TOLERANCE
aaa
MOLD FLATNESS
bbb
0.1
COPLANARITY
ccc
0.08
LEAD OFFSET
ddd
0.1
EXPOSED PAD OFFSET
eee
0.1
0.30
0.1
BOTTOM VIEW
VIEW M-M
Figure 4. Package outline dimension
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MXD8638C – 0.1-3.0GHz SP3T Switch
Reflow Chart
tP
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
TSmax
tL
TSmin
Ramp-down
tS
Preheat
t 25 ℃ to Peak
Time
Figure 5. Recommended Lead-Free Reflow Profile
Table 6 Reflow condition
Profile Parameter
Lead-Free Assembly, Convection, IR/Convection
Ramp-up rate(TSmax to Tp)
3℃/second max.
Preheat temperature(TSmin to TSmax)
150℃ to 200℃
Preheat time(ts)
60 - 180 seconds
Time above TL , 217℃(tL)
60 - 150 seconds
Peak temperature(Tp)
260℃
Time within 5℃ of peak temperature(tp)
20 - 40 seconds
Ramp-down rate
6℃/second max.
Time 25℃ to peak temperature
8 minutes max.
ESD Sensitivity
Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD
protection techniques should be used when handling these devices.
RoHS Compliant
This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls
(PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant.
1.0.1
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