MXD8626L

MXD8626L SPDT Switch for 3G/4G Application VED APPRO This document contains information that is confidential and proprietary to Maxscend Technologies Inc. (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8626L – SPDT Switch for 3G/4G Application General Description Applications The MXD8626L is a Single-Pole, Double-Throw  GSM/WCDMA/LTE receive (SPDT) LTE/WCDMA/GSM switch. Switching is controlled by an integrated GPIO interface with a Features single control pin.  Broadband frequency range: 0.7 to 2.7 GHz  Low insertion loss: 0.45 dB @ 2.7 GHz  High isolation: 25 dB up to 2.7 GHz  P0.1dB >29dBm  No external DC blocking capacitors required  Single GPIO control line with VDD voltage No external DC blocking capacitors are required as long as no DC voltage is applied on any RF path. The MXD8626L is provided in a compact 1.1mm x regulator: 0.7mm x 0.45mm 6-lead LGA package that meets VCTL= 1.6 to 3.00 V requirements for board-level assembly. A functional block diagram and VDD= 2.5 to 3.00 V the pin  configuration are shown in Figure 1. Small, 6-Lead LGA, 400 um pitch (1.1mm x 0.7mmx 0.45 mm) package Functional Block Diagram and Pin Function Figure 1.Functional Block Diagram and Pin-out Page 2 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8626L -- SPDT Switch for 3G/4G Application Application Circuit Figure 2. MXD8626L Application Circuit Note: C1 = 100pF Table 1. Pin Description Pin No. 1 2 3 Name V1 GND VDD Description Digital control input Ground Power supply Pin No. 4 5 6 Name RF2 ANT RF1 Description RF I/O. Throw 2 of the switch. Antenna RF I/O. Throw 1 of the switch. Truth Table Table 2. State 0 1 Active Path ANT to RF1 ANT to RF2 V1 (Bump B1) 0 1 Note: “1” = 1.6 V to 3.00 V. “0” = 0 V to +0.3 V. Recommended Operation Range Table 3. Parameters Operation Frequency Power supply Switch Control Voltage High Switch Control Voltage Low Symbol Min Typ Max f1 0.1 2.5 1.6 0 2.8 1.8 0 3.0 3.0 3.0 0.3 VDD VCTL_H VCTL_L Units GHz V V V Page 3 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8626L -- SPDT Switch for 3G/4G Application Specifications Table 4.Electrical Specifications Parameter Symbol Min. Specification Typical Max. Units Test Condition DC Specifications Supply voltage Control voltage: Low High Current on V1 pin Supply current VDD 2.5 2.8 3.0 V VCTL_L VCTL_H 0 +1.6 0 +1.8 +0.3 +3.0 V V 5 μA 60 μA 10 μs 2 μs 20 mVpp ICTL IDD 45 DC supply turnon/turn-off time ton RF path switching time tsw Supply ripple VPP RF Specifications Insertion loss (RF1 or RF2 to ANT pin) IL Isolation (ANT to RF1 or RF2) Voltage Standing Wave Ratio, all ports 0.1dB compression point （from antenna to RF1 and RF2） 1 ISO 35 28 23 VSWR 0.35 0.38 0.45 40 30 25 1.25:1 dB dB dB dB dB dB 1.5:1 29 - dBm VDD= 2.8 V, V1 = VCTL_H Measured from 50% of final VDD supply voltage to 90% of final RF power From one active state to another active state transition, measured from 50% of final control voltage to 90% of final RF power 700 to 960 MHz 1710 to 2170 MHz 2170 to 2690 MHz 700 to 960 MHz 1710 to 2170 MHz 2170 to 2690 MHz Referenced to 50 Ω, 700 to 2690 MHz 700 to 2690 MHz Absolute Maximum Ratings Table 5. Maximum ratings Parameters Symbol Minimum Maximum Supply voltage Digital control voltage RF input power Operating temperature Storage temperature Electrostatic discharge: Human Body Model (HBM), Class 1C Machine Model (MM), Class A VDD VCTL PIN TOP TSTG +2.5 0 +3.0 +3.0 +29 +85 +150 V V dBm ℃ ℃ 1000 V 100 V –30 –55 ESD Units Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Page 4 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8626L -- SPDT Switch for 3G/4G Application Package Outline Dimension ALL DIMENSIONS ARE IN MILLIMETERS. SYMBOL A A2 A3 e D E aaa ccc MIN. 0.40 0.09 0.31 0.35 0.65 1.05 MILLIMETER NOR. 0.45 0.12 0.33 0.40 0.70 1.10 0.10 MAX. 0.50 0.15 0.35 0.45 0.80 1.15 0.05 Figure 3. Package outline dimension Page 5 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8626L -- SPDT Switch for 3G/4G Application Reflow Chart Figure 4. Recommended Lead-Free Reflow Profile Table 6. Profile Parameter Lead-Free Assembly, Convection, IR/Convection Ramp-up rate（TSmax to Tp） 3℃/second max. Preheat temperature（TSmin to TSmax） 150℃ to 200℃ Preheat time（ts） 60 - 180 seconds Time above TL , 217℃（tL） 60 - 150 seconds Peak temperature（Tp） 260℃ Time within 5℃ of peak temperature(tp) 20 - 40 seconds Ramp-down rate 6℃/second max. Time 25℃ to peak temperature 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. Page 6 of 6 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential