MXD8546FA

MXD8546FA VED APPRO X-DPDT Switch for 0.4 to 3.8G Applications Description Applications The MXD8546FA is a CMOS, Silicon-On-Insulator (SOI) ◼ Simultaneous voice and LTE systems double-pole, double-throw (DPDT) switch. The switch ◼ Diversity Antenna switching provides high linearity performance, low insertion loss Features and high isolation. Switching is controlled by one control voltage. ◼ Broadband frequency range: 0.4 to 3.8GHz the RF1 and RF2 pins connect to one of the two other ◼ Excellent insertion loss: 0.35dB @2.7GHz RF port pins (RF3 or RF4) through a low insertion loss ◼ Input 0.1dB compression point: 39dBm ◼ Low harmonic generation required on the RF path as long as no DC voltage is ◼ High ESD robustness applied externally. ◼ Wide power supply voltage range: 1.7 to 3.3V The MXD8546FA DPDT switch is provided in a compact ◼ Positive control voltage range: 1.5V to VDD ◼ Small, QFN (12-pin, 2 x 2 mm) package, MSL1 ◼ RoHS compliant package Depending on the logic voltage level applied to this pin, path, while maintaining a high isolation path to the alternate port. No external DC blocking capacitors are Quad Flat No-Lead (QFN) 2 x 2 mm package. A functional block diagram is shown in Figure 1. The pin configuration and package are shown in Figure 1 too. Signal pin assignments and functional pin descriptions are provided in Table 1. RF3 GND RF2 GND RF3 12 11 10 RF4 VDD 1 9 RF4 N/C 2 8 N/C VCTL 3 7 RF1 RF1 4 5 6 GND RF2 GND Figure 1 Functional Block and Pin Diagram Page 1 / 8 MXD8546FA Rev 1.1 This document contains information that is confidential and proprietary to Maxscend Microelectronics Company, Ltd. (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Function Characteristics X-DPDT Switch for 0.4 to 3.8G Applications RF3 GND 11 10 1 9 2 8 3 7 RF4 100pF N/C N/C RF1 100pF GND 5 6 4 RF2 VCTL 12 GND VDD GND Function Characteristics Figure 2 Application Circuit Table 1 Pin Descriptions No. Name Description No. Name Description 1 VDD DC Power Supply 7 RF1 RF Port1 2 N/C Not Connected 8 N/C Not Connected 3 VCTL DC Control Pin 9 RF4 RF Port4 4 GND Ground 10 GND Ground 5 RF2 RF Port2 11 RF3 RF Port3 6 GND Ground 12 GND Ground Table 2 VCTL Truth Table for RF Channel Operating Mode VCTL RF Channel Operating Mode High RF3 to RF1,RF4 to RF2 Low RF3 to RF2, RF4 to RF1 Page 2 / 8 MXD8546FA Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information X-DPDT Switch for 0.4 to 3.8G Applications Electrical Characteristics Table 3 Absolute Maximum Ratings Parameter Symbol Min Max DC Supply Voltage VDD -0.3 3.6 Logic Control Voltage VCTL -0.3 3.6 MAX RF Input Power PIN 37 (RF1/RF2/RF3/RF4 to GND) PIN 39 Device Operating Temperature TOP -40 90 Device Storage Temperature TSTG -55 150 Electrostatic Discharge VESD(HBM) 1000 (All Pins) VESD(CDM) 500 Unit V dBm Condition TA=25℃ TA=25℃ F0=950MHz, 20% DC, ZO=50Ω, VDD=2.8V,TA=25℃ F0=950MHz, CW , ZO=50Ω, VDD=2.8V, TA=25℃ ℃ V Human Body Model Charged Device Model Notice Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Table 4 Recommended Operating Conditions Parameter Symbol MIN F0 0.4 VDD 1.7 Control Voltage High VCTLH Control Voltage Low VCTLL Operating Frequency DC Supply Voltage Page 3 / 8 TYP MAX Unit 3.8 GHz 2.8 3.3 V 1.5 1.8 VDD V 0 0 0.3 V MXD8546FA Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information X-DPDT Switch for 0.4 to 3.8G Applications Table 5 Nominal Operating Parameters Parameter Symbol Specification MIN Normal Condition TYP Unit Condition MAX VDD=2.8V, VCTLH=1.8V, VCTLL=0V, PIN=0dBm, ZO=50Ω, TA=25℃, Unless Otherwise Stated DC Performances DC Supply Current IDD 90 120 Current on VCTL ICTL 1 5 uA Timing Performances Startup Time TON RF Path Switching Time TSW 10 2 3 us 50% of VDD to 90% of RF power 50% of VCTL to 90% of RF power RF Performances Insertion Loss (RF1/RF2 to RF3/RF4) IL Isolation (RF1/RF2 to RF3/RF4, RF1 ISO to RF2, RF3 to RF4) Input Return Loss (RF1/RF2 to RF3/RF4) Input 0.1dB Compression Point(RF1/RF2 to RF3/RF4) 2nd Order Harmonic (RF1/RF2 to RF3/RF4) 3rd Order Harmonic RL 0.26 0.30 F0=0.4 to 1.0GHz 0.30 0.35 F0=1.1 to 2.2GHz 0.35 0.40 F0=2.5 to 2.7GHz 0.42 0.50 F0=3.4 to 3.8GHz 30 33 25 30 21 25 F0=2.5 to 2.7GHz 16 18 F0=3.4 to 3.8GHz 10 15 F0=0.4 to 3.8GHz P0.1dB 39 2F0 -95 dB dBm -85 F0=1.1 to 2.2GHz F0=950MHz, 20% DC F0=824 to 915MHz @35dBm dBc 3F0 -95 -85 2nd Order Intermodulation IMD2 -115 -110 3rd Order Intermodulation IMD3 -115 -110 (RF1/RF2 to RF3/RF4) F0=0.4 to 1.0GHz Page 4 / 8 F0=824 to 915MHz @35dBm dBm Reference to Table 6 Reference to Table 7 MXD8546FA Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information X-DPDT Switch for 0.4 to 3.8G Applications Table 6 IMD2 Test Conditions Band In-Band Frequency CW Carrier CW Interferer MHz MHz dBm MHz dBm 1 Low 2140 1950 20 190 -15 1 High 2140 1950 20 4090 -15 5 Low 881.5 836.5 20 45 -15 5 High 881.5 836.5 20 1718 -15 Table 7 IMD3 Test Conditions Band In-Band Frequency CW Carrier CW Interferer MHz MHz dBm MHz dBm 1 LOW 2140 1950 20 1760 -15 5 HIGH 881.5 836.5 20 791.5 -15 Page 5 / 8 MXD8546FA Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information X-DPDT Switch for 0.4 to 3.8G Applications Package Outline Dimensions D A J B eee C A B R0.20 PIN 1 I.D. e/2 1 PIN 1 CORNER e E K eee C A B EXPOSED DIE ATTACH PAD aaa 12× L C 12× b ddd M TOP VIEW // bbb ccc C C A B BOTTOM VIEW C C SEATING PLANE M DESCRIPTION SYM BOL M ILLlM ETER M IN NOM M AX TOTALTHlCKNESS A 0.51 0.55 0.60 STAND OFF L/F THICKNESS A1 A3 00. 0 - 0.02 0.15 Ref 0.05 - EAD WIDTH BODY SIZE b 0.15 0.20 0.25 X D - 2.00 BSC - Y E e - 2.00 BSC 0.50 BSC - X J 0.77 0.92 1.02 Y K 0.77 0.92 1.02 L aaa 0.19 0.29 0.05 0.39 LEAD PITCH EP SIZE LEAD LENGTH PACKAGE EDGE TOLERANCE M OLD FLATNESS bbb 0.10 COPLANARITY ccc 0.10 LEAD OFFSET EXPOSED PAD OFFSET ddd eee 0.05 0.08 M A3 A A1 Figure 3 Package Outline Dimension Page 6 / 8 MXD8546FA Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information X-DPDT Switch for 0.4 to 3.8G Applications Marking Specification Product Code(Fixed)： 8546FA 8546 FAAA Manufacture Code(Variable): From 1~9 and A ~Z excluding letter I and O for lot tracking PIN1 Figure 4 Marking Specification(Top View) Tape and Reel Dimensions Figure 5 Tape and Reel Dimensions Page 7 / 8 MXD8546FA Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential Package Information X-DPDT Switch for 0.4 to 3.8G Applications Reflow Chart tP TP Critical Zone TL to TP Ramp-Up Temperature TL TSMAX tL TSMIN Ramp-Down tS Preheat t25-TP Time Figure 6 Recommended Lead-Free Reflow Profile Table 8 Reflow Chart Parameters Reflow Profile Parameter Preheat Temperature(TSMIN to TSMAX) 150℃ to 200℃ Preheat Time(ts) 60 to 180 Seconds Ramp-Up Rate(TSMAX to TP) 3℃/s MAX Time Above TL 217℃(tL) 60 to 150 Seconds Peak Temperature（TP） 260℃ 20 to 40 Seconds Time within 5℃ of Peak Temperature(tP) Ramp-Down Rate(TSMAX to TP) 6℃/s MAX 8 Minutes MAX Time for 25℃ to Peak Temperature(t25-TP) ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be applied when devices are operating. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and is considered RoHS compliant. Page 8 / 8 MXD8546FA Rev1.1 Copyright @2018 Maxscend Microelectronics Company, Ltd. All rights reserved. Maxscend Confidential